HSINCHU, Taiwan ─ July 1, 2024 ─ With artificial intelligence (AI) expected to remain a major driver of worldwide semiconductor industry growth over the coming years, SEMICON Taiwan 2024 will gather industry leaders and visionaries at the Taipei Nangang Exhibition Center, Halls 1 and 2 (TaiNEX 1 and 2) from September 4-6 for insights into the latest trends, developments, and innovations fueling market growth in the AI era. Complimentary registration for SEMICON Taiwan 2024 is now open. An early-bird discount of 30% is available for the international forums.

Themed Breaking Limits: Powering the AI ​​Era, SEMICON Taiwan 2024 will feature up to 3,600 booths – a record event high – with 1,000 exhibitors showcasing groundbreaking semiconductor technology innovations and smart applications. Exhibitors at SEMICON Taiwan 2024 – the Silicon Island’s largest and most influential annual semiconductor event – will include industry powerhouses, including Applied Materials, ASMPT, Delta Electronics, DISCO, Hermes-Epitek, Innolux, KLA, Lam Research, Merck KGaA, Darmstadt, Germany, and TEL.

“SEMICON Taiwan 2024 will provide insights on the AI wave and key semiconductor technologies enabling innovation including the 3nm advanced node, advanced packaging and chiplets, silicon photonics and compound semiconductors,” said Terry Tsao, Global Chief Marketing Officer and President of Taiwan, SEMI. “We look forward to bringing together players from across the semiconductor supply chain to explore new innovation opportunities and partnerships to address current challenges and accelerate the implementation of AI applications.”

SEMICON Taiwan 2024 Highlights

16 Themed Pavilions – This year's pavilions will cover critical semiconductor industry topics, such as green manufacturing, heterogeneous integration, materials, Taiwan localization, testing, and workforce development. New at SEMICON Taiwan this year are pavilions focused on key areas: 

• The AI Zone will gather key semiconductor manufacturers in the AI chip supply chain to showcase cutting-edge R&D technologies and connect with the robust capabilities of Taiwan's AI supply chain. An interactive generative AI will walk SEMICON Taiwan 2024 attendees through the evolution of semiconductors.

• The Smart Mobility Innovation Zone will highlight key trends, including software-defined electric vehicles (EVs) and will include representatives from major carmakers, Ford and KIA, who will provide insights on strengthening the chip industry’s connection with the automotive supply chain.

• Wide-bandgap (WBG) power semiconductor, silicon photonics, precision machinery and more.

The Smart Manufacturing Expo Taiwan, held in conjunction with SEMICON Taiwan, will bring together smart manufacturing solution providers, system integrators, software and hardware vendors, and demand-side players in the smart manufacturing industry to explore new ways to increase manufacturing efficiency. The events are also co-located with Strategic Materials Conference Taiwan.

SEMICON Taiwan 2024 Summits

With more than 20 international forums at SEMICON Taiwan 2024, experts from ASE, Infineon, MediaTek, Microsoft, Quanta, Samsung, SK Hynix, TSMC, and Infineon, will provide insights into chip industry trends and the latest innovations.

• The CEO Summit will bring together executives from Applied Materials, Imec, Marvell, Microsoft, Quanta, SK Hynix, and TSMC to discuss  innovations shaping the future of the semiconductor industry.

• The Heterogeneous Integration Global Summit 2024 is themed Innovations in Advanced System Integration in the HPC/AI Era. Participants can expect in-depth discussions and presentations on the latest innovations shaping the future of integrated systems.

• The Silicon Photonics Global Summit will showcase diverse applications of silicon photonics that are revolutionizing industries. This summit will highlight advancements in high-speed data transmission and optical interconnects for data communication and telecommunications. The forum will also cover silicon photonics’ role in advanced computing, data centers and cloud computing, as well as its impact on automotive and transportation sectors, including LiDAR for autonomous vehicles and optical communication for smart transportation systems.

