MILPITAS, Calif. — November 2, 2023 — SEMI today announced availability of the new Industry 4.0 Readiness Assessment Model (IRAM) to help organizations across the semiconductor supply chain assess and track their smart manufacturing technology deployment progress and develop a roadmap for their digital transformations. Created through a collaboration of the SEMI Smart Manufacturing Initiative and industry experts, IRAM aids companies in identifying technology enhancements critical to scaling and sustaining their Industry 4.0 transformation to improve chipmaking efficiency, productivity, and quality.

“The new SEMI IRAM will help semiconductor companies assess their Industry 4.0 compliance as they implement smart manufacturing practices that demand greater connectivity inside chip fabs and throughout the supply chain,” said Ajit Manocha, SEMI President and CEO. “Crucially, the service will also facilitate cybersecurity decision-making as semiconductor companies work with their supply chain partners to protect data traversing Industry 4.0 networks.”

IRAM is designed to support critical operations in fabs and back-end or enterprise-level facilities but also extends to supporting industries and most batch-based manufacturing lines, offering a benchmarking tool to compare Industry 4.0 deployment among peers or across industries. IRAM enables organizations to assess their Industry 4.0 maturity and take the necessary steps to maximize ROI.

“The IRAM model is specific enough for immediate utility and flexible enough for everything from individual operations to entire fabs or the enterprise,” said Andrew Seward, Field Solutions and Marketing and Analytics Manager at Tokyo Electron America, Inc. and co-chair of the SEMI Smart Manufacturing Guidelines Sub-committee. “The model will facilitate the identification of gaps and defining next steps, whether you're just beginning your smart manufacturing journey or are already well on your way.”

The SEMI Smart Manufacturing Initiative has chapters in the Americas, China, Europe, Japan, Korea, Southeast Asia and Taiwan. Group members collaborate on Smart Manufacturing challenges and opportunities in their regions. Become involved by contacting SEMI at [email protected].

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Launches Industry 4.0 Readiness Assessment Model to Advance Semiconductor Smart Manufacturing Maturity

MILPITAS, Calif. — October 17, 2023 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today released the following statement on new export controls announced today by the U.S. Commerce Department:

“We recognize and appreciate that sustaining a robust U.S. semiconductor sector is central to the Administration's national security objectives. However, given the risks of unilateral and broad controls, we will continue to evaluate the consequences of these export controls and communicate to the Administration the impacts to the global and U.S. semiconductor supply chain.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments.

About SEMI
SEMI^® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Statement on New U.S. Export Controls

TAIPEI, Taiwan — October 16, 2023 — 2023 Energy Taiwan and Net-Zero Taiwan opens Oct. 18 at the Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1) to showcase the latest innovations and collaboration opportunities in the world’s drive toward net-zero carbon emissions. Jointly organized by the Taiwan External Trade Development Council (TAITRA) and Green Energy and Sustainability Alliance (GESA), a SEMI Industry Group, the event is Taiwan’s largest platform for promoting renewable energy across solar power, wind power, smart storage and emerging energy sources. Registration is open.

The three-day event featuring forums and expositions will gather representatives from the renewable energy industry, public sector, academia and research organizations to explore ways to increase green energy production.

“It is imperative that we start the net-zero transformation without delay to mitigate the impact of global climate change,” said Terry Tsao, Global Chief Marketing Officer and President of SEMI Taiwan. “To realize this goal, we must increase renewable energy production volume. Investments in renewable energy are growing worldwide. For its part, Taiwan continues to promote solar power, wind power, energy storage, and various emerging power sources while encouraging the development of high-potential energy sources such as hydrogen, marine, and geothermal energy.”

Energy Taiwan and Net-Zero Taiwan Highlights

Running Oct. 18-20, the event will feature new business opportunities and innovative net-zero solutions during the following forums:

• Smart Energy Storage Forum – Experts from the Ministry of Economic Affairs, Delta Electronics, Ancillary Power, and CTBC Bank will consider ways to support industry development and realize the AlwaysOn vision for energy storage systems. Speakers will address the topic from perspectives including government regulations and policies, onsite firefighting and protection, internal safety design of energy storage systems, financing, insurance, and operations.

