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Distinguished CMU Professor Recognized for Out-of-the-Box Thinking in 3D IC Research

MILPITAS, Calif. –– September 24, 2024 –– Dr. Wojciech P. Maly,  a pioneer in broad spectrum research in electronic system design who died in 2021, today was inducted posthumously into the Phil Kaufman Hall of Fame.

 

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The honor, co-sponsored by the Electronic System Design (ESD) Alliance, a SEMI Technology Community, and the IEEE Council on Electronic Design Automation (CEDA), acknowledges his significant and innovative contributions to the electronic system design industry. Founded in 2021, the Phil Kaufman Hall of Fame honors deceased members of the industry who made major contributions but did not receive the Phil Kaufman Award during their lifetime.

A distinguished professor at Carnegie-Mellon University (CMU) in Pittsburgh, Penn., Dr. Maly’s research interests focused on interfaces between very-large-scale integration (VLSI) design, testing and manufacturing with an emphasis on the stochastic nature of phenomena relating to these three VLSI domains. He authored, co-authored and edited numerous books, journal and conference papers, as well as patents, which have attempted to promote integration of design, test and manufacturing. 

“Professor Maly was ahead of his time and demonstrated amazing creativity and out-of-the-box thinking,” said Andrzej Strojwas, Chief Technology Officer at PDF Solutions, and a former student of Dr. Maly. “Our industry is only now realizing the potential of his pioneering work especially in the area of three-dimensional ICs.”

“Dr. Maly’s name may not be as well recognized as other industry giants, but his contribution is unmistakable and valued,” said Bob Smith, executive director of the ESD Alliance. “With this honor, he is not forgotten and will remain in the annuls of the ESD industry.”

Dr. Maly received the Master of Science degree in electronic engineering from the Technical University of Warsaw, Poland, in 1970, and a Ph.D. degree from the Institute of Applied Cybernetics, Polish Academy of Sciences, also in Warsaw, in 1975. 

From 1970 to 1973, he was with the Institute of Applied Cybernetics. In 1973, he joined the Technical University of Warsaw, where he was appointed Assistant Professor in 1975. From 1979 to 1981, he was a Visiting Assistant Professor of Electrical and Computer Engineering at CMU. Beginning in 1983, he was the Whitaker Professor of Electrical and Computer Engineering at CMU.

Professor Maly was the recipient and/or co-recipient of various awards. He received Carnegie Mellon's Benjamin Richard Teare Teaching Award; AT&T Foundation Award for Excellence in Instructing Engineering Students; Eta Kappa Nu CMU Sigma Chapter Excellence in Teaching Award; and the Semiconductor Research Corporation’s 2007 Aristotle Award.

His list of awarded research accomplishments includes honors for his Ph.D. thesis from Ministry of Higher Education of Poland; SRC’s 1992 Technical Excellence Award; the Best Paper Awards from the International Test Conference in 1990 and 1997; ESREF’s 1994 Best Paper Award; the 1994 Best Paper Awards from IEEE Transaction on Semiconductor Manufacturing; and Best Paper Award from 1996 European Design and Test Conference. He was a recipient of a Fellowship from Deutsche Forschungsgemeinschaft and Humboldt Research Award.

About the IEEE Council on Electronic Design Automation (CEDA)

The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters. 

Stay in Touch With IEEE CEDA

About The ESD Alliance

The ESD Alliance, a SEMI Technology Community, represents members of the ecosystem that provides goods and services spanning the conceptualization, design, verification, manufacturing and deployment of semiconductor-based electronic systems. The industry is essential to the global semiconductor industry as the driving force that enables new electronic systems to be conceived, designed and brought to market.

The ESD Alliance focuses on initiatives and activities that bring value to the entire industry:

  • Coordinating and amplifying the collective and regional voices of the industry
  • Continually promoting the value the industry delivers to the global semiconductor and electronics industry.
  • Addressing and defending threats and reducing risks to the industry.
  • Achieving efficiencies for the industry.
  • Marketing the attractiveness of the design ecosystem as an ideal industry for pursuing a career.
  • Enabling networking, sharing and collaboration across the industry.

Engage with the ESD Alliance

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

All trademarks and registered trademarks are the property of their respective owners.

Association Contacts

Nanette Collins/ESDA
Phone: 1.617.437.1822
Email: [email protected]   

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected] 

Laura Paul/IEEE-CEDA
Phone: 1.352.872.5544 Ext. 805
Email: [email protected]

MUNICH, Germany – September 11, 2024 –The SEMI MEMS & Imaging Sensors Summit, themed Sensor Revolution for a Connected Future, is set to bring together some of the world’s leading minds in sensor technology on November 14 at the International Conference Center Munich (ICM), Germany. Registration is open.

