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SEMI Press Release

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MILPITAS, Calif. — August 27, 2024 — Industry visionaries and experts will gather October 7-9 at the MEMS & Sensors Executive Congress (MSEC 2024) at the Château-Bromont Hotel in Bromont, Quebec, Canada for insights into the latest trends and innovations in sensorization. Themed Sensors Enabling a New Intelligence, the conference will highlight applications and technology advancements for growth markets, including generative AI, augmented and virtual reality (AR/VR), and Positioning, Navigation and Timing (PNT), as well as sustainability and manufacturing trends. Registration is open.

Mems & sensors“Bromont, Quebec, known for its cutting-edge research facilities and thriving tech community, offers the perfect setting for industry professionals to collaborate, share insights, and explore advancements in microelectronics and sensor technologies,” said Tim Brosnihan, Executive Director of the SEMI MEMS & Sensors Industry Group (MSIG). “Along with nearby Montreal, the area is home to top companies such as Teledyne MEMS, IBM, and C2MI, who will be hosting tours as part of the MSEC and a fantastic opening reception. The conference will highlight the region's contributions to the industry while fostering connections and driving forward the future of MEMS and sensors.”

“The Technum Quebec innovation zone is thrilled to be part of this collaborative endeavor that aligns perfectly with our mission to drive digital transformation and technological advancement,” said Normand Bourbonnais, CEO of Technum Québec. “Our partnership with C2MI and participation in MSEC reinforces our commitment to positioning Quebec as a leader in the digital technologies sector. Digital technologies, particularly the hardware innovations emerging from Quebec, are foundational to building the industries of tomorrow. Our collaboration underscores our dedication to driving advancements that not only bolster our local economy but also position Quebec as a global leader in cutting-edge technological development.”

Hosted by the MEMS & Sensors Industry Group, a SEMI technology community,MSEC 2024 will kick off with a tour at C2MI, a Canadian company at the forefront of microfabrication and sensor advancements. C2MI will also host the MSEC 2024 welcome reception.

“The MSEC conference in Bromont is an important milestone in our joint efforts to strengthen the semiconductor industry in North America,” said Marie-Josée Turgeon, CEO of C2MI. “This event underscores the importance of collaboration between industry leaders, researchers, and policy makers to boost innovation and foster resilience in the semiconductor industry. C2MI is proud to be playing a key role in such initiatives, fostering partnerships that are set to shape the industry's future.”

MSEC 2024 Keynote Speakers

  • Alissa M. Fitzgerald, Ph.D. - Founder & CEO, AM Fitzgerald & Associates; The Past, Present and Future of MEMS
  • Marcellino Gemelli – Sr. Director, Business Development and Alliance Management, Bosch Sensortec; The Seven Steps to Bring AI Tools Inside a Semiconductor Company 
  • Bernhard Straub - Head of MEMS Consumer Sensors, Infineon Technologies; Voice of the Future: AI-Driven Interactions Powered by High-SNR MEMS Microphones 
  • Dan Cohen -Head of Commercialization, Google X; Sensors for AI and AI for Sensors

MSEC 2024 Sessions

  • Session 1 – Keynotes featuring thought leaders from AM Fitzgerald & Associates, Bosch Sensortec, Infineon, and GoogleX
  • Session 2 – Product Showdown: AR and VR Technology
  • Session 3 – Latest MEMS and Sensors Market & Business Trends
  • Session 4 – Sustainability & Trends
  • Session 5 – MSIG Shark-Tank: Canadian Edition
  • Session 6 – Advancements in Positioning, Navigation, and Timing

MSEC 2024 Sponsors

  • Platinum – EV Group 
  • Gold – Infineon 
  • Bronze – Bosch Sensortec, Evatec, KLA, Lam Research, STMicroelectronics 
  • Event – C2MI, Rogue Valley Microdevices, SUSS MicroTec, Technum, Teledyne Technologies 

About SEMI

SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Samer Bahou/SEMI US
Phone: 1.408.943.7870
Email: [email protected]

MUNICH, Germany ─ August 19, 2024 ─ Themed Innovation and Collaboration: Powering Sustainable Exponential Growth, SEMICON Europa 2024 will gather industry experts November 12-15 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management and workforce. Co-located with electronica, SEMICON Europa, Europe’s premier exhibition and conference for the microelectronics supply chain, will feature keynotes from the electronics design and manufacturing ecosystem, academia and governments. Registration is open. 