• Net-Zero Taiwan International Forum – Sponsored by the National Development Council, the forum will feature experts from France, Finland, Spain, the Taiwan Carbon Solution Exchange (TCX) and Carbon Disclosure Project (CDP) offering insights centered on three themes: Go Green: Trends and Insights, Green Finance: Financing for Energy Revolution, and Green Energy: Powered by Tech. Speakers will share cases of corporate carbon reduction as well as net-zero trends and strategies in various regions. Sustainability companies such as Schneider Electric Taiwan, HD Renewable Energy, and Chinese Petroleum Corporation, as well as green finance providers Mega Bank, Bank SinoPac, and the Taipei Exchange will also participate in the Forum.

• Solar Power Technology Symposium – Industry experts and academics will discuss the latest solar power industry trends and paths to new innovations. Topics will include the advantages of perovskite technology, new developments in optical storage for solar power systems, and green building case studies.

• Energy Transition: Toward a Sustainable Future Forum – Operators of green energy and financial institutions will explore the latest trends and cutting-edge applications in green power, green finance, and green power industry development. Experts will also share viewpoints on how to sustainably develop green energy and create a new green finance ecosystem.

Power Installation Capacity Accounts for Nearly 70% of Renewable Energy Infrastructure

The development of renewable energy continues to attract growing investment worldwide. According to the World Energy Investment 2023 report released by the International Energy Agency (IEA), global investment in renewable energy in 2023 is expected to reach US$1.7 trillion, an increase of 24% compared to 2021. For the first time, total annual investment in solar power energy will exceed anticipated new investments in the upstream petroleum sector.

Statistics from Taiwan’s Ministry of Economic Affairs show that the average annual growth rate of Taiwan’s installed renewable energy capacity over the past five years has reached 21.9%, far exceeding the global average of 9.1%.

Solar power photovoltaics accounts for 68.9% of renewable energy expansion in Taiwan, with the growth rate of offshore wind power at 7.4%, onshore wind power at 5.5%, and conventional hydropower at 13.5%. The percentage of renewable energy installations in Taiwan continues to increase. At today’s Energy Taiwan and Net-Zero Taiwan press conference, speakers from Chinese Petroleum Corporation and Taiwan Cement Corporation shared insights under the theme Building a Complete Ecosystem for Taiwan to Move Towards Net-Zero Emissions.

Visit the 2023 Energy Taiwan and Net-Zero Taiwan website for more information. See the event agenda.

About Green Energy and Sustainability Alliance (GESA)
SEMI Taiwan established the Energy Group in 2008. The Committee brings together opinion leaders for policy initiatives to facilitate collaboration among the solar power, wind power and smart energy storage industries. Formed by SEMI Taiwan in July 2023 to accelerate the semiconductor industry's net-zero transition, GESA serves as a cross-sector platform for industry, government, academia, and research, fostering policy exchange and technological advancements. The Alliance promotes carbon emissions reduction, energy management, circular economy, and green finance. It aims to become Taiwan's largest platform for green energy and sustainability and help the chip industry reach net zero by 2050.

About TAITRA
TAITRA is a non-profit organization established by Taiwan in 1970 to promote Taiwan's foreign trade and facilitate business collaborations. TAITRA has a team of 1,300 specialists and operates five local offices as well as 62 branches worldwide. Together with Taipei World Trade Center (TWTC) and Taiwan Trade Center (TTC), TAITRA has formed a global network dedicated to promoting world trade.

Through its domestic and overseas offices, TAITRA provides trade promotion, market research, education, and matchmaking services. Branch offices play vital roles in coordinating Taiwan Trade Shows between TAITRA’s Taipei headquarters and local companies and inviting buyers to visit local industries. TAITRA plays a crucial role in enhancing Taiwan's global trade presence and promoting economic development.

About SEMI
SEMI^® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about 2023 Energy Taiwan and Net-Zero Taiwan Opens This Week With Carbon Emission Reductions, Renewable Energy Innovations in Focus

MILPITAS, Calif. — October 16, 2023 — Electronic System Design (ESD) industry revenue increased 5.3% to $3,962.7 million in the second quarter of 2023 from $3,763.6 million in the second quarter of 2022, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 9.5%.

“Growth in total electronic design automation (EDA) revenue in Q2 23 was limited by weak semiconductor IP revenue,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “However, total license and maintenance revenue, which includes all design tools, was strong at 16.1% overall with double-digit growth in all regions except Japan.”

