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Publication Date:

Principal Analysts:

Christian Gregor Dieseldorff and Clark Tseng, SEMI


Microsoft® Excel® file (.xls)

This report tracks more than 280 fabs/lines worldwide and more than 50 companies and organizations around the world. This edition extends the forecast to 2024, providing insights into current and future investment activities in 300mm semiconductor fabs and informs business planning and capacity additions.


Product Information


  • Twelve-year report with data by quarters from 2013-2024
  • High-level summaries, tables, charts, and graphs for presentations
  • Detailed data in fab construction and equipment spending by major product segments, such as Foundry, NAND Flash, DRAM, Logic, Power, etc.
  • Fab capacities by fab line, by company, by product types, by geographic locations
  • Fab status includes planned, constructing, equipping, in production, fab closures, and wafer size conversions


  • Access current and future data on worldwide 300mm fabs, including announced/planned future fabs
  • Gain insight into up-to-date analysis with verified and validated data on new investment, technology upgrade, capacity expansion, and transactions
  • Improve investment and business planning with validated current data and forecasts
  • Access to benchmark data used by financial institutions, industry experts, and top-tier companies worldwide


The information for the fab reports and forecasts is compiled from various sources in the industry including publicly available information such as capital spending plans, fab plans, ramp schedules, and technology roadmaps.

Source data are verified across an extensive network of industry contacts. These data are used in modeling for each company and facility, incorporating various economic indicators and best educated estimates.

The report uses a bottom-up approach, tracking projects per cleanroom facility but uses also a top down analysis by company, region, and industry segment.

Content details include capital expenditure for construction and equipment, capacities, technologies used, product types, and wafer sizes.


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