DRESDEN, Germany — April 4, 2023 — Leading experts in 3D integration and systems for semiconductor manufacturing will gather at the annual SEMI 3D & Systems Summit, June 26-28, 2023 in Dresden, for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent systems. The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies. Registration is open.

“We look forward to hosting industry leaders at the 3D & Systems Summit as they deliver insights into cutting-edge advanced packaging solutions,” said Laith Altimime, President of SEMI Europe. “Packaging innovations are critical to semiconductor industry growth, increasing chip performance, reducing power consumption and enabling smaller end devices for emerging and growing segments including autonomous driving, 6G, Internet of Things (IoT), artificial intelligence (AI), and machine learning.”

Themed Smarter Systems through Heterogeneous Integration, this year’s 3D & Systems Summit will feature a broader scope of topics including: 

• Advanced Packaging: Enabling Moore’s Law’s – The Next Frontier
• Market Briefing and Technical Roadmap
• Industrialization and Mass Adoption of 3D Technologies
• Hybrid Bonding Developments
• Chiplet Design Packaging: Architectures and Challenges
• Novel Processes and Interconnect Solutions for 3D
• Photonics Integration
• Sustainability
• Applications Enabled by 3D

3D & Systems Summit Distinguished Speakers

	Seung Kang, VP of Strategy Adeia, Inc.
	Raja Swaminathan, Corporate VP AMD
	Rozalia Beica, VP Strategic Marketing & Business Development, Microelectronics Business Unit AT&S China
	Yoan Dupret, Managing Director and CTO Menta
	Pascal Metzger, CEO SET Corporation S.A.
	Luc Augustin, CTO Smart Photonics
	E. Jan Vardaman, President TechSearch International, Inc.
	Emilie Jolivet, Semiconductor, Memory and Computing Division Director Yole Group

Global Leaders to Present

3D & Systems Summit presenters also include experts from these global leaders:

• Adeia
• AMD
• ASML
• AT&S China
• Besi
• CEA-Leti
• EPIC
• EV Group
• Fraunhofer IIS-EAS
• Fraunhofer IZM-ASSID
• imec
• Intel Corporation
• KLA Corporation
• Menta
• MKS-Atotech
• Research Fab Microelectronics Germany (FMD) and Fraunhofer Group for Microelectronics
• SET Corporation S.A.
• Siemens EDA
• Smart Photonics
• SPTS Technologies Ltd., a KLA company
• SÜSS MicroTec
• TechSearch International
• Yole Group

Exhibition and Premium Networking Opportunities

The 3D & Systems Summit will feature business-to-business matchmaking and networking for exploring new partnerships and other business opportunities. This year’s networking dinner will take place on the Elbe River cruise.

To reserve an exhibition space, contact [email protected].

For more details, please visit the 3D & Systems Summit website and connect with SEMI Europe onTwitter or LinkedIn – @SEMIEurope, #3DSummit.

Premium Sponsors

• Platinum: Adeia, Inc. and Comet Yxlon
• Gold: Racyics and SÜSS MicroTec
• Silver: Lam Research
• Event: EV Group, imec and MKS-Atotech,

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI 3D & Systems Summit to Spotlight Latest Trends in Heterogeneous Integration, Hybrid Bonding, Chiplet Design and Photonics

MILPITAS, Calif. – April 12, 2023 – Worldwide sales of semiconductor manufacturing equipment increased 5% from $102.6 billion in 2021 to an all-time record of $107.6 billion last year, SEMI, the industry association representing the global electronics design and manufacturing supply chain, reported today. The data is now available in the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

For the third consecutive year, China remained the largest semiconductor equipment market in 2022 despite a 5% slowdown in the pace of investments in the region year over year, accounting for $28.3 billion in billings. Taiwan, the second-largest destination for equipment spending, recorded an increase of 8% to $26.8 billion, marking the fourth straight year of growth for the region. Equipment sales to Korea contracted 14% to $21.5 billion. Annual semiconductor equipment investments in Europe surged 93%, while North America logged a 38% increase. Sales to the Rest of World and Japan increased 34% and 7% year over year, respectively.

“The record high for semiconductor manufacturing equipment sales in 2022 stems from the industry’s drive to add the fab capacity required to support long-term growth and innovations in key end markets including high-performance computing and automotive,” said Ajit Manocha, SEMI president and CEO. “Additionally, the results reflect investments and determination across regions to avoid future semiconductor supply chain constraints like those that surfaced during the pandemic.”

