MILPITAS, Calif. — February 5, 2024 — SEMI today announced the availability of a free quick start guide to facilitate the onshoring of advanced packaging facilities in the United States and support the region’s buildout of a semiconductor manufacturing supply chain. Offered by SEMI and the UCLA Center for Heterogeneous Integration and Performance Scaling (CHIPS) and funded by the National Institute of Standards and Technology (NIST), the Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP) highlights critical areas of development needed to establish advanced packaging facilities on U.S. soil.

Based on the Heterogeneous Integration Roadmap (HIR), the guide incorporates a manufacturing approach to implement the HIR. Some 100 chip industry veterans from more than 40 companies collaborated with representatives from academic institutions, industrial consortia, and government agencies to develop the guide.

Addressing hardware and software tools, manufacturing processes, and supplier infrastructure, the guide covers tools, processes, standards, and interdependencies that enable advanced packaging for high-performance computing (HPC), medical, health and wearables applications.

“The MRHIEP drills down into operational objectives by examining current capabilities and highlighting critical areas of development needed for onshored manufacturing to be successful in the U.S.,” said Melissa Grupen-Shemansky, SEMI CTO. “The guide provides vital support for implementation of the HIR, a comprehensive document addressing the global supply chain for heterogenous integration.”

Download the guide.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI and UCLA Offer Guide to Facilitate Onshoring Advanced Packaging Facilities in the United States

Event to Honor Dr. Lawrence T. Pileggi of Carnegie Mellon University for Significant Contributions to the Electronic System Design Industry

MILPITAS, Calif. –– January 30, 2024 –– The Phil Kaufman Award ceremony and banquet honoring Dr. Lawrence Pileggi of Carnegie Mellon University (CMU) as the 2023 award recipient will be held Thursday, February 22, 6:30-9:30pm at The GlassHouse in San Jose, Calif.
 

Dr. Pileggi, CMU’s Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering, received the award for his pioneering contributions to circuit simulation and optimization. These advances have enabled the electronics system design industry to address the challenge of interconnect delay dominated designs. Dr. Pileggi has also contributed to innovations in Electrical & Computer Engineering (ECE) education.

Dr. Walden Rhines, President and CEO of Cornami, Inc., former CEO of Mentor Graphics (now Siemens), and the 2015 Phil Kaufman Award recipient, will emcee the ceremony. The tribute speaker will be Dr. Andrzej Strojwas of CMU, the CTO of PDF Solutions and the 2016 Phil Kaufman Award recipient.

The annual award ceremony and banquet are sponsored by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and the IEEE Council on Electronic Design Automation (CEDA). Tickets are $250 for members of SEMI and IEEE and $300 per non-member. Registration for the event on the ESD Alliance or CEDA websites.

About the Phil Kaufman Award
The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2022 recipient was Dr. Giovanni de Micheli, Professor and Director of the Institute of Electrical Engineering and of the Integrated Systems Centre at EPF Lausanne, Switzerland.

About the IEEE Council on Electronic Design Automation (CEDA)
The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies –Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). CEDA sponsors a portfolio of over 30 conferences including ASP-DAC, DATE, DAC, ESWEEK, and ICCAD. Its award program recognizes EDA professionals which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career awards.

Stay in touch with IEEE CEDA

• Website: ieee-ceda.org
• LinkedIn: https://www.linkedin.com/company/ieee-ceda/
• Facebook: https://www.facebook.com/ieeeceda/
• Twitter: https://twitter.com/IEEECEDA

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. Visit the ESD Alliance to learn more.

Follow the ESD Alliance

• Website: esd-alliance.org
• Blog: ESD Alliance Bridging the Frontier blog
• Twitter: @ESDAlliance
• LinkedIn: https://www.linkedin.com/groups/3582068/
• Facebook: https://www.facebook.com/ESDAlliance

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

All trademarks and registered trademarks are the property of their respective owners.
 

Association Contacts

Nanette Collins/ESDA
Phone: 1.617.437.1822
Email: [email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Amanda Osborn/IEEE-CEDA
Phone: 1.352.872.5544 ext. 123
Email: [email protected]

• Read more about Phil Kaufman Award Ceremony and Banquet Set for February 22

SEOUL, South Korea ─ January 30, 2024 ─ With the rise of generative AI driving demand for advanced chips and memory semiconductors to process and store massive amounts of data, the stage is set for SEMICON Korea 2024, opening tomorrow at COEX in Seoul. The region's premier microelectronics event, SEMICON Korea 2024 will take aim at collaborations and technology innovations critical to manufacturing semiconductors demanded by advanced applications.

