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MILPITAS, Calif. — April 9, 2024 — Aiming to help the global semiconductor workforce expand its skills to address the talent gap, SEMI today announced the expansion of the SEMI University™ learning platform to include in-person trainings. Complementing SEMI U online courses, the semiconductor curriculum is designed for technicians, engineers and non-technical staff ranging from new hires to experienced workers looking to advance their careers. The courses cover subjects including front-end and back-end manufacturing operations, principles of chip design, and rapidly evolving technologies such as artificial intelligence (AI), MEMS and advanced packaging.

The initial in-person trainings will be held at SEMI headquarters in Milpitas, California. See the SEMI University Course Calendar for upcoming sessions. SEMI U will also offer instructor-led trainings on July 8, 2024, at the Moscone Center in San Francisco preceding SEMICON West 2024, July 9-11. Discounted SEMI U: Pre-Show Training sessions are available for SEMICON West attendees and students.

“SEMI member companies have flagged the semiconductor industry talent and skills gap as a top concern that could impact long-term growth,” said SEMI University Director Naresh Naik. “Our new SEMI U in-person trainings bolster our online courses in supporting industry efforts to train and upskill employees and help incoming talent establish their careers in pursuing growth. We carefully curated each course topic based on industry demand, emerging trends, and feedback from our existing online courses. By focusing on these specific areas, we aim to address the most pressing needs of our audience, providing them with practical skills and knowledge that are directly applicable to their roles and career advancement.”

SEMI U in-person course topics include:

About SEMI University and the SEMI Workforce Development Program

The SEMI University learning platform offers more than 575 online courses specifically created for the semiconductor industry, providing an easy-to-use online training program in multiple languages for employees ranging from recently hired facility operators to experienced technicians, engineers and non-technical staff.

SEMI has offered in-person training and technology trend updates more than 50 years, and it hosts webinars covering SEMI standards, market dynamics and semiconductor manufacturing and design best practices. SEMI University builds on this experience and adds to the association’s holistic Workforce Development program offered by the SEMI Foundation. The non-profit arm of SEMI, the SEMI Foundation drives initiatives to increase awareness of semiconductor industry careers, connect member companies with university students for mentoring and internships, attract and train military veterans, and develop a more diverse and inclusive workforce.

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. April 8, 2024 — Electronic System Design (ESD) industry revenue increased 14% to $4,423 million in the fourth quarter of 2023 from the $3,879.9 million logged in the third quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 14.1%.

“Electronic design automation (EDA) continued to report strong revenue growth in Q4 2023,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “The Computer-Aided Engineering, Printed Circuit Board and Multi-Chip Module, Semiconductor Intellectual Property, and Services categories reported double-digit growth. Further, all geographic regions reported substantial growth.”

The companies tracked in the EDMD report employed 60,106 people globally in Q4 2023, an 8.9% jump over the Q4 2022 headcount of 55,192 and up 0.6% compared to Q3 2023.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Year-Over-Year Change

  • Computer-Aided Engineering (CAE) revenue increased 19.5% to $1,512.1 million. The four-quarter CAE moving average increased 19.3%.
  • IC Physical Design and Verification revenue declined 1% to $691.5 million. The four-quarter moving average for the category increased 20%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 21% to $410.8 million. The four-quarter moving average for PCB and MCM rose 18.9%.
  • Semiconductor Intellectual Property (SIP) revenue increased 13.7% to $1,632.4 million. The four-quarter SIP moving average rose 5.9%.
  • Services revenue jumped 25.4% to $176.2 million. The four-quarter Services moving average rose 10.8%.

Revenue by Region – Year-Over-Year Change

  • The Americas, the largest reporting region by revenue, procured $1,921 million of electronic system design products and services in Q4 2023, an 11.9% increase. The four-quarter moving average for the Americas rose 11.6%.
  • Europe, Middle East, and Africa (EMEA) procured $608.2 million of electronic system design products and services in Q4 2023, a 20.5% increase. The four-quarter moving average for EMEA grew 17.8%.
  • Japan’s procurement of electronic system design products and services grew 8.3% to $262 million. The four-quarter moving average for Japan increased 9.4%.
  • Asia Pacific (APAC) procured $1,631.8 million of electronic system design products and services in Q4 2023, a 15.2% increase. The four-quarter moving average for APAC grew 16.7%.