Mems & summitHosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community, the summit will showcase leading-edge innovations in wearable health monitoring, 300mm MEMS manufacturing for increased scalability, and energy-efficient AI for visual applications. Presentations will also explore advancements in hyperspectral imaging, light detection and ranging (LiDAR) for autonomous vehicles, and sustainable sensor technologies driving progress in healthcare, smart mobility, and sustainability.

"As the MEMS and imaging sensors landscape continues to evolve, we’re witnessing rapid advancements in technologies like AI and machine learning, opening doors to innovative applications that are transforming industries,” said Laith Altimime, president of SEMI Europe. “We are excited to bring together industry leaders at this year’s summit to explore how these cutting-edge technologies are coming together to enable sustainable growth and shape a connected future.”

Featured Speakers

The Summit will present a distinguished lineup of thought leaders, providing insights into emerging trends and the latest technological developments:

Industry-Leading Exhibitors at MEMS & Imaging Sensors Summit

  • AGP Co., Ltd
  • CEA-Leti
  • COMET Yxlon
  • EDA Solutions Limited
  • Eurofins | MASER
  • FormFactor
  • LAM Research
  • Philips MEMS & Micro Devices
  • Polyteknik AS
  • Pyxalis
  • QP Technologies (formerly Quik-Pak)
  • Schott AG
  • scia Systems GmbH
  • Shenzhen Angstrom Excellence Technology
  • Spraying Systems Deutschland GmbH
  • Ushio Inc.

Premier Sponsors

Contact Salil Gupte at [email protected] to explore sponsorship opportunities for the MEMS & Imaging Sensors Summit 2024.

For more information, please visit the MEMS & Sensors Imaging Summit website .

Stay connected with SEMI Europe on X or LinkedIn @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope

About SEMI

SEMI®is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON®expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit  www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Sitong He / SEMI Europe 
Phone: +49 151 5546 2638
Email:  [email protected]

Samer Bahou / SEMI Headquarters
Phone: 1.408.943.7870
Email: [email protected]

SEMI launches its Workforce Development Program in India to address the global talent gap and make youth job-ready

SEMI

 

SEMICON INDIA

DELHI, India – September 11, 2024 – SEMICON India 2024, the region’s premier semiconductor event, commenced today with a grand inauguration presided over by Hon’ble Prime Minister Narendra Modi at the India Exposition Mart Ltd. (IEML) in Greater Noida. Organized by SEMI in partnership with Messe München India, MeitY, India Semiconductor Mission (ISM) and Digital India, the event underscores India’s emergence as a global semiconductor powerhouse. SEMICON India 2024 brings leading global semiconductor industry companies to exhibit and present on addressing key challenges such as talent shortages, supply chain redesign, and sustainability concerns.

As part of its ongoing efforts to accelerate India's semiconductor growth, SEMI has officially launched its Workforce Development Program in India with a recent workshop on Semiconductor Manufacturing, held in partnership with ESSCI at IIT Delhi. The program emphasizes collaboration with educational institutions to create specialized curricula for semiconductor design roles and co-develop skill development initiatives. Addressing the global talent gap in the semiconductor industry, the launch aims to equip India’s robust engineering pipeline with the necessary skills to be job-ready for the fast-growing sector.

SEMICON India features additional SEMI programs to advance industry growth, such as Sustainability and Smart Manufacturing, supporting the favorable regulatory policies by the ISM and the Government of India and facilitating global investments to strengthen India's position in the industry. Representatives from Uttar Pradesh, Gujarat, Assam, Karnataka, Odisha, and Tamil Nadu will showcase their vision and policies designed to attract significant investments and drive growth, further highlighting India's collective ambition to become a key player in the global semiconductor landscape.

In his address, Honorable Prime Minister Narendra Modi emphasized the semiconductor industry’s critical role in India’s technological advancement and reaffirmed the government’s commitment to strengthening the sector.

Echoing this sentiment, Ajit Manocha, SEMI President and CEO, said, “India is on the path to becoming the next semiconductor powerhouse in Asia, and the stars are now aligned to create an ecosystem that enables growth for India and the world. With AI fueling global semiconductor demand, around 150 new fabs will be required to meet the industry’s ambitious $1 trillion target by 2030. India will need to achieve exponential growth to maximize its share, and SEMICON India will help to catalyze this market, augmenting ISM’s roadmap and favorable policies.”

“India is projected to face a workforce shortage of 250,000 to 300,000 professionals by 2027; upskilling India's raw talent to meet this demand is crucial, and global players have a vital role in this effort,” Manocha said. “In partnership with leading Indian institutions, SEMI aims to address this talent gap by equipping the future workforce with the necessary skills and expertise to thrive in the evolving semiconductor landscape."

