Current Edition:
July 2026Publication Schedule:
AnnuallyPrincipal Analysts:
SEMI and TechSearch InternationalFormat:
Microsoft® Excel® file (.xls)The Worldwide Assembly & Test Facility Database provides a detailed global view of semiconductor back-end manufacturing facilities operated by integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test (OSAT) companies.
The 2026 edition covers more than 820 facilities worldwide. It provides facility-level information on company ownership, location, operating status, assembly and packaging capabilities, test coverage, device focus, advanced packaging technologies, automotive certifications, substrate and interposer platforms, end-market focus, and selected site attributes.
The database helps users evaluate the global assembly and test footprint, compare regional capabilities, identify potential manufacturing partners, assess supply-chain exposure, and monitor the evolution of back-end capacity and technology.
What’s New in 2026
- Expanded global coverage to more than 820 facilities.
- New and expanded fields covering silicon and compound semiconductor capability, compound semiconductor types, substrate/interposer platforms, end-market focus, and technology/module capability.
- Updated facility operating status, ownership, location, assembly, test, device focus, and packaging capability information.
- Updated Top 10 OSAT capital expenditure ranking and Top 20 OSAT revenue ranking.
The database is developed through primary and secondary research conducted by TechSearch International and SEMI. Where possible, the research team contacts companies directly to validate and update facility information. Company websites, public disclosures, and other industry sources are also systematically reviewed to supplement and verify the collected data.
Product Information
Features
Company and Site Information: Company name, ownership, headquarters, plant site, address, region, website, and selected facility details.
Operating Profile: Facility status, plant type, assembly activity, test coverage, and operating history.
Assembly and Packaging Capabilities: Leadframe, laminate BGA/CSP, wafer-level packaging, bumping, TSV, modules, SiP, MCP, and advanced packaging technologies.
Device and Material Focus: Memory, logic/analog, power, RF, MEMS/sensors, CIS/opto/photonics, silicon usage, compound semiconductor capability, and compound semiconductor types including SiC, GaN, GaAs, and InP.
Market and Technology Attributes: Automotive certification; substrate/interposer platform, including laminate substrate, RDL, ceramic substrate, silicon interposer, and leadframe; end-market focus; technology/module capability; and notes.
OSAT Market Benchmarks: Top-company rankings by revenue and capital expenditures.
Benefits & Applications
- Map global IDM and OSAT manufacturing footprints.
- Assess regional concentration and supply-chain exposure.
- Identify alternative assembly, packaging, and test partners.
- Compare facility-level technology and device capabilities.
- Support strategic planning, market analysis, sourcing, and competitive benchmarking.
- Track facility openings, closures, expansions, and technology evolution.
Purchase
| Product | Member | Non-Member | |
|---|---|---|---|
| Worldwide Assembly & Test Facility Database - 1 user, One-Time Purchase | $8,200 | $11,000 | Buy Now |
|
To purchase multiple user licenses at a discount, please contact [email protected]. |
To purchase multiple user licenses at a discount, please contact [email protected].
Please review Market Intelligence License Agreement