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ClassOne Technology, global provider of advanced semiconductor plating tools, announced the sale of a second Solstice® S8 system to i3 Microsystems (i3M), a wholly-owned subsidiary of defense industry supplier i3 Electronics headquartered in Binghamton, NY. The eight-chambered Solstice S8 configuration includes ClassOne’s proprietary CopperMax™ chamber for advanced copper plating. The announcement was made jointly by ClassOne CEO, Byron Exarcos, and i3 VP/General Manager, Robert Nead.

"We brought in the first Solstice S8 to replace our wet benches and automate our plating processes,” said Nead. “And the tool’s high performance and flexibility have served us extremely well. With eight chambers, the Solstice is able to handle both plating and surface preparation processes. We’re now adding solvent strip and UBM etch capabilities to our first Solstice, and we are configuring our second Solstice to match. Bottom line, we've been very pleased with the Solstice and also with ClassOne's customer service, both of which are strongly supporting our ongoing growth.”

“A key feature of i3M’s Solstice S8 configuration is that it includes our proprietary CopperMax™ electroplating chamber,” said Exarcos. “This unique chamber is designed to deliver class-leading copper plating quality while at the same time reducing plating consumables costs. It gives users the ability to routinely achieve exceptional levels of copper plating feature quality and also cut copper chemistry additives costs by as much as 95%.

Solstice presently serves many of the world’s leading defense contractors and is emerging as the electroplating and wafer surface preparation system of choice for meeting the exacting requirements of the defense and aerospace industries.

The ClassOne Solstice S8 is an eight-chambered system for high-performance, fully-automated electroplating and surface preparation. The Solstice platform also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, the tool’s unique Plating-Plus™ capability also enables it to handle many surface preparation functions, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility serves to streamline process production and can reduce the number of different tools a user needs to purchase.

ESPOO, Finland, 22nd of March 2021 – During the past year, organizations worldwide have been forced to adapt to new ways of working and serving their customers due to the covid-19 pandemic and the related restrictions to travel and logistics. Picosun Group has significantly reinforced its local service units globally and established its PicoSupport™ Center.

PicoSupport™ Center provides on-site support and planned service items such as ALD system installations and preventive maintenance visits conducted by highly experienced, trained and certified field service engineers. It also takes care of customers’ Helpdesk and Emergency Service operations.

At the core of PicoSupport™ Center’s Helpdesk are state-of-the-art remote support tools taking advantage of augmented/mixed reality, live video, screensharing and remote connection applications. In accordance with Industry 4.0, these tools allow safe and on-time service delivery no matter the physical location or time zone of the customer. They also offer an endlessly upgradeable platform for further embedding of e.g. remote training and e-learning modules with full virtual reality environments.

Today, the remote support tools are already widely implemented in Picosun’s customer base. The remote applications are used for a number of services ranging from system inspections and troubleshooting to software upgrades, bug fixes and process optimizations.

“I’m very proud to say that we have been able to adapt to the changing environment by employing new ways of interaction to ensure continued customer satisfaction. The feedback on the new remote support applications has been very positive. Customers find them easy to use and have benefitted from them in terms of faster reaction times and lower costs compared to traditional on-site services,” says Timo Malinen, VP, Service Business Area of Picosun Group.

“As our customers’ trusted strategic ALD partner we are committed to top-notch and uninterrupted services, despite of the changes in the world we operate in. We are looking forward to further enhance and develop the ways with which we can ensure smooth and trouble-free operations together with our customers,” Malinen concludes.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Timo Malinen
VP, Service Business Area, Picosun Group
Tel: +358 40 5011860
Email: [email protected]
Web: www.picosun.com

FREMONT, Calif. – Mar 15, 2021 – YES (Yield Engineering Systems, Inc.), a preferred provider of material modification and surface enhancement solutions for the semiconductor, life science and display markets, today announced that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding. The new system will be utilized in bringing next-generation HBM (high bandwidth memory) to market. It is scheduled for delivery in the second quarter of 2021 to support the customer’s R&D activities and initial production demands.