“India Semiconductor Mission, Ministry of Electronics & IT, and Government of India are committed to a diversified and resilient semiconductor supply chain,” said ISM CEO Shri Akash Tripathi. “In the last 32 months, ISM has placed India in the semiconductor manufacturing map of the world, with four semiconductor manufacturing facilities coming up with a total investment of over USD 17 billion. With a very strong talent pipeline and strong resolve of GoI to support the development of the semiconductor industry in India, I am sure we will be successful in becoming a trusted partner in the global value chain of semiconductors in the coming years.”

SEMICON India 2024, co-located with electronica India and productronica India, features over 250 exhibitors, of which over 140 are international exhibitors, including global leaders such as SEMI, NXP, Foxconn, PSMC, Renesas, Tata Electronics, CG Power, Applied Materials and Cadence. Attendees will explore innovations in smart manufacturing, supply chain management, sustainability, and workforce development during the three-day event.

Program Sessions and Participating Companies

  • Advanced Packaging – Experts will discuss how 2.5D and 3D integration enable chiplets to be optimized for different functions while highlighting the role of heterogeneous integration in developing next-generation devices for artificial intelligence, high-performance computing, and other demanding applications. Participating companies include AMD, Applied Materials, BESI, KLA and Western Digital.
  • Design / EDA – This session will explore the march of technology in chip design and how tool vendors are evolving to equip designers with the capabilities needed to create and verify the next generation of chips. Participating companies include Breker Verification Systems, Cadence, Micron, Real Intent, Siemens and Synopsys.
  • Flexible Hybrid Electronics (FHE) – Speakers will delve into the latest advancements in FHE, focusing on advanced packaging techniques and healthcare applications while exploring market opportunities and the importance of environmental sustainability. Participating companies and organizations include Elephantech, ITC Packaging, MeitY, National Centre for Flexible Electronics, and Reddy Laboratories Ltd.
  • Smart Manufacturing – This program will feature presentations showcasing real-world applications of technology areas like automation, data utilization with AI and machine learning, and digital twins, providing attendees with a clear path towards integrating them into their own operations. Participating companies include Ansys, Applied Materials, Lam Research, Micron and Tata Electronics.
  • Smart MedTech – Experts will explore how advanced medical electronics and semiconductors are transforming patient care and healthcare supply chains, featuring insights into cutting-edge technologies and solutions for preventative care.
  • Supply Chain Management – This session aims to provide a holistic overview of the current landscape, challenges, and opportunities in the semiconductor supply chain in India, featuring insights from industry leaders in device manufacturing, semiconductor equipment manufacturing, and materials providers. Participating companies include Applied Materials, Lam Research, Tata Electronics, and TechInsights.
  • Sustainability – Experts will analyze sustainability vulnerabilities in the semiconductor industry, highlight existing resources that can be readily implemented, and explore innovative solutions to unsolved challenges. Participating companies and organizations include Applied Materials, Electramet, MeitY, and  Merck KGaA, Darmstadt, Germany.
  • Workforce Development –This session will offer a comprehensive overview of semiconductor workforce development in India with insights from industry leaders, educators, and government officials. Participants will review and adapt successful global initiatives to the Indian context and explore potential partnerships with local educational institutions, government agencies, and NGOs. Participating companies and organizations include AICTE, Applied Materials, ESSCI, and Micron.
  • In addition to the above, parallel sessions are planned themed around design ecosystem by Qualcomm, R&D for advanced packaging, and taxation regime of India.

For more details, please visit www.semiconindia.org and connect with SEMI India on LinkedIn and X (#SEMICONIndia).

SEMICON India Organization and Partners

SEMICON India 2024 is organized by SEMI, the global industry association representing the semiconductor and electronics design and manufacturing supply chain, in partnership with India Semiconductor Mission (ISM), Ministry of Electronics and IT (MeitY), and Messe München India, the Indian subsidiary of Messe München GmbH and a leading organizer of trade fairs in India. The SEMICON India 2024 program has been developed in partnership with the Electronic Industries Association of India (ELCINA) and with support from the India Electronics & Semiconductor Association (IESA) and India Cellular & Electronics Association (ICEA).

About SEMI

SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org , contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

About ISM

ISM was established on December 15, 2021, under the Digital India Corporation following the approval of the Union Cabinet chaired by Hon’ble Prime Minister of India. It is the nodal agency for the Semicon India Programme for Development of Semiconductors and Display Manufacturing Ecosystem in India with an outlay of ~USD 10 Bn. The India Semiconductor Mission (ISM) has been advancing India's strategies to develop a robust semiconductor and display ecosystem.

semi logo

 

IESA

DELHI, India – September 11, 2024 – In a strategic move to further solidify India's position in the global semiconductor value chain, SEMI®, the global industry association that connects the semiconductor and electronics design and manufacturing value chain, has announced a strategic agreement with the India Electronics and Semiconductor Association (IESA), the leading industry body representing the electronics and semiconductor sectors in India.  IESA will become part of the global SEMI family and represent SEMI in India. IESA will continue to use its current brand while beginning to implement SEMI’s processes and select initiatives.