The companies tracked in the EDMD report employed 59,160 people globally in Q2 2023, an 11.8% jump over the Q2 2022 headcount of 52,918 and up 2.5% compared to Q1 2023.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Year-Over-Year Change

• Computer-Aided Engineering (CAE) revenue jumped 19.7% to $1,512.4 million. The four-quarter CAE moving average increased 17.6%.

• IC Physical Design and Verification revenue rose 14.2% to $689 million. The four-quarter moving average for the category increased 17.2%.

• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 6.3% to $369 million. The four-quarter moving average for PCB and MCM rose 11.7%.

• Semiconductor Intellectual Property (SIP) revenue decreased 11.6% to $1,255 million. The four-quarter SIP moving average fell 1.6%.

• Services revenue increased 5.2% to $137.5 million. The four-quarter Services moving average rose 12.3%.

Revenue by Region – Year-Over-Year Change

• The Americas, the largest reporting region by revenue, procured $1,627.9 million of electronic system design products and services in Q2 2023, an 0.6% decline. The four-quarter moving average for the Americas rose 7.5%.

• Europe, Middle East, and Africa (EMEA) procured $509.4 million of electronic system design products and services in Q2 2023, a 7.8% increase. The four-quarter moving average for EMEA grew 8.2%.

• Japan’s procurement of electronic system design products and services decreased 4.3% to $241.6 million. The four-quarter moving average for Japan fell 0.3%.

• Asia Pacific (APAC) procured $1,583.9 million of electronic system design products and services in Q2 2023, a 13.1% increase. The four-quarter moving average for APAC grew 14.4%.

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

• Revenue by product category (CAE, IC Physical Design and Verification, Semiconductor IP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
• Revenue by geographic region (Americas, EMEA, Japan and APAC)
• Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI

SEMI® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts

Paul Cohen
ESD Alliance, a SEMI Technology Community
Phone: (978) 769-2106                      

Jack Taylor
Siemens EDA PR
Siemens Digital Industries Software
Phone: (512) 560-7143          

• Read more about Electronic System Design Industry Posts $4 Billion in Revenue in Q2 2023, ESD Alliance Reports

MILPITAS, Calif. — October 2, 2023 — Industry visionaries and experts will gather November 6-8 at the MEMS & Sensors Executive Congress (MSEC 2023) at the WIGWAM Resort in Phoenix, Arizona for insights into the latest trends and innovations in sensorization. Themed Sensorizing Our World – Driving Global Solutions, the conference will highlight applications and technology advances for growth markets including automotive, biomedical and MEMS healthcare, AI and generative AI, metaverse, positioning, navigation and timing (PNT), and sustainable smart cities. Registration is open.

“I’m very excited about this year’s MSEC 2023 theme of driving global solutions through sensorization,” said Tim Brosnihan, Executive Director of the SEMI MEMS & Sensors Industry Group (MSIG). “Sensors are essential to helping the world overcome challenges on a number of fronts, from climate change and transportation to improving health. At the same time, these obstacles create tremendous business and societal opportunities. We look forward to hosting industry leaders as they offer perspectives on the path forward.”

Hosted by the MEMS & Sensors Industry Group, a SEMI technology community, MSEC 2023 will kick off with an outdoor luncheon, a tour of EVG’s industry-leading MEMS tools and processing facilities, a poster session, and a presentation by Arizona State University Knowledge Enterprise Corporate Innovation Labs and faculty on MEMS and sensor innovation opportunities in Arizona’s Silicon Desert.

Day 1 at MSEC 2023 will also feature the Rolling Together Team Bike Building activity with bicycles to be donated to a local children’s charity.

MSEC 2023 Sessions

• Session 1 – Keynotes featuring thought leaders from Emerge, Qualcomm and Kennedy Space Center
• Session 2 – Product Showdown: Medical Sensors and Applications
• Session 3 – Latest MEMS and Sensors Market and Business Trends
• Session 4 – Exploring AI, Generative AI and the Metaverse
• Session 5 – Advancements in Positioning, Navigation and Timing
• Session 6 – Advanced and Novel Sensor Applications

MSEC 2023 Sponsors

• Platinum – EVG
• Gold – Infineon
• Bronze – Evatec, KLA, Lam Research, X-FAB
• Event – Bosch, NXP, PNI, Rogue Valley Microdevices, SUSS MicroTec, Team NEO, Teledyne Technologies, ULVAC Technologies

About SEMI
SEMI^® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about MEMS & Sensors Executive Congress 2023 to Spotlight Sensorization Driving Global Solutions

MILPITAS, Calif. — September 25, 2023 — SEMI today announced the election of four new members to the SEMI North America Advisory Board (NAAB): Dr. Russell Low, President and CEO of Axcelis; Martin Elzingre, Vice President and General Manager of Semiconductor Division North America at Edwards Vacuum; Audrey Charles, Senior Vice President of Corporate Strategy at Lam Research; and Dr. Jeorge S. Hurtarte, Senior Director of SoC Semiconductor Test at Teradyne.