About the EDMD Report
The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

  • Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.
 

Association Contacts

Paul Cohen
Phone: 978-769-2106
Email: [email protected]

Jack Taylor
Phone: 512-560-7143
Email: [email protected]

DRESDEN, Germany — March 26, 2024 — Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024, in Dresden for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent and sustainable systems. Registration is open.

Themed Heterogeneous Systems for the Intelligently Connected Era, this year’s SEMI 3D & Systems Summit will feature a broader scope of topics including market trends, chiplet design, hybrid bonding, Co-Packaged Optics (CPO), high-bandwidth computing and environmental sustainability.

“We look forward to hosting the most prominent names in 3D integration microelectronics manufacturing to showcase their latest products and technologies at the 3D & Systems Summit,” said Laith Altimime, President of SEMI Europe. “With advanced packaging innovations critical to enabling environmental sustainability while increasing chip performance, we look forward to hosting experts who will discuss the microelectronics industry’s work to explore more eco-friendly alternatives to conventional materials.”

3D Summit Sessions

Session 1: Semiconductor Market Trends and European Impact
Executive leaders will analyze the dynamic relationship between global semiconductor trends and the European landscape, highlighting the implications for Europe’s economic expansion and technological progress.

Session 2: Chiplet System Architectures – Design and Technologies
Industry experts will delve into dynamic chiplet design, emphasizing innovative approaches, emerging trends, optimization strategies, and packaging solutions that drive chiplet innovations.

Session 3: Hybrid Bonding Technologies for Advanced 3D Integration
Specialists will spotlight the latest advancements in hybrid bonding technologies, focusing on recent developments, novel techniques, and emerging applications. Speakers will highlight hybrid bonding’s transformative potential for enhancing semiconductor performance and overall functionality.

Session 4: Manufacturing Innovation for 3D Integration
Visionaries will showcase the newest hybrid bonding advancements, emphasizing their potential to enhance chip performance, efficiency, and functionality through recent innovations and emerging applications.

Session 5: Co-Packaged Optics (CPO) – Innovations for High Bandwidth Computing
Leaders will explore CPO as an advancement in integrated photonics, highlighting its cost-effectiveness, enhanced integration, and potential to improve performance in data transmission and processing systems.

Session 6: Materials and Processes Supporting Environmental Sustainability
Experts will spotlight semiconductor industry efforts to prioritize environmental sustainability through collaboration, innovation, and a continued commitment to exploring eco-friendly alternatives and reducing the industry’s environmental footprint.

Global Leaders to Present

3D & Systems Summit presenters include experts from these global leaders:

  • CARIAD
  • CEA-Leti
  • EPIC
  • EV Group
  • Fraunhofer IIS-EAS
  • Fraunhofer IZM-ASSID
  • imec
  • KLA Corporation
  • MKS-Atotech
  • NVIDIA
  • Silicon Saxony
  • SPTS Technologies Ltd., a KLA company
  • STMicroelectronics
  • TechSearch International, Inc.

Exhibition and Business Networking

The 3D & Systems Summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.

To reserve an exhibition space, contact [email protected].

This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise.

Networking Dinner registration is reserved exclusively for 3D & Systems Summit 2024 participants. Guests may register their spouse for dinner by completing the spouse registration form

3D Summit premium sponsors: Adeia, ASE, Comet Yxlon, EV Group, Heidenhain, imec, KLA, Lam Research, and MKS-Atotech.

For more details, please visit the 3D & Systems Summit 2024 website and connect with SEMI Europe onX or LinkedIn @SEMIEurope (#3DSummit).
 

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
 

Association Contacts

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Executives from RISC-V International, SiFive, Keysight, D2S, Breker, PDF Solutions and Real Intent to Share Industry Insights

MILPITAS, Calif. –– March 26, 2024 –– Key executives from leading semiconductor EDA and IP companies will gather to discuss the latest industry trends, challenges and opportunities Thursday, May 9, in Santa Clara, California at the annual CEO Executive Outlook, hosted by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, and Keysight Technologies. Registration is open.