The announcement comes at a pivotal time, the start of SEMICON India 2024, the flagship event aimed at bringing together global leaders, semiconductor industry experts, and key stakeholders under the theme of "Shaping the Semiconductor Future."

This unification is set to bolster India’s ambition to become a “Semiconductor Powerhouse” by advancing its design and manufacturing ecosystem. Together, the associations will enhance domestic manufacturing in line with India’s "Make in India" initiative, support workforce development, improve global competitiveness, and foster greater technological self-reliance. Additionally, SEMI members will now have direct access to India's growing semiconductor market, tapping into new growth opportunities.

Ajit Manocha, President and CEO, SEMI, expressed his excitement about this milestone, stating, “India holds immense potential in the semiconductor space, and many global companies are already exploring the opportunities within the country's semiconductor industry. This partnership will help SEMI grow a strong presence in this critical emerging market and enable both organizations to identify tangible strategies that leverage our combined strengths to enhance supply chain resilience."

Dr. Veerappan, Chairperson, and Ashok Chandak, President, IESA, emphasized the strategic significance of the partnership, saying, “This milestone is a major win for India, SEMI, and IESA. It positions India to become a global semiconductor powerhouse, accelerates economic growth, and fosters innovation. By combining our capabilities with SEMI’s global standards, network, and resources, we are fortifying India’s ambitions and attracting global partnerships and investments to scale up design, manufacturing, and production capacities.” 

This agreement will also pave the way for joint policy advocacy efforts, with IESA and SEMI working closely with both Central and State governments to drive incentives for product development and manufacturing, leveraging key programs such as the Production Linked Incentive (PLI) and Design Linked Incentive (DLI) models. 

The Semiconductor Executive Forum, held on 10th Sept ahead of the SEMICON India event chaired by Mr. Ashvini Vaishnaw, Hon’ble Minister for Railways, Electronics and IT and Information and Broadcasting, saw participation from over 100 industry leaders from SEMI member companies, with a significant participation of IESA members. Fourteen members (CxOs) from SEMI and IESA engaged in an interactive discussion with the Hon’ble Prime Minister of India, Mr. Narendra Modi, focusing on the fast-track development of the semiconductor ecosystem. Global CxOs elevated the forum with valuable insights, offering guidance to both the government and industry on how to transform the current industry momentum into sustained business growth. SEMICON India 2024, with 250+ exhibitors, 650+ booths, 100+ global companies and 50+ CxOs in attendance 11-13th Sept 2024, is shaping up to be the largest semiconductor event in India's history.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

About IESA

IESA is India's premier industry body for ESDM & Intelligent Electronics. Our main objective is to establish India as a leading global hub for electronics manufacturing and design. We work with government ministries, industry players, and academic institutions to facilitate the comprehensive implementation of the Program for Development of Semiconductor and Display Ecosystem. Our team of renowned experts in semiconductor and display technologies is committed to promoting technology solutions that positively impact the lives of 1.3 billion Indians.

For further information, please contact:

SEMI: 
Santosh Jochim, PRHUB - 7892772953

IESA:
Somdatta Sengupta, Consocia Advisory - 8861822111

Dr. Jason Cong to be Honored With 2024 Phil Kaufman Award

 

Recognized for Significant Contributions to FPGA Design Automation Technology and Electronic System Design Education and Industry

 

MILPITAS, Calif. –– September 5, 2024 ––Dr. Jason Cong, Distinguished Professor and Volgenau Chair for Engineering Excellence at the University of California, Los Angeles (UCLA), will be honored with the 2024 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD). 

 

The annual award from the Electronic System Design Alliance (ESD Alliance), a SEMI technology community, and the Council on Electronic Design Automation (CEDA) of the Institute of Electrical and Electronics Engineers (IEEE) will be presented at the Phil Kaufman Award presentation and banquet, November 6 in San Jose, Calif. The organizations are honoring Dr. Cong for his sustained fundamental contributions to Field-Programmable Gate Array (FPGA) design automation technology, from circuit to system levels, with widespread industrial impact. 

 

“Dr. Jason Cong is highly regarded in the industry for his work in FPGA synthesis and interconnect optimization and is recognized as a top researcher in the field,” said Dr. Anirudh Devgan, President and CEO of Cadence Design Systems and the 2021 Phil Kaufman Award honoree. “Along with his passion for teaching and mentoring the next generation of innovators, Jason has had a significant impact on the FPGA and EDA industries.”

 

“Jason Cong has made sustained, seminal contributions to design automation for FPGA designs, from chips to systems, across logic, layout, compilation, and applications, over a remarkable 30-plus-year span,” said Rob Rutenbar, Senior Vice Chancellor for Research, Distinguished Professor of CS and ECE at the University of Pittsburgh, and the 2017 Phil Kaufman Award recipient. “He is an inspiring and well-accomplished educator, mentor, and role model for generations of students who became successful faculty members, co-founders of startups, and key contributors to major EDA and semiconductor companies.”