SEMICON Europa"Leaders from across the value chain at SEMICON Europa will discuss innovations and collaboration strategies that are driving semiconductor industry growth in Europe and globally," said Laith Altimime, president of SEMI Europe. "The industry remains committed to ensuring harmony between technological advancement and environmental progress. We look forward to hosting visionaries as they offer insights into achieving sustainable growth and overcoming the talent gap."

A key highlight of the event, the CxO Summit, will bring together visionary leaders from across the value chain to discuss how Europe’s microelectronics ecosystem can collaborate to uphold strategic leadership. The Summit will serve as a stage for fostering insightful partnerships on pressing and emerging challenges throughout SEMICON Europa. Executives from AMS Osram, Bosch, Comet Group, Inficon, Porsche, Schneider Electric, Siemens, STMicroelectronics, and other leading companies will share insights on the critical issues shaping the foundation for sustainable exponential growth in the European semiconductor industry.

SEMICON Europa 2024 will feature the launch of the III-V Compound Summit that will showcase the critical importance and emerging impact of III-V compound semiconductors in driving the future of electronics.

“Advancements in III-V compound semiconductor materials are crucial for the next generation of high-performance, energy-efficient devices, supporting the industry to overcome manufacturing complexities, boost efficiency and reduce costs,” said Ajit Manocha, SEMI President and CEO. “The III-V Compound Summit at SEMICON Europa will be an indispensable discussion in how these technologies will transform the electronics landscape, marking the beginning of a new era of technological progress.” 

Additional SEMICON Europa Highlights

  • ITF Chip into the Future - Powered by imec: Industry leaders will examine how the EU Chips Act can advance Europe’s semiconductor industry through collaboration, innovation, and investment. Discussions will cover key drivers, best practices, and the future of chip research and manufacturing.
  • Advanced Packaging Conference: Leading experts will discuss innovations in chiplets, heat dissipation, miniaturization, and other advanced packaging techniques essential for meeting the high-performance computing demands of modern AI applications.
  • Fab Management Forum: Presenters will explore strategies to enhance semiconductor manufacturing efficiency and performance. Topics include global market strategies, smart manufacturing, innovations, environmental sustainability, supply chain resilience, and next-gen technologies.
  • MEMS & Imaging Sensors Summit: Sessions will examine how advancements in MEMS and imaging technologies are enhancing connectivity and driving innovation across sectors such as agriculture, automotive, and healthcare, with a focus on the integration of AI/ML and data fusion in next-generation applications.
  • SEMI Networking Night: Industry stakeholders will gather to connect with peers and explore new business partnerships.

Executive Forum Programs 

  • Cultivating a Thriving SiC Market: This session will feature insights from industry leaders addressing the challenges and solutions in Silicon Carbide (SiC) power semiconductors, crucial for automotive and AI applications.
  • Electrification and Power Semiconductors: Examining key innovations in power semiconductors driving global electrification, this session will cover focus areas including efficiency, cost-performance, manufacturing technologies, and the role of semiconductors in advancing sustainable energy and electric vehicles.
  • Global Automotive Advisory Council Summit - Smart Mobility Forum: Addressing current challenges and opportunities in automotive semiconductor technology, this forum will bring together stakeholders and innovators to explore trends, such as autonomous, electric and software defined vehicle, towards a sustainable future in mobility.
  • Innovation Showcase: Attendees will learn about innovations in the microelectronics and semiconductor space.
  • Integrated Photonics: This session will explore how photonic integrated circuits (PICs) are transforming various industries by combining optical and electronic systems into compact, high performance, energy and cost-efficient designs.
  • Meet the SEMIs: Session attendees will have opportunities to network with SEMI European Committee Members, exchange ideas, and discuss ways to advance the industry.
  • Smart Manufacturing: This session will explore AI solutions for smarter semiconductor manufacturing operations, including data acquisition, digital twins, and autonomous production, with a focus on climate. 