 

Kicking off the program, Calista Redmond, CEO of RISC-V International, the industry group representing the RISC-V ecosystem, and Patrick Little, CEO of SiFive, a RISC-V IP provider, will address the state of the developing RISC-V market.

A panel discussion with executives from leading companies in the design ecosystem will immediately follow. Participants include:

  • Niels Faché of Keysight
  • Aki Fujimura of D2S
  • Dave Kelf of Breker
  • John Kibarian of PDF Solutions
  • Prakash Narain of Real Intent
  • Moderator: Bob Smith, Executive Director of the ESD Alliance

The event will be held at Keysight Technologies, 5301 Stevens Creek Blvd. in Santa Clara, beginning at 5:30 p.m. with networking, dinner and beverages. The RISC-V speaker program starts at 6:45 p.m. with the executive panel discussion to follow at 7:30 p.m. Tickets for the event are $25 per person for SEMI members and $50 per person for non-members.

About The ESD Alliance

The ESD Alliance, a SEMI Technology Community, represents members of the design ecosystem that provide goods and services spanning the conceptualization, design, verification, manufacturing and deployment of semiconductor chips and electronic systems.

The ESD Alliance focuses on:

  • Coordinating and amplifying the collective voice of the design industry
  • Promoting the value the design industry delivers to the global semiconductor and electronics industry
  • Addressing and defending against threats and reducing risks
  • Achieving efficiencies for the industry
  • Marketing the attractiveness of the design industry as an ideal place to pursue a career
  • Enabling networking, sharing and collaboration among its members

Engage with the ESD Alliance

www.esd-alliance.org
ESD Alliance Bridging the Frontier blog
X @ESDAlliance
LinkedIn
Facebook

 

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

All trademarks and registered trademarks are the property of their respective owners.
 

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Nanette Collins/ESD Alliance
Phone: 1.617.437.1822
Email: [email protected]

MILPITAS, Calif. — March 26, 2024 — More than 125 experts will offer insights into the latest semiconductor manufacturing strategies and methodologies as hundreds of industry stakeholders gather at the 35th annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2024), May 13-16 in Albany, New York. Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in artificial intelligence, smart manufacturing and sustainability will come into sharp focus. Registration is open.

Featuring keynotes by thought leaders from IBM, Wolfspeed, and Semiconductor Advisors, ASMC 2024 is the premier event where industry professionals network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Bradley Wood, Applications Engineering Manager, CMP Filtration at Entegris, and Vijayalakshmi Seshachalam, CVD Process Engineer Lead at GlobalFoundries.

ASMC will also feature the workforce development panel discussion Talent Pipeline: Building a Sustainable and Diverse Semiconductor Workforce. Panelists will include:

  • Fran Dillard, Vice President and Chief Diversity Inclusion Officer, Micron
  • Kylie Patterson, Senior Advisor, CHIPS for America
  • Héctor M. Rodríguez, Ph.D., Professional Engineer, Dean of Science, Technology, Engineering and Math, Hudson Valley Community College
  • Kevin Younis, COO and Executive Deputy Commissioner, Empire State Development

ASMC 2024 technical sessions will cover topics including:

  • 3D, TSV, and Novel Advanced Silicon Processing
  • Advanced Equipment Processes and Materials
  • Advanced Metrology
  • Advanced Process Control
  • Advanced Semiconductor Technologies
  • Big Data Management and Mining
  • Contamination Free Manufacturing
  • Defect Inspection
  • Equipment Optimization
  • Factory Automation
  • Manufacturing for Sustainability
  • Smart Manufacturing / Industrial Engineering
  • Yield Enhancement / Yield Methodologies

The Women in Semiconductors (WiS 2024) program takes place on Thursday, May 16 in conjunction with ASMC 2024. The program will address challenges and strategies for promoting diversity and inclusion in the workplace. Complimentary registration is available for ASMC attendees.

For more conference details, please visit the ASMC website or contact Krish Raghunath of SEMI at [email protected].

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. — March 19, 2024 — Global 300mm fab equipment spending for front-end facilities is forecast to reach a record US$137 billion in 2027 after topping US$100 billion for the first time by 2025 on the strength of the memory market recovery and strong demand for high-performance computing and automotive applications, SEMI highlighted today in its quarterly 300mm Fab Outlook Report to 2027 report.

