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CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021年 SEMI 中日交流协作会 China SEMI.org [email protected] America/Los_Angeles public
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Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://china.semi.org.cn/article/175 Business Executive Technical
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CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021 SEMI China-Japan Collaboration Conference China SEMI.org [email protected] America/Los_Angeles public
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Report highlights female engineers are passionate about engineering despite barriers to entering the field;
KLA Corporation’s new Engineering Inspiration Report showcases motivators, passions and challenges to entering the engineering field

MILPITAS, Calif., October 26, 2021 - KLA Corporation (NASDAQ: KLAC) today announced the KLA Engineering Inspiration Report, a new multi-regional research that shows engineers are extremely passionate about possibilities that the field provides. The inaugural report notes roughly two-thirds (65%) of engineers and students indicate they entered the field to create something that might change people’s lives.

Overall, nearly two-thirds of engineers (64%) indicate they are just as, if not more, passionate than they were when they entered the field. While there is no statistical difference in those numbers (women: 61% and men: 64%), women are faced with additional challenges such as the lack of family engineering role models and a later introduction to the engineering career path than their male counterparts. Further, 59% of female engineers say they were challenged in that STEM was not considered an appropriate field for women when they were on the path to engineering. The data speaks to the perseverance of women in engineering to continue in a career with a high level of passion despite the barriers they faced along the way.

The KLA Engineering Inspiration Report reveals the motivations, inspirations and major challenges on the path to becoming an engineer. As the gap between the supply and demand of engineering talent across industry sectors has increased, KLA found it critical to better understand the unique needs of those who choose the career path to encourage a more diverse set of people to explore the engineering profession. To gain insights, KLA commissioned the survey of both students and engineers in five regions which include the U.S., the U.K., China, Taiwan and Israel to assess their feelings, the drivers behind success and the barriers to entry that we need to work together to overcome.

On the launch of the report, KLA’s Chief Executive Officer and President Rick Wallace commented, “The insights gleaned from the Engineering Inspiration Report offer the opportunity for us to customize the KLA workplace experience, not only for our existing engineers but also those of the next generation. Part of our vision at KLA is ‘the future is ours to create,’ and engineers are critical to making that a reality and bringing cutting-edge innovations to life. It is up to us to ensure that we are creating an inspirational, stimulating and inclusive environment for them to work.”

Engineers want to make an impact

When first introduced to engineering, around two-thirds of engineers and students were highly motivated by the ability to solve problems (68%), the chance to create something that might change people’s lives (65%) and the opportunity to bring the future to today (65%). In addition, half (50%) of engineers and students indicate they have been inspired by sustainability issues, such as climate change, overpopulation and major natural disasters, and 39% by social concerns such as social disparities and disparities of resources.

In Taiwan, seven in 10 (70%) engineers and students say the digital revolution, such as the emergence and adoption of AI, machine learning and other technologies, drew them to the field—which is over 20 percentage points higher than the multi-regional average (49%).
When looking for careers in engineering, students and engineers similarly indicate that salary is important but so are the opportunities for career growth and other life benefits such as sabbaticals, new parent programs, financial planning support and time off to volunteer. Outside of work, engineers and students turn to music (29%), exercise (28%) and nature (28%) to draw inspiration for their day-to-day work—possibly further indicating the need for a package deal when choosing an employer.
Women on the engineering career path are determined and perseverant

Women in engineering want change. More than half (54%) of female engineers and students say they were motivated by the chance to break the glass ceiling when first introduced to engineering.

One of the biggest challenges is when and how women are introduced to engineering as a career. Nearly half (44%) of all engineers and students indicate they were first introduced to the engineering field by family or friends. Yet, when looking by gender, only 9% of female students report a parent introduced them to the field (vs. 17% of male students), and only one-third (35%) of female students report they were motivated by the chance to follow in the footsteps of a parent or family member (vs. 50% of male students).

Further, when asked when they began considering engineering as a career path, male students are more likely to say high school, while female students indicate undergrad.

