semiconductors

The semiconductor industry felt more of a fourth-quarter slowdown than the end markets.  Semiconductor-related products are typically much more volatile than the electronic equipment markets they serve.

SEMI has long promoted the industry collaboration that has contributed to the rise of the smart digital world we live in today. A world where data is being generated continuously by systems, gadgets, and sensors around us – often referred to as the Internet of Things (IoT). In our personal lives, most of us have smartphones, smart watches, smart TVs and smart cars, and we live in smart homes and smart cities generating huge amounts of data.In the work world, data and analytics are now influencing almost every industry including healthcare, government, financial services, construction and transportation. This data has the potential to transform our lives and make our world even smarter – if we can communicate and process this data, and use it to come up with actionable recommendations or actions. Artificial Intelligence (AI) and Machine Learning (ML) techniques have generated much excitement precisely because they offer us ways to realize the full value of data by harnessing it and transforming it into active intelligence.Data-intensive technologies are required to store, communicate and analyze data. And it all starts with innovation in microelectronics chips and systems spanning processors, memory, sensors, radios and other devices, presenting a huge opportunity to producers of these technologies. However, with Moore's Law beginning to slow, technology paths and innovation options are diverging. Companies must swiftly assess these options in order to develop competitive offerings. But the technological complexity and divergence makes it increasingly expensive or even unaffordable for many companies to track and pursue these options.The good news is that cost-effective early assessment is possible through pre-competitive collaboration that can produce new and often unexpected cross-disciplinary insights by overcoming traditional silos in industry and academia. Unfortunately, important collaborative industry platforms, such as the International Technology Roadmap for Semiconductors (ITRS), have folded, opening a collaboration gap in the global microelectronics ecosystem.As part of its mission to help companies connect, collaborate, and innovate, SEMI has built a collaborative, cross-supply-chain platform – the Strategic Innovation Platform (SIP). The goal is to provide early and comprehensive assessment of future technologies that are five to eight years away from commercialization. The assessment identifies not just technical barriers but also manufacturing and supply-chain constraints to implementing new technologies. SIP brings together the entire microelectronics ecosystem including strategic technology thought leaders, subject matter experts, technology and application developers, academia, researchers, start-ups and government. With more than 2,100-member companies spread across the global electronics manufacturing supply chain, SEMI is uniquely positioned to enable this critical collaboration. Award-Winning First ProjectThe inaugural SIP project assessed key drivers of future technologies. A key finding was that fast, efficient interconnects between devices and components are critical to the system performance important to customers and users, implying that system-level optimization is required. For data-intensive applications, interconnects have emerged as a key bottleneck for both performance and power in various circuits and systems in part because the slowing of Moore’s Law has decelerated advances in individual device performance, and in part because systems are becoming more complex, requiring heterogeneous integration.To address this challenge, SIP brought together industry experts from ASE Inc., Dow Chemical, Lam Research, Qualcomm and Xilinx to assess the future impact of interconnects for data-intensive applications. SEMI also involved Stanford University professors to collaborate on modeling and simulation. Through this unique cross-disciplinary collaboration, SIP developed a realistic model to evaluate the system-level performance of single-chip systems, as well as multi-chip systems – including traditional 2D packages, high-performance 2.5D systems that use interposers, and futuristic 3D systems. SIP also explored supply chain challenges in business continuity, manufacturability, Environment, Health and Safety (EHS) and the regulatory environment. SEMI worked with a broad range of industry partners to ensure that the model parameters accurately reflected realities on the design and factory floors to ensure usable results. Experimentation has become ever more expensive, with one industry player reporting that “it costs us $100 million to do a good experimental evaluation.” Accurate models can go a long way toward reducing the cost of technology assessment. The SIP collaboration produced key quantifiable insights including comparisons that highlight the benefits and limitations of various materials being explored for future interconnects, and of architectures under consideration for future data-intensive applications. For example, the current workhorse for artificial intelligence (AI) platforms – 2.5D technology – delivers a 4X improvement over 2D packaging but falls short of providing the orders-of-magnitude improvement that future AI/ML applications may require. These findings enable the industry to begin to identify ways to optimize 2.5D architectures, transition to 3D heterogeneous integration for performance-critical applications in the medium term, and to eventually evaluate new paradigms such as neuromorphic and quantum. The project findings were presented late last year in the form of two research papers at Electronics System-Integration Technology Conferences (ESTC) and International Microelectronics Assembly and Packaging Society (IMAPS) recently. One received the “Best Paper of the Session” award at IMAPS – a recognition that affirms the power of a collaborative platform such as SIP to produce valuable insights to address the growing technology complexity within the microelectronics industry. The microelectronics industry is on the cusp of a historic inflection point, where it could fuel the rise of emerging applications in AI/ML and IoT, and can grow into a trillion dollar industry over the next several years. More importantly, the industry is poised to help solve some of society’s most complex problems in areas including healthy living, climate change and transportation. No company can do this alone, and pre-competitive platforms such as SIP are key both to accelerating innovation through cross-disciplinary collaboration, and to reducing costs for individual companies. Please contact Tom Salmon at [email protected] or Pushkar Apte at [email protected] for more details and to get involved in future projects.Tom Salmon is vice president of Collaborative Technology Platforms. Pushkar Apte is a strategic technology advisor at SEMI.