TechARENA Programs 

  • 20 Under 30 Recognition Program: The 2024 SEMI Europe 20 Under 30 will honor young leaders in the microelectronics supply chain for their career success, leadership, commitment, community involvement, and collaborative innovation.
  • Advocacy and Geopolitics: Exploring the European Economic Security Strategy's impact on the semiconductor industry, this session will feature presenters discussing how new policies affect global supply chains and the need for international cooperation to ensure competitiveness and long-term growth.
  • Breakthroughs in Medical Technology: This session will explore how advanced medical electronics and semiconductors are advancing digital healthcare for the future.
  • Building the Talent Pipeline – SEMI Initiatives: Session attendees will discover how SEMI initiatives are fostering a robust talent pipeline for the semiconductor industry through university partnerships, STEM outreach, ongoing training, and diversity programs.
  • End-to-End Cybersecurity: Experts will come together to explore comprehensive solutions for securing semiconductor supply chains, protecting intellectual property, and ensuring product integrity in a connected world.
  • EU Digital Forum: Partners from HiCONNECTS and other R&D EU-funded projects will demonstrate how innovative heterogeneous integration (HI) core technologies address major societal and technical challenges.
  • European Projects for a Diverse Talent Pipeline: Speakers will highlight European Commission funded projects under the EU Chips Act aimed at addressing the urgent talent gap in the semiconductor industry by enhancing STEM education, re-skilling and up-skilling, promoting diversity, and sharing best practices in recruitment and onboarding.
  • Future Disruptions: Experts will share actionable insights and strategies on critical topics such as supply chain management, sustainability, ESG, PFAS regulations, and geopolitical impacts to navigate future disruptions in the semiconductor industry.
  • Future of Computing: This session will examine how advancements in quantum computing, neuromorphic computing, and trusted electronics are addressing global challenges and transforming the future of information processing with innovative solutions.
  • Future of Work: Industry leaders will discuss how inclusive leadership can address the global talent shortage, develop the next generation of industry leaders, and foster a diverse and sustainable workforce.
  • Materials Innovation: This session will examine how innovations in materials are advancing Moore’s Law, supporting sustainable semiconductor manufacturing, and addressing global environmental challenges.
  • SCREEN─ Innovation For a Sustainable World: Experts will present updates on new equipment platforms and solutions for Industry 4.0, 3D-Integration, and More-than-Moore devices, drawing from 25 years of collaboration with European partners.
  • Tackling Investment in Semiconductors Start-Ups: This session will feature demonstrations on how European innovations are enabling future technology roadmaps and scaling up start-ups in the industry. 

For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Sitong He at [email protected].

SEMICON Europa Sponsors 

About SEMI

SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Maria Daniela Perez / SEMI Europe 
Phone: +49 160 2562977 
Email: [email protected]

Samer Bahou / SEMI Headquarters
Phone: +1 408 943 7870
Email: [email protected]

SEOUL, Korea — August 20, 2024 — With innovations in advanced packaging crucial to enhancing semiconductors for AI, high-performance computing (HPC) and other leading-edge applications, the Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.

Advanced packaging summitOrganized by SEMI Korea, Advanced Packaging Summit 2024 will bring together leaders from companies such as Intel, Samsung, and SK hynix to explore topics including 2.5D packaging, chiplet packaging, co-packaged optics (CPO) and flip-chip ball grid array (FCBGA) substrate technologies. The Summit will feature a panel discussion that will examine how advanced packaging can help meet the performance demands of AI and HPC.

Agenda Topics and Presenters

  • The Journey of the Semiconductor Industry and the Innovation of Advanced Packaging - Heejoung Joun, Samsung Electronics 
  • CPO (Co-Packaged Optics) - David Harame, AIM Photonics 
  • Advanced Packaging Technology for HBM and 2.5D SiP - Ho-Young Son, SK hynix
  • Enabling the AI Era - Jinyoung Jeon, ASMPT 
  • The Role of Advanced Packaging Technology for AI - SungSoon Park, Intel 
  • FCBGA Substrate Technologies for AI/HPC - Mooseong Kim, LG Innotek 
  • Advanced Packages for Chiplets - TaeKyeong Hwang, Amkor Technology Korea 
  • Glass Substrates - Prof. Bongyoung Yoo, Hanyang University 

Advanced Packaging Summit Sponsors

Registration is open until September 4, 2024. More information can be found on the event website.