Global sales of wafer processing equipment rose 8% in 2022, while other front-end segment billings grew 11%. After robust growth in 2021, assembly and packaging equipment sales decreased 19% last year while total test equipment billings contracted 4% year over year.

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Annual Billings by Region in Billions of U.S. Dollars with Year-Over-Year Change Rates

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Download a sample of the EMDS report.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Semiconductor Equipment Billings Reach Industry Record $107.6 Billion in 2022, SEMI Reports

MILPITAS, Calif. — April 11, 2023 — The vital importance of workplace inclusion and diversity to the growth of the global semiconductor industry will take center stage as the Women in Semiconductors (WiS) program returns in-person on May 1 in conjunction with the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2023) in Saratoga Springs, New York. WiS 2023 continues to connect more women in the semiconductor manufacturing industry while driving critical discussions across genders. WiS registration is complimentary for ASMC registrants and students.

WiS 2023 will highlight the importance of allyship, mentorship, overcoming biases, and creating a culture of support and belonging to enable more women to grow and succeed in the semiconductor industry.

WiS 2023 builds on the strength of past events with its focus on the critical role of promoting gender diversity in the workplace. Industry stakeholders ranging from company leaders, team members and developers of internal programs supporting women will benefit from expert insights, open discussion and networking at the event.

The program will feature the workshop Strategies for Navigating Gender Bias, led by Rita B. Allen, President and Founder of Rita B. Allen Associates, and a keynote panel moderated by Michelle Williams-Vaden, Deputy Director of the SEMI Foundation. Panelists will include:

• Debbie Gustafson, CEO, Energetiq Technology
• Dann Woodland, Ph.D., SVP and President, Advanced Planarization Solutions, Entegris
• Gary Patton, Ph.D., Corporate VP and GM, Intel
• Priya Mukundhan, Ph.D., Sr. Director, Product Marketing, Onto Innovation

WiS 2023 will also include an interactive group mentoring session focused on the following topics:

• Addressing bias
• Building relationships
• Cultivating confidence
• Knowing your brand

The program is co-chaired by Garima Gautam, Engineering Manager, Fab Sort Manufacturing Productivity at Intel, and Marie LeGuilly, Director of Procurement at Entegris, with support from the WiS organizing committee, more than 70 women dedicated to promoting the success and advancement of women in the semiconductor industry.

WiS 2023 is sponsored by Athinia, Axcelis, EMD Electronics, Energetiq Technology, IBM, Intel, Nikon Precision, Onto Innovation and TEL. 

For program details, please contact Margaret Kindling at [email protected] or (202) 393-5552.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Women in Semiconductors 2023 to Highlight Bridging the Gender Gap Through Allyship

MILPITAS, Calif. — April 4, 2023 — Advanced semiconductor manufacturing topics ranging from yield management and metrology to new developments in improving post-pandemic manufacturing agility will come into sharp focus at SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2023), May 1-4 in Saratoga Springs, New York. Expected to draw hundreds of attendees from across the industry, the 34th annual ASMC will feature nearly 30 hours of technical and poster presentations by more than 85 industry experts on the latest manufacturing strategies and methodologies. Registration is open.

ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Larry Pulvirent, Lead Manufacturing Integration Engineer at AIM Photonics, and Jan Rothe, Sr. Manager Global Manufacturing Solutions Strategy & Architecture at GlobalFoundries.

ASMC 2023 Keynotes and Tutorial

	Dr. Thomas Morgenstern, EVP, Frontend Infineon Technologies European Chips Act
	Dr. Nabil Mistkawi, Senior Staff Engineer, Technologist Samsung Electronics Tutorial: Device Technology Challenges and Innovations Driving Scaling in the New ERA
	Salvatore Coffa, Group VP, General Manager STMicroelectronics Silicon Carbide
	Thomas Sonderman, President and CEO SkyWater Technology CHIPS Act
	Robert Maire, President Semiconductor Advisors Market Update

ASMC 2023 technical sessions will cover topics including:

• Advanced Equipment Processes and Materials
• Advanced Metrology
• Advanced Process Control
• Advanced Semiconductor Technologies
• Big Data, Automation and Analytics
• Contamination Free Manufacturing
• Defect Inspection
• Equipment Optimization
• Workforce Development
• Yield Enhancement / Yield Methodologies