Worldwide 300mm fab equipment investment is expected to increase 20% to US$116.5 billion in 2025 and 12% to US$130.5 billion in 2026 before hitting a record high in 2027.

“Projections for the steepening ramp of 300mm fab equipment spending in the coming years reflects the production capacity needed to meet growing demand for electronics across a diverse range of markets as well as a new wave of applications spawned by artificial intelligence (AI) innovation,” said Ajit Manocha, SEMI President and CEO. “The newest SEMI report also highlights the critical importance of increases in government investments in semiconductor manufacturing to bolster economies and security worldwide. This trend is expected to help significantly narrow the equipment spending gap between re-emerging and emerging regions and the historical top-spending regions in Asia.”
 

 
 

Regional Growth

The SEMI 300mm Fab Outlook to 2027 report shows China continuing to lead fab equipment spending with US$30 billion in investments in each of the next four years fueled by government incentives and domestic self-sufficiency policies.

Supported by leading-edge nodes expansion for high-performance computing (HPC) and the memory market recovery, Taiwanese and Korean chip suppliers are increasing their equipment investments. Taiwan is expected to rank second in equipment spending at US$28 billion in 2027, up from US$20.3 billion in 2024, while Korea is expected to rank third at US$26.3 billion in 2027, an increase from US$19.5 billion this year.

The Americas is projected to double 300mm fab equipment investments from US$12 billion in 2024 to US$24.7 billion in 2027, while spending in Japan, Europe & the Middle East, and Southeast Asia are expected to reach US$11.4 billion, US$11.2 billion, and US$5.3 billion in 2027, respectively.

Segment Growth

Foundry segment spending is expected to decline 4% to US$56.6 billion this year due in part to the expected slowdown in mature nodes (>10nm) investment, though the segment continues to log the highest growth among all segments to meet market demand for generative AI, automotive and intelligent edge devices. The segment’s equipment spending is forecast to post a 7.6% compound annual growth rate (CAGR) to US$79.1 billion from 2023 to 2027.

Demand for greater data throughput, crucial for AI servers, is driving strong demand for high-bandwidth memory (HBM) and spurring increased investment in memory technology. Among all segments, memory is ranked second and is expected to post US$41.5 billion in equipment investments in 2027, a 20% CAGR from 2023. DRAM equipment spending is expected to rise to US$25.2 billion in 2027, a 17.4% CAGR, while 3D NAND investment is projected to reach US$16.8 billion in 2027, a 29% CAGR.

The Analog, Micro, Opto, and Discrete segments are projected to increase 300mm fab equipment investments to US$5.5 billion, US$4.3 billion, US$2.3 billion, and US$1.6 billion in 2027, respectively.

The SEMI 300mm Fab Outlook Report to 2027 report lists 405 facilities and lines globally, including 75 high-probability facilities expected to start operation during the four years beginning in 2024. The report reflects 358 updates and 26 new fabs/lines project since its last publication in December 2023.

For more information on the report or to subscribe to SEMI market data, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

MILPITAS, Calif. ─ March 19, 2024 – Keynote speakers at the SEMI MEMS and Sensors Technical Congress (MSTC 2024) will highlight smart home and smart garment innovations driven by artificial intelligence (AI) as industry visionaries and experts gather May 1-2 at Covel Commons at University of California, Los Angeles (UCLA) to discuss the latest MEMS and sensors trends and innovations. Registration is open.

Themed Sensorizing Our World: Technology Driving Global Solutions, MSTC 2024 will feature keynotes and technical sessions on critical MEMS and sensors topics. Highlights also include posters showcasing novel applications from the next generation of innovators and networking opportunities for participants to help grow their businesses.

Sponsored by the SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2024 will offer a deep dive into how to bring sensor products to market, from design through fabrication and testing and packaging to end-use applications. Industry experts will explore the software and systems needed to expand both legacy and emerging MEMS and sensors to open new markets and business opportunities.