Country Pavilions – Regional Collaboration and Expansion Opportunities

SEMICON Taiwan 2024 will feature 13 country pavilions with exhibitors from Australia, the Czech Republic, Germany, Italy, Japan, the Netherlands, Poland, Singapore, the United Kingdom, and the United States, with new exhibitors from France, Malaysia and the Philippines. The Country Pavilions aim to promote cross-regional partnerships and business opportunities with Taiwan in areas such as compound semiconductors and silicon photonics.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Samer Bahou/SEMI US
Phone: 1.408.943.7870
Email: [email protected]

Elma Fang/SEMI Taiwan
Phone: 886.3-560-1777 #211
Email: [email protected]

• Read more about SEMICON Taiwan 2024 to Showcase AI as Key Driver of Semiconductor Industry Growth

MILPITAS, Calif. ─ June 27, 2024 ─ SEMI, the industry association serving the global electronics design and manufacturing supply chain, today applauded the United States Department of Commerce's announcement of a Preliminary Memorandum of Terms for an award under the CHIPS and Science Act to support Entegris construction of a state-of-the-art manufacturing center for advanced materials and process solutions for leading-edge semiconductors in Colorado Springs, Colorado. The proposed investment of up to $75 million would strengthen critical semiconductor supply chain materials and create nearly 600 direct manufacturing jobs over several years and approximately 500 construction jobs by 2030. 

"SEMI applauds the U.S. Department of Commerce for this expansion of its efforts to bolster the domestic semiconductor supply chain," said Joe Stockunas, President of SEMI Americas. "Truly strengthening advanced chipmaking requires an end-to-end supply chain focus, and the materials segment is vital to semiconductor innovation and, ultimately, technology advancement that is foundational to the global economy and improving the quality of life around the world. We encourage government investments in chip, equipment and materials R&D, as well as in advanced packaging, to support the ecosystem buildout."

"Entegris is working with the SEMI Foundation VetWorks program to bring military veterans into our industry, and we are pleased the company has designated this as a Military Center of Excellence with the goal to recruit 50% of its entire project workforce from veteran and military families," Stockunas said. "Additionally, at a recent SEMI event, Entegris highlighted their focus on sustainability in selecting a site for this new manufacturing facility, very much in line with our Sustainability initiative efforts."

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, the SEMI Foundation and SEMI VetWorks for more information on efforts to address the microelectronics industry’s talent needs, and the SEMI Sustainability Initiative for details on efforts to find sustainability solutions and share best practices across the global semiconductor value chain.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Samer Bahou/SEMI US
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Applauds U.S. CHIPS Act Award for Entegris Semiconductor Materials Facility in Colorado

Concurrent with SEMICON West, FLEX Conference 2024 to Spotlight Flexible Hybrid Electronics Innovations

SAN FRANCISCO – June 26, 2024 – Investments in the build-out of the U.S. semiconductor manufacturing supply chain will come into sharp focus at SEMICON West 2024 as government and industry leaders gather at the CEO Summit on Tuesday, July 9. The presentations will address plans for the more than $300 billion in capital expenditures for the domestic semiconductor industry announced since the enactment of the U.S. CHIPS and Science Act, an unprecedented level of investment. Registration is open for the conferences and sold-out exhibition, July 9-11 at the Moscone Center in San Francisco.

On Wednesday, July 10, the CEO Summit will convene executives for presentations on key global semiconductor industry opportunities and challenges in areas including workforce development, sustainability, supply chain management, and growth.

“The path to $1 trillion in semiconductor annual revenue is here and now as the industry’s expansion hits its stride,” said Joe Stockunas, President of SEMI Americas. “Global chip industry growth is fueled by the proliferation of artificial intelligence (AI)* and growing demand in other key markets including computing, communications, mobility, machine learning, and medical technologies. We look forward to hosting more than 400 speakers and panelists in over 40 sessions covering the entire semiconductor supply chain as they focus on ways for the industry to fulfill its tremendous potential.”