Engineering degrees can be costly and time consuming, yet may not be teaching all the right skills

Across all regions, engineers cite common challenges to entering the field, with the stress of needing to achieve academic excellence, the time it takes to become an engineer and the cost of education as the top challenges. Though in some regions, like Israel and Taiwan, the challenges are more prevalent. When thinking about why more people do not chose engineering as a career path, half (50%) of students and engineers in Israel point to the stress of needing to achieve academic excellence as a barrier to pursuing the career (multi-regional average: 36%). More than half (56%) of students and engineers in Taiwan say the time it takes to become an engineer is a top reason why more people do not consider the field (multi-regional average: 40%).

Beyond the education required, professional engineers indicate a gap between the skills they were taught in school and the skills required to be successful in their career. Engineers rank teamwork, time management and project management among the top skills required for success, yet more than half (52%, 63% and 60%, respectively) of students say those skills are not being taught in their current programs.

The passion is high and so are opportunities

Almost all students and engineers indicate they are highly passionate about the chance to join the field and, in turn, would recommend their career to others. 86% of students say they are very passionate about the opportunity to become an engineer, and 82% of engineers say they would recommend becoming an engineer to someone they know.

These results are even higher in certain regions. For instance, 94% of U.K. students say they are very passionate about the opportunity to become an engineer, and nearly nine in 10 U.K. engineers (88%) and Chinese engineers (88%) say they would recommend becoming an engineer to someone they know.

Additional Resources

For more details about the KLA Engineering Inspiration Report and to hear stories from KLA engineers about why they became an engineer, please visit www.kla.com/EngineeringInspiration.

Methodology

In partnership with IPSOS, a global business and consumer research services organization, a survey was fielded from June 4 – July 29, 2021 in five regions (the United States, the United Kingdom, China, Taiwan and Israel) in their native language. The survey sample included 1,083 students and 2,278 engineers, using an online methodology with a varied sample per market and per audience.

About KLA

KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at www.kla.com (KLAC-F).

The Silicon Valley company to offer custom metrology solutions for advanced semiconductor applications to be led by industry expert Dr. Yihung Lin.

November 4, 2021 – Sunnyvale, CA. Covalent Metrology, a leading North American analytical services company located in the heart of Silicon Valley, announced that it has formed a new Semiconductor Consulting practice group, and that Dr. Yihung Lin, a recognized leader in semiconductor metrology, has joined Covalent to lead the new initiative.

The formation of the semiconductor practice group connects Covalent’s extensive portfolio of analytical solutions and expertise to an array of application challenges encountered by innovative semiconductor companies.

“Delivering customers value-added metrology solutions requires the formulation of optimal analytical strategies, techniques and methods based on in-depth understanding of what the customer is trying to achieve,” shared Craig Hunter, Chief Executive Officer at Covalent Metrology. “The traditional job-shop, sample measurement relationship that many outsourced analytical labs have with their clients is not conducive to forming genuine partnerships or solving customers’ most difficult problems.”

With today’s announcement of the new Semiconductor Practice Group, Covalent aims to disrupt the status quo value proposition offered in the marketplace by outsourcing analytical services, seeking to create the first company to offer access to world-class instrumentation and analytical expertise with an engagement model better suited to help customers solve their more strategic development problems.

The semiconductor industry is experiencing a surge in investment across a broad range of applications. Companies such as Intel, TSMC and Micron have announced ambitious investment plans including billions of dollars to be spent in U.S. manufacturing facilities. At the same time, new ventures have been forming at a rapid pace in new areas like quantum computing, purpose-built chips for AI applications, power electronics and other innovative new applications. Advanced metrology solutions, coupled with expert insights, will be necessary to support the massive industry development and expansion.

Dr. Yihung Lin has joined Covalent to lead this new initiative. Dr. Lin’s twenty-plus year career includes 11 years with TSMC, where he most recently led teams of engineers focused on leveraging machine learning and artificial intelligence to solve metrology challenges at the 2nm advanced logic node. Prior to TSMC, Dr. Lin worked at Intel on 3D chamber physics and device simulations to facilitate manufacturing yield. He received his PhD in Chemical Engineering from the University of Maryland at College Park.