The more than 53,000 people who flocked to SEMICON Korea last month were treated to a motherlode of insight into the future of the semiconductor industry as 470 companies exhibited innovative technologies in more than 2,000 booths. But the annual event’s most arresting numbers came in keynotes and other presentations pointing to the extraordinary industry growth that lies ahead.“It is no exaggeration to say that 90 percent of the world’s data has been generated in the last few years,” said Jim Feldhan, president of Semico Research. “This explosive growth of data is expected to continue. That's why server shipments will grow by 20.3 percent, or 30 million units, this year alone.”Feldhan said that the Internet of Things (IoT) will be a chief driver of semiconductor industry growth, with IoT expected to be applied in areas as varied as automotive, smart cities, edge computers, finance, architecture, agriculture and healthcare. For its part, artificial intelligence (AI) will start to exercise human-like judgment. Feldhan noted that in many instances in these fields, “it is more accurate to apply AI and vision systems than to rely on traditional decision-making.”Yoon Jong Lee, senior vice president of DB HiTek, predicted that the Internet, AI and 5G will drive market growth. “Looking back over the past 30 years, semiconductor market growth was powered by PCs, the Internet and cell phones, yet last year memory accounted for 35 percent of total semiconductor sales, more than double the figure in 2016,” he said. He predicted that, in 2019, the foundry sector will outstrip the semiconductor market in growth, noting that the average growth rate of the semiconductor industry is expected to be 4.1 percent, compared to 7.1 percent for the foundry market. Clark Tseng, director of SEMI, reported that the strong semiconductor growth in 2018 is unlikely to continue in 2019 due to the decline in memory pricing, as well as mobile and PC demand. “Demand for semiconductors is likely to decline in the first half as the industry is still digesting inventory and rebound in the second,” Tseng said. Semiconductor industry growth headwinds include decreases in high-end smartphone purchases, PC demand and demand for DRAMs for servers in data centers, Tseng said. Declines in economic growth and consumption in China and the U.S.-China trade war will also contribute to a slowdown. However, Tseng noted that, over the long term, technology innovation will continue and that the semiconductor industry’s prospects remain bright.One key innovation will be the elimination of AI’s reliance on Internet connections in the future. In his opening day keynote, Eunsoo Shim, senior vice president at Samsung Electronics, emphasized that AI technology that operates without the Internet in the future is essential. “We are developing 'on-device AI' technology that incorporates AI algorithms in products such as smartphones and autonomous vehicles,” he said. "When on-device AI technology is implemented, it reduces reliance on the Internet, battery consumption, and data latency.” Reducing latency will significantly improve device response time.Walden C. Rhines, CEO Emeritus of Mentor, a Siemens business, predicted that AI will fuel rapid memory growth. The memory semiconductor (DRAM, NAND flash) market is expected to see a temporary slowdown this year, with the market expected to rebound in 2020. Rhines said that memory could be seen as an early market with rapid future growth, citing memory market super-booms in 1995 and 2000.“Memory production has not decreased since 1995 or 2000,” he said. “Although memory prices will temporarily fall this year after significant market growth in 2017 to 2018, the market will continue to grow as memory production increases,” he said. Rhines added that “although memory prices will drop by about 10 percent this year, he believes prices will increase 6 percent next year.” He also predicted the steady growth of the non-memory semiconductor market as AI technology matures and China’s investment in fabless companies continues.Indeed, SEMICON Korea speakers made it clear that concerns about the growth of the semiconductor industry are expected to be short-lived. While overall growth is likely to slow in 2019, the industry is expected to rebound steadily – powered by the semiconductor industry paradigm shift led by AI, IOT, and autonomous driving – and reach a new high of nearly $541 billion in 2020.Jaegwan Shim is a marketing specialist at SEMI Korea.