Luminaries speaking on Tuesday at the CEO Summit will include the following:

• Laurie E. Locascio, Ph.D., Director and the Under Secretary of Commerce for Standards and Technology at National Institute of Standards and Technology, S. Department of Commerce
• Bertrand Loy, President and CEO, Entegris
• Kai Beckmann, Member of the Executive Board of Merck KGaA, Darmstadt, Germany and CEO, EMD Electronics
• Hichem M'Saad, Ph.D., Chair of the Management Board and Chief Executive Officer, ASM
• Sandra Watson, President and CEO, Arizona Commerce Authority
• Keyvan Esfarjani, Executive VP, Chief Global Operations Officer and General Manager of Manufacturing, Supply Chain and Operations, Intel Corporation
• Prabu Raja, President, Semiconductor Products Group, Applied Materials
• Kevin Younis, Chief Operating Officer and Executive Deputy Commissioner, Empire State Development
• Scott Jensen, Director of Workforce Strategy for CHIPS, U.S. Department of Commerce

The session will also feature two fireside chats with the following industry leaders and government official:

• Keys to Success for Investments in the U.S.
  • Tim Archer, President and CEO, Lam Research
  • Thomas Caulfield, President and CEO, GlobalFoundries
• Plans for Nearshoring and Support of the Global Semiconductor Supply Chain
  • Jose W. Fernandez, Under Secretary, Economic Growth, Energy and the Environment, U.S. Department of Commerce
  • Joe Stockunas, President, SEMI Americas

More SEMICON West 2024 Highlights

AI will be a prominent theme at SEMICON West 2024 as thought leaders convene for sessions addressing the technology and other critical areas of semiconductor industry growth:

• Workforce Development – Themes addressed at the Pavilion will include fostering an inclusive and equitable workforce and building a diverse talent pipeline.
• Environment, Health, Safety and Sustainability – Addressing the critical issue of PFAS, experts will come together for a PFAS initiative working session. Topics will also include bringing circular economy to the value chain, innovation in chip manufacturing, net zero and PFAS innovation and building green literacy.
• Smart Manufacturing – Topics will include digital twins for design and manufacturing, optimizing yield with AI, AI for smart production, accelerating sustainability and autonomous factories.
• Smart Data/AI – Experts will explore the future of AI hardware, hardware innovation driven by Generative AI and the future of memory.
• Smart Mobility – Focus areas will include chiplets for automotive and software-defined vehicles.
• Smart MedTech – Thought leaders will delve into emerging MedTech monitoring technologies and the commercialization of MedTech innovations.
• Heterogeneous Integration – Themes will include building next-generation systems for AI and high-performance computing as well as road mapping the future of heterogeneous integration.
• Supply Chain Management – Experts will discuss key topics such as creating a robust and resilient supply chain risk management program, how visas facilitate commercial travel to the U.S., and strengthening the hemisphere’s semiconductor supply chain.
• Cybersecurity – Assuring cybersecurity resilience through industry partnerships will be a focus area.
• TechTALKS – Topics include AI and machine learning; heterogenous and packaging; advanced design; sensorization; and photonics
• Test Vision Symposium – Themed Test in the Semiconductor Future, the symposium will focus on the growing role of semiconductor test in areas such as electric vehicles (EVs), consumer electronics, high-performance computing and AI.
• The popular Bulls and Bears session will feature experts from Cantor Fitzgerald, Evercore, Mitsubishi UFJ Financial Group, Morgan Stanley and Parnassus Investments.

SEMI Market Symposium

The SEMI Market Symposium returns on Monday, July 8 with a midyear update on key market trends and drivers. Leading industry analysts will present market forecasts for the semiconductor, equipment, materials, and other industries in the electronics design and manufacturing space.

FLEX Conference & Exhibition

Co-located with SEMICON West 2024, the FLEX Conference & Exhibition will feature keynotes, panel discussions, technical sessions, funding opportunities, product-based demonstrations and industry tours highlighting the latest innovations in flexible hybrid electronics (FHE), printed electronics and advanced packaging, including heterogeneous integration. Keynote speakers will include experts from industry leaders such as Advanced Semiconductor Engineering, Axiom Space, Intel, and Toyota Research Institute of North America.