Dr. Lin commented, “I am thrilled to join this capable and growing team and be a part of metrology history in the making. Throughout my career, I have witnessed how critical it can be to apply advanced metrology techniques and strategies to enable device and materials innovations. Many companies do not have the resources to build a broad, deep, world-class metrology lab and team in-house. Covalent is the first company with the vision and strategy changing metrology to an outsourced partner, and I am looking forward to realizing its full potential.”

About Covalent Metrology
Covalent Metrology is a disruptive analytical services laboratory and platform based in Sunnyvale, California. Its mission is to help companies who use advanced materials to get better data and insights more easily and affordably to facilitate faster development and production. Covalent is dramatically changing the characterization and imaging landscape by combining transparent pricing, data platforms, and top-notch customer service with world-class scientists, state-of-art tools, and strategic partnerships.
Covalent now has over 500 customers in 30+ industries.
Contact: Shannon Scheiwiller, Chief Marketing Officer
Tel: 408-498-4611
Email: [email protected]
www.covalentmetrology.com

PragmatIC Semiconductor, a world leader in flexible electronics, is proud to announce that Birger Steen has joined its Board of Directors. Birger is Board Chair of multiple technology businesses including Internet of Things pioneer and global Bluetooth LE market leader Nordic Semiconductor ASA, business network innovator Pagero AB, and German care technology leader myneva GmbH.

Birger is also a Thematic Partner at Summa Equity’s Tech-enabled Transformation team, where he invests and works with companies that deploy technology to solve global challenges. Previously he was CEO at Parallels, Inc. and held senior roles at Microsoft Corporation including Vice President of Worldwide SMB and Distribution, and General Manager of Microsoft Russia and Microsoft Norway.

In a recent announcement, PragmatIC unveiled plans for its second FlexLogIC® fabrication line, located in the North East of England, to expand capacity in order to meet the rapidly growing demand for its ultra-low-cost flexible integrated circuits. This expansion is supported by $80 million funding, which will also allow the team to more than double in size over the next 12 months.

“We are delighted to welcome Birger to the board. He brings an in-depth understanding of the global semiconductor market, and his wide experience in leading advanced technology companies will be crucial during our next stage of growth,” said Scott White, CEO of PragmatIC Semiconductor. “Birger also joins a select group of individual investors in PragmatIC who, along with our institutional and corporate shareholders, allow us to continue building the business as a major independent semiconductor foundry, extending electronics into markets previously not possible with traditional silicon chips.”

Erik Langaker, independent Chair of the Board, added: “Having known Birger and followed his career closely for more than 30 years, I am confident that his involvement and investment in PragmatIC will help guide the team through this significant period of development. His extensive operational and international background will enable him to work closely with the management to refine their strategic roadmap and build a strong presence in the semiconductor community.”

“PragmatIC has a truly disruptive vision for their innovative flexible chips,” said Birger Steen. “Their strategy for geographically distributed semiconductor fabrication offers customers the ability to take control of critical supply chains while also quickly responding to market trends and creating new, innovative solutions that solve some of the biggest global problems we are facing today. I am excited to be joining the board at such an important stage in the company’s growth.”

https://www.pragmaticsemi.com/news/pragmatic-semiconductor-announces-ap…

Technetics PTFE & Polymer Solutions (aka Technetics Group Houston) has been acquired by Edgewater Capital Partners effective September 3, 2021.   The new name is Altamira Material Solutions LP.

This acquisition includes two PTFE and Polymer processing facilities in Houston and one location in Hatfield, PA that provides best in class chemical etching services for the fluoropolymer industry.

The Altamira team wants you to know how much we appreciate your support over the years.   We are all eager to continue to serve you.     These changes in our organizational structure will allow us to focus more on our core business and improvements in our processes to support our customers.     More importantly, the team you have grown to trust and rely on for your products is not changing, it’s growing!   We are all excited about the opportunities ahead under our new ownership.