About SEMI 

SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts 
Jaegwan Shim, SEMI Korea 
Phone: 82+2.531.7804 
Email: [email protected]

Samer Bahou, SEMI Headquarters
Phone: 1.408.943.7870
Email: [email protected]

MILPITAS, Calif. – August 19, 2024 –The global semiconductor manufacturing industry in the second quarter of 2024 continued to show signs of improvement with significant growth of IC sales, stabilizing capital expenditure, and an increase in installed wafer fab capacity, SEMI announced today in its Q2 2024 publication of the Semiconductor Manufacturing Monitor (SMM) Report , prepared in partnership with TechInsights. While slower recovery in some end markets impacted the pace of growth in the first half of the year, the surge in demand for AI chips and high bandwidth memory (HBM) created strong tailwinds driving industry expansion.

 

SEMI & Tech Insights

 

Seasonality and weaker than expected consumer demand impacted electronics sales in the first half of 2024 resulting in a 0.8% decrease year-over-year (YoY). Starting Q3 2024, electronics sales are forecast to see a rebound, growing 4% YoY and 9% relative to Q2 2024. IC sales showed robust 27% YoY growth in Q2 2024 and are further expected to surge 29% in Q3 2024, surpassing record levels seen in 2021 as the AI-fueled demand continues to boost IC sales growth. Improved demand also led to a 2.6% decline YoY in IC inventory levels in the first half of 2024. 

Installed wafer fab capacity reached 40.5 million wafers per quarter (in 300mm wafer equivalent) in Q2 2024 and is projected to rise 1.6% in Q3 2024. Foundry and Logic-related capacity showed stronger growth in Q2 2024 at 2.0% and is projected to increase 1.9% in Q3 2024 driven by capacity build-up for advanced nodes. Memory capacity increased 0.7% in Q2 2024 and is forecast to see 1.1% growth in Q3 2024 supported by strong demand for HBM and improving memory pricing conditions. All regions tracked saw installed capacity increases in Q2 2024 with China remaining the fastest growing region despite mediocre fab utilization rates.

Semiconductor capital expenditures remained conservative in the first half of 2024 resulting in a 9.8% decrease YoY. The trend is expected to turn positive starting in Q3 2024 in response to the growing demand for AI chips and rapid adoption of HBM with memory CapEx leading the growth at 16% quarter-on-quarter (QoQ) while non-memory related capital expenditures increase by 6% QoQ.

“Despite moderate semiconductor capital expenditures in the first half of the year, we expect a positive trend to begin in Q3 2024 led by memory CapEx,” said Clark Tseng, Senior Director of Market Intelligence at SEMI. “Strong demand for AI chips and high bandwidth memory is boosting results in various segments of the semiconductor manufacturing ecosystem.”

"The entire semiconductor supply chain is recovering this year as the market prepares for a surge in 2025," said Boris Metodiev, Director of Market Analysis at TechInsights. "AI is certainly continuing to drive high value ICs to the market, while also supporting CapEx for capacity expansion of AI chips and especially HBM. As consumer demand recovers, and new technologies like AI are pushed to the edge, unit volumes and especially revenues will recover and support the broader semiconductor manufacturing sector."

IC salesCapex versus Fab capacity

Sources: SEMI (www.semi.org) and TechInsights (www.techinsights.com), August 2024

The Semiconductor Manufacturing Monitor (SMM) report provides end-to-end data on the worldwide semiconductor manufacturing industry. The report highlights key trends based on industry indicators including capital equipment, fab capacity, and semiconductor and electronics sales, and includes a capital equipment market forecast. The SMM report also contains two years of quarterly data and a one-quarter outlook for the semiconductor manufacturing supply chain including leading IDM, fabless, foundry, and OSAT companies. An SMM subscription includes quarterly reports.

Download a sample Semiconductor Manufacturing Monitor report.

For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. Details on SEMI market data are available at SEMI Market Data.

About SEMI 
SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org , contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact 
Samer Bahou/SEMI 
Phone: 1.408.943.7870
Email: [email protected]

MILPITAS, Calif. – August 12, 2024 – In an effort to help the global semiconductor value chain lower greenhouse gas (GHG) emissions, the industry association SEMI released today its first region-specific analysis of current and forecasted low-carbon energy (LCE) markets for South Korea. Developed by the SEMI Energy Collaborative (EC) and its sponsors, with insights from partner organizations and the South Korean government, the report highlights investments and policy changes required to increase supply of LCE.

