downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content
Default Banner Image

Taiwan

FREMONT, Calif. - YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has set up Engineering Centers of Excellence at two locations in India: Coimbatore and Bangalore. A sales office will also be located in the Bangalore area.

“It is no secret that high-caliber engineering expertise is in high demand in Silicon Valley,” said Ramakanth Alapati, Chairman and CEO of YES. “Our company’s rapid growth has inspired us to widen our technical recruitment efforts to include global engineering talent powerhouses like India. In addition, we feel there is a strong market for reliable, cost-effective YES systems within India’s domestic semiconductor industry.”

Leading YES’s efforts in India will be Dr. Ankineedu Velaga, a high-tech engineering executive with more than 35 years of experience spanning engineering and fab operations, customer interaction and retention, and business development support in the US and Asia.

“Ankineedu’s experience in driving teams to improve processes will be a great resource for YES as we scale to meet the challenges of worldwide growth. We will be looking to him to draw upon his impressive track record of building organizations to develop complex semiconductor capital equipment as well as leading organizations to achieve better process development, yields, process control, cycle time, cost, and product quality,” said Rezwan Lateef, President of YES.

Dr. Velaga has held leadership roles with BRIDG, imec, SilTerra, Applied Materials, Avago, and Lucent (among others), and his global management experience extends from the US and the European Union to Malaysia and Singapore. His educational background includes a Ph.D. in Chemical Engineering from the University of Arkansas, an M.S. in Chemical Engineering from the Indian Institute of Technology in Madras, and a B.S in Chemical Engineering from the Regional Engineering College in Warangal, India.

“I am pleased and honored to be embarking on this exciting endeavor with YES,” commented Velaga. “We expect to build our India team quickly, and I look forward to talking with high-potential candidates. To see our current job postings for YES India, please visit Careers at yieldengineering.com and scroll down to the ‘YES India’ heading. If you don’t see a job there at the moment that aligns with your skills and interests, but you are a qualified candidate with a technical background and semiconductor experience, I encourage you to submit your resumé to [email protected] and include ‘YES India’ in the subject line.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, plasma etching tools, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

Heidelberg/Würzburg – "1 - 10 - 100 - 1000" – Achievable component heights of over 1 cm, surfaces with roughness in the order of 10 nm, structure sizes of less than 100 nm, and writing speeds over 1000 mm/s: At the SPIE Photonics West in San Francisco, from January 25th to 27th, Heidelberg Instruments will be presenting, for the first time, the new two-photon polymerization MPO 100, a multi-user tool that combines both the requirements of 3D lithography with resolutions in the 100 nm range and 3D microprinting with structure heights of over one centimeter, all in one device.

"The MPO 100 is a unique tool for microfabrication and achieves the highest resolution among additive manufacturing processes at 100 nanometers. Furthermore, the 1-10-100-1000 capability of the MPO 100 will enable users at universities, R&D institutions, as well as the industry and offer significant advantages for new developments in areas such as micro-optics, microfluidics, and biomedicine," says Dr. Benedikt Stender of Multiphoton Optics GmbH, the subsidiary of Heidelberg Instruments where the development of the MPO 100 was carried out.

The MPO 100 works with a laser wavelength in the green spectral range, which is ideally suited for the 3D structuring of typical photoresists. Furthermore, MPO 100 is optimized to use the hybrid polymers (ORMOCER®s), particularly important for various applications. In addition to sophisticated algorithms to maximize structure quality, the synchronized scanning system offers the possibility of stitching-free patterning. In addition, the MPO 100 is currently the only tool in the market equipped with a flowbox that guarantees temperature stability of up to 0.1°C and thus provides the necessary stability for large-scale exposures. Application-specific writing modes enable customer-specific printing requirements and distinguish the MPO 100 as a multi-user tool.

"With the MPO 100, we have combined the strengths of both companies in one system: Multiphoton Optics' sophisticated exposure unit for two-photon polymerization and Heidelberg Instruments' industrial platform, which guarantees the required stability and meets the necessary industry standards. The capabilities of the MPO 100 are already very popular with our customers, who benefit from the worldwide support from our service organization and ISO-certified production," says Steffen Diez, COO of Heidelberg Instruments.