Register for SEMICON West 2024. Early-bird registration discounts are available until June 30.

Follow SEMICON West on X: #SEMICONWest

*SEMI World Fab Forecast report
 

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Samer Bahou/SEMI U.S.
Phone: 1.408.943.7870
Email: [email protected] 

• Read more about SEMICON West 2024 Opens July 9 to Spotlight Investments in U.S. Semiconductor Manufacturing, AI, Key Trends and Industry Growth

MILPITAS, Calif. — July 15, 2024 — Electronic System Design (ESD) industry revenue increased 14.4% to $4,521.6 million in the first quarter of 2024 from the $3,951.1 million registered in the first quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 14.8%.

“The electronic design automation (EDA) industry continued to report strong revenue growth in Q1 2024,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “All product categories reported increases, with CAE, IC Physical, Semiconductor IP and Services posting double-digit upticks. Further, all geographic regions reported growth, with the Americas and Asia Pacific logging double-digit revenue gains.”

The companies tracked in the EDMD report employed 61,653 people globally in Q1 2024, a 6.9% jump over the Q1 2023 headcount of 57,696 and up 2.6% compared to Q4 2023.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Year-Over-Year Change

• Computer-Aided Engineering (CAE) revenue increased 13% to $1,621.1 million. The four-quarter CAE moving average increased 18.9%.
• IC Physical Design and Verification revenue grew 13.9% to $769.6 million. The four-quarter moving average for the category increased 17.5%.
• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue rose 2.8% to $378.9 million. The four-quarter moving average for PCB and MCM rose 13.2%.
• Semiconductor Intellectual Property (SIP) revenue increased 18.6% to $1,578.1 million. The four-quarter SIP moving average rose 10.3%.
• Services revenue jumped 22.3% to $173.9 million. The four-quarter Services moving average rose 12.3%.

Revenue by Region – Year-Over-Year Change

• The Americas, the largest reporting region by revenue, procured $1,937.2 million of electronic system design products and services in Q1 2024, a 14.1% increase. The four-quarter moving average for the Americas rose 12.1%.
• Europe, Middle East, and Africa (EMEA) procured $579.0 million of electronic system design products and services in Q1 2024, a 9.2% increase. The four-quarter moving average for EMEA grew 14.6%.
• Japan’s procurement of electronic system design products and services grew 2.8% to $280.7 million. The four-quarter moving average for Japan increased 8.9%.
• Asia Pacific (APAC) procured $1,724.7 million of electronic system design products and services in Q1 2024, a 19% increase. The four-quarter moving average for APAC grew 19.2%.

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and Services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

• Revenue by product category (CAE, IC Physical Design and Verification, SIP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
• Revenue by geographic region (Americas, EMEA, Japan and APAC)
• Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Association Contacts

Paul Cohen
Phone: 978-769-2106
Email: [email protected]

Jack Taylor
Phone: 512-560-7143
Email: [email protected]

• Read more about Electronic System Design Industry Posts $4.5 Billion in Revenue in Q1 2024, ESD Alliance Reports

MILPITAS, Calif. – June 18, 2024 – To keep pace with unremitting growth in demand for chips, the global semiconductor manufacturing industry is expected to increase capacity by 6% in 2024 and post a 7% gain in 2025, reaching a record capacity high of 33.7 million wafers per month (wpm: 8-inch equivalent), SEMI announced today in its latest quarterly World Fab Forecast report.

Leading-edge capacity for 5nm nodes and under is expected to grow 13% in 2024, chiefly driven by generative artificial intelligence (AI) for data center training, inference, and leading-edge devices. To increase processing power efficiency, chipmakers including Intel, Samsung, and TSMC are poised to start production of 2nm Gate-All-Around (GAA) chips, boosting total leading-edge capacity growth by 17% in 2025.