SEMI logoInitial findings of the Semiconductor Climate Consortium (SCC), part of the SEMI Sustainability Initiative along with the EC, show that indirect emissions from electricity consumption account for 83% of total semiconductor value chain GHG emissions. Therefore, substantially scaling LCE investment and installation offers the most effective path to strengthening industry response to the threat of climate change. EC analysis of the South Korean LCE market projects that the industry will face a 15 to 30 TWh gap in meeting declared corporate targets for 2030. The gap may increase to 30 to 50 TWh if the sector aligns its decarbonization efforts with more rigorous targets set by the Intergovernmental Panel on Climate Change for emission pathways consistent with 1.5°C global warming.

The EC report series identifies how each region’s gap might be closed. Generally, for South Korea, the EC recommends:

  • Expansion and improvement of corporate LCE procurement mechanisms
  • Facilitating community collaboration in the project development process and the introduction of national guidelines on community benefit-sharing
  • Accelerating measures to overcome grid bottlenecks such as the streamlining of regulatory processes for solar PV and wind.

The downloadable report provides the full analysis of the anticipated impact of these recommendations.

“The Energy Collaborative report series analyzes the roadblocks impeding our aspirations to achieve low-carbon emissions for our industry and offers recommendations on addressing them across key regions,” said Mousumi Bhat, PhD, Vice President of Global Sustainability Programs at SEMI. “We reviewed the analysis and proposed recommendations with representatives of MOTIE in South Korea as a very constructive first step. We look forward to continuing our discussions and assisting, wherever possible, with implementation of solutions and growing our sustainable manufacturing footprint there and in other regions.”

SEMI announced the meeting with EC representatives and South Korea’s Ministry of Trade, Industry and Energy (MOTIE) officials on June 4, 2024.

The Energy Collaborative Report: Key Challenges and Potential Solutions for Expansion and Procurement of Low-Carbon Electricity for South Korea is the first of five to be released. Other regions analyzed by the EC include Japan, Taiwan, Malaysia and Singapore. Companies interested in becoming sponsors of the Energy Collaborative initiative may contact Jamie Belliveau at [email protected] to discuss the benefits.

About the Energy Collaborative

The SEMI Energy Collaborative is dedicated to engaging a leadership network of corporations and domain experts to accelerate the pace of adoption of renewable energy solutions together with regional governments and regulators in key markets. Through collaboration with the semiconductor value chain, the EC aspires to improve the currently untenable trajectory of semiconductor manufacturing emissions. Companies sharing this vision from across the semiconductor and energy ecosystems sponsor the EC, along with partners from civil society and non-profit organizations.

About SEMI

SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org , contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact 

Samer Bahou
Phone: 1.408.943.7870
Email: [email protected]

BERLIN, Germany — August 6, 2024 —The EuroPAT Workshop, an annual event of the SEMI Integrated Packaging Assembly & Testing European Chapter Technology Community (ESiPAT-TC), taking place from 9-10 September, 2024 in Berlin, will feature manufacturing and supply chain trends for semiconductor packaging, assembly, and test in Europe. Themed Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing? , the third edition of the workshop will showcase collaboration among Outsourced Semiconductor Assembly and Test (OSAT) providers and Semiconductor Packaging, Assembly, and Test Service Providers (SPAT-SPs) that is instrumental for the resilience of Europe’s microelectronics industry. Registration is open.

SEMIAs the complexity of semiconductor technologies increases, collaborative Chip-Package-Board-System co-design is becoming a focal point for Integrated Device Manufacturers (IDMs) and Original Equipment Manufacturers (OEMs). Workshop attendees will deep dive into this complex framework and explore the future of electronics packaging, assembly, and test. Additionally, the workshop will disseminate results of the Pack4EU, a European funded project assessing the current status and evolving needs of packaging, assembly, and test in Europe. 

"SEMI Europe looks forward to welcoming leading packaging, assembly and test experts to the EuroPAT Workshop in Berlin," said Laith Altimime, President of SEMI Europe. “The exceptional lineup of speakers will offer insights into vital trends for semiconductor packaging manufacturing.”