Contact for further questions:
Veronika Loose, Marketing and Communications
[email protected]
+49 931 90879288

More information:
https://heidelberg-instruments.com/
https://multiphoton.de

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and more than 1,000 installed systems, Heidelberg Instruments is one of the leading international players in the development and production of high-precision photolithography systems and nanofabrication tools. Heidelberg Instruments systems are installed in industrial and scientific facilities around the world. They are used for efficient direct writing, as well as for photomask fabrication for a wide range of industries - including semiconductors, quantum computing, photonics, 2D materials, IoT, and many related application fields.

About Multiphoton Optics
Multiphoton Optics GmbH, a wholly owned subsidiary of Heidelberg Instruments Mikrotechnik GmbH, is a global solution provider for 3D lithography via two-photon polymerization (TPP). This disruptive technology enables the production of complex functional structures in micro-optics and microsystems technology, optical interconnect technology, micromechanics, and biomedical technology. The modular 3D printing platform enables the high-precision fabrication of structures in the submicrometer to millimeter range with very high throughput.

Taiwan
Highlighted content

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here

Online
Zhubei City, Hsinchu County 302
Taiwan

Standards

Date: Friday,  Mar. 4, 2022

Time: 1:30-3:30 PM (Taiwan Time) 

Via Virtual Meeting

 

Agenda: 

 

Standards Contact Information:

Cher Wu 吳琇君

Senior Executive Consultant | Standards

SEMI Taiwan

+886-933-976766

[email protected]

1:30 pm - 3:30 pm Off Add to Calendar 2022-03-04 13:30:00 2022-03-04 15:30:00 3D Packaging & Integration Taiwan TC Chapter Meeting Date: Friday,  Mar. 4, 2022 Time: 1:30-3:30 PM (Taiwan Time)  Via Virtual Meeting   Agenda:  Agenda_3D P&I Taiwan TC Meeting_20220304.pdf (553.35 KB)   Standards Contact Information: Cher Wu 吳琇君 Senior Executive Consultant | Standards SEMI Taiwan +886-933-976766 [email protected] Online Zhubei City, Hsinchu County 302 Taiwan SEMI.org [email protected] Asia/Taipei public Asia/Taipei

Registration

Complimentary for SEMI Members.

$99 Non-Members. 

Belgium France Germany Ireland Italy Japan Singapore South Korea Taiwan United States Register EMG Webinar tile Business Executive Expositions Technical Featured Speakers

Read the Speakers' Biographies.

United States

Scotten Jones
Scotten Jones
President
IC Knowledge
Naotao Horiguchi imec
Naoto Horiguchi
Program Director, Logic CMOS device technology
imec
Galya Stoeva
Galya Stoeva, moderator
Co-Chief Sales Officer
IceMOS Technology
EMG ESD Alliance FOA SOI Standards Workforce Development

Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET).  As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.

In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain

10:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
Event format

ESPOO, Finland, 3rd of February 2022 – Picosun Group and Shincron Co., Ltd. have joined forces for development and commercialization of Atomic Layer Deposition (ALD) for optical coatings. ALD technology provides uniform and conformal coatings to the even most challenging structures and is therefore well suited for high-end optical applications.

The R&D teams from both companies have worked together to tailor existing ALD processes optimizing them for the use in optical applications. In addition to standard ALD optical films, ALD magnesium fluoride (MgF2) has been researched and is now available for commercial use for the first time. So far, ALD MgF2 processes have been only presented in academic research by universities and science institutes. MgF2 is a desired material in optical applications due to its low refractive index at visible light and high transmittance in FUV optical region. It can be used as a single layer or as part of an optical stack combining low and high refractive index materials. It has also other features, such as barrier properties and high chemical stability, which bring big advantages in some applications.

The collaboration agreement was first signed in 2019 including the appointment of Shincron as Picosun’s sales representative and ALD product distributor in Japan. The collaboration was extended with Joint Development Agreement (JDA) in 2020 with the aim to develop novel and advanced ALD coatings for optical applications.

“We are very excited about the collaboration. The teamwork has been fruitful, and the results obtained now are excellent. We see optical coatings as one of the emerging ALD applications and believe in strong growth in this market”, says Jussi Rautee, CEO of Picosun.

“We are happy to add ALD technology to our offering. This way we can increase our services for our customers. We have set up a demo capability for ALD optical coatings and Japanese optical companies have shown high interest for this process”, says Masaya Narita, CEO of Shincron.