Themed Innovation Beyond Boundaries, SEMICON Korea 2024 is expected to draw record attendance of 70,000 as 500 companies showcase the latest semiconductor manufacturing technologies. The event will host 30 technology and business conferences featuring more than 200 visionaries and experts as speakers. Opportunities for companies from across the semiconductor supply chain to connect and explore new collaborations will also be a key feature.

The need for greater global semiconductor industry collaboration continues as players from across the chip ecosystem explore ways to overcome some of the world’s biggest technology challenges, including harnessing the power of semiconductors to manage generative AI and other data-hungry applications. South Korea is vital in this effort, with major semiconductor equipment companies such as ASML, Applied Materials, Lam Research, and TEL establishing R&D centers in the region. At the same time, Korea’s memory leaders Samsung and SK hynix, as well as the region’s equipment, materials and parts enterprises, are uncovering new collaboration opportunities.

SEMICON Korea 2024 Keynotes
 

	Choonhwan Kim, Senior Vice President, Head of R&D Process SK hynix Changes in Technology Trends to Overcome the Integration Limits of Memory Devices
	Anand Nambiar, Chief Commercial Officer of Electronics Business Sector Merck KGaA, Darmstadt, Germany Digital and Data in the Materials World
	Sean Lundy, VP, Global Sales Eliyan Eliyan Unleashed: Elevating Package Performance and Accelerating Memory Chiplets Adoption
	Jung-Woo Ha, Head of AI Innovation and Head of Future AI Center NAVER NAVER’s Strategy in Era of Paradigm Shift by Frontier AI

More SEMICON Korea 2024 Highlights

• The popular Supplier Search Program will host major chipmakers including GlobalFoundries, Infineon, KIOXIA and Micron as they hold some 100 meetings with Korean equipment, materials and parts companies looking to expand their global footprint.
• Forums will key in on market trends, sustainability, smart manufacturing, and metrology and inspection, with major players from across the global semiconductor ecosystem sharing best practices and cutting-edge technologies.
• Investment Forums
  • The U.S. Investment Forum will offer insights into the U.S. CHIPS Act and discuss how states such as Arizona, Colorado, Indiana, New York and Texas are establishing supporting policies.
  • The Europe Investment Forum will feature representatives from the European Commission, Belgium, France, Germany, Netherlands, Sweden, Switzerland and the United Kingdom offering insights into the EU CHIPS Act and investment strategies for growing the semiconductor industry.
  • The Southeast Asia Investment Forum will feature representatives from Malaysia, the Philippines, Thailand, and Vietnam – all emerging semiconductor manufacturing regions.
• New: The Startup Summit will match venture capitalists with startup chip companies aspiring to become the next unicorns in order to explore investment opportunities.

The STS (SEMI Technology Symposium) at SEMICON Korea 2024 will showcase the latest technology advances and roadmaps in sessions on six key semiconductor manufacturing processes:

• Lithography
• Materials
• Device
• Etch
• CMP and Cleaning
• Packaging

Workforce Development

To help address the semiconductor industry’s talent shortage, 10 engineers will provide guidance on career development to STEM university students during the Meet the Experts! mentoring program. Additionally, Women-in-Technology, aimed at enhancing industry competitiveness by promoting diversity, equity and inclusion in the chip industry, will host four female leaders as they share insights into career growth.

Full details are available on the SEMICON Korea 2024 website.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Jaegwan Shim/SEMI Korea
Phone: 82+10.3014.9807
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Korea 2024 Opens Tomorrow to Spotlight Chip Industry Innovation and Growth Opportunities

BRUSSELS, Belgium — January 25, 2024 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the European Commission’s announcement of the European Economic Security Strategy as a positive and fundamental step forward in assuring Europe’s economic security.

The European Commission designed the European Economic Security Strategy to protect the European Union’s economic security and reinforce the resilience of its economy by investing in the region’s competitiveness, diversifying its supply chains, and minimizing the risks of economic interdependencies.

The strategy was initially announced in June 2023 in response to the pandemic and the rise in geopolitical tensions after they revealed vulnerabilities in the economies of its 27 member states. It seeks to identify and assess the risks to the EU’s economic security and develop new tools for their mitigation, with a strong focus on advanced semiconductors as a critical technology area identified by the European Commission.

“The semiconductor industry depends on a high level of cross-border investments and international cooperation as its supply chain is extremely specialized and fragmented with thousands of industrial players globally,” said Laith Altimime, President of SEMI Europe. “The European Economic Security Strategy should provide a path to economic security with government incentives and other support that place equal emphasis on its three guiding principles of Protection, Promotion and Partnership.”

The initiatives proposed today by the European Commission are the following:

• Proposal for a new regulation on the screening of foreign direct investments (FDI)
• White paper on export controls
• White paper on outbound investment
• Proposal for a European Council recommendation on research security
• White paper for enhancing support for research and development involving technologies with dual-use potential

SEMI Europe will continue to engage with relevant stakeholders to contribute to the political debate and encourage a legislative framework that can enhance economic security across industrial supply chains while preserving Europe’s technological competitive advantage. SEMI will share an in-depth perspective in the position paper SEMI Europe Priorities on the European Economic Security Strategy scheduled to be published by mid-February 2024.

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

SEMI Europe Advocacy  

Discover how SEMI Europe Advocacy & Public Policy supports the microelectronics industry across trade, taxes, talent, and R&D or become involved by contacting [email protected].

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Applauds Announcement of European Economic Security Strategy

VIENNA, Austria — January 16, 2024 — Leading analysts, economists, policymakers and technologists will gather at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2024, March 6-8 in Vienna, Austria, for insights into the latest trends and innovations shaping the global semiconductor industry. The annual symposium provides industry intelligence that enables attendees to align their company business plans and forecasts with current market conditions. Registration is open.

Themed Key Strategies for Europe’s Success: An Evolving Global Landscape, ISS Europe 2024 will examine economic, technology, market, business, and societal developments and trends influencing the global electronics manufacturing industry. 

“These are exciting times for industry leaders to strategize and capitalize on growth opportunities in Europe,” said Laith Altimime, President of SEMI Europe. “Europe plays a key role in propelling global semiconductor industry growth as the digital transformation and the implementation of the EU Chips Act lay the groundwork for the industry’s path to $1 trillion. Thought leaders at ISS Europe will offer perspectives on fostering innovation, strengthening R&D, ensuring supply chain resilience, and advancing European sovereignty.”

ISS Europe 2024 Highlights

Session 1: Market Trends and Key Strategies 
Leading market analysts will address global semiconductor market trends and strategies, highlighting Europe’s challenges and opportunities in an evolving world.

Session 2: End-to-End Supply Chain Resilience

Experts will explore deglobalization trends, ways to secure the semiconductor supply chain and opportunities in both the front and back ends of semiconductor production such as process innovation and equipment advancements.

Session 3: Cultivating the Workforce and Leaders of Tomorrow 

Thought leaders will provide insights into the actionable strategies companies can implement to cultivate the workforce of tomorrow. The discussions will highlight pathways for collaboration, innovation, and strategic partnerships that can strengthen the chip industry.

Session 4: Inspire Innovation, Empower Sustainability 

Experts will examine how integrating advanced technologies – including automation and data analytics – can help address the industry’s sustainability goals, climate change, and growing digitalization.

Session 5: Sustainable Technology Solutions for Future Applications 

Speakers will shed light on coming innovations across diverse applications – such as medical devices, data centers, artificial intelligence, and automotive – and their profound implications for the design and manufacture of semiconductors.

Business Networking

ISS Europe 2024 will feature several networking activities including a welcome reception at the Hilton Vienna Park and an exclusive gala dinner at Hofburg Vienna, where attendees will meet with peers to explore new business partnerships and opportunities.

Sponsors

• Platinum: Comet, Edwards and Macquarie
• Gold: ASM, EBARA and Synopsys
• Event: EV Group (EVG), imec and JSR Micro

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2024 website and connect with SEMI Europe onX or LinkedIn @SEMIEurope (#ISSEurope).

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI ISS Europe 2024 to Spotlight European Chips Act With Focus on Innovation and Supply Chain Resilience

MILPITAS, Calif. — January 8, 2024 — Electronic System Design (ESD) industry revenue increased 25.2% to $4,702.4 million in the third quarter of 2023 from the $3,756.3 million logged in the third quarter of 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 13.8%.

“Electronic design automation (EDA) reported record revenue growth in Q3 23,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “This was the highest overall growth since Q4 1998. The Computer-Aided Engineering, IC Physical Design and Verification, Printed Circuit Board and Multi-Chip Module, and Semiconductor Intellectual Property categories reported double-digit growth. Further, all geographic regions reported substantial growth.”

The companies tracked in the EDMD report employed 59,737 people globally in Q3 2023, a 10.6% jump over the Q3 2022 headcount of 53,034 and up 1% compared to Q2 2023.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Year-Over-Year Change

• Computer-Aided Engineering (CAE) revenue increased 22.4% to $1,657.5 million. The four-quarter CAE moving average increased 16.7%.
• IC Physical Design and Verification revenue surged 45.3% to $904.5 million. The four-quarter moving average for the category increased 29%.
• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 23.6% to $426.1 million. The four-quarter moving average for PCB and MCM rose 14%.
• Semiconductor Intellectual Property (SIP) revenue increased 22.1% to $1,575.9 million. The four-quarter SIP moving average rose 5.3%.
• Services revenue slipped 3.9% to $138.3 million. The four-quarter Services moving average rose 6%.

Revenue by Region – Year-Over-Year Change

• The Americas, the largest reporting region by revenue, procured $1,984.1 million of electronic system design products and services in Q3 2023, a 22.8% jump. The four-quarter moving average for the Americas rose 11.2%.
• Europe, Middle East, and Africa (EMEA) procured $551.1 million of electronic system design products and services in Q3 2023, a 21.5% increase. The four-quarter moving average for EMEA grew 13.4%.
• Japan’s procurement of electronic system design products and services increased 30.5% to $309.3 million. The four-quarter moving average for Japan increased 9.4%.
• Asia Pacific (APAC) procured $1,858 million of electronic system design products and services in Q3 2023, a 28.1% increase. The four-quarter moving average for APAC grew 17.8%.

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

• Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
• Revenue by geographic region (Americas, EMEA, Japan and APAC)
• Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI

SEMI® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts

Paul Cohen
ESD Alliance
A SEMI Technology Community
978-769-2106

Jack Taylor
Siemens EDA PR
Siemens Digital Industries Software
512-560-7143 

• Read more about Electronic System Design Industry Posts Record $4.7 Billion in Revenue in Q3 2023, ESD Alliance Reports

MILPITAS, Calif. — January 8, 2024 — Semiconductor industry growth opportunities in the year ahead will take center stage at Industry Strategy Symposium (ISS) 2024 as the year’s first executive check-in opens today with leading analysts, researchers, economists, and technologists offering insights on forces impacting the industry.

Themed Ready, Set and Ramp?, the event at the Ritz-Carlton in Half Moon Bay, Calif. will present industry intelligence to help inform company business plans and forecasts based on current market conditions.

ISS speakers will highlight trends that promise to lay the groundwork for the semiconductor industry’s path to $1 trillion in revenue with a focus on innovation and business opportunities in growth markets. Central themes at ISS 2024 will include:

• Economic trends
• Geopolitical and semiconductor supply chain trends
• Semiconductor market drivers including AR/VR, medical and artificial intelligence (AI), and power semiconductors
• Fab challenges
• PFAS regulations and challenges
• CHIPS Act updates and investments

ISS 2024 Highlights

Keynotes

• Day 1: Sumit Sadana, Executive Vice President and Chief Business Officer, Micron Technology
• Day 2: Deepak Kulkarni, Ph.D., Senior Fellow, Advanced Packaging, AMD
• Day 3: Kevin Quinn, Senior Relationship Director, CHIPS Program Office, United States Department of Commerce
• Day 3: Ian Steff, Former Assistant Secretary of Commerce, President and CEO, mySilicon Compass

Economic trends and market forces shaping the electronics industry

• Executives and economists from Hilltop Economics, Gartner, SEMI, TechInsights and Yole Group

Insights into market and application drivers

• Top executives from META Research Lab, Microsoft, MilliporeSigma and Infineon Technologies

Technology trends

• Experts from Tokyo Electron, STMicroelectronics and TechInsights

Headwinds

• Thought leaders from Albright Stonebridge Group, Bechtel, Entegris and New Hope Energy

Tailwinds

• Experts from Comet Group, McKinsey & Company, Renesas and TechSearch International

About SEMI
SEMI^® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Industry Strategy Symposium 2024 Opens to Highlight Semiconductor Growth Opportunities on Path to $1 Trillion

MILPITAS, Calif. — January 2, 2024 — Global semiconductor capacity is expected to increase 6.4% in 2024 to top the 30 million *wafers per month (wpm) mark for the first time after rising 5.5% to 29.6 wpm in 2023, SEMI announced today in its latest quarterly World Fab Forecast report.

The 2024 growth will be driven by capacity increases in leading-edge logic and foundry, applications including generative AI and high-performance computing (HPC), and the recovery in end-demand for chips. The capacity expansion slowed in 2023 due to softening semiconductor market demand and the resulting inventory correction.

“Resurgent market demand and increased government incentives worldwide are powering an upsurge in fab investments in key chipmaking regions and the projected 6.4% rise in global capacity for 2024,” said Ajit Manocha, SEMI President and CEO. “The heightened global attention on the strategic importance of semiconductor manufacturing to national and economic security is a key catalyst of these trends.”

Covering 2022 to 2024, the World Fab Forecast report shows that the global semiconductor industry plans to begin operation of 82 new volume fabs, including 11 projects in 2023 and 42 projects in 2024 spanning wafer sizes ranging from 300mm to 100mm.

China Leads Semiconductor Industry Expansion

Boosted by government funding and other incentives, China is expected to increase its share of global semiconductor production. Chinese chip manufacturers are forecast to start operations of 18 projects in 2024, with 12% YoY capacity growth to 7.6 million wpm in 2023 and 13% YoY capacity growth to 8.6 million wpm in 2024.

Taiwan is projected to remain the second-largest region in semiconductor capacity, increasing capacity 5.6% to 5.4 million wpm in 2023 and posting 4.2% growth to 5.7 million wpm in 2024. The region is poised to begin operations of five fabs in 2024.

Korea ranks third in chip capacity at 4.9 million wpm in 2023 and 5.1 million wpm in 2024, a 5.4% increase as one fab comes online. Japan is expected to place fourth at 4.6 million wpm in 2023 and 4.7 million wpm in 2024, a capacity increase of 2% as it starts operations of four fabs in 2024.

The World Fab Forecast shows the Americas increasing chip capacity by 6% YoY to 3.1 million wpm with six new fabs in 2024. Europe & Mideast is projected to up capacity 3.6% to 2.7 million wpm in 2024 as it launches operations of four new fabs. Southeast Asia is poised to increase capacity 4% to 1.7 million wpm in 2024 with the start of four new fab projects.

Foundry Segment Continues Strong Capacity Growth

Foundry suppliers are forecast to rank as the top semiconductor equipment buyers, increasing capacity to 9.3 million wpm in 2023 and a record 10.2 million wpm in 2024.

The memory segment slowed expansion of capacity in 2023 due to weak demand in consumer electronics including PCs and smartphones. The DRAM segment is expected to increase capacity 2% to 3.8 million wpm in 2023 and 5% to 4 million wpm in 2024. Installed capacity for 3D NAND is projected to remain flat at 3.6 million in 2023 and rise 2% to 3.7 million wpm next year.

In the discrete and analog segments, vehicle electrification remains the key driver of capacity expansion. Discrete capacity is forecast to grow 10% to 4.1 million wpm in 2023 and 7% to 4.4 million wpm in 2024, while Analog capacity is projected to grow 11% to 2.1 million wpm in 2023 and 10% to 2.4 million wpm in 2024.

The latest update of the SEMI World Fab Forecast report, published in December, lists 1,500 facilities and lines globally, including 177 volume facilities and lines with various probabilities expected to start operation in 2023 or later. 

Download a sample of the SEMI World Fab Forecast report.

For details about SEMI reports on other semiconductor sectors, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

*200mm equivalent

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contacts

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

• Read more about Global Semiconductor Capacity Projected to Reach Record High 30 Million Wafers Per Month in 2024, SEMI Reports