“This order marks an important milestone for YES, as it is a validation of our efforts to serve the memory market. This new VertaBond system will enable our valued customer’s most advanced HBM development and pilot production,” said Alex Chow, Asia Sales President & General Manager at YES. “We are very pleased and look forward to working with them to meet their exciting technology roadmap.”

“YES has long been a leader in cutting-edge solutions for polyimide cure and wafer-to-wafer bonding applications utilizing novel vacuum technologies. We are pleased to introduce the VertaBond system for wafers and panels, which is based on this core competence, to customers with demanding 3D stacking and heterogenous integration applications in logic, memory and other critical areas,” said Dr. Zia Karim, Sr. VP and CTO at YES.

About VertaBond
VertaBond is YES’s new vacuum-based wafer-to-wafer and die-to-wafer bonding system. Its superior temperature uniformity and low vacuum environment work together to improve the properties of bonding interfaces and eliminate voids which can cause yield loss and performance degradation. Vacuum technology enables void-free bonding in less time, reduces thermal budget, and provides excellent bonding strength and particle performance.

About YES
YES (Yield Engineering Systems, Inc.) is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

VertaBond™ and the YES logo are trademarks of YES (Yield Engineering Systems, Inc.).

BUSCH VACUUM SOLUTIONS USA ACQUIRES LONG-TERM SALES CHANNEL PARTNER
Distributor of vacuum equipment sales and service in Eastern Central Region

Virginia Beach, VA, February 4, 2021 - Busch Vacuum Solutions USA, one of the largest manufacturers of vacuum pumps, blowers, compressors and systems, announces the acquisition of Jennings Associates Inc. (dba Jennings Alberts Inc) a distributor for new equipment, maintenance, and repair for vacuum pumps blowers and heat exchangers. The acquisition of Jennings Alberts’ vacuum pump, blower and service portion of the business furthers Busch’s long-term goal of providing even better technical and service support for customers in the Eastern Central Region.

Busch partnered with Jennings Associates to represent them in Eastern PA, Southern NJ, and DE in 1977. Together, they have become prominent industry leaders supplying vacuum solutions for many applications including meat processing, food packaging, chemical, pharmaceutical, metallurgy and plastics.

“The Busch-Jennings family business relationship has continued to grow over the last 44 years. We are all very excited that the Jennings vacuum pump and blower, sales and service, business officially becomes part of the larger Busch company which is also a family-owned business.” said Mr. Bill Altier, part owner of Jennings Alberts. Mr. Altier joins Busch as a Regional Manager and will continue to serve customers in this market.

Also joining Busch as a Regional Sales Manager is Mrs. Lisa (Jennings) Dugery, part owner of Jennings Alberts, who said “We are excited to join the Busch team because of the success and mutual trust our companies have built over the years.” She also added, “And because of their long track record of innovation and great success, I know our family’s legacy is in good hands.”

According to Mr. Turgay Ozan, President of Busch USA, “As a vacuum industry leader, we are acquiring one of the foremost distributors and service organizations in the market. Joining with the Jennings team, after such a long partnership, is a logical step.” Mr. Ozan added, “For this region, we are becoming a direct resource for customers with access to Busch Product Managers, Engineers and Service Specialists, nationally and globally.”

Busch Vacuum Solutions manufactures products and designs systems in the USA and offers a wide national service network. The transition of the Jennings vacuum and blower business takes place immediately.

About Busch Vacuum Solutions
Busch Vacuum Solutions USA sales and manufacturing headquarters is in Virginia Beach, VA where a team of 500 dedicated employees takes care of all their customer’s industrial vacuum needs. Busch USA is part of the global Busch Vacuum Solutions family owned company with over 3500 employees in more than 40 countries.

For more information about Busch: www.buschusa.com

Intermolecular, Inc. (“Intermolecular”), the trusted partner for materials innovation and a wholly-owned subsidiary of Merck KGaA, Darmstadt, Germany, today announced the relocation of the Silicon Valley Innovation Hub from Menlo Park to Intermolecular’s San Jose facilities, combining Merck KGaA, Darmstadt, Germany’s innovation efforts in the Bay area with Intermolecular’s services for materials and electronics, creating a unique space that empowers collaboration with startups.

