MUNICH, Germany ─ September 5, 2023 ─ Experts will gather for insights into the latest advanced packaging and fab management trends and innovations as critical enablers of the path to net zero at SEMICON Europa 2023, November 14-17 at Messe München in Munich. Registration is open for the Advanced Packaging Conference (APC) and Fab Management Forum (FMF).

Co-located with productronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain and featuring a live exhibition and programs.

Advanced Packaging Conference ─ Packaging Innovations Enabling Sustainable Applications

Sustainability is vital to the semiconductor industry growth on its path to $1 trillion, with electrification, renewable energy, connectivity, and AI playing crucial roles. Collaboration and innovation across the semiconductor supply chain will be essential to fueling sustainability.

This year’s Advanced Packaging Conference (APC) will focus on: 

• Megatrends and Opportunities for Advanced Packaging and Front-End Integration
• Smarter Supply Chain Solutions for A Sustainable Ecosystem
• Testing and Reliability
• System in Package (SiP) Requirements for Future Applications
• Power Electronics Packaging

Speakers include experts from AT&S, Atotech an MKS Brand, Cohu, Comet Yxlon, Elmos Semiconductor, Evatec, Fraunhofer Institutes, GlobalFoundries, Henkel, imec, Infineon Technologies, JCET Group, Koh Young Europe, Merck KGaA, Darmstadt, Germany, ProSys, STMicroelectronics, and TSMC.

The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, Merck KGaA, Darmstadt, Germany, Panasonic Connect and Resonac Europe.

Fab Management Forum ─ Strategies for Succeeding Sustainable Growth

Long-term strategies are essential to improving resilience across the European semiconductor supply chain.

This year’s Fab Management Forum (FMF) will focus on:

• Fab Expansion Landscape: Opportunities and Challenges
• Industrial Collaboration Models
• Poster Session: Industry Meets Innovative Ideas
• Cultivating the Workforce of Tomorrow
• Solutions Enabling the Path to Net Zero
• Smarter Manufacturing for a Connected Ecosystem

Speakers include thought leaders from Applied Materials, D-SIMLAB Technologies, INFICON, Infineon Technologies, Intel, Qualcomm, Robert Bosch, Schneider Electric, STMicroelectronics, Texas Instruments, Tokyo Electron Europe, Watlow, Wolfspeed, and X-FAB.

The forum is sponsored by Comet Yxlon, Edwards, Flexciton, INFICON, Sachsen-Anhalt, Schneider Electric, Tokyo Electron Europe (TEL), and Watlow.

Other SEMICON Europa 2023 Highlights

• Opening Ceremony will include keynotes by industry leaders from Cadence, CEA-Leti, Comet Group, Edwards, and imec.
• ITF Towards NETZERO - Powered by imec will explore the environmental impact and resource consumption challenges faced by the semiconductor industry.
• ALD TechDay – Powered by Beneq will feature keynotes from Yole Intelligence, Beneq and imec on innovative Atomic Layer Deposition (ALD)
• Executive Forum Program will delve into semiconductor industry topics such as Smart Mobility, Smart MedTech, Smart and Green Manufacturing, materials innovation, electrification and power semiconductors. The program will also feature a fireside discussion with thought leaders from Wolfspeed and ATREG.
• TechARENA Program will address themes including geopolitics, public policy European-funded projects, workforce development, the future of computing and integrated photonics. The program will also include the European premiere of the Chip in, a documentary featuring three twentysomethings on a tour to explore careers in microelectronics, and a discussion on sustainability innovations with leaders from SCREEN.

Programs in halls B1 and B2 are complimentary for all SEMICON Europa and productronica visitors. For more details, please visit the SEMICON Europa 2023 website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Serena Brischetto at [email protected].