Read more: picosun.com/optics/magnesiumfluoride

More information:
Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
www.picosun.com

Masaya Narita
CEO, Shincron Co., Ltd.
Tel: +81 45 650 2411
Email: [email protected]
www.shincron.co.jp/en/

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

About Shincron
Shincron is a leading global supplier of innovative vacuum thin film deposition equipment. Visit www.shincron.co.jp/en/ for more information.

Breker Verification Systems today announced Nuclei System Technology deployed its System Coherency Synthesis TrekApp to ensure coherency of its configurable low-power and high-performance 32- and 64-bit RISC-V processor intellectual property (IP) designs.

“After an extensive evaluation, we choose Breker’s System Coherency TrekApp to help to ensure our design’s coherency,” remarks JianYing Peng, CEO of Nuclei System Technology. “TrekApp offers ease to use and extremely fast setup and covers broad aspect of verification from simple workload to complex scenarios that includes Dekker and Atomics tests.”

“Its flexible scaling will scale with us as we go from verifying the coherency of a few CPUs to hundreds of CPUs, matching our needs now and for our future RISC-V solution offerings.”

The System Coherency Synthesis TrekApp can generate thousands of high-coverage tests to stress cross-system coherency for a broad range of SoC platforms and processors. It is based on Breker’s Cache Coherency TrekApp and uses abstract models of common and novel algorithms to automatically generate coherency test content for complex, multi-agent system platforms based on coverage directives. The TrekApp can be configured for Arm, RISC-V and other processor configurations and broad range of storage and I/O architectures.

About Nuclei System Technology
Nuclei System Technology is a leading RISC-V processor IP vendor based in multiple locations across China. It produces a range of configurable low-power and high-performance 32/64-bit RISC-V processors and related solutions for artificial intelligence of things (AIoT) applications, an emerging technology that combines IoT and AI technologies to enable decision making and analytics. For more information, visit the Nuclei System Technology website nucleisys.com or send email to [email protected].

About Breker Verification Systems
Breker Verification Systems is a leading provider of Portable Stimulus solutions, a standard means to specify verification intent and behaviors reusable across target platforms. It is the first company to introduce graph-based verification and the synthesis of powerful test sets from intent-based, abstract scenario models based on AI planning algorithms. Breker’s Test Suite Synthesis and TrekApp library allows the automated generation of high-coverage, powerful test cases for deployment into a variety of UVM, SoC and Post-Silicon verification environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM, Huawei and other companies leveraging Breker’s solutions are available on the Breker website. Breker is privately held and works with leading semiconductor companies worldwide.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, is proud to introduce the new plasma etching cluster tool “Cluster H ™”.

“With our cutting-edge plasma etching technology, Cluster H™ provides the full-scale production capabilities for compound semiconductor devices such as high-frequency filters, SiC/GaN power devices, GaAs VCSELs, micro-OLED/LED, CMOS image sensors, and advanced packaging,” explains Tsukasa Kawabe, President and COO of Samco.

“We created Cluster H ™ to meet the strong demand from our valued customers for high throughput equipment. Cluster H™ with etching processes available only at Samco enables the combination of optimal materials and process technologies in advanced electronic device fabrication.” Continues Tsukasa.

■Features
Cluster H ™ is a cluster tool for etching and ashing that supports direct transfer of ø6” and ø8” diameter wafers. Centered on a hexagonal vacuum transfer platform, it is equipped with two vacuum cassette chambers and one vacuum aligner as part of the standard equipment configuration, and up to three process modules that can be attached. The ICP etching process module uses the reaction chamber of the high-end ICP etching model RIE-800iP and is backed by our extensive process library and best-known methods. In addition, the frog-leg dual-blade robot enables high wafer throughput, compact transfer chamber, and system footprint.
In addition, the revamped software incorporates useful functions with improved reliability. The standard system is equipped with a user-friendly GUI and equipment management functions such as equipment performance tracking, wafer transfer history for each module and packages, and simulation functions for higher-level communication, and supports the manufacturing execution system (MES) used at customers’ factories.