 

“Dr. Cong has been a key innovator and EDA educator with outstanding technical contributions in design automation for FPGA designs, including logic, layout, compilation, and applications,” said Georges Gielen, Professor at KU Leuven and past Chair of the IEEE Council on EDA Awards Committee. “He has founded numerous successful startups, and with over 30 years on the faculty of UCLA, he and his numerous Ph.D. students continue to enhance the semiconductor industry.”

 

“The EDA industry would not be where it is today without Dr. Cong’s fundamental contributions to design automation for FPGA design and his strong role as an educator and mentor,” said Bob Smith, Executive Director of the ESD Alliance. “On behalf of SEMI and the ESD Alliance, I congratulate Dr. Cong on being honored with the 2024 Phil Kaufman award.”
 

About Dr. Jason Cong

Dr. Jason Cong is the Volgenau Chair for Engineering Excellence Professor at the UCLA Computer Science Department, and a former department chair, with joint appointment from the Electrical and Computer Engineering Department. He is the director of the Center for Domain-Specific Computing (CDSC) and the director of VLSI Architecture, Synthesis, and Technology (VAST) Laboratory. Dr. Cong’s research interests include novel architectures and compilation for customizable computing, synthesis of VLSI circuits and systems, and quantum computing.

 

He has over 500 publications in these areas, including 18 best paper awards, and four papers in the FPGA and Reconfigurable Computing Hall of Fame. He and his former students co-founded AutoESL, which developed the most widely used high-level synthesis tool for FPGAs. The tool was renamed to Vivado HLS and Vitis HLS after Xilinx’s acquisition. Dr. Cong is member of the National Academy of Engineering and the American Academy of Arts and Sciences, and a Fellow of ACM, IEEE, and the National Academy of Inventors. He is recipient of the Semiconductor Industry Association (SIA) University Research Award, the EDAA Achievement Award, and the ISPD Lifetime Achievement Award, and he received the IEEE Robert N. Noyce Medal for “fundamental contributions to electronic design automation and FPGA design methods.”

 

He received his Bachelor of Science degree in Computer Science from Peking University in Beijing, China, in 1985, and his Master of Science and Ph.D. degrees in Computer Science from the University of Illinois at Urbana-Champaign in 1987 and 1990, respectively. 

 

About the Phil Kaufman Award

The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2023 recipient was Dr. Lawrence T. Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University. 

 

About the IEEE Council on Electronic Design Automation (CEDA)

The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters. 

 

Stay in Touch With IEEE CEDA

 

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

Follow the ESD Alliance

 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

 

All trademarks and registered trademarks are the property of their respective owners.

 

Association Contacts

Nanette Collins/ESDA                                                                                                

Phone: 1.617.437.1822                                  

Email: [email protected]       

 

Samer Bahou/SEMI

Phone: 1.408.943.7870

Email: [email protected] 

 

Laura Paul/IEEE-CEDA

Phone: 1.352.872.5544 Ext. 805

Email: [email protected]

 

 

MILPITAS, Calif. – September 4, 2024 – Global semiconductor equipment billings increased 4% year-over-year to US$26.8 billion in the second quarter of 2024, while quarter-over-quarter billings edged up 1% during the same period, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

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“Global semiconductor equipment billings totaled $53.2 billion for the first half of 2024, reflecting a healthy year so far for the industry overall,” said Ajit Manocha, SEMI President and CEO. “The semiconductor equipment market has returned to growth driven by strategic investments to support continued strong demand for advanced technologies and regions seeking to bolster their chipmaking ecosystems.” 

 

 

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

 

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

  • Monthly SEMI Billings Report, a perspective on equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
  • SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Download a sample of the EMDS report.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.  

 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

 

Association Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870

Email: [email protected] 

MILPITAS, Calif. – September 4, 2024 – The MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community, today announced an updated Request for Proposals (RFP) for the development and manufacture of positioning, navigation and timing (PNT) components and systems. The full RFP contains information on the submission process. 

The MSIG PNT program, a public-private partnership with the U.S Army Research Laboratory, advances PNT solutions that pinpoint the position of stationary and mobile assets and enable their navigation under mission-critical situations. SEMI MSIG expects to announce multiple awards to teams or U.S. organizations with a diverse range of research and development capabilities. White paper proposals are due September 23, 2024, at 5:00 p.m. PDT.