“The proliferation of AI processing, from cloud computing to edge devices, is fueling the race to develop high-performance chips and driving a robust expansion of global semiconductor manufacturing capacity,” said Ajit Manocha, SEMI President and CEO. “This creates a virtuous cycle: AI will drive the growth of semiconductor content across a diverse range of applications, which in turn encourages further investment.”

Capacity Expansion by Region

Chinese chipmakers are expected to maintain double-digit capacity growth, registering a 14% increase to 10.1 million wpm in 2025 – nearly a third of the industry’s total – after logging a 15% rise to 8.85 million wpm in 2024. Despite the potential risks of an overshoot, the region continues aggressive investment in its capacity expansion, in part to mitigate the impact of recent export controls. Major foundry suppliers including Huahong Group, Nexchip, Sien Integrated and SMIC and DRAM maker CXMT are investing heavily to grow the region’s semiconductor manufacturing capacity.

Most of the other major chipmaking regions are expected to see capacity growth of no more than 5% in 2025. Taiwan is forecast to rank second in capacity in 2025 at 5.8 million wpm, a 4% growth rate, while South Korea is projected to take the third spot next year, expanding capacity 7% to 5.4 million wpm after surpassing the 5 million wpm mark for the first time in 2024. Japan, the Americas, Europe & Mideast, and Southeast Asia are expected to grow semiconductor manufacturing capacity 4.7 million wpm (3% YoY), 3.2 million wpm (5% YoY), 2.7 million wpm (4% YoY), and 1.8 million wpm (4% YoY), respectively.

Capacity Expansion by Segment

Fueled largely by Intel’s establishment of its foundry business and China’s capacity expansion, the foundry segment is projected to increase capacity 11% in 2024 and 10% in 2025, reaching 12.7 million wpm by 2026.

Rapid adoption of high bandwidth memory (HBM) to meet rising demand for faster processors required by AI servers is powering unprecedented capacity growth in the memory sector. Exploding AI adoption has driven increasing demand for denser HBM stacks, with each stack now integrating 8 to 12 dice. In response, leading DRAM makers are increasing investment in HBM/DRAM. DRAM capacity is expected to increase by 9% in both 2024 and 2025. By contrast, the 3D NAND market recovery remains slow, with no growth in capacity forecast for 2024 and a 5% increase expected in 2025.

The rise of AI applications in edge devices is expected to increase DRAM content in mainstream smartphones from 8GB to 12GB, while laptops using AI assistants will need at least 16GB of DRAM. The expansion of AI to edge devices will also stoke demand for DRAM.

Download a sample of the SEMI World Fab Forecast report.

For details about SEMI reports on other semiconductor sectors, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

• Read more about Global Semiconductor Fab Capacity Projected to Expand 6% in 2024 and 7% in 2025, SEMI Reports

MILPITAS, Calif. – June 17, 2024 – FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $1 million. 

The program is funded by the Army Research Laboratory (ARL). ARL funding will be matched with contributions by grant recipients to cover total project cost. The RFP seeks proposals targeting FHE advances in the following areas:

• Development of Novel Materials, Additive Processing, and Printed Electronics for Harsh Environments
• Advancement in High-Density, Multi-Layer Interconnect Technology for Ultra-Narrow Linewidth and Spacing, FHE and Hybrid Electronics Packaging
• Advanced Design and Modeling Tools for FHE
• FHE Manufacturing, Standards, and Reliability
• Other (Restricted Open Topics)
  • Sensing
  • AI/ML Applications
  • Thermal Management

Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths including team diversity. See the SEMI FlexTech 2024 Request for Proposals for more details on the evaluation process.