SEMICON Europa 2023 Sponsors

• Platinum: Cadence, Koh Young Europe, Macquarie, and Tokyo Electron Europe (TEL)
• Gold: Comet Yxlon, Edwards, KLA and Resonac Europe
• Silver: Evatec, Invest in Pomerania, Soitec, SÜSS MicroTec, and ZEISS
• Event sponsors: ASE Global, Atotech an MKS Brand, ATREG, Beneq, EBARA, Entegris, EVGroup (EVG), Flexciton, imec, INFICON, Merck KGaA, Darmstadt, Germany, Panasonic Connect, Sachsen-Anhalt, Samsung, SCREEN, Synopsys, and Watlow

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON Europa 2023 Conferences to Highlight Advanced Packaging and Fab Management as Key Enablers of Sustainability

MILPITAS, Calif. — September 11, 2023 — The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is now accepting abstract submissions for its 2024 event, May 13-16, in Albany, New York. ASMC 2024 will feature technical presentations of more than 90 peer-reviewed manuscripts on advanced semiconductor manufacturing along with keynotes, a tutorial, a panel discussion, and networking events. Technical abstracts are due October 20, 2023. See the ASMC 2024 Author Kit for submission details.

ASMC 2024 encourages submissions of abstracts of papers co-authored by device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing.

Selected speakers will present to IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academics gathered at the event. All technical papers will be published by IEEE, and papers may be published in a special section on ASMC 2024 in IEEE Transactions on Semiconductor Manufacturing.

Technical presentation topics include:

• Advanced Equipment Processes and Materials
• Advanced Metrology
• Advanced Patterning, Design for Manufacturability and Design-Technology Co-Optimization
• Advanced Process Control
• Big Data Management and Mining
• Contamination Free Manufacturing
• Defect Inspection and Reduction
• Discrete and Power Devices
• Equipment Optimization
• Factory Automation
• Industrial Engineering
• Innovative Silicon Devices and Processes
• Lean Manufacturing
• Manufacturing for Sustainability
• Non-silicon and Non-CMOS
• Packaging and Through Silicon Via
• Smart Manufacturing
• The Fabless Experience
• Workforce Development
• Yield Enhancement and Learning
• Yield Methodologies

ASMC, in its 35th year, provides critical insights into advanced semiconductor manufacturing and remains a vital venue for professionals to network and exchange knowledge about best practices.

To learn more about the conference and selection process, please contact Taylor Zhao at [email protected].

ASMC is organized by SEMI Americas.

About SEMI
SEMI^® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about ASMC 2024 Call for Abstract Submissions Opens

MILPITAS, Calif. – September 6, 2023 – Global semiconductor equipment billings dipped 2% year-over-year to US$25.8 billion in the second quarter of 2023, while quarter-over-quarter billings slipped 4%, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

“Overall demand for capital equipment remains strong despite uncertainty that continued to pervade the macroeconomy in the first half of 2023,” said Ajit Manocha, SEMI president and CEO. “During the report period, some semiconductor market segments exercised caution in making capital equipment investments, though the impact across regions varied.”

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:
 

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Download a sample of the EMDS report.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.

About SEMI
SEMI^® connects 3,000 companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Q2 2023 Global Semiconductor Equipment Billings Dips 2% Year-Over-Year, SEMI Reports

TAIPEI, Taiwan – September 5, 2023 – Industry luminaries gathered today for a press conference to kick off SEMICON Taiwan 2023, opening tomorrow with companies from across the electronics design and manufacturing supply chain coming together for insights into the latest trends, developments and innovations driving industry growth. Registration is open for the exhibition and conferences, September 6-8, 2023, at TaiNEX 1 and 2 in Taipei.

“The semiconductor industry has entered a new era of opportunities for global cooperation to solve some of its greatest challenges,” Terry Tsao, President of SEMI Taiwan and SEMI Chief Marketing Officer, said at the conference. “Achieving net zero carbon emissions, building the workforce of the future and ensuring supply chain resilience as the chip industry drives toward $1 trillion in annual revenue will require nothing less than a whole-industry effort. We look forward to hosting industry experts and visionaries from around the world at SEMICON Taiwan 2023 to focus on these and other key opportunities for the chip industry ecosystem to fulfill its tremendous potential.”

Tsao was joined at the press conference by Tsung-Tsong Wu, Minister of the National Science and Technology Council (NSTC); Tien Wu, CEO of ASE; Doris Hsu, Chairperson and CEO of GlobalWafers; and John Lee, Managing Director of Merck KGaA, Darmstadt, Germany in Taiwan.