ASMC will also feature the panel discussion Unintended Consequences of Government Subsidies on Moore’s Law and the Future of Semiconductors. Panelists will include:

• Sam Howell, Research Assistant, Technology and National Security Program, CNAS
• Sanjay Tripathi, Vice President, Semiconductor Technology & Services, IBM
• Robert Maire, President, Semiconductor Advisors
• Rick Glasmann, VP North American Operations, The MAX Group

The Women in Semiconductors (WiS 2023) program takes place May 1 in conjunction with ASMC 2023. The program will address the importance of promoting diversity and inclusion in the workplace. Complimentary registration is available for ASMC attendees. 

For more conference details, please visit the ASMC website or contact Taylor Zhao of SEMI at [email protected].

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about ASMC 2023 to Spotlight Advanced Semiconductor Manufacturing Excellence

MILPITAS, Calif. — April 4, 2023 — FLEX Conference will gather industry experts July 11-13, 2023, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible hybrid electronics (FHE), printed electronics and advanced packaging including heterogeneous integration. Hosted by SEMI, FLEX is now part of SEMICON West, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain. Registration for both events is open.

Themed Intelligently Flexible, FLEX Conference 2023 will attract global industry professionals from more than 150 companies, R&D labs, and government agencies as the event focuses on equipment, processes, materials and applications driving the latest FHE technology breakthroughs. FLEX will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.

“FLEX showcases advancements in next-generation electronics packaging accelerating industry growth,” said Melissa Grupen-Shemansky, CTO and Vice President of Technology Communities at SEMI. “Companies pushing the boundaries of heterogeneous integration will join FlexTech, NBMC and NextFlex innovators as they present cutting-edge research and development to advance industry technical knowledge through papers, posters and product information.”

“FLEX is a leading forum for networking with colleagues passionate about flexible hybrid electronics,” said Robert Praino, Chief Innovation Officer and Co-Founder of Chasm Advanced Materials Inc. and chairman of the FLEX Executive Planning Committee. “We’ve combined compelling industry topics with abundant deep dives into areas of common interest for learning across the ecosystem. The FLEX executive committee has worked to ensure rich technical content, consistent with the event’s tradition over the past 20-plus years, that promises to shed new light on business and innovation opportunities ahead.”

FLEX Conference 2023 Keynotes

	Richard Price, CTO Pragmatic Semiconductor Simplifying the IC Ecosystem
	Michelle Foss, Fellow in Energy, Minerals and Materials Rice University The Very Big Picture on Materials – All of the Options Fit to Print
	Kris Erickson, Research Manager Meta Reality Labs Advancing Additively Manufactured Electronics for Heterogeneous Integration

FLEX Future Disruptors Session

FLEX will also feature the Future FLEX Disruptors session, where startups will meet with venture capitalists for insightful business and technology coaching to help cultivate the next generation of innovators and highlight novel technologies for the audience to consider.

About SEMI
SEMI^®connects more than 2,500 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visitwww.semi.org, contact one of our worldwide offices and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email:[email protected]

• Read more about FLEX Conference 2023 to Spotlight Latest Flexible Hybrid Electronics, Printed Electronics and Advanced Packaging Innovations

MILPITAS, Calif. — April 3, 2023 — Semiconductor industry executives will gather May 18, 2023, in Santa Clara, California for CEO Outlook, an annual panel discussion about the current state and future of the chip design and semiconductor industries, the Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced today. The event is open to ESD Alliance and SEMI members at no cost. Registration is open.

The in-person event, co-sponsored by ESD Alliance member Keysight Technologies, will be held in building 5 at Agilent Technologies, 5301 Stevens Creek Blvd. in Santa Clara. The event begins at 5:30 p.m. with networking, food and beverages, followed by the hour-long panel at 6:30 p.m. and concluding with an audience Q&A session.

The ESD Alliance Annual Membership meeting begins at 5 p.m. Non-members registered for CEO Outlook are welcome to attend.

Semiconductor Engineering Editor-in-Chief Ed Sperling will moderate the panel discussion.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community representing members in the electronic system and semiconductor design ecosystem, is a community that addresses technical, marketing, economic and legislative issues affecting the entire industry. It acts as the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. Visit www.semi.org/en/communities/esda to learn more.