MSTC 2024 Keynote Speakers

Seong-Hyok Sean Kim, Ph.D., CTO, Senior Research Fellow 
& Vice President, Tech Lead of AI Perception and Quantum AI
LG Electronics Inc.

Sensing as an AI Service for Smart Home

Enrico Alessi, R&D Manager
STMicroelectronics

The Rise of Smart Garments: Sensors, AI and Fashion


MSTC 2024 Technical Sessions

MSTC 2024 will also showcase MEMS and sensors applications in the following areas:

  • AI-driven Sensor Systems
  • MEMS Emerging Technology & Devices
  • New Frontiers in MEMS & Sensors Fabrication
  • Revolutionary Sensors for Biomedical Applications
  • Smart Environmental Sensors
  • Positioning, Navigation & Timing

More MSTC 2024 Session Highlights

  • Market and Technology Trends and Forecast
  • Automotive Sensor Tech Showdown
  • UCLA lab tours
  • Networking reception showcasing technology application posters created by students from UCLA

See the complete agenda for MSTC 2024. Follow MSTC 2024 on X and LinkedIn.

 

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

New edition of database tracks 33% more facilities and highlights advanced packaging and factory certifications

MILPITAS, Calif. – March 18, 2024 – The new edition of the Worldwide Assembly & Test Facility Database expands coverage to 670 facilities, 33% more than the previous release, including 500 outsourced semiconductor assembly and test (OSAT) service providers and 170 integrated device manufacturer (IDM) facilities, SEMI and TechSearch International announced today. The database is the only commercially available listing of assembly and test suppliers that provides comprehensive updates on packaging and testing services offered by the semiconductor industry.

The updated database includes factory certifications in critical areas such as quality, environmental, security and safety as well as data reflecting automotive quality certifications obtained by each site. The new edition also highlights advanced packaging offerings by each factory, defined as flip chip bumping and assembly, fan-out and fan-in wafer-level packaging (WLP), through silicon via (TSV), 2.5D and 3D capability.

“Understanding the location of legacy packaging as well as advanced packaging and test is essential to effective supply-base management,” said Jan Vardaman, President at TechSearch International. “The updated Worldwide Assembly & Test Facility Database is an invaluable tool in tracking the packaging and assembly ecosystem.”

“The database increases its focus on advanced packaging while highlighting conventional packaging capabilities and new test capabilities to support innovations in key end markets including automotive,” said Clark Tseng, Senior Director of SEMI Market Intelligence.
 

 

Combining the semiconductor industry expertise of SEMI and TechSearch International, the Worldwide Assembly & Test Facility Database update also lists revenues of the world's top 20 OSAT companies and captures changes in technology capabilities and service offerings.

Covering facilities in the Americas, China, Europe, Japan, Southeast Asia, South Korea and Taiwan, the database highlights new and emerging packaging offerings by manufacturing locations and companies. Details tracked include:

  • Plant site location, technology, and capability: Packaging, test, and other product specializations, such as sensor, automotive and power devices
  • Packaging assembly service offerings Ball grid array (BGA), specific leadframe types such as quad flat package (QFP), quad flat no-leads (QFN), small outline (SO), flip-chip bumping, WLP, Modules/System in Package (SIP), and sensors
  • New manufacturing sites announced, planned or under construction

Key Report Highlights

  • The world's top 20 OSAT companies in 2022 with financial comparisons to 2021, as well as preliminary comparisons to 2023
  • 150-plus facility additions compared to the 2022 report
  • 200-plus companies and more than 670 total back-end facilities
  • 325-plus facilities with test capabilities
  • 100-plus facilities offering QFN
  • 85-plus bumping facilities, including more than 65 with 300mm wafer bumping capacity
  • 90-plus facilities offering WLCSP technology
  • 130-plus OSAT facilities in Taiwan, more than 150 in China, and more than 60 in Southeast Asia
  • 50-plus IDM assembly and test facilities in Southeast Asia, about 45 in China, nearly 20 in Americas and more than 12 in Europe
  • More than 30% of global factories offering advanced packaging capabilities in one of the following areas: flip chip bumping and assembly, fan-out and fan-in WLP, TSV, 2.5D and 3D

Worldwide Assembly & Test Facility Database licenses are available for single and multiple users. SEMI members save up to 25% on licenses. Download a sample of the report and see pricing and ordering details.