The Silicon Valley Innovation Hub was established in 2017 in Menlo Park, CA. As part of the global Innovation Ecosystem of Merck KGaA, Darmstadt, Germany, it strives to identify and develop viable new businesses and technologies between the company’s existing business sectors or break new ground beyond them.

“The mission of the Silicon Valley Innovation Hub is to identify and explore untapped innovation- and business opportunities for Merck KGaA, Darmstadt, Germany. In this context, the intersection of life science and material science is becoming increasingly important and opens new areas of innovation. Having the Silicon Valley Innovation Hub and Intermolecular under one roof now will allow us and our cooperation partners to develop and test new materials for biological applications. We are very excited about these new opportunities,” states Thomas Herget, head of the Silicon Valley Innovation Hub.

Intermolecular has a unique toolset and expertise to quickly test and prove new advanced technologies and materials for semiconductor devices and electronic applications.

Having the Innovation Hub in the same building will further strengthen collaboration of the company’s businesses with startups and innovative companies in and around the Bay Area to rapidly grow their business from concept to high-volume manufacturing. The building boasts 30,000 square feet of cleanroom, chemical labs, offices, a collaboration area and event spaces.

Intermolecular’s customizable services are tailored to meet a startup’s unique needs, whether it is achieving a proof-of-principle, a first prototype, or a small series production. Intermolecular assigns experts in emerging technologies and offers its manufacturing facilities, which can run experiments 24/7to test and validate materials critical to product development. Intermolecular’s flexible methodologies and quality data help accelerate product design innovation, at any phase of a startup’s product development cycle.

“Intermolecular offers a seamless process flow that is specific and confidential to each startup, which is key to speeding time to innovation,” said Casper van Oosten, business field head and managing director for Intermolecular, Inc. “By providing startups the tools and expertise to validate their ideas, we can help them accelerate their path to new investment and speed their product introductions by giving them concrete data needed to move quickly from a research phase to full production. Having the experts from the Silicon Valley Innovation Hub now under one roof, we are looking forward to branch out into new areas and exploring collaboration opportunities that bring benefits to our customers/startups.”

“Semiconductor companies, particularly companies working on current generation and emerging memories, need to do a lot of experimentation to get the best combination of processes and materials,” said Tom Coughlin, president of Coughlin Associates. “Companies such as Intermolecular can provide efficient ways to gather and analyze the required data to make the next generations of memory possible.”

About the Silicon Valley Innovation Hub

Merck KGaA, Darmstadt, Germany’s Silicon Valley Innovation Hub supports scouting for the company’s existing businesses, with the additional objective to look between and beyond their scopes. This means evaluating new technological opportunities, building and maintaining local relationships and partnerships, and driving new business in fields such as cell-based meat.

About Intermolecular

Intermolecular is a trusted partner for materials innovation and the Silicon Valley science hub of Merck KGaA, Darmstadt, Germany and its Performance Materials business. Intermolecular explores, tests and develops advanced materials that are revolutionizing the next generation of electronics that make lives easier, entertaining and more productive. For more than 15 years, the team, methodologies and quality data have driven impactful outcomes, market opportunities and innovative product designs for customers.

About Merck KGaA, Darmstadt, Germany

Merck KGaA, Darmstadt, Germany, a leading science and technology company, operates across healthcare, life science and electronics. Around 58,000 employees work to make a positive difference to millions of people’s lives every day by creating more joyful and sustainable ways to live. From advancing gene editing technologies and discovering unique ways to treat the most challenging diseases to enabling the intelligence of devices – the company is everywhere. In 2020, Merck KGaA, Darmstadt, Germany, generated sales of € 17.5 billion in 66 countries.

The company holds the global rights to the name and trademark “Merck” internationally. The only exceptions are the United States and Canada, where the business sectors of Merck KGaA, Darmstadt, Germany operate as EMD Serono in healthcare, MilliporeSigma in life science, and EMD Electronics. Since its founding 1668, scientific exploration and responsible entrepreneurship have been key to the company’s technological and scientific advances. To this day, the founding family remains the majority owner of the publicly listed company.