Follow the ESD Alliance

ESD Alliance Bridging the Frontier blog
Twitter: @ESDAlliance
LinkedIn
Facebook

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

All trademarks and registered trademarks are the property of their respective owners.

Association Contact

Nanette Collins
Public Relations for the ESD Alliance
Email: [email protected]

• Read more about SEMI ESD Alliance 2023 CEO Outlook to Highlight Future of Chip Design and Semiconductor Industries

MILPITAS, Calif. — March 27, 2023 — Semiconductor manufacturers worldwide are forecast to increase 300mm fab capacity to an all-time high of 9.6 million wafers per month (wpm) in 2026, SEMI announced today in its 300mm Fab Outlook to 2026 report. After strong growth in 2021 and 2022, the 300mm capacity expansion is expected to slow this year due to soft demand for memory and logic devices.

“While the pace of the global 300mm fab capacity expansion is moderating, the industry remains squarely focused on growing capacity to meet robust secular demand for semiconductors,” said Ajit Manocha, SEMI President and CEO. “The foundry*, memory and power sectors will be major drivers of the new record capacity increase expected in 2026.”
 

Chipmakers expected to increase 300mm fab capacity during the 2022 to 2026 forecast period to meet growth in demand include GlobalFoundries, Hua Hong Semiconductor, Infineon, Intel, Kioxia, Micron, Samsung, SK Hynix, SMIC, STMicroelectronics, Texas Instruments, TSMC and UMC. The companies are planning 82 new facilities and lines to start operations from 2023 to 2026.

Regional Outlooks

Due to U.S. export controls, China will continue to focus government investments on mature technology to lead in 300mm front-end fab capacity, increasing its global share from 22% in 2022 to 25% in 2026, reaching 2.4 million wafers per month, the SEMI 300mm Fab Outlook to 2026 shows.

Korea’s worldwide 300mm fab capacity share is expected to slip from 25% to 23% from 2022 to 2026 on weak demand in the memory market. Taiwan is on track to retain third place despite a slight dip in share from 22% to 21% during the same period, while Japan’s share of worldwide 300mm fab capacity is also expected to edge down, from 13% last year to 12% in 2026, as competition with other regions increases. 

Powered by strong demand in the automotive segment and government investment, the Americas and Europe & Mideast are expected to see 300mm fab capacity share growth from 2022 to 2026. The Americas’ global share is forecast to rise 0.2% to nearly 9% by 2026, while Europe & Mideast is projected to increase its capacity share from 6% to 7% and Southeast Asia is expected to maintain its 4% share of 300mm front-end fab capacity during the same period.

Projected Capacity Growth Rates by Sector

The SEMI 300mm Fab Outlook to 2026 shows analog and power leading other sectors in capacity growth at a 30% CAGR from 2022 to 2026, followed by foundry at 12%, opto at 6% and memory at 4%.

The latest update of the SEMI 300mm Fab Outlook To 2026, published on March 14, 2023, lists 366 facilities and lines – 258 in operation and 108 planned for the future.

Download a sample of the SEMI 300mm Fab Outlook report.

For details about SEMI reports on other semiconductor sectors, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

*Foundry segment includes micro and logic devices

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance electronics design and manufacturing technology and business. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable more innovative, faster, powerful, and affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.932.309.
Email: [email protected]

• Read more about 2026 All-Time High in Store for Global 300mm Semiconductor Fab Capacity After 2023 Slowdown, SEMI Reports

PENANG, Malaysia — 21 March 2023 — Critical areas of semiconductor industry growth including sustainability, smart manufacturing, smart mobility, smart medtech and workforce development will take center stage at SEMICON Southeast Asia, as the industry’s premier global electronics manufacturing and supply chain event returns to Penang 23-25 May at the Setia SPICE Convention Centre. SEMICON Southeast Asia 2023 is organized in partnership with Malaysia Ministry of International Trade & Industry (MITI), Malaysian Investment Development Authority (MIDA) and InvestPenang. Registration is open.

Themed Boosting the Agility and Resiliency of the Electronics Supply Chain, SEMICON Southeast Asia 2023 will also gather industry leaders to explore ways to build a more robust supply chain as players across the ecosystem navigate the current economic downturn and ongoing disruptions.