Samco announces the release of the production-worthy cluster tool, Cluster H ™. The system is ideally suited for high volume manufacturing leveraging our experience and expertise in manufacturing production-proven systems and our broad process know-how. With the advanced hardware and software features on the Cluster H ™, we are certain that it will contribute to the success in manufacturing of electronic devices for our valued customers. As a pioneer in thin film technology, Samco looks forward to continuing to provide cutting-edge solutions to the industry

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including high-frequency filters, SiC/GaN power devices, GaAs VCSELs, micro-OLED/LED, CMOS image sensors, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samco.co.jp/en/

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

ESPOO, Finland, 18th of January 2022 – Picosun takes part as an industrial partner in QuTI, a recently launched extensive research project aiming to develop new components, manufacturing and testing solutions that are needed in quantum technology. Quantum technology has gained interest in a vast array of industries on a large scale. The remarkable performance improvements it offers enable for example powerful computing and benefits in communications, healthcare, sensors, imaging and measurement applications.

The QuTI project is coordinated by VTT Technical Research Centre of Finland, and it has a total budget of around 10 million euros. Other industrial partners of the consortium include Bluefors, Afore, IQM, Rockley Photonics, CSC, Quantastica, Saab and Vexlum. The research partners are VTT, Aalto University and the University of Tampere.

“Quantum technology is a multidisciplinary and rapidly advancing field. The QuTI consortium provides an ideal starting point for strengthening the international competitiveness of Finnish technology and industry in this fast-growing field,” says QuTI project’s coordinator, Research Professor Mika Prunnila from VTT.

“Quantum technology has already taken the step from research laboratories to commercial applications. We look forward in supporting this development trend even further and being part of creating a globally competitive industrial ecosystem in Finland around this technology,” says Dr. Jani Kivioja, CTO of Picosun Group.

“Atomic Layer Deposition, or ALD, is the advanced thin film coating method for ultra-thin, highly uniform and conformal material layers that enables the digital solutions of today. It will also play a crucial role in future innovations and in the quantum computing, communication and sensing devices that will be developed in the QuTI project”, continues Jussi Rautee, CEO of Picosun Group.

More information:
Jani Kivioja
CTO, Picosun Group
Tel: +358 46 922 8804
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Victor Huang has joined the company as its first Vice President of Legal Affairs.

Mr. Huang has served as both General Counsel for startups and Intellectual Property Counsel for some of the world’s leading technology firms, including eBay and Illumina, and has built and strategically managed patent portfolios in a variety of markets. While working to safeguard and expand YES’s intellectual property assets, he will also build the legal function and advise the company on licensing and joint development agreements, M&A activity, and a diverse range of corporate legal tasks and concerns including employment and compliance.

“Victor’s extensive experience in the strategic management of worldwide IP portfolios will be a great resource for YES as we continue our international expansion. We feel that his engineering background, coupled with his history of building scalable processes for business and legal operations in a fast-growing environment, make him an especially good fit for our team,” said Rezwan Lateef, President of YES.

Mr. Huang holds a bachelor’s degree in Electrical Engineering from the University of California at Davis, and received his JD from the University of San Francisco School of Law. He has a particular interest in issues relating to open source programs, including compliance, product security, and community relations.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, plasma etching tools, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

Wooptix SL, a Spanish company dedicated to developing advanced imaging solutions for the semiconductor industry, will be presenting a new technique for Patterned Wafer Geometry at the upcoming SPIE Advanced Lithography conference on February 28th, 2022, in a paper published together with Applied Materials. The flatness of the silicon wafer used to manufacture integrated circuits is controlled to tight tolerances to ensure the full wafer is sufficiently flat for lithographic processing. In recent years, a metrology tool based on double Fizeau interferometry has been used to generate wafer geometry maps to correct for process induced focus issues and overlay problems. In the upcoming paper, WFPI is used successfully on patterned silicon wafers to acquire 7.65 million data points in 5 seconds on the full 300mm patterned wafer with a lateral resolution of 96µm to generate the wafer shape.

About Wooptix
Based in La Laguna Tenerife, Canary Islands, Wooptix is founded on decades of optical research done at the astrophysics department at La Laguna University in conjunction with Teide Observatory in Tenerife, one of the world’s most important astronomy research centers. Wooptix, being a venture funded company and an Intel Capital portfolio company, has used the venture funds to develop Phemet and bring it to commercialization for semiconductor the lab market and is currently in the early stages of bringing the technique in to a fully automated fab tool.