Armstadt, Germany, March 4, 2021 – Merck KGaA, Darmstadt, Germany, a leading science and technology company, is changing the name of its Performance Materials business sector to Electronics. The new name is the visible result of the strategic realignment conducted over the past several years and a further milestone of the “Bright Future” transformation program, which began in 2018.

“The renaming of our business sector to Electronics is a logical step for us. After all, the new name underscores our strategic focus on the electronics industry. At the same time, it clearly illustrates our contribution to a world characterized by tremendous technological advances and exponential data growth,” said Kai Beckmann, Member of the Executive Board of Merck KGaA, Darmstadt, Germany, and CEO Electronics. “Under the ‘Bright Future’ umbrella, we’ve developed into a leading player within the electronics industry over the last few years. And with the new name Electronics, we’re now also making it clear, at a glance, what our business sector represents.”

As the company behind the companies advancing digital living, the Electronics business sector is involved in all major technology trends – be it 5G, Big Data, autonomous driving, artificial intelligence, or the Internet of Things. Thanks to these and other megatrends, the demand for ever smaller, faster and more energy-efficient electronics is continuously growing. For example, more and more of the components in modern chips are now approaching atomic dimensions.

“Bright Future” – A successful transformation program

The acquisitions of Intermolecular and Versum Materials in 2019 represented two very important moves within the scope of the ongoing transformation program. Thanks to the integration of Intermolecular, which offers unique processes and R&D capacities, Merck KGaA, Darmstadt, Germany, is now capable of making the latest material innovations available to its customers in the electronics industry even more rapidly. Through the acquisition of Versum Materials, the company has expanded its portfolio to include innovation-driven, ultra-high-purity process chemicals, gases and equipment for semiconductor manufacturing. The name Versum Materials, which has been in use separately until now, will be superseded by the new name of the business sector.

However, the name change will not have any effect on the existing organizational structure of the business sector, which comprises the three business units Semiconductor Solutions, Display Solutions and Surface Solutions. Electronics thus covers a particularly broad range of products and solutions, including high-tech materials and solutions for the semiconductor industry as well as liquid crystals and OLED materials for displays and effect pigments for coatings and cosmetics.

In September 2020, Merck KGaA, Darmstadt, Germany, raised its expectations for average annual organic sales growth of Electronics to 3% to 4% against the backdrop of its focus on the semiconductor industry, which is showing strong growth. The business sector currently generates around 90% of its sales in the two business units Semiconductor Solutions and Display Solutions.

SANTA ROSA, Calif., – February 17, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, today announced availability of the new TargetPoint TCM™ gyro-stabilized digital magnetic compass. TargetPoint TCM incorporates PNI’s high sensitivity Magneto-Inductive sensors with the latest high stability 3-axis MEMS accelerometer and 3-axis MEMS gyroscopes providing accurate orientation while in dynamic motion and in magnetically challenging environments. TargetPoint TCM excels in conditions that cause errors in traditional digital magnetic compasses.

TargetPoint TCM uses advanced magnetic distortion compensation and calibration scoring algorithms to counter the effects of hard and soft iron interference, providing highly accurate heading information in almost any environment and orientation.

TargetPoint TCM features and benefits include:
 Patented magnetic anomaly rejection algorithms eliminate errors due to magnetic distortion, even in magnetically harsh environments
 Gyro-stabilized compass for dynamic accuracy of sub-0.5 degrees of heading accuracy
 Multiple calibration methods, including 12-point hard- and soft-iron calibration methods, are available to ensure ease of calibration for all applications
 ITAR-free

“For military rangefinder and targeting systems developers who need accurate orientation in demanding conditions, TargetPoint TCM is a ruggedized digital magnetic compass built to handle weapons shock,” said Robin Stoecker, vice president of sales and marketing at PNI Sensor. “It’s an ideal choice for targeting applications that require reliability, consistency and accuracy.”