This year’s EuroPAT Workshop will be hosted by Swissbit Germany AG on day one and the Mercure Hotel MOA on day two. The workshop will present a broad scope of topics including: 

  • Packaging, assembly and test manufacturing in Europe
  • The role of European OSATs and SPAT-SPs
  • Semiconductor packaging supply chain
  • EU Chips Act updates for packaging
  • Coordination and Support Action (CSA) and Pack4EU Chips Joint Undertaking (Chips JU) updates
  • European markets and applications strengths and weaknesses
  • Technology transfer from pilot lines in RTO and industrial pilot lines
  • Collaboration in open advanced packaging piloting facilities

Global Industry Leaders to Attend

The EuroPAT Workshop participating companies include experts from global leaders:

  • BESI
  • Cimetrix by PDF Solutions
  • Colandis
  • Disco
  • EV Group
  • Gebr. Schmid GmbH
  • Koh Young Europe
  • MST Micro Systems Technologies
  • PacTech
  • Racyics
  • Schott
  • Swissbit

Networking

This year’s networking dinner cruise will be held on the Spree River on the first day of the summit at Restaurantschiff Capt’n Schillow .

Registration for the dinner cruise is reserved exclusively for workshop participants. Tickets may be purchased by completing the registration form.

Premium sponsors 

EuroPAT Workshop attendees are invited to participate at the upcoming SEMI 3D & Systems Summit on June 25-27 in Dresden and the Advanced Packaging Conference (APC) on November 13 at SEMICON Europa 2024 in Munich. To learn more about participation, sponsorship and exhibition opportunities, please contact [email protected]. 

For more details, please visit the EuroPAT Workshop website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#EuroPAT).

About SEMI

SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts 

Sitong He / SEMI Europe 
Phone: +49 151 5546 2638 
Email:  [email protected]

Samer Bahou/SEMI US
Phone: 1.408.943.7870
Email: [email protected]

Program Targeting Increased Access to Affordable Care for Industry Workforce Supported by Kellogg and Packard Foundations 

MILPITAS, Calif and WASHINGTON, D.C. — August 6, 2024 — Seeking to bolster the semiconductor industry workforce in the U.S. by addressing gaps in child care needs, the SEMI Foundation and Policy Equity Group today announced a collaboration to help companies comply with child care requirements under the U.S. CHIPS and Science Act. The W.K. Kellogg Foundation and the David and Lucile Packard Foundation have agreed to fund the efforts as part of the larger Investing in America Child Care Partnership that leverages federal investments to shift policies and engagement around quality, accessible, and affordable child care.

SEMI Foundation

 

Policy equity

The SEMI Foundation and Policy Equity Group are seeking to work with early childhood education leaders in Arizona, Ohio, and Michigan to strengthen local child care systems, support employers in creating child care benefits that meet employee needs, and increase access to high-quality, affordable child care in communities that house America’s growing semiconductor workforce.

“Quality child care is critical to the current and future workforce of the semiconductor industry and to ultimately narrowing our talent gap,” said Shari Liss, Executive Director of the SEMI Foundation. “The SEMI Foundation is honored to collaborate with Policy Equity Group and to be supported by the Kellogg and Packard Foundations to work toward systemic changes in child care, build community-based solutions, and conduct extensive industry outreach to potential workers who require quality child care.”

“For quite some time, the early childhood field has highlighted child care as essential infrastructure that supports worker productivity and economic growth,” said Jeffrey Capizzano, President of the Policy Equity Group. “We are fortunate to work with the SEMI Foundation and our philanthropic partners to demonstrate how the business community can contribute to expanding child care capacity and quality in their communities.”

The funding and collaboration will involve activities including:

  • Landscape analyses to assess the current state of the semiconductor workforce and the local early child care and education system
  • Targeted outreach programs based on the landscape analysis to connect women and underrepresented minorities to the semiconductor workforce, while leveraging child care access as a critical support and attraction point
  • Child care plans that meet CHIPS Act requirements and address the needs of semiconductor companies, with the goal of improving both the sustainability and capacity of local child care systems
  • Resources and training materials to help employers advocate for child care in their states and provide support for their employees to identify and access affordable, high-quality child care options
  • Documentation of the lessons learned that can inform replication and scaling across other communities, with a concerted focus on how a company’s child care strategy can be supportive of supply-building across a community’s early childhood ecosystem

The SEMI Foundation is the non-profit arm of SEMI, the industry association representing the global semiconductor and electronics design and manufacturing supply chain. The Foundation drives the SEMI Workforce Development program and provides connections to more than 3,000 member companies worldwide.