The largest SEMICON Taiwan ever, the event is expected to draw more than 50,000 attendees while featuring 3,000 booths and 950 exhibitors. Themed Inspire Innovation. Empower Sustainability, SEMICON Taiwan 2023 will offer more than 20 forums spotlighting critical industry topics including:

• Advanced Manufacturing
• Heterogeneous Integration
• Compound Semiconductors
• Automotive Chips
• Smart Manufacturing
• Sustainable Manufacturing
• Semiconductor Cybersecurity
• Talent

Other SEMICON Taiwan 2023 Highlights

CEO Summit
Top semiconductor industry executives will gather at the CEO Summit to examine vital innovation trends and keys to the industry’s success over the next 20 years. Featured speakers will include:

• Tien Wu, CEO of Advanced Semiconductor Engineering (ASE)
• Mark Liu, Chairman of Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC)
• Anirudh Devgan, President and CEO of Cadence Design Systems
• Tim Archer, President and CEO of Lam Research
• Toshiki Kawai, President and CEO of Tokyo Electron (TEL)

Market and Industry Trend Forum
Leading industry analysts will explore market trends, present industry forecasts, and provide insights into how companies across the semiconductor ecosystem can navigate the unpredictable market environment. Speakers will include analysts from Gartner, McKinsey & Company, Morgan Stanley, Mizuho Bank, the SEMI Market Intelligent Team (MIT), and TechInsights. 

10 Country Pavilions
With Taiwan a vital partner in the global semiconductor industry, SEMICON Taiwan 2023 will feature country pavilions including Australia, the Czech Republic, Germany, Italy, Japan, Netherlands, Poland, Singapore, the UK and the United States.

9 Theme Pavilions and Multiple International Forums
SEMICON Taiwan 2023 theme pavilions will showcase areas key to semiconductor industry growth including Heterogeneous Integration, Compound Semiconductor, Materials, Green Manufacturing, and Workforce Development.

Smart Manufacturing Journey, themed AI-Driven Innovation of Future Automation, will also highlight SEMICON Taiwan 2023. The interactive exhibition will feature leading-edge artificial intelligence (AI) technologies and the latest developments in factory robotics and automation.

SEMICON Taiwan 2023 will also include:

• Smart Manufacturing Expo Taiwan
• Heterogeneous Integration Global Summit
• Strategic Materials Conference Taiwan
• FLEX Taiwan 2023

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Monica Hung/SEMI Taiwan
Phone: +886.3.560.1777 ext. 207
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Phil Wang/One For All PR Agency
Phone: +886.2.8712.8681 ext. 389
Email: [email protected]

Urven Chang/One For All PR Agency
Phone: +886.2.8712.8681 ext. 335
Email: [email protected]

• Read more about SEMICON Taiwan 2023 Kicks Off With Press Conference Spotlighting Critical Semiconductor Industry Themes

Dr. Pileggi Will be Recognized for His Significant Contributions to the Electronic System Design Industry

MILPITAS, Calif. – September 5, 2023 – Dr. Lawrence Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University, will be honored with the 2023 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD). The award will be presented at the annual Phil Kaufman Award presentation and dinner in Q1 2024.

Dr. Pileggi will be honored for his pioneering contributions to circuit simulation and optimization that have enabled the industry to address the challenge of interconnect delay dominated designs, and for his innovations in Electrical & Computer Engineering (ECE) education. The Phil Kaufman Award is presented annually by the Electronic System Design Alliance (ESD Alliance), a SEMI technology community, and the Council on Electronic Design Automation (CEDA) of the Institute of Electrical and Electronics Engineers (IEEE).

“Dr. Pileggi’s work over the last several decades has been pivotal to the advancement of circuit simulation and optimization in electronic design automation,” said Anirudh Devgan, President and CEO of Cadence Design Systems, a member of the ESD Alliance. “Larry is one of the most influential professors in our field; his work has had widespread, profound and lasting impact on the industry.”