For public policy lovers, civic-minded, engaged U.S. citizens, and people around the world interested in the U.S. President’s positions and priorities, the annual State of the Union address (SOTU) is “must-see TV.” This year, the anticipation and expectations were different than with past presidents. President Trump is the first U.S. president who has used social media to the extreme that he has. President Trump’s prolific Twitter feed has had an interesting impact on the SOTU. U.S. citizens and people from around the world already know President Trump’s positions on issues, his policy priorities and what gets him excited. There is an ongoing, direct line to the President’s thoughts throughout each and every day. In the past we looked to the SOTU for insights into what the sitting president is really thinking and his future policy priorities. Now, there isn’t much we don’t already know.One looming question this year was whether President Trump would reach out in a conciliatory manner to help bridge the political divide and lay the groundwork to enable some public policy wins and avoid another government shutdown. While there were moments of conciliation, the President made it clear he would not move on areas that are most contentious with the other side of the aisle. For example, the President unequivocally reiterated his intent to build the wall. While the message plays well to his base, it is, in effect, a frontal assault and challenge to Democrats. It’s hard to image that his staunch stance will help move the two parties to work together on substantive policy issues. It may also mean that the wall issue will occupy lawmakers time for the foreseeable future, sidelining debate on other important issues.The best hope is that a bipartisan bill finds its way to the President’s desk that he can sign and use to “declare victory.” However, many political observers believe the likelihood of the President declaring a national security emergency is rising as a maneuver to ensure funding for the wall and avoid a shutdown. While such a declaration would most likely face a court challenge, the President could claim that his decision was a move of last resort and leverage the moment to position Democrats as obstructionists to his base. The scenario does not bode well for the bipartisan support necessary to address other issues.What does this mean for our industry? Were there any points raised in the SOTU that would signal a change in what we are facing regarding trade, tariffs, export controls and immigration? Were any new issues or ideas raised that could help lift the global economy? In short, no. On one hand, the President cited his good relationship with the president of China, but on the other doubled down on his attacks on China, seeming to stand firm to bolster his position at the table as the U.S. and China trade talks continue.What do these dynamics mean for SEMI Global Advocacy? In 2018 we were heavily engaged in efforts to prevent regulations that would inhibit our members' ability to develop and deploy technologies and maintain global market access. We advanced our global advocacy model, leveraging our regional presence around the world. Many of the potential issues we faced emanated from the U.S., including those focused on controlling technology development, limiting trade and enhancing export controls. We also intensified our efforts to address industry talent pipeline issues.In 2019, our public policy focus will be to continue to push back on tariffs, engage members to inform the rule-making process for export controls and to attempt to influence the immigration debate as it pertains to access to talent. In addition, while the U.S. R D tax credit was made permanent through the tax cut in 2017, some of the provisions may have unintended consequences and will need to be modified. How the law is enacted will affect how businesses can deduct qualified research and development and other expenses from their taxable income, so we anticipate activity on the tax front as well.It will also be a big year for SEMI on the workforce development front. SEMI will continue to grow its existing High Tech U (HTU), university and mentor programs. In addition, SEMI will be positioning itself as the global leader in addressing issues related to the talent pipeline by approaching the problem with a full-spectrum, holistic approach that is intended to better address more immediate needs in attracting, training and retaining qualified talent. We’ll also focus on improving the industry image and exciting students at a younger age by providing experiential learning activities throughout a defined educational pathway. Stay tuned on this front as the full program unfolds.In general, we will continue to build our relationships and stature as a leading voice for our members and the end-to-end semiconductor supply chain in the areas of talent, trade, tax and technology (SEMI’s “4 Ts”) and to ensure free and fair trade, access to markets, supply chain growth, IP protections and enhanced efforts to improve cybersecurity. Mike Russo is VP of Global Industry Advocacy at SEMI.

Critical subsystems for the IC equipment market continued to grow to a new record of $11 billion in 2018. While 2019 is expected to be a downturn year, the long-term outlook remains unchanged with an average growth rate of 3 percent. Last year may have been a new high for revenues, but it will be remembered as a year of two parts: record quarterly revenues in Q1, followed by rapidly falling orders in Q3 and Q4. Normally, this would not be a problem as suppliers are used to managing volatility in their businesses. However, encouraged by solid end market drivers and optimistic customers, the timing of this downturn was particularly bad as it coincided with the addition of significant new manufacturing capacity for critical subsystems that will be needed to supply the industry into the next decade. The resulting step change in costs against the backdrop of falling revenues has put strain on the financials of these suppliers. Although current visibility is poor, the order decline appears to be stabilising and the worst is nearly over. Revenues are expected to recover in the second half of 2019 followed by a promising outlook for the following three years. Critical Subsystems for IC equipment history and forecast to 2022. After a pause in 2019, the trend is expected to continue to reach new industry records. Suppliers of subsystems used in vacuum process tools, such as deposition and etch, have benefited the most from critical subsystems growth since 2012. Vacuum intensity of semiconductor processing continues to grow and in 2018 the value of vacuum process tools exceeded the value of non-vacuum process tools for the first time. This trend is expected to continue with vacuum based semiconductor process equipment accounting for over 60 percent of wafer fab equipment revenues by 2023. In summary, 2019 is expected to be down 10 percent to 20 percent as the industry digests the recent large additions to semiconductor manufacturing capacity, followed by a new cycle starting in 2020.Julian West is a technical and marketing analyst at VLSI Research Europe.

