Breker Verification Systems today announced Nuclei System Technology deployed its System Coherency Synthesis TrekApp to ensure coherency of its configurable low-power and high-performance 32- and 64-bit RISC-V processor intellectual property (IP) designs.

“After an extensive evaluation, we choose Breker’s System Coherency TrekApp to help to ensure our design’s coherency,” remarks JianYing Peng, CEO of Nuclei System Technology. “TrekApp offers ease to use and extremely fast setup and covers broad aspect of verification from simple workload to complex scenarios that includes Dekker and Atomics tests.”

“Its flexible scaling will scale with us as we go from verifying the coherency of a few CPUs to hundreds of CPUs, matching our needs now and for our future RISC-V solution offerings.”

The System Coherency Synthesis TrekApp can generate thousands of high-coverage tests to stress cross-system coherency for a broad range of SoC platforms and processors. It is based on Breker’s Cache Coherency TrekApp and uses abstract models of common and novel algorithms to automatically generate coherency test content for complex, multi-agent system platforms based on coverage directives. The TrekApp can be configured for Arm, RISC-V and other processor configurations and broad range of storage and I/O architectures.

About Nuclei System Technology
Nuclei System Technology is a leading RISC-V processor IP vendor based in multiple locations across China. It produces a range of configurable low-power and high-performance 32/64-bit RISC-V processors and related solutions for artificial intelligence of things (AIoT) applications, an emerging technology that combines IoT and AI technologies to enable decision making and analytics. For more information, visit the Nuclei System Technology website nucleisys.com or send email to [email protected].

About Breker Verification Systems
Breker Verification Systems is a leading provider of Portable Stimulus solutions, a standard means to specify verification intent and behaviors reusable across target platforms. It is the first company to introduce graph-based verification and the synthesis of powerful test sets from intent-based, abstract scenario models based on AI planning algorithms. Breker’s Test Suite Synthesis and TrekApp library allows the automated generation of high-coverage, powerful test cases for deployment into a variety of UVM, SoC and Post-Silicon verification environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM, Huawei and other companies leveraging Breker’s solutions are available on the Breker website. Breker is privately held and works with leading semiconductor companies worldwide.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

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Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, is proud to introduce the new plasma etching cluster tool “Cluster H ™”.

“With our cutting-edge plasma etching technology, Cluster H™ provides the full-scale production capabilities for compound semiconductor devices such as high-frequency filters, SiC/GaN power devices, GaAs VCSELs, micro-OLED/LED, CMOS image sensors, and advanced packaging,” explains Tsukasa Kawabe, President and COO of Samco.

“We created Cluster H ™ to meet the strong demand from our valued customers for high throughput equipment. Cluster H™ with etching processes available only at Samco enables the combination of optimal materials and process technologies in advanced electronic device fabrication.” Continues Tsukasa.

■Features
Cluster H ™ is a cluster tool for etching and ashing that supports direct transfer of ø6” and ø8” diameter wafers. Centered on a hexagonal vacuum transfer platform, it is equipped with two vacuum cassette chambers and one vacuum aligner as part of the standard equipment configuration, and up to three process modules that can be attached. The ICP etching process module uses the reaction chamber of the high-end ICP etching model RIE-800iP and is backed by our extensive process library and best-known methods. In addition, the frog-leg dual-blade robot enables high wafer throughput, compact transfer chamber, and system footprint.
In addition, the revamped software incorporates useful functions with improved reliability. The standard system is equipped with a user-friendly GUI and equipment management functions such as equipment performance tracking, wafer transfer history for each module and packages, and simulation functions for higher-level communication, and supports the manufacturing execution system (MES) used at customers’ factories.