Andrew Bastian, General Manager for Altamira states; "The team Altamira Material Solutions is excited to build on our 50-year history of supplying industry leading PTFE products with our new partner Edgewater. We have a big vision for the future and expect to achieve great things together. This partnership is a win for our employees and customers. We couldn't be happier with the opportunity to work together toward a bright future."

For any additional information about Altamira , please contact Roxanne Dittrich, Business Director ([email protected]).

www.Altamira-MS.com

Registration Details

Members - FREE

    Register with your company email to receive the member price

Non-Members - $25

No Cancellations

Questions:  Contact Ayo Kajopaiye, [email protected]

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Silicon on Insulator technology is a very diverse and multi-faceted enabler of semiconductor products.  In certain areas if offers performance advantages across a wide dynamic range of leakage and in other areas it enables the use of high voltages in multi-domain designs.  It also inherently bring low capacitance which makes it great for ultra-fast switching in RF designs and significantly improved radiation robustness compared to bulk CMOS; it’s easy to see why SOI technology continues to expand in use through-out the industry.

Attend this webinar to see how these advantages are being applied to products in the medical and automotive (and more) application spaces.

CA
United States

8:00 am - 8:10 am
Carlos Mazure
Carlos Mazure
SOI Consortium

Welcome and Introduction

8:10 am - 8:30 am
Jon Cheek
Jon Cheek
Sr. Director, Process Technology Development
NXP Semiconductor

SOI Technology: Enabling Everything from Automotive to 6G

Abstract – The use of Fully-Depleted SOI, FD-SOI, combined with an ultrathin buried oxide create a technology ideally suited for the Internet of Things revolution. FDSOI enables the dynamic modulation of the threshold voltage during operation, not just during the design phase, to open a whole new world of creative product opportunities. One such example is the creation of ultralow leakage embedded SRAM memories which consume so little power that some resulting IoT products can last years on a single household battery. Other versions of SOI Technology with thick buried oxide enable use of 50V to 70V domains on a chip without need of complex isolation schemes. This ability to provide high voltage support along with digital processing is yet another reason SOI is adopted to provided differentiation in product offerings. Each of these approaches will be discussed and shown how it benefits the final products.

8:30 am - 8:50 am
Giulio Ricotti ST
Giulio Ricotti
Design Director & Technical Staff Fellow
ST Microelectronics

BCBD-SOI Technologies and Applications in Ultrasound Imaging and More

Giulio Ricotti – Design Director and Technical Staff Company Fellow - STMicroelectronics

After earning his Electronics Engineering degree, Giulio joined ST in 1994 as a design engineer in their Smart Power (SP) products group. Currently a Design Director and Technical Staff Company Fellow, Giulio has more than 60 patents and has authored 70 publications. Giulio has also been awarded the “Premio dei Premi” in 2009 by the Italian president Giorgio Napolitano for his crucial contribution to innovation with the 4D ultrasound imaging project that is used today all over the world for pregnancy and cardiology screenings.

8:50 am - 9:00 am
Ayo Kajopaiye Pic
Ayo Kajopaiye & Carlos Mazure
SOI Consortium

Discussion & Q&A

FOA

Join us for the the first in a series of webinars focused on applications of SOI technology, brought to you by the SEMI SOI Consortium. The series will underline the breadth of products that SOI technologies cover.

The first webinar of the series will feature ST Microelectronics and NXP.  ST Microelectronics will focus on their BCD-SOI technologies and applications, such as medical ultrasound imaging. NXP will showcase multiple applications of SOI technologies in automotive from power electronics through infotainment.

 

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
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Brooks Instrument, a world leader in advanced flow, pressure, vacuum and vapor delivery solutions, will feature its new GP200 Series pressure-based mass flow controller (P-MFC) at SEMICON Europa, November 16-19, in Munich, Germany. The company will be exhibiting in booth B1572.

The new GP200 Series is the industry’s first fully pressure-insensitive, pressure-based mass flow controller designed specifically for advanced etch and chemical vapor deposition processes in semiconductor manufacturing.