SEMI’s Environment, Health Safety (EHS) Advocacy program has been helping the semiconductor manufacturing supply chain collectively address common challenges for over 20 years. Now, as national and regional governments worldwide increasingly weigh legislation that could impact the industry, SEMI continues to ensure that microelectronics industry understands the potential impact and provides an effective platform for taking collective member-led action.Olivier Corvez recently joined SEMI to focus exclusively on shaping SEMI’s EHS Advocacy program to meet escalating demands on the industry. He recently sat down with SEMI’s communications team to discuss SEMI's evolving EHS Advocacy program. SEMI Communications: As senior manager of EHS Advocacy, based at SEMI’s Milpitas, California, headquarters, what do you see as the major issues impacting EHS Advocacy for electronics manufacturing worldwide?Corvez: EHS is a vast topic that cuts across many different types of issues such as regulatory compliance obligations, management systems performances, as well as sustainability related public disclosures. SEMI’s global members are engaged on all these fronts, while creating advanced materials, sophisticated tools and managing a complicated and extensive supply chain.On the regulatory side, there has been exponential growth in the number of EHS laws considered and adopted by legislatures worldwide. Often these new regulations generate shockwaves across the globe as member companies are required to adapt to new requirements that spread across the entire manufacturing supply chain.Many new regulations are originating from Europe and demand much of my attention. We are paying especially close attention to the Stockholm Convention on eliminating persistent organic pollutants. A chemical called PFOA has been a subject of much effort at SEMI for years now and we are heartened by the reception of our position by the European Commission.SEMI Communications: What do you find most interesting about operating the EHS Advocacy program at SEMI?Corvez: The first word that comes to mind is “variety.” This role involves a blend of strategy, regulatory interpretation skills, project management, communication and even accounting. There is always something new to learn and positions and strategies to develop.SEMI, as a member-driven, collaborative platform, needs a high level of knowledge sharing and communications. I am working to establish a workspace where members can share previously-created analyses and minimize “recreating the wheel.” We have ambitious plans to deploy additional tools and a redesigned website that will improve our knowledge-sharing capabilities and best serve our members.We also plan to renew collaboration with other industry associations such as SIA and SESHA. Partnering with other associations means our voice is stronger, our messaging is reinforced, and our efforts are coordinated. Last but not least, I believe that maintaining a sense of geographical proximity for SEMI’s worldwide efforts is important. SEMI’s local advocacy efforts are facilitated by SEMI regional staff and I look forward to collaborating with them as they maintain ongoing dialogue with our local members and their local, state and national governments. SEMI Communications: What is the most challenging part of your role?Corvez: The most challenging aspect will be to reinvigorate participation in all of our EHS activities and find ways to create a state of fruitful collaboration among members worldwide. Secondly, establishing a new EHS governance structure is a significant challenge, but it is incredibly important to have a strong leadership group and decision-making mechanism that will efficiently help define our vision and priorities.Our new direction will require members to lead our activities at all levels. We believe there is a strong ROI for companies to dedicate resources to address the issues or topics we need to pursue to keep them and their products, accepted, profitable and the industry to grow. While SEMI provides the platform for collaboration, we must supplement our efforts with members providing the manpower to ensure our activities are a success.SEMI Communications: Tell us about your background. Corvez: I bring 20 years of diverse experience as a consultant, auditor and corporate EHS program management across most economic sectors on a global scale. Recently, I managed an EHS team distributed across 10 countries, dedicated to providing EHS compliance support to Cisco facilities worldwide.In addition to compliance experience, I have worked on implementing EHS Management systems at ABB or Total while in France (primarily) in the late 1990s. While at KPMG in Paris I was involved in over 400 due diligence projects for transactions services for electronics, chemicals, auto industry, aeronautics, etc. On the sustainability reporting side, I was lucky to be involved with large corporations and spent five years verifying EHS and social performances disclosed in sustainability annual reports. I received my formal training and received a Masters of Science in Environmental Sciences from Universite de Rouen, France, and my Bachelors of Science in Environmental Geology from Northeastern University in Boston. I also trained as an ISO 14001 auditor at DNV Sweden.All of these experiences have led me to this current position at SEMI, where I look forward to making effective and meaningful impact.Have questions or suggestions for Olivier? He can be reached at [email protected] or at +1.408.943.6957. To learn more about the EHS advocacy program at SEMI, please click here.Heidi Hoffman is senior director of Technology Communities Marketing at SEMI.