Samco announces the release of the production-worthy cluster tool, Cluster H ™. The system is ideally suited for high volume manufacturing leveraging our experience and expertise in manufacturing production-proven systems and our broad process know-how. With the advanced hardware and software features on the Cluster H ™, we are certain that it will contribute to the success in manufacturing of electronic devices for our valued customers. As a pioneer in thin film technology, Samco looks forward to continuing to provide cutting-edge solutions to the industry

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including high-frequency filters, SiC/GaN power devices, GaAs VCSELs, micro-OLED/LED, CMOS image sensors, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samco.co.jp/en/

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

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ESPOO, Finland, 18th of January 2022 – Picosun takes part as an industrial partner in QuTI, a recently launched extensive research project aiming to develop new components, manufacturing and testing solutions that are needed in quantum technology. Quantum technology has gained interest in a vast array of industries on a large scale. The remarkable performance improvements it offers enable for example powerful computing and benefits in communications, healthcare, sensors, imaging and measurement applications.

The QuTI project is coordinated by VTT Technical Research Centre of Finland, and it has a total budget of around 10 million euros. Other industrial partners of the consortium include Bluefors, Afore, IQM, Rockley Photonics, CSC, Quantastica, Saab and Vexlum. The research partners are VTT, Aalto University and the University of Tampere.

“Quantum technology is a multidisciplinary and rapidly advancing field. The QuTI consortium provides an ideal starting point for strengthening the international competitiveness of Finnish technology and industry in this fast-growing field,” says QuTI project’s coordinator, Research Professor Mika Prunnila from VTT.

“Quantum technology has already taken the step from research laboratories to commercial applications. We look forward in supporting this development trend even further and being part of creating a globally competitive industrial ecosystem in Finland around this technology,” says Dr. Jani Kivioja, CTO of Picosun Group.

“Atomic Layer Deposition, or ALD, is the advanced thin film coating method for ultra-thin, highly uniform and conformal material layers that enables the digital solutions of today. It will also play a crucial role in future innovations and in the quantum computing, communication and sensing devices that will be developed in the QuTI project”, continues Jussi Rautee, CEO of Picosun Group.

More information:
Jani Kivioja
CTO, Picosun Group
Tel: +358 46 922 8804
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

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YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that Victor Huang has joined the company as its first Vice President of Legal Affairs.

Mr. Huang has served as both General Counsel for startups and Intellectual Property Counsel for some of the world’s leading technology firms, including eBay and Illumina, and has built and strategically managed patent portfolios in a variety of markets. While working to safeguard and expand YES’s intellectual property assets, he will also build the legal function and advise the company on licensing and joint development agreements, M&A activity, and a diverse range of corporate legal tasks and concerns including employment and compliance.

“Victor’s extensive experience in the strategic management of worldwide IP portfolios will be a great resource for YES as we continue our international expansion. We feel that his engineering background, coupled with his history of building scalable processes for business and legal operations in a fast-growing environment, make him an especially good fit for our team,” said Rezwan Lateef, President of YES.

Mr. Huang holds a bachelor’s degree in Electrical Engineering from the University of California at Davis, and received his JD from the University of San Francisco School of Law. He has a particular interest in issues relating to open source programs, including compliance, product security, and community relations.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, plasma etching tools, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

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Wooptix SL, a Spanish company dedicated to developing advanced imaging solutions for the semiconductor industry, will be presenting a new technique for Patterned Wafer Geometry at the upcoming SPIE Advanced Lithography conference on February 28th, 2022, in a paper published together with Applied Materials. The flatness of the silicon wafer used to manufacture integrated circuits is controlled to tight tolerances to ensure the full wafer is sufficiently flat for lithographic processing. In recent years, a metrology tool based on double Fizeau interferometry has been used to generate wafer geometry maps to correct for process induced focus issues and overlay problems. In the upcoming paper, WFPI is used successfully on patterned silicon wafers to acquire 7.65 million data points in 5 seconds on the full 300mm patterned wafer with a lateral resolution of 96µm to generate the wafer shape.

About Wooptix
Based in La Laguna Tenerife, Canary Islands, Wooptix is founded on decades of optical research done at the astrophysics department at La Laguna University in conjunction with Teide Observatory in Tenerife, one of the world’s most important astronomy research centers. Wooptix, being a venture funded company and an Intel Capital portfolio company, has used the venture funds to develop Phemet and bring it to commercialization for semiconductor the lab market and is currently in the early stages of bringing the technique in to a fully automated fab tool.