Providing ≤ ±1% process gas accuracy and ≤ ±0.15% S.P. repeatability, the ultrafast GP200 Series meets the critical requirements for high aspect ratio etch processes for TSV, MEMS and high-throughput continuous plasma processes.

Featuring a patented architecture that overcomes the limitations of conventional P-MFCs, the GP200 is designed to maintain accurate flow delivery of low vapor pressure and high-pressure gases into processes operating from high vacuum above atmospheric pressure. In comparison, conventional P-MFCs require high supply pressures and low outlet pressures or their performance quickly degrades. By offering a greater flexibility than conventional P-MFCs, the GP200 Series is the first universal pressure-based solution and upgrade for traditional P-MFCs and thermal MFCs.

The GP200’s extreme pressure insensitivity and zero leak-by valve (ZLV) technology enables design engineers to reduce gas panel complexity, size and cost by eliminating the need for point-of-use pressure regulators and transducers.

In addition to its GP200 Series P-MFC, Brooks will showcase other key products such as vacuum and pressure measurement sensors, gauges and instrumentation used in wafer process equipment and fab gas distribution.

For more information about the complete range of Brooks Instrument products and solutions for semiconductor applications, visit www.brooksinstrument.com.

For more information about the GP200 Series P-MFC, including specifications and videos, visit experience.brooksinstrument.com/pressure-based-mass-flow-controller-gp200.

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech industrial manufacturing and process industries.

With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers. Its broad family of products includes brands such as Celerity, UNIT Instruments and Tylan.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has signed an exclusive agreement with Osiris (Osiris International GmbH) to license its smartEBR technology for edge bead removal on panels. This proprietary process, based on wet etch chemistry, will enable YES to expand its wet processing capabilities.

“We are very pleased to partner with YES in this effort to extend our smartEBR technology to more complex applications,” said Pirmin Muffler, founder and Managing Director of Osiris. “We selected YES as our partner because of their proven ability to rapidly bring innovation to high-volume manufacturing production environments.”

“YES is committed to developing a variety of solutions for panel-based applications in the PCB and advanced packaging markets” said Zia Karim, CTO of YES. “When combined with our extensive process expertise, the smartEBR technology will allow our customers to remove metal, photoresist and dielectric coatings efficiently from a variety of panel types, ensuring high yield and defect control.”

“Our mission is to be the preferred provider of surface modification and material enhancement solutions in the markets that we serve,” said Rezwan Lateef, President of YES. “The Osiris EBR technology adds an important element to our product portfolio, as we continue to support and enable the ambitious roadmaps of our key semiconductor customers.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

About Osiris International GmbH
Osiris International GmbH is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor, microOLED, Mask and microsystems (MEMS) technology. The company provides a wide range of optimized front- and back-end solutions used in the processing of a variety of substrates. For more information, please visit www.osiris-nano.com.

Registration Details

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

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About the Instructor

Dr. Toni Mattila is the Head of Sustainable Manufacturing at Business Finland, which is a governmental agency for R&D and innovation funding, business development and internationalization services. Toni leads a national business development program with the goal of transforming Finnish manufacturing industries towards sustainable development. Toni worked for fourteen years in academia as a researcher in the field of microelectronics. Toni is an active member of IEEE Electronics Packaging Society, and a frequent attendee of various electronics conferences.

United States

Tony Mattila
Toni T. Mattila
Head of Sustainable Manufacturing
Business Finland
FlexTech

This Master Class was held live on December 1, 2021.  It is still available On Demand.

Sustainability is more a way of thinking than a technological solution. To achieve sustainability, a company must develop a comprehensive approach that covers multiple levels and segments of its business.

Watch this course to develop an understanding of the essential components of industrial carbon footprint and discuss actions companies and industry can take to reduce theirs. Throughout the course, we paid particular attention to the electronics industry; what the sector has already contributed and what remains to be achieved.

The role of new technologies – e.g. FHE - was discussed and what role they play in reducing the carbon footprint so that ‘sustainability’ can become a sustainable business.

Watch this course to focus on a broader picture of sustainability in the electronics sector.

9:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
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