For more information on the database or to subscribe to SEMI market data, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

About TechSearch International, Inc.
Founded in 1987, TechSearch International (Austin, Texas) is a technology licensing and consulting company specializing in accurate, relevant, and timely information on advanced packaging technology and market development. Visit www.techsearchinc.com.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Kuala Lumpur, 19 March 2024 – With the Southeast Asia semiconductor sector attracting growing worldwide investments as more regions diversify their supply chains, the stage is set for SEMICON Southeast Asia 2024 as visionaries and experts gather May 28-30 at MITEC in Kuala Lumpur, Malaysia for insights into the latest industry developments, trends and innovations and critical areas including sustainability, smart manufacturing, and workforce development. Registration is open.

Themed Boosting Agility and Resiliency of the Global Electronics Supply Chain, SEMICON Southeast Asia 2024 will feature more than 500 exhibiting companies and more than 1,000 booths, doubling participation from last year’s exhibition and conference. The exponential expansion underscores the rising interest in Southeast Asia's semiconductor sector and the increasing importance of SEMICON Southeast Asia, the region’s premier global electronics manufacturing and supply chain event, in bringing industry stakeholders together to pursue new innovation and growth opportunities.

Accounting for US$200 billion in chip exports, Southeast Asia boasts growing manufacturing capabilities, supporting government policies and a strong pool of skilled workers.

“In recent years, Southeast Asia has become a compelling destination for foreign direct investments (FDIs) due to its strategic location, investment-friendly policies, and the region's diverse workforce,” said SEMI Southeast Asia President Linda Tan. “SEMICON Southeast Asia 2024 is a crucial platform for the region, offering a tremendous opportunity for participants to actively engage with industry peers, network, and share knowledge.”

“In 2023, Malaysia's Electrical and Electronics (E&E) industry contributed over 40% to Malaysia’s total exports, making it a vital component and strong performer of our export economy,” said YB Tengku Datuk Seri Utama Zafrul Aziz, Minister of Investment, Trade and Industry (MITI). “This is a clear demonstration of how strong policies have contributed to this sector’s resilience, which will receive further impetus under the New Industrial Master Plan 2030 (NIMP2030) and the National Semiconductor Strategic Task Force (NSSTF).”

“With focus areas such as integrated circuit design, wafer fabrication, and high-technology industries, we aim to strengthen Malaysia's position in the global E&E value chain with an emphasis on sustainability, innovation, and competitiveness,” YB Zafrul Aziz said. “To that end, we are pleased to again welcome SEMICON Southeast Asia. The event is expected to help domestic E&E companies strengthen their footprint within the region as they capitalize on increasing global demand for semiconductors.”

SEMICON Southeast Asia 2024 Highlights

SEMICON Southeast Asia 2024 is made possible by strategic partnerships with the Invest Selangor, Malaysia External Trade Development Corporation (MATRADE), Ministry of Investment, Trade and Industry (MITI) and Malaysian Investment Development Authority (MIDA).

For the full event agenda, please visit the SEMICON Southeast Asia website.

About MITI

MITI is the key driver in making Malaysia the preferred destination for quality investments and enhancing the nation's rising status as a globally competitive trading nation. Its objectives and roles are oriented towards ensuring Malaysia’s rapid economic development and help achieve the country's stated goal of becoming a developed nation.

About MIDA

MIDA is the government’s principal investment promotion and development agency under the Ministry of Investment, Trade and Industry (MITI) to oversee and drive investments into the manufacturing and services sectors in Malaysia. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 21 overseas offices. MIDA continues to be the strategic partner to businesses in seizing the opportunities arising from the technology revolution of this era.

About Invest Selangor

Invest Selangor Berhad (ISB) is the state government agency responsible for promoting and facilitating investment in Selangor, Malaysia. With its commitment to providing investors with the ease of doing business, ISB ensures investors have a hassle-free investment journey. The agency offers a comprehensive suite of services, including site selection assistance, investment facilitation, and aftercare services. ISB is dedicated to providing investors with a conducive business environment, which includes streamlined procedures, efficient services, and access to industry insights and networks. This commitment to investor ease of mind has made Selangor an attractive investment destination for local and foreign investors. With ISB's support, investors can focus on their business operations and leave the administrative matters to the agency, giving them the peace of mind they need to grow their investments in Selangor.