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YES (Yield Engineering Systems, Inc. ), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has acquired SPEC (Semiconductor Process Equipment Corporation) of Valencia, California for an undisclosed amount. The companies had announced a strategic partnership agreement in June.

The purchase brings together two longtime, trusted semiconductor equipment suppliers with more than 70 years of industry experience between them. “YES and SPEC have many characteristics in common,” said Rama Alapati, CEO of YES. “Both of us have accumulated decades of technological expertise and have installed hundreds of systems in dozens of countries. We both take pride in our many repeat customers, and our excellent industry reputations. In acquiring SPEC, we feel YES is now better-positioned to meet the growing demands of current and future customers in emerging markets such as HPC, AI/ML, 5G, autonomous driving, augmented reality, and other computationally intensive applications.”

“The SPEC product line, which includes cleaning, etching, stripping and plating equipment, complements our portfolio well, and will allow YES to extend our offerings into the wet processing market,” added Rezwan Lateef, President of YES. “We welcome SPEC’s employees to the YES team, and we look forward to developing a variety of new products together to address and anticipate customer needs.”

“SPEC is very pleased to join forces with YES. With global demand for semiconductors increasing dramatically, this merger could not have come at a better time for both companies. We are excited to help YES open new markets and opportunities for our proven wet-process technologies going forward,” said Kevin McGillivray, co-founder of SPEC.

In addition to augmenting its personnel resources with the SPEC staff, YES will gain more than 40,000 square feet of manufacturing, assembly, and cleanroom space in Valencia, as well as SPEC’s regional offices around the world.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit http://www.yieldengineering.com.

About SPEC
SPEC (Semiconductor Process Equipment Corporation) is a highly experienced supplier of surface conditioning wet process equipment. Since 1986, SPEC has designed and manufactured wafer-level and device-level wet process equipment for acid and solvent surface modification (cleaning, etching, stripping), electroplating, and electroless (chemical) plating for all industries requiring a high level of process cleanliness. SPEC’s products are used for polysilicon chip, chunk, and ingot cleaning; crucible cleaning, cavity cleaning for particle accelerators, chemical mixing and delivery, hard drive component cleaning, and quartzware cleaning. SPEC systems are engineered to match the unique requirements of the end user. For more information, please visit http://www.team-spec.com.

• Read more about YES (Yield Engineering Systems, Inc.) Acquires SPEC (Semiconductor Process Equipment Corp.)

ESPOO, Finland, 14th of December 2021 - There has been a need for enhanced coating methods in organic electronic manufacturing as foldable phones and other future product iterations need materials that are lighter, more reliable and enable folding and stretching of a device. Thus, the use of thin film encapsulation solutions has become more common in organic electronic manufacturing.

Atomic layer deposition (ALD) has already proven to be the coating solution of choice for a wide range of applications in the semiconductor industry. Inorganic films, which are the standard output of an ALD process, are however susceptible to crack or develop defects under severe mechanical stress. This issue is magnified when depositing on large surface areas often required in flexible organic electronics manufacturing. Picosun’s novel approach to address these issues, for which patent rights are pending, includes nanolamination of dense inorganic layers deposited with ALD to maintain excellent barrier performance‚ with organic or hybrid molecular layer deposition (MLD) layers to offer enhanced flexibility and de-emphasize the defects which may appear when films are stressed.

Picosun research on an industrially viable ALD/MLD process was demonstrated on wafers and polymer substrates over 200 mm in diameter with a deposition temperature of 90 °C using Picosun ALD tools. The results showed great thickness uniformity and higher throughput compared to pure ALD film deposition. The MLD film proved to be stable in ambient environment and the complementary strengths of ALD and MLD hindered H2O permeation through the film stack, which enables flexibility in moisture barrier design.

“We are excited to bring these insights to the market as there has been little information available from stable and industrially viable MLD processes in full wafer scale. Besides organic electronics, we see immense potential with the ALD/MLD films in the manufacturing of LEDs, MEMS and medical packaging”, states Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

Watch the Picosun webinar to learn more about the topic and Picosun results:
https://info.picosun.com/webinars/ald-mld-nanolaminate-films

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

• Read more about Picosun to introduce novel coating solution for organic electronics