About the Policy Equity Group

The Policy Equity Group’s work focuses on building the capacity of socially conscious organizations that are dedicated to improving the lives of young children and their families. We collaborate with states, cities, and organizations to design and implement effective early care and education systems. Our methods ensure that early childhood policies and systems programs are sustainably and sufficiently funded, guided by stakeholder voices and data, and are powered by the collective efforts of all sectors that impact the lives of children and families. For more information about Policy Equity Group, visit https://policyequity.com/.

About the SEMI Foundation 
The SEMI Foundation’s mission is to support economic opportunity for workers and the sustained growth of the microelectronics industry through creating pathways and opportunities for job seekers and tools and systems for semiconductor companies to attract, develop, retain, and advance a diverse and skilled workforce. Visit the SEMI Foundation online to learn more, and follow the SEMI Foundation on LinkedIn .

About SEMI 
SEMI®is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON®expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit  www.semi.org, contact a regional office, and connect with SEMI on  LinkedIn  and X to learn more.

Organization Contacts 

Shanita Sims, Communications Manager
Policy Equity Group
[email protected]

Michelle Williams-Vaden, Deputy & Sr. Director, Strategy & Partnerships
SEMI Foundation
1.707.280.6795
[email protected]

Samer Bahou, Communications Director
SEMI
1.408.943.7870
[email protected]

MILPITAS, Calif. — August 2, 2024 — Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), FlexTech , a SEMI Technology Community, today announced winners of the 2024 FLEXI Awards presented at the FLEX Conference on July 10 at the Moscone Center in San Francisco.

FLEX AwardThe 2024 FLEXI Awards spotlight FHE contributions in four categories: R&D Achievement, Product Innovation, Environmental Sustainability and Industry Leadership.

2024 FLEXI Award Winners 

R&D Achievement – Deepak Trivedi , Ph.D.

Entries for this award were evaluated for their world-class approach, originality, and commercial potential for expanding the scope for FHE products or manufacturing processes. Dr. Deepak Trivedi, Principal Engineer from GE Aerospace, led the collaborative effort with UES a BlueHalo company and Binghamton University to develop Sensiworm, a revolutionary soft robotic device designed for in-situ inspection of aircraft engines. With its inchworm-like movement, the Sensiworm navigates confined spaces, using advanced sensors and a camera system to detect defects and assess surface conditions in real-time. This technology eliminates the need for engine disassembly, which significantly reduces inspection time and costs and minimizes aircraft downtime.

“Leading the Sensiworm technology development has been a remarkable journey,” said Trivedi. “This innovation showcases the incredible potential of flexible hybrid electronics for soft robotics and for revolutionizing industrial maintenance and military readiness. I am grateful to SEMI FlexTech, my team at GE Aerospace, and our partners, UES and Binghamton University. I’m proud of what we’ve achieved and excited for the future impact of our work.” 

 Product Innovation – SunRay Scientific Inc. 

This award is presented to a company for introducing an innovation in flexible electronics products in the last twelve months. Madhu Stemmermann, CEO and co-founder of SunRay Scientific, recognized the potential of anisotropic conductive material to revolutionize electrical interconnect solutions. Stemmermann and her team developed ZTACH® ACE, magnetically aligned, Z-axis conductive epoxy, a reliable and scalable solution for flexible electronics and semiconductor packaging.

“SunRay Scientific Inc. is honored to receive the FLEXI Product Innovation award for ZTACH® ACE,” said Stemmermann. “With incredible support from SEMI, NextFlex, AFRL, ARL, industry and academic partners, we have launched a commercially available interconnect solution addressing unmet needs across healthcare, consumer, automotive and defense.”

Environmental Sustainability – Lynne Garone 

This award recognizes an individual for their volunteering efforts and achievements in advancing the flexible and hybrid electronics industry toward environmental sustainability. Through her passionate and effective advocacy for sustainability, Lynne Garone, Associate Vice President from E Ink, increased individual employee sustainability practices and prompted corporate commitments to the United Nations Global Compact and to achieving carbon net-zero. Additionally, Garone was actively involved in a Massachusetts-based Green Team initiative.