“With global electronics supply chains being redrawn as a result of geopolitical forces, more multinational players are shifting their attention to Southeast Asia, where much of the world’s semiconductor manufacturing capabilities are concentrated,” said Linda Tan, President of SEMI Southeast Asia. “There is no better time for the region to bolster its position as a key hub for electronics manufacturing and deepen its integration with global value chains. We look forward to hosting industry leaders at SEMICON Southeast Asia 2023 as they gather to discuss how they can build on the region’s strengths to help increase global supply chain resilience, and better position the industry to seize the innovation and growth opportunities ahead.”

SEMICON Southeast Asia 2023 Highlights

• CxO Summit on Boosting Agility and Resiliency for the Electronics Supply Chain in SEA
• Roundtable discussion on investment opportunities in Southeast Asia
• Workforce Development
  • Career fair and talks
  • SEMI University Bootcamp
  • Launch of SEMI University, an online learning management system comprising courses targeted towards industry professionals in the semiconductor and electronics industry
• Forums
  • SMART Mobility
  • Market and Industry trends
  • SMART Enterprise
  • Advanced Packaging
  • SMART MedTech
  • Advanced Product Testing
  • Sustainability
• Smart & Sustainable Manufacturing Journey to help expand the adoption of Industry 4.0 best practices in the semiconductor industry
• Startups Showcase featuring the latest innovative semiconductor manufacturing solutions that are available in the market
• Industry VIP Networking Night for attendees to connect with industry leaders and experts

What SEMI Southeast Asia partners have to say

Datuk Wira Arham Abdul Rahman, Chief Executive Officer, Malaysian Investment Development Authority
“As Southeast Asia’s semiconductor hub, Malaysia has vast potential to leverage global demand and expand its already robust existing semiconductor ecosystem in the coming years. Malaysia’s position as a top investment destination in the region remains strong, with a steady influx of high-quality investments in the manufacturing sector. A significant contributor to the Malaysian economy, the sector accounted for RM84.3 billion (USD19.1 billion), or 31.9% of total investments in 2022. Electrical and electronics (E&E) remained the top-performing industry in the manufacturing sector, with total approved investments of RM29.3 billion (USD6.6 billion).”

“SEMICON Southeast Asia presents a great platform for businesses to connect, engage and widen their strategic networks. With the presence of international firms at the event, Malaysia will showcase the vibrancy of its E&E industry and offer more opportunities for global industry players to expand their supply chains to include this key sector.”

Right Honourable Mr. Chow Kon Yeow, Chief Minister of Penang
“The theme for this year’s SEMICON Southeast Asia aligns with Penang’s longstanding focus to strengthen our competitiveness in the global arena. Having built a significant presence in the semiconductor industry, Penang is often lauded for its areas of expertise along the value chain. Through InvestPenang, Malaysia continues to nurture the growth of emerging electronics subsectors and extend Penang’s depth and breadth in the global semiconductor industry to help power its growth.”

For the full event agenda, please visit the SEMICON Southeast Asia website.

About MITI
MITI is the key driver in making Malaysia the preferred destination for quality investments and enhancing the nation's rising status as a globally competitive trading nation. Its objectives and roles are oriented towards ensuring Malaysia’s rapid economic development and help achieve the country's stated goal of becoming a developed nation.

About MIDA
MIDA is the Government’s principal investment promotion and development agency under the Ministry of International Trade and Industry (MITI) to oversee and drive investments into Malaysia’s manufacturing and services sectors. Headquartered in Kuala Lumpur Sentral, MIDA has 12 regional and 21 overseas offices. MIDA continues to be a strategic partner to businesses in seizing the opportunities arising from the technology revolution of this era. For more information, please visit www.mida.gov.my and follow on Twitter, Instagram, Facebook, LinkedIn, and YouTube channels.

About InvestPenang
InvestPenang is the Penang State Government’s principal agency for promotion of investment. Its objectives are to develop and sustain Penang’s economy by enhancing and continuously supporting business activities in the State through foreign and local investments, including spawning viable new growth centers. To realize its objectives, InvestPenang also runs initiatives like the SMART Penang Center (providing assistance to SMEs) and Penang CAT Center (for talent attraction and retention). For more information, please visit https://investpenang.gov.my/ and follow InvestPenang’s social media channels: Facebook and LinkedIn.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Media Contacts

Ryan Teo/SEMI Southeast Asia
Phone: +65 9859 0883
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Reshvinder Kaur/Ascendus Communiations
Phone: +6017 275 7985
Email: [email protected] / [email protected]

• Read more about SEMICON Southeast Asia 2023 to Spotlight Electronics Supply Chain Resilience, Sustainability, Smart Tech and Talent

MILPITAS, Calif. — March 21, 2023 — Global fab equipment spending for front-end facilities is expected to decrease 22% year-over-year (YoY) to US$76 billion in 2023 from a record high of US$98 billion in 2022 before rising 21% YoY to US$92 billion in 2024 to reclaim lost ground, SEMI announced today in its latest quarterly World Fab Forecast report. The 2023 decline will stem from weakening chip demand and higher inventory of consumer and mobile devices.