White Paper Submissions

White paper submissions, the first step in responding to the RFP, are due July 21, 2024. Following the review of white papers by the RFP review committee, FlexTech will invite selected organizations to submit full proposals. The committee consists of FlexTech Council members and other subject matter experts (SMEs). Evaluation criteria include:

• Rationale
• Budget
• Collaboration value
• Dual-use (industry and military) applicability
• Relevance to the FHE ecosystem
• Schedules and milestones
• Reasonable and stretch deliverables
• Overall proposal quality

Request for Proposals Webinar

To help organizations craft their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on June 24, 2024, at 10:00am PDT. A recording will be available for registrants unable to attend the event. Register for the webinar.

About FlexTech RFPs

FlexTech RFPs support technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals.

The community encourages partnerships among industrial companies, R&D organizations, and university teams. Development partners retain ownership of intellectual property developed under FlexTech contracts.

FLEX Conference

The FHE community, including companies, universities, and U.S. government representatives, will again gather at the FLEX Conference, co-located with SEMICON West 2024, July 9-11, 2024, at the Moscone Center in San Francisco. Register for both events. 

The FLEX Conference will also provide opportunities for attendees to network and engage with representatives from the FlexTech, NBMC, and NextFlex federal funding programs.

About FlexTech
FlexTech is an industry-led public/private partnership that brings together scientists, engineers, and business development professionals from industry, government, and universities to collaboratively initiate research and the development of the infrastructure required to develop world-class FHE devices and products. Learn more.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations With Cash Awards of Up to $1 Million

MILPITAS, Calif. ─ June 10, 2024 ─ SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today issued the following statement from Joe Stockunas, President of SEMI Americas. Stockunas commends a proposed legislative action by the United States government to address the Notice of Funding Opportunity for CHIPS and Science Act support for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the U.S.:

“As a result of the U.S. Department of Commerce’s decision to change course on issuing a third Notice of Funding Opportunity for commercial R&D under the CHIPS and Science Act, the program now faces a funding headwind to fully meet its mandate. The shift was necessitated by legislative actions directing a $3.5 billion investment in secure enclave. We strongly support a legislative solution to bridge this funding gap for the CHIPS Program Office. The Senate Commerce Committee will consider the solution – Section 602 of the Spectrum and National Security Act – this week.”

“As currently written, the proposed legislation would responsibly restore the full funding and enable the Department of Commerce to continue strengthening the domestic supply chain and reprioritize semiconductor commercial R&D projects as initially envisioned by the CHIPS and Science Act. SEMI applauds the vital work underway by the Senate Commerce Committee and looks forward to supporting the passage of the legislation on behalf of SEMI membership.”

Visit SEMI Global Advocacy to learn more about public policy efforts and developments, and SEMI Workforce Development for more information on efforts to address the microelectronics industry’s talent needs.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Samer Bahou/SEMI US
Phone: 1.408.943.7870
Email: [email protected]

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI Applauds New Legislative Solution to Address Gap in U.S. CHIPS Act Notice of Funding Opportunity

DRESDEN, Germany — June 5, 2024 —The SEMI 3D & Systems Summit, taking place from 12-14 June, 2024 in Dresden, will feature the forefront of technological integration. Themed Heterogeneous Systems for the Intelligently Connected Era, the summit will unravel the intricate web of collaboration among components driving the next wave of innovation. From artificial intelligence algorithms to sensor data processing, attendees will deep dive into the dynamic framework enabling decision-making and real-time applications in an increasingly connected world. Registration is open.

"SEMI Europe looks forward to welcoming leading experts in Dresden. With exceptional speakers and a brand-new exhibition, the Summit offers insights into cutting-edge heterogeneous integration innovations essential for semiconductor applications, driving the advancement of intelligent systems," said Laith Altimime, President of SEMI Europe.

