Industry survey finds 83% of respondents would be more inclined to buy used equipment with money-back guarantee.

Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced changes to its industry-first “Money Back Guarantee” (‘MBG’) program that will expand access to buyers by eliminating the premium previously associated with this warranty. Moov will now offer its no-questions-asked, money-back guarantee free of charge for end users (semiconductor manufacturers) who purchase semiconductor equipment and parts through Moov’s global marketplace, valid on over 90% of inventory. This announcement comes as Moov’s marketplace surpasses another milestone, exceeding $4bn FMV in active listings for pre-owned semiconductor manufacturing equipment.

Historically, reliability has been a significant barrier for semiconductor manufacturers looking to incorporate secondhand equipment in their procurement strategies. In fact, this problem has been so pervasive that 81% of industry respondents surveyed by Moov “strongly agree” or “agree” that reliability is a top barrier to purchasing secondhand semiconductor manufacturing equipment.

“Reliability is arguably the biggest barrier to the growth of the global secondary equipment market, and the growth of used equipment as a percentage of fabs’ overall equipment spend,” said Steven Zhou, CEO and cofounder of Moov Technologies. “In growing Moov to become the world’s largest marketplace for used equipment, solving the reliability challenge is at the core of just about everything we’ve built – from verified listings to digital inspections, white-glove logistics, and most importantly our no-questions-asked money-back guarantee.”

A money-back guarantee fundamentally shifts risk away from buyers and significantly impacts manufacturers’ willingness to purchase used equipment. Indeed, 83% of industry respondents agreed that they would be more inclined to purchase secondhand equipment if offered a 100% no-questions asked money-back guarantee.

Moov’s decision to offer its MBG free to all buyers reflects its commitment to quality.

“We eliminated the small premium on this program because Moov stands by the quality of our service and inventory on our marketplace,” said Raymond Mahon, Head of Customer Success at Moov. “All eligible purchases on Moov will now include our no-questions-asked, money-back guarantee so that buyers can fully leverage the secondary market as an integral part of their procurement strategy – without the risk historically associated with purchasing secondhand equipment.”

To learn more about Moov’s Money Back Guarantee program visit www.moov.co/services.

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov's platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

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SANTA BARBARA, CA – September 1, 2023 – Sikama International Inc., in collaboration with AirProducts Inc.™, is proud to announce the full commercial launch of its acid-free Electron Attachment (EA) Fluxless Reflow Soldering System, a revolutionary step for the Advanced Packaging Semiconductor sector.

The innovative technology behind this system is based on the Electron Attachment (EA) principle for activating hydrogen, a method that AirProducts has been refining for the past 15 years to efficiently reduce surface oxides. The EA technology is engineered to break down H₂ molecules into hydrogen anions, which are then targeted towards the soldering surfaces to effectively clean and reduce oxides before the reflow process. Additionally, this technology operates at ambient pressure and temperatures well within the window of traditional reflow processes.

The key advantages of this technology include:
• Truly Residue-Free: Enhanced reflow quality without flux-induced solder voids and wafer contamination. No post-reflow cleaning equipment is required and significantly less oven cleaning.
• In-line Process: Easily integrated into existing manufacturing lines without batch processing. The EA process occurs immediately before the reflow process.
• Environmental Impact: The EA flux-free process is entirely residue-free and environmentally benign with no organic vapors, hazardous residues, or CO2 emission.
• Ambient Pressure and sub-reflow temperatures: No vacuum requirements and safely processes substrates.

Sikama, as the exclusive global integrator of this technology and partner with AirProducts, views the technology and equipment commercialization as “a game-changer for this industry, as the need for advanced solutions to packaging evolutions in the semiconductor industry continue to evolve”, according to Herb Weigel, President and CEO of Sikama International.

The Sikama EA1200 Solder reflow oven is certified to EN 600204-1, SEMI S2/S8/S22/S23/F47/E6, is CE certified, and is verified to be compliant with NFPA79 in installed applications. Nearly 50 Worldwide Patents have been issued on this technology. The technology is well suited to provide significant benefits to small geometries in wafer bumping, copper pillar, and flip chip applications.

Established in 1982, Sikama International, Inc. designs and produces its products in Santa Barbara, California. Their reflow system offerings provide exceptional performance, with the fluxless systems set to redefine industry standards.

Reliable. Repeatable. Responsible. Reflow.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

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Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023
Innovative bonding materials presented at leading Asia technology conferences

Tapei, Taiwan – August 28, 2023 – Brewer Science, Inc., will present new developments in temporary and permanent bonding material technologies for advanced packaging this week at Asia’s two premier technology conferences, Advanced Packaging Summit on September 5th and SEMICON Taiwan from September 6th – 8th.

Dr. Dongshun Bai, Brewer Science's Senior Technologist & Business Development Director, spearheads a decade-spanning journey in semiconductor advancements. His expertise will be on display at the Advanced Packaging Summit, hosted by SEMI, where he will delve into his presentation titled "Novel Materials for Advanced Packaging". Dr. Bai will discuss new material improvements for advanced packaging, focusing on excellent bonding uniformity, optimizing adhesion for high-density substrates, ensuring high-temperature stability, and groundbreaking innovations in surface modification.

Brewer Science continues at SEMICON Taiwan, hosted at the TaiNEX 1&2 in Taipei from September 6th to 8th. Ms. Rama Puligadda, Chief Technical Officer at Brewer Science, takes the stage at the Heterogeneous Integration Global Summit. Scheduled for September 7th at 11:50am (Taipei Time), her presentation, "Recent Advances in Materials for Advanced Packaging", will illuminate advancements powering hybrid bonding, fan-out packaging, 3D/2.5D technology, and embedded solutions for heterogeneous semiconductor integration.

Ms. Puligadda's presentation will underscore the pivotal role of materials innovation in enabling cutting-edge packaging technologies. Addressing challenges in 3D/2.5D packaging, flexible solutions, and fan-out packaging, her insights will unveil how Brewer Science's advanced materials enable innovative packaging design, miniaturization, functionality, and cost-effectiveness.

In conjunction with the events, Brewer Science announces the launch of BrewerBOND® 703 laser release material, which reduces the risk of UV damage during laser debonding. The new material combines high UV absorption capabilities with ultra-low UV transmittance properties to provide a safeguard against UV laser energy interference on delicate device wafers. Learn more about this material by visiting Brewer Science's booth at SEMICON Taiwan or submitting an inquiry through the company's official website.

Throughout the events, Brewer Science's experts will be stationed at booth K2470 in the SEMICON Taiwan Exhibit Hall, available for engaging discussions and insightful demonstrations. Join them on:
• Wednesday, September 6: 10:00am–5:00pm
• Thursday, September 7: 10:00am–5:00pm
• Friday, September 8: 10:00am–4:00pm

For those unable to attend the conferences, Brewer Science extends an open invitation to explore their Temporary Bonding and Debonding Services and Permanent Bonding Materials webpages. You can also request datasheets or schedule expert-led consultations through the company's website.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at www.brewerscience.com.

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