The Board appointments took effect September 15, 2023. Members serve a three-year term. The principal advocate for member companies located in North America, the NAAB provides guidance on SEMI Americas programs designed to advance their business interests and address significant challenges in the electronics manufacturing and design supply chain.

“We continue to expand the breadth of our board to further strengthen industry representation in components, design, device, equipment, materials and services,” said Joe Stockunas, President of SEMI Americas. “The board is comprised of small to large companies to provide varying perspectives to meet the needs of our members during this incredibly challenging and exciting time for our industry. We are extremely fortunate to add the depth of knowledge and expertise from Russell, Martin, Audrey and Jeorge to carry us forward.”

Dr. Russell Low, President and CEO of Axcelis, joined the board of directors of Axcelis in 2016, providing skills in R&D, engineering, operations and general management. During his seven years with Axcelis, Dr. Low has been instrumental in developing and launching Axcelis' expanding Purion ion implant product line, including its successful Purion Power Series. He has more than 30 of leadership experience in the semiconductor industry from his tenure at Applied Materials, Varian, and Veeco. He holds a Bachelor of Science degree in Chemistry from Southampton University, Executive Master of Business Administration from MIT, a Ph.D in Physical Chemistry from University of Oxford and was a visiting fellow at Stanford University. Additionally, he was awarded 44 U.S. patents.

Martin Elzingre, Vice President and General Manager of Semiconductor Division North America at Edwards Vacuum, brings process engineering, applications, product marketing, sales and operations management to the NAAB from his career at Lam, Electroglas, and KLA. During his tenure at KLA, he held a senior director position for more than 16 years. He is also a board member of Atlas Copco North America and Atlas Copco Europe Financial Services Board. Elzingre holds a Bachelor of Science degree in Business Management from University of Phoenix.

With over 25 years at Lam Research, Audrey Charles, Senior Vice President of Corporate Strategy, is responsible for aligning and driving strategic priorities across the company in support of Lam’s long-term growth plan. She also oversees Lam’s Corporate Development team and the company’s investment arm, Lam Capital. Her experience includes engineering, customer technology management, and a range of leadership positions including Senior Vice President of Global Human Resources, Vice President of Corporate Initiatives and Chief of Staff to the CEO. She earned a Bachelor of Science in Applied Physics from Dublin City University and a Master of Business Administration from MIT Sloan.

Dr. Jeorge S. Hurtarte, Principal Marketing Strategist at Teradyne for SoC semiconductor test, has more than 35 years of experience in the semiconductor industry in design engineering, semiconductor fabrication, assembly and test, and sales and marketing. Dr. Hurtarte has held various technical, management and executive positions at Teradyne, Lam Research, LitePoint, TranSwitch, and Rockwell Semiconductors. He holds a Bachelor of Science degree in electrical engineering from University of California, Irvine, a Master of Science in computer science from National University, a Master of Science in telecommunications engineering from Walden University, and a Ph.D. in electrical engineering from Auburn University. He is also a graduate of Harvard Business School's Advanced Management Program (AMP) for executives.

Dr. Hurtarte has served on the advisory Board of Directors of the Global Semiconductor Alliance (previously called the Fabless Semiconductor Association), TUV Rheinland of North America, and the NSF’s Wireless Internet Center for Advanced RF Technology. Dr. Hurtarte is the lead co-author of the book Understanding Fabless IC Technology.

About SEMI
SEMI^® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI North America Advisory Board Welcomes New Members From Axcelis, Edwards Vacuum, Lam Research and Teradyne

MILPITAS, Calif. — September 20, 2023 — The SEMI Semiconductor Climate Consortium (SCC) today issued its first report of the semiconductor ecosystem’s greenhouse gas (GHG) emissions profile, an in-depth analysis of the semiconductor value chain’s carbon footprint and priority-ranked carbon emission sources for the industry to address.