Next year’s fab equipment spending recovery will be driven in part by the end of the semiconductor inventory correction in 2023 and strengthening demand for semiconductors in the high-performance computing (HPC) and automotive segments.

“This quarter’s SEMI World Fab Forecast update offers our first look ahead to 2024, highlighting the steady global expansion of fab capacity to support future semiconductor industry growth driven by the automotive and computing segments and a host of emerging applications,” said Ajit Manocha, SEMI president and CEO. “The report points to a healthy 21% uptick in equipment investment next year.”

Taiwan Continues to Lead Equipment Spending

Taiwan is expected to retain the global lead in fab equipment spending in 2024 with US$24.9 billion in investments, a 4.2% YoY increase, followed by Korea at US$21 billion, a YoY 41.5% jump. While China is forecast to place third in equipment spending worldwide in 2024, U.S. export controls are expected to limit the region’s spending to US$16 billion, comparable to the region’s investments in 2023. 

The Americas is expected to remain the fourth largest region in spending with a record US$11 billion in investments in 2024, a 23.9% YoY increase. Europe & Mideast is also forecast to log record investments next year, increasing spending by 36% to US$8.2 billion. Fab equipment spending in Japan and Southeast Asia is expected to increase to US$7.0 billion and US$3.0 billion, respectively, in 2024.

Foundry Segment Continues to Lead Semiconductor Industry Expansion

Covering 2022 to 2024, the SEMI World Fab Forecast report shows the global semiconductor industry increasing capacity by 4.8% this year after a 7.2% rise in 2022. Capacity growth is expected to continue in 2024, rising 5.6%.

With more suppliers providing foundry services to increase global capacity, the foundry segment is expected to lead the semiconductor expansion in 2023 with US$43.4 billion in investments, a 12.1% YoY decline, and US$48.8 billion, a 12.4% increase, in 2024. Memory is forecast to place second in global spending in 2023 despite a 44.4% YoY decline to US$17.1 billion, with investments rising to US$28.2 billion next year.

Unlike other segments, analog and power will see a steady expansion with a forecast spending increase of 1.3% to US$9.7 billion in 2023 on the strength of stable growth in the automotive market. Investments by the segment are expected to remain flat next year.

The latest update of the SEMI World Fab Forecast report, published in March, lists 1,470 facilities and lines globally, including 142 volume facilities and lines with various probabilities that are expected to start production in 2023 or later.

Download a sample of the SEMI World Fab Forecast report.

For details about SEMI reports on other semiconductor sectors, visit SEMI Market Data or contact the SEMI Market Intelligence Team (MIT) at [email protected].

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

• Read more about Global Fab Equipment Spending on Track for 2024 Recovery After 2023 Slowdown, SEMI Reports

MILPITAS, Calif. – March 14, 2023 – Focusing on Building a Path Forward for the global semiconductor industry’s drive to $1 trillion and net zero, SEMICON West 2023 will gather industry experts and leaders July 11-13 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues. The event, North America’s premier exhibition and conference for the microelectronics supply chain, will feature keynotes and executive panels with thought leaders from the electronics design and manufacturing ecosystem, academia and government. Registration is open.

SEMICON West 2023 will also address key themes including government investment in chip manufacturing, heterogeneous integration, smart mobility, smart medtech and smart manufacturing.

“As a previous executive, exhibitor, board member and attendee of over 30 shows, I have never seen as many new and exciting enhanced show features as there will be at SEMICON West 2023,” said Joe Stockunas, president of SEMI Americas. “The program is shaping up to be an incredible lineup, leading each morning with the CEO Summit keynote presentations followed by full days of great content from industry leaders and networking activities. It’s a perfect opportunity and space to catch up with colleagues, grow your contacts and business, and extend conversations at nearby iconic San Francisco restaurants and happy hours. We are close to sellout in the exhibition halls and look forward to seeing you there.” 