Last year the industry posted another remarkable double-digit revenue growth year. IC shipments eclipsed one trillion units for the first time and continued to enable an ever-expanding array of silicon intensive-applications.2018 was also a pivotal year of transformation at SEMI. Setting our sights firmly on building more value for SEMI members, we doubled down on priorities I established this time last year. We advocated intensively on global trade policies, industry talent needs, and critical environment, health and safety (EHS) concerns. To underpin our efforts around talent, we took the bold step to reinvigorate the industry’s identity with a dynamic image campaign. Above all, we targeted critical industry-wide issues to help us realize the ambition of becoming a trillion-dollar industry in the next decade. Workforce DevelopmentRedefining our approach to talent development in 2018 was and remains a top priority. A diverse, highly skilled workforce is crucial to the industry’s ability to innovate. Last year we ramped up a number of SEMI High Tech U (HTU) programs to inspire young people and attract them to careers in high-tech manufacturing. To date, more than 130,000 students have been touched by HTU – through student or teacher programs.Over the past year, we designed a new university outreach program and established partnerships with 100 institutions. We established Workforce Pavilions at SEMICON events in Southeast Asia, the U.S., Taiwan, Europe and Japan for students to explore career opportunities and meet with recruiters. We thrilled at seeing sponsors hire young talent at SEMI events. This year, all SEMICONs worldwide will feature Workforce Pavilions.SEMI also formalized its commitment to Diversity and Inclusion (D I) with the establishment of a D I council to shape new programs including the recently launched Spotlight on SEMI Women. To localize and fully optimize our D I programs, we established regional workforce councils in every region we serve. We unveiled the SEMI Mentoring Program to support students and young professionals on this journey by facilitating one-on-one mentoring relationships with industry professionals. Hundreds of mentees have enrolled. But we still need more mentors. I urge you to join the program. During the year, SEMI also expanded its workforce staff and developed a comprehensive workforce strategy with programs that engage students as early as elementary school and inspires them through high school and college. The program provides pathways to professional careers, building a pipeline to fill the short-term and long-term talent needs of the industry. Industry Image CampaignAs we developed the comprehensive workforce development program, we knew we had to refresh the industry’s image and appeal to the next generation through contemporary media and communications channels. So we recently launched a bold, innovative campaign to raise industry awareness and attract students and recent graduates to careers in semiconductor manufacturing.Our You’re Welcome campaign is a novel, creative approach that blends entertainment, media and storytelling to excite students about the industry. The campaign went viral immediately and within weeks had more than 5.5 million social media impressions and 2.3 million video views.Trade Policy AdvocacyRising trade tensions between the U.S. and China catapulted global trade policy to the forefront of industry concerns in 2018. Since the tariffs have taken force, semiconductor companies have faced higher costs, greater uncertainty, and difficulty selling products abroad. The tariffs have forced many SEMI member companies to pause or rethink their investment strategies.SEMI quickly engaged U.S. policymakers and provided resources for SEMI members. We formed a member trade task force, staged trade compliance seminars in China, and convened meetings with over 110 U.S. congressional, agency and administration officials, and provided testimony on the importance of the free trade to the industry.SEMI continues to educate policymakers about the critical importance of free and fair trade, open markets, and respect and enforcement of IP for all players in the global electronics manufacturing supply chain. As part of this initiative, we distributed “10 Principles for the Global Semiconductor Supply Chain in Modern Trade Agreements” and encouraged their adoption in various trade negotiations. These principles outline the primary considerations for balanced trade rules that benefit SEMI members around the world, strengthen innovation and perpetuate the societal benefits of affordable microelectronics.Environment, Health and SafetyEnvironmental regulations are proliferating globally even as advanced semiconductor manufacturing technology relies increasingly on a host of new materials. With dozens of new fabs and fab line upgrades, our industry must align on best practices, sensibly respond to materials restrictions, and renew efforts toward sustainable manufacturing.That’s why the revitalization of SEMI EHS efforts became another priority in 2018. Two months ago, we hosted the inaugural EHS Summit at SEMI Headquarters. Fully, 70 EHS professionals and company executives met to form the basis for the future SEMI EHS program.The Year AheadDespite a softening in the market, compounded by Apple’s first-ever announcement of a revenue decline in 16 years, a geopolitical whirlwind on trade and an extended shutdown of much of the U.S. government, the future is bright.At SEMI’s annual Industry Strategy Symposium (ISS 2019) in Half Moon Bay, Calif. in early January, the sense of optimism was palpable. In her keynote address, Dr. Ann Kelleher, Sr. VP and General Manager, Technology and Manufacturing Group, at Intel, observed that data is powering the fourth industry revolution and the expansion of compute. With