Titled Transparency, Ambition, and Collaboration: Advancing the Climate Agenda of the Semiconductor Value Chain, the report provides the most comprehensive sustainability data available on the semiconductor ecosystem. Key takeaways from the report compiled by Boston Consulting Group (BCG), under the direction of the SCC Baselining, Ambition-Setting and Roadmapping (BAR) Working Group, include:

• Baseline of value chain emissions: Semiconductor devices produced in 2021 have a lifetime CO2e footprint of 500 megatonne (MT) – 16% from supply chain, 21% from manufacturing, and 63% from device use.

• Low-carbon energy is a key lever: Bold and decisive investments in low-carbon energy sources can address more than 80% of industry emissions primarily by reducing the carbon footprint stemming from electricity usage for semiconductor manufacturing and for powering chips in electronics devices.

• Investment and innovation to solve remaining 16%: Emissions from the supply chain and from manufacturing process gases will require considerable research and development to address, necessitating investments now.

• Future manufacturing emissions scenarios: Current government and company commitments will substantially reduce manufacturing emissions, but they are still forecasted to overshoot the carbon budget for the 1.5°C pathway.

• Dilemma of value chain emissions: Digital technologies that require semiconductors play a crucial role in reducing energy use and emissions across industries while simultaneously adding to the overall carbon footprint.

“While the SCC’s work on behalf of the industry is just getting started, its sustainability report clearly outlines where chip industry efforts initially should be focused and how we can make the greatest impact for SEMI members and the semiconductor value chain at large,” said Mousumi Bhat, Vice President of Sustainability at SEMI. “Thanks to the BCG team for their collaboration on this seminal work.”

“For our industry to effectively accelerate climate action, it is crucial that we have a shared view on our industry’s baseline carbon footprint, expected trajectory of future emissions, and available improvement levers,” said Marijn Vervoorn, BAR co-lead and Director of Sustainability Strategy at ASML. “This report, including its clear view on data gaps and required data quality improvements, provides the foundation for an ambitious industry roadmap showing the tangible action required to achieve both short-term objectives and Net Zero emissions in 2050.”

“Our work is far from finished,” said Chris Jones, BAR co-lead and Business Development Manager at Edwards. “For the SCC to be successful, we need all three stages of baselining, setting our ambitions (targets) and curating the roadmap of how we will get there. Net Zero is our ultimate goal for SCC members, but the many steps to get there is the detail we are working out.”

“The BCG team is proud to be part of this groundbreaking research to build the most comprehensive baseline of the industry’s greenhouse gas emissions, helping to focus our Climate Change and Sustainability efforts where they are most impactful,” said Ramiro Palma, Ph.D., BCG Managing Director and Partner, Global Semiconductor Practice Area co-lead. “We thank the SCC and its member companies for all their engagement to make this study their own in a step toward a greener future.”

Download the report.

About the Semiconductor Climate Consortium

The Semiconductor Climate Consortium (SCC) is the first global collaborative of semiconductor ecosystem companies focused on reducing greenhouse gas emissions across the value chain. The consortium's members are committed to working toward the following pillars and objectives:

• Collaboration – Align on common approaches, technology innovations and communications channels to continuously reduce greenhouse gas emissions.
• Transparency – Publicly report progress and Scope 1, 2 and 3 emissions annually.
• Ambition – Set near- and long-term decarbonization targets with the aim of reaching net zero emissions by 2050.

Discover how the SCC is working to accelerate efforts by the industry value chain to reduce greenhouse gas emissions or become involved by contacting us at [email protected].

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X, formerly Twitter, to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain’s Carbon Emissions

MILPITAS, Calif. — September 21, 2023 — Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 13 new 200mm volume fabs (excluding EPI) as the industry reaches a record high of more than 7.7 million wafers per month (wpm), SEMI announced today in its 200mm Fab Outlook to 2026 report.

Power and compound semiconductors, which are vital for the consumer, automotive and industrial sectors, are the biggest drivers of 200mm investment. The development of powertrain inverters and charging stations for electric vehicles (EVs) in particular is expected to fuel increases in global 200mm wafer capacity as EV adoption continues to rise.

“The global semiconductor industry’s ramp to record 200mm fab capacity highlights the bullish expectations for growth in the automotive market in particular,” said Ajit Manocha, SEMI President and CEO. “While automotive chip supply has stabilized, the increased chip content in EVs and the drive to reduce charging time is spurring capacity expansions.”