“Larry Pileggi has had a broad and deep influence on EDA, spanning education, key inventions, research consortia, and commercial startups,” said Leon Stok, Vice President of EDA at IBM. “In each of these, he is not just participating but driving the outcome.”

“Dr. Pileggi has been a key innovator and EDA educator with numerous fundamental technical contributions in modeling, design and design methodologies for integrated systems and electrical power systems,” said Gi-Joon Nam, President of the IEEE Council on EDA. “Further, with over 30 years on the faculty of Carnegie Mellon University and the University of Texas at Austin, his numerous Ph.D. students continue to enhance the semiconductor industry.”

“On behalf of the ESD Alliance, I congratulate Dr. Pileggi on being honored with the 2023 Phil Kaufman award,” said Bob Smith, Executive Director of the ESD Alliance. “The industry would not be where it is today without his fundamental R&D, which has enabled much of the advanced technology we use every day.”

About Dr. Lawrence T. Pileggi

Prior to his current role as Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University, Dr. Pileggi held positions at Westinghouse Research and Development and the University of Texas at Austin. He has consulted for various semiconductor and EDA companies and co-founded Fabbrix Inc., Extreme DA, and Pearl Street Technologies. His research interests include various aspects of digital and analog integrated circuit design and simulation, optimization, and modeling of electric power systems.

Dr. Pileggi has received numerous awards, including the ACM/IEEE A. Richard Newton Technical Impact Award in Electronic Design Automation in 2011 and the 2015 Semiconductor Industry Association (SIA) University Researcher Award.

He co-authored Electronic Circuit and System Simulation Methods, McGraw-Hill, 1995 and IC Interconnect Analysis, Kluwer, 2002, has published over 400 conference and journal papers, and holds 40 U.S. patents. He is a fellow of the IEEE.

Dr. Pileggi received his BSEE and MSEE from the University of Pittsburgh in 1983 and 1984, respectively, and his Ph.D. from Carnegie Mellon University in 1989.

About the Phil Kaufman Award

The Phil Kaufman Award honors individuals who have had a demonstrable impact on the field of electronic system design through technology innovations, education/mentoring, or business or industry leadership. The award was established as a tribute to Phil Kaufman, the late industry pioneer who turned innovative technologies into commercial businesses that have benefited electronic designers. The 2022 recipient was Dr. Giovanni de Micheli, Professor and Director of the Institute of Electrical Engineering and of the Integrated Systems Centre at EPF Lausanne, Switzerland.

About the IEEE Council on Electronic Design Automation (CEDA)

The IEEE Council on Electronic Design Automation (CEDA) provides a focal point for EDA activities spread across seven IEEE societies (Antennas and Propagation, Circuits and Systems, Computer, Electron Devices, Electronics Packaging, Microwave Theory and Techniques, and Solid-State Circuits). The Council sponsors or co-sponsors over a dozen key EDA conferences including: the Design Automation Conference (DAC), Asia and South Pacific Design Automation Conference (ASP-DAC), International Conference on Computer-Aided Design (ICCAD), Design Automation and Test in Europe (DATE), and events at Embedded Systems Week (ESWEEK). The Council also publishes IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems (TCAD), IEEE Design & Test (D&T), and IEEE Embedded Systems Letters (ESL). The Council boasts a prestigious awards program in order to promote the recognition of leading EDA professionals, which includes the A. Richard Newton, Phil Kaufman, and Ernest S. Kuh Early Career Awards. The Council welcomes new volunteers and local chapters.

Stay in touch with IEEE CEDA

• Website: ieee-ceda.org
• LinkedIn: https://www.linkedin.com/groups/8343531
• Facebook: https://www.facebook.com/ieeeceda/
• Twitter: https://twitter.com/IEEECEDA

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. Visit ESD Alliance to learn more.

Follow the ESD Alliance

• Website: esd-alliance.org
• Blog: ESD Alliance Bridging the Frontier blog
• Twitter: @ESDAlliance
• LinkedIn: https://www.linkedin.com/groups/3582068/
• Facebook: https://www.facebook.com/ESDAlliance

About SEMI
SEMI^® connects more than 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

All trademarks and registered trademarks are the property of their respective owners.