customers expecting continual improvements in applications, Kelleher highlighted the tremendous opportunity for the chip industry to meet these expectations.At ISS 2019, we announced a Memorandum of Understand between SEMI and imec. The MOU will enable us to accelerate our members’ engagement in SEMI’s Smart vertical market platforms, in particular Smart MedTech and Smart Transportation. Our partnership with imec will also allow us to boost SEMI Standards activities in non-CMOS technologies, deepen technology roadmap efforts and augment our SEMI Think Tank initiative in thought leadership at a global level.Over the course of this coming year, will we begin our global rollout of key building blocks of our comprehensive workforce development program to engage schoolchildren as young as 10 and learners all the way to veterans who return to the workforce. We are now able, with the invaluable help of our Workforce Development Council and the passionate engagement of many SEMI member companies, to offer a solution to the talent crisis in our industry.We will continue to be the leading voice for our members and the end-to-end semiconductor supply chain across Talent, Trade, Tax and Technology as we work to ensure free, fair trade that protects IP while preserving vital access to markets to grow the supply chain. Vertical Market PlatformsOur vertical market platforms are an important part of this growth. For example, in Smart MedTech, SEMI looks forward to working with the Nano-Bio Materials Consortium to advance human monitoring technology for telemedicine and digital health after winning $7 million to fund the renewed program. In Smart Transportation, we will leverage the Global Automotive Advisory Council (GAAC) we formed last year to represent the full automotive supply chain and the Smart Transportation and Smart Automotive forums featured at all our SEMICON events to enable the industry to identify and seize opportunities in autonomous driving. At ISS 2019, Sujeet Chand of Rockwell Automation noted that “digitization will grow faster in the next 10 years than it did in the past 50,” a trend calling for semiconductor fab architectures that transform data into business value. We will continue to bring the industry together at our Smart Manufacturing venues to help uncover ways to deploy deep learning, edge computing and other Smart technologies to deliver this value and meet the challenges of automation as artificial intelligence’s (AI) sprawling influence reshapes industries including manufacturing.I am filled with optimism and thrilled about the opportunities I see on the horizon for our members as we build on our 2018 accomplishments to enable your prosperity in 2019 and beyond. My heartfelt thanks to all of you for your participation in our programs and events.I look forward to another successful year as we connect, collaborate and innovate together!Ajit Manocha is president and CEO of SEMI.

SEMI met with Jay Zhang, business development director at Corning Incorporated, to discuss recent innovations at Corning that allow fine granularity CTE engineering as well as high Young’s modulus. We also talked about the impact of this work on in-process warp control, as well as the associated production methodology that provides rapid prototyping and high-volume manufacturing. We spoke ahead of his presentation at the 3D Systems Summit, 28-30 January, 2019, in Dresden, Germany. To register for the event, please click here.SEMI: What is Corning’s mission and vision and your role within the company?Zhang: Corning is one of the world’s leading innovators in materials science with a track record of 165+ years of life-changing innovations. We excel in glass science, ceramics science, and optical physics and succeed through sustained investment in RD E. Our products include Corning® Gorilla® glass, a durable material used on more than six billion mobile devices worldwide, and industry-leading LCD glass for display applications. We have recently dedicated a unit of the company called Precision Glass Solutions to address the emerging need for glass in the semiconductor industry. Here we apply Corning’s long history of glass science expertise and deep customer relationships in consumer electronics to support cutting-edge applications like wafer-level optics for precise 3D sensing and carrier solutions for temporary bonding applications in semiconductor manufacturing. It’s our most recent work in the Carrier Solutions product line that I’m excited to present: a new carrier glass product optimized for fan-out, called Corning Advanced Packaging Carriers.SEMI: What projects are you currently working on that you think will make a difference in 2019?Zhang: My team is excited to introduce Corning Advanced Packaging Carriers this year. This is a new line of product within our portfolio of Carrier Solutions. These ultra-flat glass carriers are specially developed to reduce customers’ challenge of in-process warp by up to 40 percent, which in turn helps advanced packaging customers achieve better yield.Corning Advanced Packaging Carriers feature high-stiffness properties and are available in a wide range of coefficients of thermal expansion (CTE) in fine granularity. These attributes help customers select an ideal glass carrier that will minimize in-process warp for their package. Furthermore, we make sample quantities of these carriers available in just four to six weeks to help maximize efficiency during customers’ R D process.My team is excited about the potential of this new product, but also encouraged by our results. We have already supplied this product and have heard from one of the largest semiconductor companies in Taiwan that it has reduced in-process warp by as much as 150μm.SEMI: Your presentation at the 3D Systems Summit will focus on Agile Manufacturing of