This year’s SEMI 3D & Systems Summit will present a broad scope of topics including:

• AI as a Driver to Grow 3D Technology Implementation
• Accelerating the AI Economy through Heterogeneous Integration
• Heterogeneous Integration for Photonics Applications
• Technology and Market Updates for 2.5D & 3D Packaging for Heterogeneous Integration
• Design and Technologies of Chiplet System Architectures
• Hybrid Bonding Technologies for Advanced 3D Integration
• Manufacturing Innovation for 3D Integration

Featured Speakers 

• Bill Chen, ASE Fellow & Senior Technical Advisor, ASE, Inc.
• Carlos Lee, Director General, EPIC
• Dirk Hilbert, Mayor, City of Dresden
• Jan Vardaman, President, TechSearch International, Inc.
• Frank Bösenberg, Managing Director, Silicon Saxony
• Kurt Herremans, Program Director Automotive Chiplets, imec
• Isabel Obieta, Programme Manager for Sustainable Semiconductors, EISMEA
• Liron Gantz, Manager of the Electro-Optics Group, NVIDIA
• Ming Zhang, VP of R&D, PDF Solutions
• Serge Nicoleau, Group VP of Technology, STMicroelectronics
• Seung Kang, Senior VP of Semiconductor Strategy, Adeia

Global Leaders to Present 

3D & Systems Summit presenters include experts from global leaders:

• Adeia
• ANSYS, Inc.
• ASE, Inc. 
• CEA-Leti
• Comet Yxlon
• EPIC
• European Commission
• EV Group
• Fraunhofer IZM
• HEIDENHAIN
• imec
• KLA Corporation
• Lam Research
• MKS-Atotech
• NVIDIA
• PDF Solutions
• Siemens EDA
• Silicon Saxony
• SPTS Technologies
• STMicroelectronics
• SUSS MicroTec
• TechSearch International, Inc.
• Tokyo Electron Limited
• Yole Group

Networking 

This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise on the second day of the summit.

Networking Dinner Cruise registration is reserved exclusively for 3D & Systems Summit 2024 participants. Guests may register their spouse for dinner by completing the spouse registration form.

Exhibition

The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies at the new exhibition area. Exhibitors include: Adeia, ASE, Inc., ASMPT AMICRA, Besi, CEA-Leti, Comet Yxlon, Confovis, European Chips Diversity Alliance, European Chips Skills Academy, EV Group, Fraunhofer IZM-ASSID, HEIDENHAIN, HiCONNECTS, Lam Research, ProSys, Renishaw, SET Corporation, Tokyo Electron Limited and Wooptix.

To reserve an exhibition space, contact [email protected].

3D & Systems Summit Premium Sponsors

• Platinum: Adeia, ASE, Inc., Comet Yxlon, Heidenhain, KLA Corporation, and Lam Research
• Event: EV Group, Evatec, imec, MKS-Atotech, SÜSS MicroTec and Tokyo Electron Limited

For more details, please visit the 3D & Systems Summit 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#3DSummit).

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI 3D & Systems Summit to Highlight Heterogeneous Systems for Intelligent Decision-Making and Real-Time Applications

Additional supply critical to semiconductor industry meeting its net zero goals.

SEOUL, South Korea – June 4, 2024 – SEMI, the industry association serving the global electronics design and manufacturing supply chain, as part of its Energy Collaborative (EC) Initiative, and EC Sponsors met with officials from South Korea’s Ministry of Trade, Industry and Energy today to discuss the EC analysis, recommendations and solutions for expanding access of the region’s semiconductor ecosystem to renewable energy – a critical factor for the South Korea chip supply chain to meet its net zero goals.

“Growing demand for low-carbon energy (LCE) electricity is a concern for all manufacturing sectors, but especially for semiconductors as they are critical to many aspects of economic growth and the engine of the information economy,“ said Dr. Mousumi Bhat, Vice President of Sustainability Programs at SEMI. “Transitioning to LCE is vital for the chip industry to meet its commitments to decarbonize. Reducing the carbon footprint of South Korea’s production of chips and the electronic devices they enable is a key part of this work.”

The SEMI EC co-hosted the meeting with Solutions for Our Climate (SFOC) in partnership with the Asia Clean Energy Coalition (ACEC) and the Clean Energy Buyers Association (CEBA).  SEMI EC Sponsors, ASML, Lam Research, Qualcomm and Samsung Electronics also attended to provide industry perspectives. 