Association Contacts

Nanette Collins/ESDA
Phone: 1.617.437.1822
Email: [email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Amanda Osborn/IEEE-CEDA
Phone: 1.352.872.5544 ext. 123
Email: [email protected]

• Read more about Dr. Lawrence T. Pileggi of Carnegie Mellon University to be Honored With 2023 Phil Kaufman Award

MILPITAS, Calif. ─ September 5, 2023 ─ SEMI today announced that, starting in Q3 2023, it will license its server certification protocol to combat software piracy. With piracy costing the software industry an estimated billions of dollars annually, the protocol will help prevent unauthorized access to licensed software products by assigning a unique identifier to each customer license server in order to assure software access can only be granted by authorized servers.

The protocol joint development program was led by the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, with Cadence Design Systems, Siemens EDA and Synopsys all participating in the development effort. The protocol was reviewed and approved by an independent group of semiconductor companies that rely on EDA tools in their business operations.

While several large EDA companies are now implementing the protocol, it is not EDA-specific and can be used in any license management system for high-value software products. The protocol has also been introduced to the SEMI Traceability Standards Technical Committee for development into a SEMI Standard.

The ESD Alliance will provide an overview of the protocol in a webinar on Wednesday, Sept. 27, 10:00am-11:30am PDT. Registration is free.

“The server certification protocol underscores the industry’s commitment to prevent unauthorized software usage, a problem that impacts both end users and software providers,” said Bob Smith, Executive Director of the ESD Alliance.

To request more information about the protocol, contact [email protected].

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. Visit the ESD Alliance website to learn more.

Follow the ESD Alliance

• ESD Alliance Bridging the Frontier blog
• Twitter: @ESDAlliance
• LinkedIn
• Facebook

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

All trademarks and registered trademarks are the property of their respective owners.

Association Contacts

Nanette Collins
Public Relations for the ESD Alliance
Email: [email protected]
Phone: 617-437-1822

Michael Hall/SEMI US
Email: [email protected]
Phone: 408-943-7988

• Read more about SEMI to License Server Certification Protocol to Help Combat Software Piracy

MILPITAS, Calif. — October 30, 2023 — SOI Industry Consortium (SOIIC), a SEMI Technology Community, today announced new leadership, Governing Council members and upcoming educational events for the ecosystem of chip designers, developers, and equipment and materials providers in the silicon on insulator ecosystem.

Patrick Martin, Head of Field Technology at Soitec, was elected as Chair and Jamie Schaeffer, Ph.D., Vice President of Product Management at GlobalFoundries, as Vice Chair of the consortium. Martin and Schaeffer will help guide the strategic direction and operations of the SOIIC Governing Council.

The Governing Council also includes the following members:

• Giorgio Cesana, Director of Technology Strategy Development, STMicroelectronics
• Madhavan Esayanur, Senior Director, MEMC, A GlobalWafers Company
• Joachim Kunkel, General Manager of Solutions Group, Synopsys
• Mostafa Emam, Founder and CEO, Incize
• Jim Reed, Vice President of Key Account Development, Okmetic
• Akihiko Tamura, Managing Director and CEO, SEH Europe
• Michael Tchagaspanian, EVP Strategic Partnerships, CEA-Leti
• Jeffrey Wang, CEO, Simgui Technology
• Joseph Wang, Director of Engineering, Qualcomm
• Victor Wang, Vice President of Front-End Innovation, NXP Semiconductors

“SOIIC has a rich history of raising awareness of the advantages of advanced substrates and SOI technology, in particular, within the semiconductor ecosystem especially with product designers,” said Patrick Martin of Soitec. “For many products, SOI technology provides a pathway to excellent reliability, more functionality at comparable or lower price points, lower energy consumption, and greater efficiency than semiconductors from bulk silicon.”

“In today's world where products require higher performance with lower power consumption, understanding the benefits and capabilities of SOI technology is critical,” said Jamie Schaeffer of GlobalFoundries. “The number of products containing chips designed and made on advanced substrates continues to expand and GlobalFoundries is pleased to be a primary manufacturer of the chips that power them. I look forward to leveraging this experience to advance the SOIIC mission as a member of the Governing Council.” 