CEO Summit Keynotes at SEMICON West 2023

• Path to $1T
  • Luminaries will share insights on the chip industry’s progress towards $1 trillion in annual revenue including the importance of CHIPS Act funding as well as new semiconductor technology advances and growth segments that promise to boost the global supply chain’s financial performance.
• Path to Net Zero
  • CEOs will share sustainability strategies and perspectives on the U.S. microelectronics industry’s position on international sustainability and climate agreements and legislation.
• Path for Talent
  • Featured topics will include creating a diverse and inclusive industry, building a career in microelectronics and cultivating an inclusive talent pipeline.

Building a Path to Net Zero – Sustainability Programs

This track will include the Path to Net Zero CEO Summit keynotes and the following sessions.

• Climate Equity & Social Impact
  • The session will showcase big-picture environmental, social and governance (ESG) topics and collaborative solutions to the most daunting challenges presented by the world’s rapidly changing climate. Focus areas include advancing the United Nations’ sustainable development goals, establishing equitable economic opportunities, and leveraging public-private partnerships to develop climate equity programs.
• Sustainability & EHS Forum 2023
  • Speakers and panels will discuss the status of disclosures, incentives, tax implications, regulations, and new proposals for research related to per-and polyfluoroalkyl substances (PFAS), phenol, isopropylated phosphate (PIP) and greenhouse gases. They’ll also explore strategies for navigating the evolving regulatory environment.
• Startups for Semiconductor Sustainability Pitch & Pavilion
  • The session will highlight the role of startups in the semiconductor industry’s path to net zero. Panels of venture capitalists and corporate venture capitalists will discuss their funding of new technology solutions for decarbonization.
  • Also featured will be pitches from SEMI Startups for Semiconductor Sustainability program finalists and a pitch and mentoring competition judged by the corporate venture capital arms of leading semiconductor makers and equipment manufacturers. The Startups program is part of the SEMI Sustainability Initiative to enable a greener chip industry.

Supply Chain Management and CHIPS Act Investments

• Navigating Uncertainty – How Do You Build Agile Supply Chains?
  • With business agility never more important to overcome industry disruptions, this panel will discuss foundational requirements for an agile supply chain and strategies for addressing challenges in a rapidly changing environment.
• CHIPS Act: The Path Forward
  • This session will provide updates on available federal funding, program priorities, forecasts of new chip fabs expected from the CHIPS Act incentives, and an outlook for supply chain growth.

SEMICON West 2023 Pavilions

• Smart Manufacturing Pavilion
  • Highlights will include discussions on automation and equipment for fully autonomous factories, wireless connectivity and security, manufacturing operations enabled by artificial intelligence and machine learning, and deploying Industry 4.0 technologies in new facilities enabled by CHIPS Act funding.
• Smart Mobility Pavilion
  • Key themes will include affordable electrification, intelligent sensors for smart mobility, and the role of silicon carbide (SiC) in the automotive ecosystem.
• Smart MedTech Pavilion
  • Industry leaders, innovators, and venture capitalists will discuss future opportunities in the medical technology sector and showcase the latest innovations.
• Workforce Development Pavilion
  • Targeting both new strategies for recruiters and tactics for job seekers, the pavilion will highlight why microelectronics is a smart career choice, feature discussions on building a diverse and inclusive workforce, and host an interactive day with high school students to help spark their interest in microelectronics careers.

Business Programs

• The SEMI Market Symposium will provide a midyear update of key market trends and drivers as well as a forum to discuss pertinent business issues. Speakers will present market forecasts and analysis for the semiconductor, equipment, materials and other industries in the electronics design and manufacturing supply chain.
• Bulls & Bears will again feature unique and diverse perspectives from Wall Street analysts on the microelectronics industry.

TechTALKS

Technology experts will explore key themes such as silicon wafers and advanced wafer technology, market dynamics and sustainability in electronic materials, the latest trends in sensorization, heterogeneous integration, and accelerating the pace of lithography and scaling innovation.

SEMICON West 2023 will also feature networking opportunities at show floor lounges and receptions.

The Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2023.

Follow SEMICON West on Twitter: #SEMICONWest

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMICON West 2023 to Highlight Supply Chain Management, Sustainability and Workforce Development in Drive to $1 Trillion and Net Zero