Pricing and Availability
For product specifications, download the TargetPoint TCM product sheet. For pricing and availability, please contact PNI Sales or your regional PNI representative.

About PNI Sensor
With over 30 years of experience, PNI is the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications. PNI’s sensors and algorithms serve as the cornerstone of successful IoT projects and other mission-critical applications where pinpoint location, accuracy, and low power consumption are essential. Building on decades of patented sensor and algorithm development, PNI offers the industry’s highest-performance geomagnetic sensor in its class, location and motion coprocessors, high-performance modules, sensor fusion algorithms, and complete sensor systems. To learn more, please visit www.pnicorp.com.

Media Contact:
Robin Stoecker
PNI Sensor
Tel: +1 707-566-2260 |Email: [email protected]

Semiconductor equipment manufacturer ClassOne Technology has just released its proprietary new SoftSeal™ Plating Rotor, designed to enhance processing performance on the company’s Solstice® electroplating systems. The announcement was made by ClassOne’s CEO, Byron Exarcos and Senior Technology Director, John Ghekiere.

“Together with the plating reactor, the plating rotor design is key to maximizing on-wafer performance,” said Exarcos. “It’s responsible for distributing the electrical supply across the wafer, isolating electrolytes from the electrical contacts, and a great deal more. Which is why we’re constantly working to optimize rotor performance. The new SoftSeal is our latest and most advanced generation in Solstice rotors, and it’s already achieving unprecedented levels of electroplating uniformity along with reduced cost of ownership.”

“This highly-uniform performance comes from a combination of finely-tuned rotating-disk electrode physics and an optimized density of electrical contacts around the wafer,” said Ghekiere. "The ‘SoftSeal’ name comes from its high-performance FFKM elastomer seal which very effectively isolates plating chemistries from the wafer’s edge-exclusion zone. The new rotor also adapts automatically to substrate thickness, so it can accept thick or thin substrates without any adjustment. The design accommodates both flatted and multi-flat wafers, and it’s customizable to non-standard wafer sizes. Plus, the seal is more robust than on competitive rotors, meaning longer part life and no handling concerns.”

“In addition, the SoftSeal rotor’s low profile enables bubble-free entry into the plating bath,” Ghekiere noted. “And a unique design feature directs excess chemistry back into the bath at the end of the plating process. This is particularly important for conserving expensive plating baths such as gold. And, after processing, a special wafer retrieval method eliminates wafer flexing and stress by eliminating the need for extraction force at the center of the wafer.”

ClassOne stated that the new SoftSeal rotor is designed to fit all models of the company's Solstice electroplating systems and it will be standard equipment on all of the new tools going forward.

ClassOne Solstice systems are designed to provide high-performance, cost-efficient, single-wafer electroplating specifically for ≤200mm processing. The series includes the Solstice S8 and Solstice S4 for fully automated 8-chamber and 4-chamber high-speed production. It also includes the semiautomated Solstice LT, with up to three chambers that can be used both for process development and production. In addition to electroplating, the unique Plating-Plus™ capabilities of the Solstice platform enable it to handle many other important surface preparation functions, such as wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch, and more. Class-leading performance and flexibility consistently make Solstice the tool of choice for ≤200mm plating across a range of product categories.

ECM Lab Solutions is a new offer from the ECM Group, dedicated to laboratories, research centers and universities. This offer combines equipment from three companies and four brands: ECM Technologies, ECM Greentech, SEMCO Technologies & Cyberstar.

With more than 90 years of experience in manufacturing industrial equipment, this ECM Group offer highlights the diverse and flexbile nature of ECM's technology and expertise by transitioning from heat treating steels and automotive applications to a wide range of research and specialty fields.

With advanced technologies for crystal growth, vacuum heat treatment and chemical vapor deposition, ECM Lab Solutions offers reliable solutions for semiconductor, solar, medical and other mechanical applications.

Registration Details

Member Price: $99.00

Note:  Use company email address to log in for automatic recognition as a member.  Members must be current SEMI Members for member discounts.

Non-Member Price: $199.00

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During the workshop recording, you will hear perspectives from the key stakeholder segments and develop a greater understanding of the overall efforts and progress of the task force.