“SOI technology and its design, manufacture, and applications have not stood still during the SOIIC reformation,” said Heidi Hoffman, Senior Director of Corporate Marketing at SEMI and Executive Director at SOIIC. “IP and design software are more robust than ever, advancements have been realized in substrate architectures, and product designers are looking for solutions to key challenges. The newly formed Governing Council is energized and ready to plan and execute on our global mission.”

Upcoming SOIIC Events

• Shanghai FD-SOI Forum and RF-SOI Workshops hosted by VeriSilicon and Simgui – October 23-24
• SOI TechForum Session at SEMICON Europa – November 16

More SOIIC events are planned for 2024.

Membership in the SEMI SOIIC Technology Community is open to all SEMI members. Complete this Interest Form to join the consortium. Subscribe to the SOIIC biweekly newsletter.

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI SOI Industry Consortium Elects New Leadership and Governing Council and Announces Upcoming Events

SEOUL, Korea — August 29, 2023 — With advanced packaging a key enabler of semiconductor innovation, the stage is set for the Advanced Packaging Summit as industry leaders and visionaries gather September 5 at the Suwon Convention Center for insights into critical themes including advances in high-performance computing (HPC). Registration is open.

Representatives from chip manufacturing powerhouses such as AMD, Samsung Electronics and SK hynix will join leading packaging providers and research institutions to present on topics including HPC interconnection technologies, 3D packaging, chiplets, HIR (Heterogeneous Integration Roadmap), Hybrid Bonding, LAB (Laser Assisted Bonding), and supply chain management during two sessions.

Session 1: High-Performance Computing

	Wu Xin, Corporate Vice President, Silicon Technology AMD
	Ki Ill Moon, Vice President, Head of Packaging Technology Development SK hynix
	Donghan Kim, Sr. Staff and Head of Strategy Collaboration Solution Development Synopsys
	Stefan Chitoraga, Technology and Market Analyst, Packaging and Assembly Yole Group

Session 2: Interconnection Technology for High-Performance Computing

	Jongsoo Choi, Principal Professional Samsung Electronics
	Vikas Dubey, Senior Scientist Systems Packaging Fraunhofer ENAS
	Dongshun Bai, Senior Technologist and Business Development Director Brewer Science
	SeokHo Na, Master, Sr. Director of R&D Amkor Technology Korea

A key feature of the Advanced Packaging Summit, after each session one hour will be dedicated to in-depth discussions between speakers and conference attendees about technology, market and business trends and issues.

Advanced Packaging Summit Sponsors

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Jaegwan Shim/SEMI Korea
Phone: 82+2.531.7804
Email: [email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Korea Summit to Showcase Future of Advanced Packaging

HANOI, Vietnam — 29 August 2023 — Key semiconductor industry players and stakeholders including partners, government agencies, and academia will gather September 28-29 in Hanoi for the Vietnam Business Summit to highlight growth opportunities in Vietnam’s chip industry and across the Southeast Asia electronics ecosystem. Registration is open.

“Despite challenges on the global stage, Vietnam's economy exhibited remarkable resilience and adaptability in 2022, positioning the country as a beacon of stability and growth,” said Linda Tan, President of SEMI Southeast Asia. “Vietnam’s semiconductor industry is also on an upward trajectory, with an estimated compound annual growth rate of 6.12% between 2022 and 2027.”

“SEMI Southeast Asia is committed to playing a leading role to help grow the semiconductor industry in the region,” Tan said. “Events such as the Vietnam Business Summit take aim at elevating Vietnam's position in the Southeast Asia semiconductor ecosystem and the global semiconductor value chain.”

Vietnam Business Summit Highlights

• Industry dialogue sessions will focus on efforts by Vietnam’s industrial ecosystem to support the semiconductor industry and highlight the region’s competitive advantages including government measures to increase investments designed to support business growth and spur new partnership opportunities. Semiconductor players will share their perspectives on Vietnam’s growth potential.

• Conferences and keynotes will feature insights from thought leaders on the chip industry market outlook, challenges the semiconductor industry faces, the talent landscape and Vietnam's semiconductor roadmap.