“E Ink believes innovation and sustainability go hand in hand,” said Garone. “Our passion in this area inspired our corporate mission to be carbon net zero by 2040, and we are confident that the meaningful actions we are taking across our business will enable us to achieve that goal.”

Industry Leadership – Stephaney Shanks Ph.D. 

This award honors an individual who has built awareness of the capabilities and possibilities that flexible and hybrid electronics bring to the broader field of electronics and who has demonstrated outstanding industry leadership in public forums, association activity, and within their organization. Dr. Stephaney Shanks, Division Director for Integrative Health and Performance Sciences at UES, A BlueHalo Company, has pioneered innovations in real-time health and performance technologies, focusing on rapid detection for national security applications. She has led teams on projects worth over $200 million and collaborates widely to advance wearable technologies.

“I am grateful and honored for this singular recognition from SEMI FlexTech,” said Shanks. “I have worked in the national security arena, focused on warfighter health applications for the better part of my career, and it is a deeply rewarding calling.”

About the FLEXI Awards Committee

The FLEXI Awards committee consists of representatives from Chasm, E Ink, Carnegie Mellon University, Bot Factory and UES, a BlueHalo, Company.

About SEMI 

SEMI®is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON®expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit  www.semi.org, contact a regional office, and connect with SEMI on  LinkedIn  and  X to learn more.

Association Contact

Samer Bahou/SEMI US
Phone: 1.408.943.7870
Email: [email protected]

MILPITAS, Calif. — August 1, 2024 — Worldwide silicon wafer shipments increased 7.1% quarter-over-quarter to 3,035 million square inches (MSI) in the second quarter of 2024, but saw an 8.9% decline from the 3,331 million square inches recorded during the same quarter last year, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry. 

SEMI logo“The silicon wafer market is recovering driven by strong demand related to products for data centers and generative AI,” said Lee Chungwei (李崇偉), Chairman of SEMI SMG and Vice President and Chief Auditor at GlobalWafers. “While the recovery is uneven across different applications, 300mm wafer Q2 shipments indicated 8% quarter-over-quarter growth for the best performance among all wafer sizes. There are a growing number of new semiconductor fabs under construction or ramping production volume. This expansion, along with the longer-term trend toward a $1 trillion semiconductor market, will inevitably require more silicon wafers.”

MSI

Data cited in this release include polished silicon wafers, including those used as virgin test wafers, as well as epitaxial silicon wafers, and non-polished silicon wafers shipped by the wafer manufacturers to end users.

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronic devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductors are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The SMG facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

MILPITAS, Calif. – July 31, 2024 –With advanced materials a critical enabler of semiconductor growth applications, Strategic Materials Conference (SMC 2024) will gather top executives and leaders from every segment of semiconductor manufacturing for insights into the latest developments in advanced materials September 30-October 2 at the Hayes Mansion in San Jose, Calif. Registration is open.

SMCSMC is the industry’s premier event focused on drivers of advanced materials, highlighting opportunities for key materials across the electronics supply chain in growth markets including computing and data storage, wireless communication, automotive, consumer and industrial electronics.

Themed Materials Revolution: Shaping the Future of Electronics and Beyond and the Impact of AI , SMC 2024 will feature the following key sessions:

  • AI Enabling Faster Semiconductor Materials Innovation
  • AI–Driven Heterogeneous Integration + Chiplet Technology
  • Market Geopolitical, and Economic Trends
  • Materials Scaling, Yield, and Metrology Challenges
  • Sustainability Materials Challenges—PFAS
  • Executive Panel: Strengthening Supply Chain for Industry Growth

Bill En, Ph.D.
Vice President of Engineering
AMD 
Demand for Power Efficiency in the Age of AI 

Martha Dudek, Ph.D.
General Manager, Materials Supply Chain
Intel Corporation
Challenges and Opportunities for Materials in Driving Innovation in Angstrom Era Semiconductor Devices 

Intel

Laura Matz, Ph.D.
Chief Science & Technology Officer
Merck KGaA, Darmstadt, Germany
The Opportunity to Accelerate the Semiconductor Industry using AI in Materials Discovery 

Merck

 

View the full SMC 2024 agenda and register .

About SEMI 

SEMI ® connects more than 3,000 member companies and 1.5 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact 

Samer Bahou/SEMI
U.S. Phone: 1.408.943.7870
Email: [email protected]