Analysis conducted by the Energy Collaborative shows that the announced LCE adoption targets of South Korean companies are expected to accumulate to 75 TWh to 130 TWh per year by 2030. Even if South Korea were to meet its target of 339 TWh of LCE on the grid by 2030 (as in the draft of the 11th BPLE), under current clean electricity procurement mechanisms, corporations would still see a 25 TWh to 100 TWh shortfall in LCE supply to meet their targets – equivalent to 35% to 75% of total declared corporate targets.

The South Korean semiconductor industry accounts for 7% of South Korea’s GDP and is a key supplier to the country’s broader technology and manufacturing sectors. If the entire semiconductor and electronics manufacturing industry were to enhance its LCE adoption target in line with the 1.5°C pathway, it would add another 30 to 40 TWh annually to South Korea’s corporate LCE demand.

SEMI shared the following recommendations to help close the gap: 

• Provide clear signaling of South Korea’s commitment to tripling global renewable energy capacity by 2030¹ by aligning its national energy targets with the 1.5C pathway.

• Drive down renewable energy generation costs by:
  • Establishing a government-operated offshore wind zoning system in which projects are awarded to developers through auction to ensure market certainty.

  • Introducing a central resource (one-stop shop) where developers can obtain permits from a single entity to reduce project lead time.

  • Alleviating separation distance restrictions² on solar PVs to increase its potential capacity.
• Ensure predictable and fair costs for renewable energy developers by setting fair regulatory standards on community benefit-sharing and grid curtailment.
• Accelerate grid reinforcement by adopting a government-led grid development system, streamlining the permitting process, and incentivizing private-sector financing.
• Facilitate greater corporate access to renewable energy procurement methods by ensuring that:
  • Power Purchase Agreement (PPA) costs (e.g. network usage fees) are transparent and fair
  • Green retail tariffs (including the Green Premium) directly contribute to carbon emission reductions

The analysis and its findings and recommendations will be available in a public report to be released in late June.

“We are pleased to partner with the SEMI Energy Collaborative in their efforts to increase access to solar and wind energy for the South Korea microelectronics industry and the region as a whole,” said Joojin Kim, CEO of Solutions for Our Climate (SFOC). “We urge the government and people of South Korea to reduce barriers to renewable energy installation to ensure our region remains an attractive and competitive place to live, work and prosper while reducing our impact on climate change.” 

1. At COP28 in 2023, South Korea committed to tripling global renewable energy capacity by 2030
2. Current separation distance restrictions reduce the potential capacity of solar power by 70%

About the SEMI Energy Collaborative
The SEMI Energy Collaborative was launched in 2023 after analysis by the Semiconductor Climate Consortium (SCC) Baselining Working Group discovered 83% of the semiconductor sector carbon emissions are due to energy usage. The EC assembles a comprehensive ecosystem of key stakeholders, energy experts and industry leaders to advance the industry’s sustainability goals by pursuing a low-carbon energy grid in chipmaking hubs in Asia. The effort benefits humanity by reducing the industry’s carbon footprint, adding new green jobs in communities and providing cleaner air for society while making locations more appealing for site selection by multi-national corporations. 

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more

Association Contact
Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI and Energy Collaborative Sponsors Meet With South Korea MOTIE Officials to Present Recommendations on Expanding Renewable Energy

MILPITAS, Calif. – June 5, 2024 – Global semiconductor equipment billings contracted 2% year-over-year to US$26.4 billion in the first quarter of 2024, while quarter-over-quarter billings dropped 6% during the same period, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

“Despite the slight dip in global semiconductor equipment billings, our industry remains strong and resilient,” said Ajit Manocha, SEMI President and CEO. “Strategic investments and demand for advanced technology will catalyze the semiconductor equipment market’s return to growth.”

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Download a sample of the EMDS report.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.

About SEMI
SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Q1 2024 Global Semiconductor Equipment Billings Edge Down 2% Year-Over-Year, SEMI Reports