 

Specific focus areas identified by the MSIG Technical Council include:

  • Thrust Area 1: Novel Materials, Fabrication, Packaging, and Testing Techniques for Low-SWaP Inertial and PNT Sensors

  • Thrust Area 2: Advanced Active and Passive Integrated Photonics for Low-SWaP Atomic Clocks, Quantum Systems, and PNT Sensors

  • Thrust Area 3: Advancements Towards Low-SWaP-C, GPS-Free PNT Technologies

Subject matter experts from the SEMI MSIG Technical Advisory and Governing Councils and the U.S Department of Defense will evaluate, prioritize, review, and manage the proposals and their resulting projects. Funding granted by SEMI MSIG must be matched with funds in the form of cash and in-kind contributions from the grant recipient to cover total project costs. On average, the industry has covered nearly 60% of the funding for the previous PNT development projects. 

 

“We invite proposals that will innovate and push the leading-edge in MEMS devices and their manufacture,” said Tim Brosnihan, executive director of SEMI MSIG. “This round of funding marks the third of the 5-year project.”

The intent of the R&D funding is to build on phase two of the SEMI MSIG PNT program, as well as identify new areas and approaches to PNT solutions for GPS-denied environments. Emphasis will be placed on system solutions, including but not limited to software, sensor fusion, cost-effective process innovation, advanced packaging solutions, component innovations, and disruptive materials development. 

 

R&D may cover software, hardware, and advanced packaging requirements of optical and MEMS-based positioning and timing systems that improve bias stability and reduce sensor noise. Technical solutions will need to address the total GPS-denied problem, meeting the system-level performance necessary to advance the state of the art.

 

SEMI MSIG will provide information about the RFP during a webinar to be held from 8:00-9:00 a.m. PDT on September 6, 2024. 

 

About SEMI

 

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

 

Association Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870

Email: [email protected] 

GREATER NOIDA, India – September 4, 2024 – SEMICON India 2024 will bring together global leaders, semiconductor industry experts, academia, and government officials from September 11-13, 2024, at the India Exposition Mart Ltd. (IEML) in Greater Noida, Delhi NCR. The event will offer valuable insights into innovations and trends in key areas such as smart manufacturing, supply chain management, sustainability, and workforce development. The event’s extensive exhibition will feature over 250 exhibitors from across the global semiconductor supply chain and will be co-located with electronica India and productronica India, providing Southeast Asia’s single largest platform for showcasing the latest advancements in the semiconductor and electronics industries. Registration is open.

A black background with green text

Description automatically generatedThe SEMICON India 2024 program is designed to maximize technological advancements in the semiconductor and electronics domain and highlight India’s policies aimed at strengthening its semiconductor ecosystem. Themed Shaping the Semiconductor Future, the event will showcase the country’s growing semiconductor ecosystem with support from the Ministry of Electronics and Information Technology (MeitY) and the India Semiconductor Mission (ISM), Government of India (GoI). Additionally, officials from state governments – including host state Uttar Pradesh and Gujarat, Assam, Karnataka, Odisha, and Tamil Nadu – will share their vision for ecosystem expansion with progressive and industry-friendly policies for attracting investments in the semiconductor and display ecosystems.

“India is primed to blossom as a global semiconductor hub, as the chip industry seeks to bolster supply chain resiliency, serve the rapidly growing electronics market, and employ the region’s wealth of engineering talent,” said Ajit Manocha, SEMI President and CEO. “SEMI is bringing the collective power and expertise of our member companies in the global electronics design and manufacturing supply chain to SEMICON India, along with hallmark SEMICON opportunities for networking, new business, and tech and market updates from top experts. This is not just a new exposition – SEMICON India represents a path to accelerate the growth of the India semiconductor ecosystem as SEMI and SEMICONs have done in other key industry regions over the past half century.”

“India Semiconductor Mission, Ministry of Electronics & IT, and Government of India are committed to a diversified and resilient semiconductor supply chain,” said ISM CEO Shri Akash Tripathi. “In the last 32 months, ISM has placed India in the semiconductor manufacturing map of the world with four semiconductor manufacturing facilities coming up with a total investment of over USD 17billion. With a very strong talent pipeline and strong resolve of GoI to support the development of the semiconductor industry in India, I am sure we will be a successful in becoming a trusted partner in the global value chain of semiconductors in the coming years.” 

Opening Ceremony and Keynote Program

Hon’ble Prime Minister of India, Shri Narendra Modi, will inaugurate SEMICON India and the accompanying exhibition on September 11, 2024. The opening ceremony will feature keynotes by prominent industry leadership from SEMI, NXP, Foxconn, PSMC, Renesas, Tata Electronics, and CG Power. The ceremony will be followed by keynote sessions themed around smart manufacturing, supply chain management, sustainability, and workforce development:

  • The keynote session on Wednesday, September 11 will feature the theme Creating a Vibrant Semiconductor Manufacturing Ecosystem in India and a roundtable discussion themed Academia Perspectives on "Opportunity India."
  • The session on Thursday, September 12 themed Global Market, Local Execution – The Benefits of Cross-Regional Partnerships will conclude with a roundtable looking at Perspectives on Lessons Learned from Greenfield Projects in Other Regions.
  • In addition to government officials, company representatives from Applied Materials, Cadence, CG Power, KLA, Lam Research, Micron, NXP, Renesas, TATA Electronics, Tokyo Electron, and many other industry leaders will participate.