The workshop is focused on diagnosing and improving SEMI F47, Specification for Semiconductor Processing Equipment Voltage Sag Immunity, widely adopted across the industry, the governing standard that defines voltage sag test levels and requirements for semiconductor tools.

Since the implementation of SEMI F47, the vulnerability of semiconductor manufacturing to single-phase and two-phase voltage sags has improved greatly. However, semiconductor manufacturers continue to experience significant product loss and downtime due to voltage sag events.

Given the ongoing issues with semiconductor plant downtime, a new SEMI Voltage Sag Immunity Task Force was formed to take a fresh look at the issue. The workshop and the task force:

  • Reviews the characteristics of the power quality events that cause downtime.
  • Takes a new look at the sensitivities in the process equipment.
  • Determines any potential adjustments to equipment design, facility design, utility systems, or SEMI Standards to further reduce voltage sag induced losses by the semiconductor industry.

Speaker Biographies

United States

10:00 am - 10:05 am
James Amano
James Amano
Sr. Director, Standards
SEMI

Welcome

10:05 am - 10:25 am
Mark Stephens EPRI
Mark Stephens
Principal Project Manager & Leader, Voltage Sag Immunity Task Force
EPRI

Introduction to the SEMI Voltage Sag Immunity Task Force Effort

A review of the key objectives of the voltage sag task force will be discussed along with the characteristics of the power quality events that are still causing semiconductor plant process downtime. A new look at the sensitivities in the tooling and process equipment is required to determine any potential adjustments to equipment design, facility design, utility systems or standards to further reduce voltage sag induced losses by the semiconductor industry. This important work will help utilities, semiconductor manufacturers, and tool equipment providers to better understand the tolerance and susceptibility of today’s generation of semiconductor processing tools and then to develop effective strategies to improve uptime and lower product losses due not only to single-phase (Type I) and two-phase (Type II) voltage sag events but for three-phase (Type III) events as well.

10:25 am - 10:50 am
Clay Burns
Clayton Burns
Principal Engineer
National Grid

Regional Voltage Sags- Importance of Addressing Three-Phase Voltage Sags in SEMI F47

A review of voltage sags at a National Grid substation which were produced by two lightning-caused three-phase transmission faults at locations fairly remote to the substation.  This will show the regional effect of transmission level faults on voltage.  The voltage sags will be compared to the existing SEMI-F47 standard and the accepted sag definition.  Additionally, a proposed regional voltage sag study will be considered in light of the changing make-up of the future electric system and the influx of large inverter-based resources.

10:50 am - 11:15 am
Ed McGann
Ed McGann
Manager of Engineering
VELCO

Utility Dynamic VAR device fault response, fault mitigation techniques, and power quality measures addressed with protection design

Co- presenters:
Greg Rieder, GlobalFoundries
Josh Burroughs, VELCO
John Fiske, VELCO

VELCO recently conducted a refurbishment of its STATCOM facility as part of a planned controls system upgrade. The system planning need for this facility is to provide area voltage support during transmission system contingencies. The refurbishment project team recognized the benefits of the STATCOM’s ability to provide voltage support during system faults and specified fault performance requirements in the vendor specifications. This presentation will discuss those performance requirements, review pre and post project upgrade system fault record’s and review project lessons learned. The second half of the presentation will cover utility fault mitigation design strategies for substation and transmission line assets as well as protective relaying techniques to improve power quality

11:15 am - 11:50 am
Michael Noth Austin Energy
Michael Noth
Power System Managing Engineer
Austin Energy

Seeing it from both sides: The importance of Power Quality Metering at the utility and inside the Fab Distribution System.

In this presentation we will discuss the importance of having power quality-based metering on both sides of the point of connection and other parts of the distribution system.  Mike will share some examples and stories of how important that can be.