About MATRADE

The Malaysia External Trade Development Corporation (MATRADE) was established on March 1, 1993 as the external trade promotion arm of Malaysia's Ministry of Investment, Trade and Industry (MITI). It has 46 overseas network and 5 Malaysia’s regional offices that support its HQ, located at Menara MATRADE, Jalan Sultan Haji Ahmad Shah, Kuala Lumpur. Its functions are:

  • To promote, assist and develop Malaysia's external trade with particular emphasis on the export of manufactured and semi-manufactured products and services;
  • To formulate and implement export marketing strategies and trade promotion activities to promote Malaysia's export;
  • To undertake commercial intelligence and market research and create a comprehensive database of information for the improvement and development of Malaysia's trade;
  • To organise training programmes to improve the international marketing skills of Malaysian exporters;
  • To enhance and protect Malaysia's international trade investment abroad; and
  • To promote, facilitate and assist in the services areas related to trade.

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Media Contacts

Precious Betache/SEMI Southeast Asia
Phone: +65 - 98178837
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Reshvinder Kaur
Phone: +6017 275 7985
Email: [email protected]

VIENNA, Austria ─ March 7, 2024 ─ SEMI Europe today announced recipients of the SEMI European Award and Special Service Award for 2023 at the SEMI Industry Strategy Symposium Europe (ISS Europe 2024). Dallal Slimani, Chief Strategy Officer at Schneider Electric, was honored with the European SEMI Award and Dr. Ivo Raaijmakers, Corporate Vice President and Executive Advisor at ASM, with the Special Service Award.

Established more than 30 years ago, the SEMI European Award and Special Service Award recognize key players in the global manufacturing supply chain, highlighting their leadership excellence and strategic contributions that lead to critical advances in the semiconductor industry.

“We are honored to recognize Dallal Slimani and Dr. Ivo Raaijmakers for their outstanding leadership and tremendous contributions to the semiconductor community,” said Laith Altimime, President of SEMI Europe. “These extraordinary leaders have been instrumental in helping the semiconductor industry fulfill its ambitions and inspiring future generations to drive toward a sustainable future.”

“This award serves as a testament to the hard work, dedication, and collaboration of an incredible partnership with SEMI and all our partners,” said Slimani. “I am grateful for this remarkable acknowledgment. I firmly believe that by partnering and engaging in the Catalyze program, we can drive the necessary changes for our industry to contribute to a more environmentally sustainable planet. The Schneider Electric team takes pride in being part of this transformation.”

The SEMI European Award recognizes Slimani’s leadership in driving sustainability initiatives and implementing circular economy principles in Europe for Schneider Electric, which culminated with the Catalyze program, to help decarbonize the semiconductor value chain.

“It is exciting to see that ALD and PEALD, a little-known technology 25 years ago, turned into the critical deposition technology it is today,” said Dr. Raaijmakers. “Many teams at ASM contributed to this technology that today enables 3D devices with new advanced materials.”

Dr. Raaijmakers’ outstanding career and leadership was pivotal in the research, development and commercialization of Atomic Layer Deposition (ALD) and Plasma-enhanced ALD (PEALD) equipment and processes, technologies that shaped and continue to influence the semiconductor industry. The ingenuity of ASM’s Finnish ALD and Korean PEALD groups and integrating their innovations into a worldwide product portfolio drove the market success of the two technologies. Dr. Raaijmakers joined ASM in 1996 and served as CTO from 1999 through 2022.

Nominations for the 2024 SEMI European Award are open. Please see the award guidelines. Prior European SEMI Award recipients hailed from companies including Melexis, imec, Soitec, CEA-Leti, Technical University of Dresden, Catholic University of Leuven, STMicroelectronics, EV Group, Infineon, and the Fraunhofer Institute. See the list of past SEMI European Award recipients.

For more details, visit the SEMI European Award web page and connect with SEMI Europe onX or LinkedIn – @SEMIEurope, #SEMIEuropeAward.

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]