• Visit to Vietnam Singapore Industrial Park where delegates will explore the park’s facilities and learn how it facilitates foreign investments in Vietnam. The park visit will also showcase Vietnam's potential as a strategic hub for semiconductor manufacturing and highlight the region’s advantages to global industry players and investors.

• SEMI TalentCONNECT Program will connect university students with semiconductor industry leaders to discuss career opportunities, foster talent development and help bridge the gap between academia and industry.

For the full event agenda, please visit the SEMI Southeast Asia website.

About SEMI
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Ryan Teo/SEMI Southeast Asia
Phone: +65 9859 0883
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

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GRENOBLE, France – August 22, 2023 – More than 40 experts will gather September 19-21 at the SEMI MEMS & Imaging Sensors Summit to share insights into new innovation opportunities for MEMS, imaging and sensors applications and their potential to enable a smarter and more sustainable world. Registration is open for the exhibition and conferences at the World Trade Center (WTC) in Grenoble, France.

Themed Ubiquitous Sensing for A Sustainable World, the summit will explore the latest MEMS, imaging and sensors technologies, developments and trends. The event is hosted by SEMI Europe and the MEMS & Sensors Industry Group (MSIG), a SEMI Technology Community.

“Rapid progress in the development and manufacture of MEMS and image sensors products featuring artificial intelligence (AI) and machine learning is leading a new wave of innovative applications,” said Laith Altimime, president of SEMI Europe. “We look forward to hosting industry thought leaders as they share their visions for how new advances promise to drive more eco-friendly products and applications.”

Featured Speakers at MEMS & Imaging Sensors Summit

Thought leaders will discuss MEMS and imaging sensors manufacturing advances and how the latest innovations are powering intelligent applications across sectors such as communications, mobility, IoT, entertainment and medical.

	Hod Finkelstein, Head of Cameras and Depth, Reality Labs Meta
	Bernard Kress, Director of Optical Engineering, Augmented Reality Hardware Google
	Lia Li, ZPM Co-founder and CEO Zero Point Motion
	Kilian Bilger, Vice President of Engineering Sensor Components Bosch
	Theodor Nielsen, CEO NIL Technology (NILT)
	Isabella Drolz, Vice President of Product Marketing Comet Yxlon
	Moti Margalit, CEO SonicEdge
	Martin Croome, Vice President of Marketing GreenWaves Technologies
	Julia Brueckner, Global Applications & Product Engineering Manager for Packaging & Wafer Business Unit Corning Incorporated

Gala Dinner and Networking Opportunities

The SEMI MEMS & Imaging Sensors Summit will feature networking opportunities including a complimentary welcome reception on September 19 in the exhibition area at the WTC and a gala dinner on September 20. Registration for the gala dinner at the Chateau de Sassenage is open.

Industry Leaders Exhibiting at MEMS & Imaging Sensors Summit

• Adeia
• AEMtec
• Besi
• Comet Yxlon
• Eurofins | MASER
• EV Group (EVG)
• FormFactor
• OPTIM Wafer Services
• Philips MEMS & Micro Devices
• Polyteknik AS
• ProSys
• Pyxalis
• SET Corporation
• Siconnex
• Siemens EDA (represented by EDA Solutions Limited)
• Sumitomo Precision Products
• SUSS Microtec
• L. Gore & Associates

Premier Sponsors

• Platinum Sponsors: Adeia, ASE, Infineon, KLA and Siconnex
• Gold Sponsors: Comet Yxlon and SUSS MicroTec
• Event sponsors: Beneq, Evatec, EV Group (EVG), Okmetic and Teledyne MEMS

For more information, please visit the SEMI MEMS & Imaging Sensors Summit website.

Stay in touch on Twitter @SEMIEurope: #MEMSSummit #MEMS #Imaging #SEMIEurope

About SEMI 
SEMI^® connects 3,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more. 

Association Contacts 

Serena Brischetto/SEMI Europe 
Phone: +49 30 3030 8077-11 
Email: [email protected] 

Michael Hall/SEMI US 
Phone: 1.408.943.7988 
Email: [email protected]

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