11:50 am - 12:15 pm
Tony Sabin DAn Hunt
Dan Sabin & Tony Hunt
Schneider Electric

Waveform captures of voltage sag events can be automatically analyzed by software to determine their source and impact

This presentation will summarize efforts to categorize events automatically that exceed SEMI F47 limits, and to determine the source of those disturbances. It will also present recent efforts to analyze the impact of voltage sags automatically on electrical loads. This research has resulted in automatic algorithms to determine which voltage sags caused downtime and which ones did not. Combining all of this information together provides a means to more precisely and effectively diagnose, manage, and mitigate voltage sag disturbances.

12:15 pm - 12:25 pm
Christopher "Dale" Moffitt
Electrical Systems Engineering
HP

Power Quality and Monitoring, What Does the Data Tell Us?

Power Quality (PQ) has a long and diverse history dating back to the first power grids in the United States. Impacts and concerns about PQ events have evolved and will continue to evolve as our usage of electricity changes. Recent natural disasters have highlighted the importance of a robust power grid and the changing landscape of power generation presents new PQ challenges. As power consumers, a key element in any PQ strategy is adequate power monitoring. This provides the data that can drive conversation with the utility, discover opportunities in our infrastructure and deliver to our facilities the power quality necessary to sustain our businesses.

12:25 pm - 12:50 pm
Willem Meijs ASML
Willem Meijs & Giel Croonen
Low Voltage expert in electrical engineering on supply distribution system for machines
ASML

SEMI F47 and Power Quality Perspectives and Considerations from a Tool OEM

This presentation will address power quality perspectives and consideration from the point of a lithographic tools manufacture. Effect of different test methods on the sag immunity, test strategy on systems, sub-systems and components. How to divide a large installation up in to testable units and maintaining performance integrity. 3 phase type III test generator topology and the impact on harmonic emission and immunity in relation to voltage sag immunity.

12:50 pm - 1:15 pm
Josh Pankratz Advanced Energy
Josh Pankratz
Director of Engineering
Advanced Energy, Inc.

Power Supply Considerations and Standards for Voltage Sag Ride Through

Disturbances in utility power during semiconductor manufacturing can result in loss of revenue, productivity, production yields, and product quality. Focus on power quality continues to grow as new fabs are built in developing regions, which historically suffer from poor infrastructure. Highly automated fabs have driven a demand for systems that can ride through power glitches without shutting down tools and production lines. This presentation examines how power quality, most typically resulting in voltage sag events, affects semiconductor manufacturing and how industry standards and guidelines for tool immunity to those events affect the design of power supplies.

1:15 pm - 1:40 pm
Steve Lewis, Lam Research, square
Steve Lewis
Lam Research

Round Table Discussion & Q&A

1:40 pm - 1:55 pm
Mark Stephens EPRI
Mark Stephens
Principal Project Manager
EPRI

Next Steps for SEMI Voltage Sag Immunity Task Force

Based on the initial findings from utility and fab power quality data, the task force is poised to move forward to re-evaluate semiconductor tools against voltage sag additional characteristics that are indicative of measured events still causing downtime. Utilities, semiconductor fabs and equipment OEMs will be invited to actively participate in this effort to obtain the required test data.

1:55 pm - 2:00 pm

Closing Remarks & Adjourn

James Amano, SEMI

CAST FlexTech FOA ITL MSIG SCIS SE&A Standards EPRI and SEMI logos

SEMI & EPRI invite you to view a workshop held on April 21, 2021, to hear perspectives from all stakeholders on a persistent and difficult issue in microelectronics manufacturing - uncertain power quality. As work on SEMI Standard F47, the Specification for Semiconductor Processing Voltage Sag Immunity, continues this is the opportunity to hear from distinct parts of the supply chain. 

10:00 am - 2:00 pm Off Add to Calendar 2021-04-21 10:00:00 2021-04-21 14:00:00 Voltage Sag Workshop for Manufacturing Fabs SEMI & EPRI invite you to view a workshop held on April 21, 2021, to hear perspectives from all stakeholders on a persistent and difficult issue in microelectronics manufacturing - uncertain power quality. As work on SEMI Standard F47, the Specification for Semiconductor Processing Voltage Sag Immunity, continues this is the opportunity to hear from distinct parts of the supply chain.  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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