Additional Program Sessions and Participating Companies

  • Advanced Packaging – Experts will discuss how 2.5D and 3D integration enable chiplets to be optimized for different functions while highlighting the role of heterogeneous integration in developing next-generation devices for artificial intelligence, high-performance computing, and other demanding applications. Participating companies include AMD, Applied Materials, BESI, KLA and Western Digital.
  • Design / EDA – This session will explore the march of technology in chip design and how tool vendors are evolving to equip designers with the capabilities needed to create and verify the next generation of chips. Participating companies include Breker Verification Systems, Cadence, Micron, Real Intent, Siemens and Synopsys.
  • Flexible Hybrid Electronics (FHE) – Speakers will delve into the latest advancements in FHE, focusing on advanced packaging techniques and healthcare applications while exploring market opportunities and the importance of environmental sustainability. Participating companies and organizations include Elephantech, ITC Packaging, MeitY, National Centre for Flexible Electronics, and Reddy Laboratories ltd.
  • Smart Manufacturing – This program will feature presentations showcasing real-world applications of technology areas like automation, data utilization with AI and machine learning, and digital twins, providing attendees with a clear path towards integrating them into their own operations. Participating companies include Ansys, Applied Materials, Lam Research, Micron and Tata Electronics.
  • Smart MedTech – Experts will explore how advanced medical electronics and semiconductors are transforming patient care and healthcare supply chains, featuring insights into cutting-edge technologies and solutions for preventative care.
  • Supply Chain Management – This session aims to provide a holistic overview of the current landscape, challenges, and opportunities in the semiconductor supply chain in India, featuring insights from industry leaders in device manufacturing, semiconductor equipment manufacturing, and materials providers. Participating companies include Applied Materials, Lam Research, Tata Electronics, and TechInsights.
  • Sustainability – Experts will analyze sustainability vulnerabilities in the semiconductor industry, highlight existing resources that can be readily implemented, and explore innovative solutions to unsolved challenges. Participating companies and organizations include Applied Materials, Electramet, MeitY, and  Merck KGaA, Darmstadt, Germany.
  • Workforce Development –This session will offer a comprehensive overview of semiconductor workforce development in India with insights from industry leaders, educators, and government officials. Participants will review and adapt successful global initiatives to the Indian context and explore potential partnerships with local educational institutions, government agencies, and NGOs. Participating companies and organizations include AICTE, Applied Materials, ESSCI, and Micron.
  • In addition to the above, parallel sessions are planned themed around design ecosystem by Qualcomm, R&D for advanced packaging, and taxation regime of India. 

For more details, please visit www.semiconindia.org and connect with SEMI India on LinkedIn and X (#SEMICONIndia).

Press and media partners can register for free by contacting Samer Bahou at [email protected]. 

SEMICON India Sponsors

SEMICON India Organization and Partners

SEMICON India 2024 is organized by SEMI, the global industry association representing the semiconductor and electronics design and manufacturing supply chain, in partnership with India Semiconductor Mission (ISM), Ministry of Electronics and IT (MeitY), and Messe München India, the Indian subsidiary of Messe München GmbH and a leading organizer of trade fairs in India. The SEMICON India 2024 program has been developed in partnership with the Electronic Industries Association of India (ELCINA) and with support from the India Electronics & Semiconductor Association (IESA) and India Cellular & Electronics Association (ICEA). 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

About ISM

ISM was established on December 15, 2021, under the Digital India Corporation following the approval of the Union Cabinet chaired by Hon’ble Prime Minister of India.  It is the nodal agency for the Semicon India Programme for Development of Semiconductors and Display Manufacturing Ecosystem in India with an outlay of ~USD 10 Bn.  The India Semiconductor Mission (ISM) has been advancing India's strategies to develop a robust semiconductor and display ecosystem. 

Association Contact

Samer Bahou
Phone: 1.408.943.7870
Email: [email protected] 

TAIPEI – September 4, 2024 – SEMICON Taiwan 2024 SEMI opens today at the Taipei Nangang Exibition Center (TaiNEX Hall 2) with industry leaders and visionaries set to take part in this year’s CEO Summit keynote program. The program culminates in a first-of-its-kind AI Chip Fireside Chat that will bring together key leaders from ASE Group, Google, Samsung, and TSMC to look at AI’s role in propelling the global semiconductor industry to $1 trillion in annual revenue near the end of this decade. Registration is open. 

A purple and black text

Description automatically generatedThe fireside chat will focus on how AI is driving global economic growth, strategies to address technical challenges and opportunities surrounding chips, and how different industries can accelerate cross-sector collaboration with the semiconductor ecosystem. Panelists include:

  • Hamidou Dia, Vice President of Applied AI Engineering, Google 

  • Dr. Jung-Bae Lee, Corporate President and Head of Memory Business, Samsung Electronics

  • Dr. Y.J., Mii, Executive Vice President and Co-COO, TSMC

  • Dr. Tien Wu, CEO, ASE Group, will moderate

CEO Summit keynotes will spotlight the AI revolution as it relates to manufacturing, packaging and testing, memory, and chip design. Presenters include:

  • Gary Dickerson, President and CEO Applied Materials

  • Dr. Luc Van den hove, President and CEO, imec

  • Noam Mizrahi, Executive Vice President and Corporate CTO, Marvell

  • Rani Borkar, Corporate Vice President, Azure Hardware Systems and Infrastructure, Microsoft

  • The aforementioned Dr. Lee of Samsung Electronics

  • Justin Kim, President, SK hynix

Record-setting Exhibition

Themed Breaking Limits: Powering the AI ​​Era, SEMICON Taiwan 2024 will feature an exhibition from September 4-6 with more than 3,700 booths – a record event high – and over 1,100 exhibitors showcasing groundbreaking semiconductor technology innovations and smart applications. As the largest and most influential annual semiconductor event on the Silicon Island, SEMICON Taiwan 2024 is expected to attract 85,000 visitors from 56 countries.

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org to learn more.

 

Association Contacts

Elma Fang/SEMI Taiwan

Phone: 886. 3-560-1777 #211

Email: [email protected]

 

Samer Bahou / SEMI Headquarters

Phone: 1.408.943.7870

Email: [email protected]

MILPITAS, Calif. – September 3, 2024 – Seeking to bolster global semiconductor value chain efforts to lower greenhouse gas (GHG) emissions, the industry association SEMI released today an analysis by its Energy Collaborative (EC) of current and forecasted low-carbon energy (LCE) markets for Japan, the second in a series of market-specific reports. Developed by the SEMI EC and its sponsors, incorporating insights from the Japanese government and partner organizations, the report outlines policy changes and investments required to increase LCE supply.

Japan is cited as one of the two most challenging markets for clean energy procurement in the latest annual disclosure report from RE100, a consortium of more than 400 companies committed to using 100% renewable energy. In 2022, LCE made up only 27% of Japan’s electricity generation mix with the remaining 73% covered by fossil fuels. The EC projects the total LCE demand in Japan in 2030 to be 390 to 450 TWh, with the best-case-scenario being that supply falls 20-80 TWh short of demand, providing for only 20%-50% of total voluntary corporate demand. 

“The Japan government has goals to revitalize the semiconductor industry and triple global production from JPY 5 trillion now to JPY 15 trillion in 2030,” said Mousumi Bhat, PhD, Vice President, Global Sustainability Programs. “To do so, the industry will need access to LCE to meet its customers’ decarbonization expectations.”

The EC report recommends accelerating the installation of LCE in Japan by:

  • Updating land usage policies that enable greater access for LCE development
  • Alleviating current policy impediments to facilitate expanding and accelerating offshore wind development 
  • Overcoming transmission grid bottlenecks with greater clarity on long term grid development plan and implementation / project delivery
  • Fostering community collaboration that accelerates designation of LCE promotion zones across the country
  • Facilitating collaboration among industries to propagate knowledge of corporate LCE procurement mechanisms.

“The analysis and findings of this substantial body of research provides a strong basis for collaboration with the semiconductor industry, facilitated by the Energy Collaborative’s meetings with government, infrastructure, and other industry leaders,” said Bhat. We provide detailed scenarios of our industry’s needs, energy technology analysis, and the voice of a critical energy customer as the local government plans policies that impact future supply of LCE.”

Each recommendation is supported by detailed analysis of current and historical market conditions in Japan and draws from concrete examples of how other regions have successfully implemented similar measures to drive LCE adoption.  

The Energy Collaborative report Key Challenges and Potential Solutions for Expansion and Procurement of Low-Carbon Electricity on Japan is the second of five, joining the report on South Korea. The EC will also analyze Taiwan, Malaysia and Singapore. Organizations sponsoring the EC will get access to more detailed analysis of each region. More information on the benefits of membership and sponsoring the Energy Collaborative initiative is available by contacting Jamie Belliveau at [email protected].

About the Energy Collaborative

The SEMI Energy Collaborative is dedicated to engaging a leadership network of corporations and domain experts to accelerate the pace of adoption of renewable energy solutions together with regional governments and regulators in key markets. Through collaboration with the semiconductor value chain, the EC aspires to improve the currently untenable trajectory of semiconductor manufacturing emissions. Companies sharing this vision from across the semiconductor and energy ecosystems sponsor the EC, along with partners from civil society and non-profit organizations.

About SEMI

SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org , contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

 

Association Contact
Samer Bahou
Phone: 1.408.943.7870
Email: [email protected]