Glass Carriers for Advanced Packaging. What exactly will you be sharing?Zhang: There is a lot of interest right now in using glass as a carrier substrate in temporary bonding applications in advanced semiconductor packaging – especially in fan-out processes. We also know that in-process warp is a significant challenge to companies pursuing advanced packaging because different CTE materials are added during the process. My team has done a lot of work to understand the impact that an ideal CTE glass carrier substrate can have on minimizing in-process warp. We have studied the available levers – both theoretical and in real-life fab environments – that can help address this challenge. I will present our findings on how it is possible to select a glass carrier with the ideal CTE and Young’s modulus to reduce in-process warp by up to 40 percent, and how Corning has developed an agile manufacturing platform to support customers with these ideal carriers from their R D stage through mass production.SEMI: What do you think will be a hot topic in the next few years?Zhang: We expect high-end fanout technology to address more applications beyond just mobile APs. There is also an interesting dynamic playing out between wafer-level and panel-level fan-out technologies. Corning is active in both areas. In developing and offering high performance glass carriers, we hope to help enable our customers to expand the fan-out applications space.SEMI: What are your expectations regarding the summit in Dresden, and why do you recommend your members and other industry leaders to attend the 2019 3D Systems Summit?Zhang: Europe is where some of the most advanced packaging technologies are born. Fan-out also saw early commercialization there. I hope to meet many scientists and technologists at 3D Systems Summit and exchange technical and business ideas. We also hope to get early feedback from other attendees about the value of our new product offering. Serena Brischetto is a marketing and communications manager at SEMI Europe.

SEMI met with Erez Halahmi, vice president at 0eC SA, to discuss a new way to transfer information not only between chips but also between servers to reduce power consumption while boosting performance. The two spoke ahead of his presentation at the 3D Systems Summit, 28-30 January, 2019, in Dresden, Germany. To register for the event, please click here.SEMI: What is Zero energy connection’s (0eC) mission and vision and your role within the company?Halahmi: Prof. Naaman of the Weizmann institute of Science (Israel) and I founded OeC SA and invented the Zero energy connection (0eC) technology. OeC SA offers a completely new and innovative solution for interconnections, which dovetails with the current technological trend of “less is more.” In fact, we constantly search for a reduction in energy consumption in favor of capacity, all while simplifying manufacturing processes. We try to look at things differently. This is why our technology is so out of the box. It is a completely new way to transfer information, not only between chips but also between servers.SEMI: What projects are you currently working on that you think will make a difference in 2019?Halahmi: I am working on several diversified exciting projects including the development of a planar field emitter and a rechargeable battery with energy density higher than 1KWh/Kg. Planar field emission is a field emitter made with standard FAB processes that enable a pixelized matrix of emitters at the resolution of photolithography. The rechargeable battery is a novel battery type that delivers unprecedent energy density.SEMI: Your presentation at the 3D Systems Summit will focus on a new way to transfer data. Why is this a key topic?Halahmi: Metals have been used to transfer data since the realization of the first integrated circuit by Jack Kilby in 1958. What happened next? Photonics slowly entered the market supported by huge investments, and the global market grew over the years. However, even with such enormous growth, photonics is not easily integrated with CMOS processes and the market also faces the conversion energy issue on top of the rising costs of process change. Integrating photonics with CMOS requires converting an electrical signal to a photonic signal and back. This costs energy and adds circuitry complexity. What to do? We identified a need to create something out of the box – on one hand using the same CMOS processes without conversion, and on the other hand significantly increasing performance. More details will be released at my presentation at the 3D Systems Summit in Dresden. I am certain that you will find our invention very intriguing. SEMI: What do you think will be the main focus in the future?Halahmi: My belief regarding many aspects of our life is that history repeats itself. Look for example at the comparison Gallium Arsenide (GaAs) versus Silicon (Si). GaAs was never able to defeat the simplicity of Si. The same applies to data transfer. However, for a solution to overtake the metal interconnect, it is not enough to offer many advantages, but the same order of production simplicity should apply. Consequently, big companies will continue to focus on metal solutions for transferring data, though some smaller companies might adopt our technology due to its relative simplicity of production and great benefits.SEMI: What are your expectations for the summit in Dresden, and why do you recommend other industry leaders to attend the 2019 3D Systems Summit?Halahmi: The summit is a great opportunity to learn about new technologies and meet the people behind these innovations. It is a unique chance to meet and question the inventors themselves and learn more about your competitors. See you soon in Dresden!Serena Brischetto is a marketing and communications manager at SEMI Europe.