Chip suppliers including Bosch, Fuji Electric, Infineon, Mitsubishi, Onsemi, Rohm, STMicroelectronics and Wolfspeed are accelerating their 200mm capacity projects to meet future demand.

The SEMI 200mm Fab Outlook to 2026 report shows fab capacity for power semiconductors growing 35% from 2023 to 2026, with Microprocessor Unit/Microcontroller Unit (MPU/MCU) ranking second at 21%, followed by MEMS, Analog, and Foundry at 16%, 8%, and 8%, respectively.

Accounting for most of the 200mm fab capacity are 80nm to 350nm technology nodes. Growth of 80nm to 130nm node capacity is forecast to expand by 10%, while 131nm to 350nm technology nodes are expected to register an 18% expansion from 2023 to 2026.
 

Regional Outlooks

Excluding EPI, Southeast Asia is projected to lead 200mm capacity growth with a 33% increase from 2023 to 2026. China is expected to rank second with 22% growth. The biggest contributor to the 200mm capacity expansion, China is projected to reach more than 1.7 million wafers per month by 2026. Americas, Europe & Mideast, and Taiwan will follow at 14%, 11%, and 7% growth, respectively.

In 2023, China is forecast to claim 22% share of 200mm fab capacity, while Japan is expected to account for 16% of total capacity, followed by Taiwan, Europe & Mideast, and America at 15%, 14%, and 14%, respectively.

The SEMI 200mm Fab Outlook to 2026 report tracks 335 fabs and lines (from R&D and volume). The report includes 99 updates across 85 facilities and lines, including 12 new lines since the previous update in March 2023.

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more.

Association Contacts

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

• Read more about Global 200mm Fabs to Reach Record High Capacity by 2026, SEMI Reports

GRENOBLE, France – September 18, 2023 – Innovation will take center stage at the SEMI MEMS & Imaging Sensors Summit as the event opens tomorrow at the World Trade Center in Grenoble to provide the latest insights into new opportunities for MEMS, imaging and sensors applications and their potential to enable a smarter and more sustainable world. Registration is open for the September 19-21 conference.

“AI and machine learning are driving a new wave of innovative applications in the development and manufacturing of MEMS and image sensors,” said Laith Altimime, President of SEMI Europe. “We look forward to hosting industry thought leaders as they share their visions for how new advances promise to drive the development of more eco-friendly products and applications.”

The event is hosted by SEMI Europe and the MEMS & Sensors Industry Group, a SEMI Technology Community.

Themed Ubiquitous Sensing for a Sustainable World, the MEMS & Imaging Sensors Summit will highlight recent manufacturing advances in MEMS and imaging sensors, as well as how the latest innovations are enabling intelligent applications in various sectors such as entertainment, medical, communications, and mobility.

Featured Speakers

• Hod Finkelstein, Head of Cameras and Depth, Reality Labs, Meta
• Bernard Kress, Director, Optical Engineering, Augmented Reality Hardware, Google
• Lia Li, Co-founder and CEO, Zero Point Motion
• Kilian Bilger, Vice President Engineering Sensor Components, Bosch
• Theodor Nielsen, CEO, NIL Technology (NILT)
• Isabella Drolz, Vice President of Product Marketing, Comet Yxlon
• Moti Margalit, CEO, SonicEdge
• Martin Croome, Vice President of Marketing, GreenWaves Technologies
• Julia Brueckner, Global Applications & Product Engineering Manager for Packaging & Wafer Business Unit, Corning Incorporated
• Thomas Russell, CEO, Mesoline
• Philippe Andreucci, CEO, Inject Power
• André Henning, Head of R&D, Siemens Healthineers

Gala Dinner and Networking Opportunities

The SEMI MEMS & Imaging Sensors Summit networking opportunities include a complimentary welcome reception on September 19 in the exhibition area at the WTC and a gala dinner on September 20 at the Chateau de Sassenage.