This year, SEMI ISS covered it all – from a high-level semiconductor market and global geopolitical overview down to the neuro morphic and quantum level. Here are key takeaways from the Day 1 keynote and Economic Trends and Market Perspectives presentations.In the opening keynote, Anne Kelleher from Intel pointed to the huge growth of data, with fabs collecting more than 5 billion sensor data points each day. The challenge, Kelleher noted, is to turn massive amounts of data into valuable information. Moore’s law is not dead. New models of computing benefit still from Moore’s law and advances in Si/CMOS technologies for conventional, deep learning, neuro morphic and quantum computing.With customers expecting continual improvements in applications, the question is whether the chip industry is moving fast enough to meet these expectations, Kelleher said. A broad supply chain, equipment and materials innovations, and attracting the “best of the best” college graduates to fuel innovation is key, she said.In the economic trends session, Nicholas Burns (ambassador ret.) from Harvard University pointed out that we will see a major shift in power. The U.S. will remain the major world power over the next 10 years, but we will see a major shift in power in the next coming decades as the gap with countries like China, Russia and India continues to narrow.Duncan Meldrum from Hilltop Economics said that we are passing the peak growth of economic cycle. He warns that a more likely outlook is that a global growth recession is developing. Although semiconductor MSI growth will see a noticeable slowdown in 2019 and 2020, the semiconductor industry is still healthy over the longer term.Bob Johnson from Gartner sees demand shifting from consumer to commercial applications with higher ROIs and budgets. AI, IoT and 5D are the major enablers. He sees structural changes in the semiconductor industry especially for memory but also for Moore’s law with increasing costs and fewer players.The DRAM markets shows volatility and NAND market may be negative in 2019 but non-memory are expected to accelerate mainly because of increasing content and some price hikes.Overall Gartner expects good long-term growth with a CAGR (2017 to 2022) of 5.1%, outpacing 2011 to 2016 CAGR of 2.6%. After a strong 2018 with 13.4% revenue, he forecasts a slower 2019 with 2.6% growth followed by a 8% growth in 2020 and negative growth rate in 2021.Andrea Lati of VLSI went “Back to fundamentals” in his presentation about the industry. VLSI sees a downside bias due to slowing global economy, tariffs, and trade wars. Future drivers are data economy, cloud, AI and automotive.As memory leads the 2019 slowdown, analog, power, logic and other sectors remain in positive territory. VLSI lowered its semiconductor equipment forecast for 2018 from 20% (Jan. 2018) to 14% (Dec. 2018) but increased its sales outlook from 8% to 15% in 2018. VLSI expects revenue to slow into the first half of 2019 but increase to over 4% in the second half of the year, resulting in total 2019 drop of 2.7%. Semiconductor equipment sales are expected to drop from 14% in 2018 to -10% in 2019.Michael Corbett of Linz Consulting, covering wafer fab materials in the years of 3D scaling, sees these as good times for the industry. His outlook for wafer fab materials is bullish based on strong MSI and because wafer fab materials suppliers are getting bigger because of M As.In the Market Perspective session, Sujeet Chand of Rockwell Automation pointed out that as more and more data is generated, the problem is how to get value of all the data collected. There is a need to create the right architecture for machine learning and AI and big data is increasingly being replaced by contextual/structured data. He expects Industry 4.0 to drive foundries to become smaller, more flexible and more productive.In the Technology and Manufacturing session, Aki Sekiguchi of TEL addressed process challenges in the age of co-optimization. The semiconductor industry continues to expand, driven by massive growth of interconnected devices, with heavy demand for processing power and storage. He expects an exponential increase of data from about 40ZB in 2018 to 50ZB in 2020 to 163 ZB in 2026.Major technologies such as DRAM, 3D NAND and logic are dealing with scaling challenges. The density of DRAM (Mb/chip) is plateauing according to 2015 to 2020 trend data, with DRAM is in need of EUV. Memory capacity demand is leading to increasing layers and higher aspect ratios that is concern for 3D NAND and mainly for plasma etch. With Logic already implementing 3D structures, it appears to be in a solid position. Buddy Nicoson of Micron talked about his 50 years in the industry and looked ahead to the next 50. The anchors – quality, cost, scale and speed – won’t change. It has been a great journey so far with unprecedented opportunities and challenges ahead of us. We are getting into a convergence (specialization, integration) and solution-based phase. We will see some inflection points in the coming years, with the best yet to come.Christian G. Dieseldorff is senior principal analyst in the Industry Research and Analysis group at SEMI in Milpitas, California.