Industry Leaders Exhibiting at MEMS & Imaging Sensors Summit

• Adeia
• AEMtec
• ASE
• Besi
• CEA-Leti
• Comet Yxlon
• Eurofins | MASER
• EV Group (EVG)
• FormFactor
• Okmetic
• OPTIM Wafer Services
• Panasonic Connect Europe
• Philips MEMS & Micro Devices
• Polyteknik AS
• ProSys
• Pyxalis
• SET Corporation
• Siconnex
• Siemens EDA (represented by EDA Solutions Limited)
• SoftMEMS LLC
• Sumitomo Precision Products
• SUSS Microtec
• VTT
• L. Gore & Associates
• Yole Group

Premier Sponsors

• Platinum Sponsors: Adeia, ASE, Infineon, KLA and Siconnex
• Gold Sponsors: Comet Yxlon and SUSS MicroTec
• Event sponsors: Beneq, Caeleste, Evatec, EV Group (EVG), Okmetic and Teledyne MEMS

For more information, please visit the SEMI MEMS & Imaging Sensors Summit website.

Stay in touch on Twitter @SEMIEurope: #MEMSSummit #MEMS #Imaging #SEMIEurope

About SEMI 
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and X (formerly Twitter) to learn more. 

Association Contacts 

Serena Brischetto/SEMI Europe 
Phone: +49 30 3030 8077-11 
Email: [email protected] 

Michael Hall/SEMI US 
Phone: 1.408.943.7988 
Email: [email protected]

• Read more about SEMI MEMS & Imaging Sensors Summit Opens Tomorrow with Sustainability and Innovation in Focus

MILPITAS, Calif. — September 12, 2023 — Global fab equipment spending for front-end facilities in 2023 is expected to decline 15% year-over-year (YoY) to US$84 billion from a record high of US$99.5 billion in 2022 before rebounding 15% YoY to US$97 billion in 2024, SEMI announced today in its latest quarterly World Fab Forecast report. Softening chip demand and elevated inventory of consumer and mobile devices will contribute to the 2023 decline.

Next year’s fab equipment spending recovery will be partly driven by the end of the semiconductor inventory correction in 2023 and strengthening demand for semiconductors in the high-performance computing (HPC) and memory segments.

“The 2023 decline in equipment investment is proving shallower and the 2024 rebound stronger than expected earlier this year,” said Ajit Manocha, SEMI president and CEO. “The trend suggests the semiconductor industry is turning the corner on the downturn and on a path back to robust growth fueled by healthy chip demand.”
 

Foundry Segment Continues to Lead Semiconductor Industry Expansion

The foundry segment is expected to lead the semiconductor expansion in 2023 with US$49 billion in investments, 1% growth, and US$51.5 billion in spending in 2024, a 5% increase as investment continues in leading-edge and mature process nodes. Memory spending is forecast to stage a strong comeback in 2024 with a 65% increase to US$27 billion after a 46% decline in 2023. Specifically, DRAM investments are expected to decline 19% YoY to US$11 billion in 2023 but recover to US$15 billion, a 40% annual jump, in 2024. NAND spending is projected to mirror that trend, decreasing 67% to US$6 billion in 2023 but surging 113% to US$12.1 billion in 2024. MPU investments are expected to remain flat in 2023 and increase 16% to US$9 billion in 2024.

Taiwan Continues to Lead Equipment Spending

Taiwan is expected to retain the global lead in fab equipment spending in 2024 with US$23 billion in investments, a 4% YoY increase. Korea is projected to rank second in spending, with an estimated US$22 billion in investments in 2024, a 41% jump from this year reflecting a memory sector recovery. With export controls expected to limit China’s spending in leading-edge technologies and foreign investment, the region is forecast to place third in equipment spending worldwide in 2024 at US$20 billion, a decline from 2023 levels. Despite the constraints, Chinese foundry suppliers and IDMs are expected to continue investments in mature process nodes.

The Americas is expected to remain the fourth largest region in spending, reaching a historic high of US$14 billion in investments in 2024, a 23% YoY increase. The Europe and Mideast region is also forecast to log record investments next year, increasing spending by 41.5% to US$8 billion. Fab equipment spending in Japan and Southeast Asia is expected to increase to US$7 billion and US$3 billion, respectively, in 2024.

Covering 2022 to 2024, the SEMI World Fab Forecast report shows the global semiconductor industry increasing capacity by 5% this year after an 8% rise in 2022. Capacity growth is expected to continue in 2024, climbing 6%.

The latest update of the SEMI World Fab Forecast report, published in September, lists 1,477 facilities and lines globally, including 169 facilities and lines with various probabilities expected to start operation in 2023 or later.

Download a sample of the SEMI World Fab Forecast report.

For details about SEMI reports on other semiconductor sectors, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

• Read more about 2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports