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[April 10, 2023 – Taipei, Taiwan] Test Research, Inc. (TRI) has unveiled its latest innovation in Conformal Coating Inspection, the TR7700 SIII Ultra CI. Equipped with advanced optical design, specialized multi-phase lighting, and intelligent inspection algorithms, this cutting-edge AOI can detect coating issues with unprecedented accuracy, measure coating thickness, and inspect dispensed flux and glue.

The TR7700 SIII Ultra CI AOI can precisely measure coating thickness from critical areas on the PCB, detecting unwanted coating spills near PCB connectors, sensitive components, and designated mounting holes. The CI software can identify common coating issues, including cracks, bubbles/voids, insufficient/excess coating, and loss of adhesion, with innovative algorithms calculating the maximum/minimum coating coverage length and measuring coating length, splash, or insufficient coating. The coating thickness measurement range is from 35 μm to 750 μm.

The Smart CI AOI allows for the creation of coating maps from CAD data for rapid deployment. The smart programming also extends to learning and tuning the coating programming for an accurate inspection.

Upgrade your conformal coating inspection with TRI's latest technology. For more information about the TR7700 SIII Ultra CI, please visit the link below, https://www.tri.com.tw/en/product/product_detail-60-2-1689-1.html.

TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0, can help manufacturers realize their production line's full potential. These systems are designed to interoperate with other manufacturing equipment, minimize downtime, optimize production quality, and reduce operator workload.

About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Optical Inspection to Board Testing, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] call +886-2-2832 8918.

Taiwan Taiwan_cyber event_20230505
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新竹經濟部專業人員研究中心 Room514
East District, Hsinchu City
Taiwan

9:30 am - 10:00 am

報到交流

10:00 am - 10:10 am
Dr. Scott Yu
Dr. Scott Yu

致歡迎詞

Dr. 游志源
副處長,台灣積體電路製造股份有限公司
主席,SEMI I&C 國際資通訊標準台灣區委員會

10:10 am - 10:20 am
MR. JLPeng
Mr. JL Peng

SEMI E187資安標準與智慧製造發展(暫訂)

Mr. 彭金郎
SEMI Standards Fab & Equipment Information Security Task Force
技術經理,力晶積成電子製造股份有限公司

10:20 am - 10:45 am
Jeklly Chen_ASE
Mr. Jekyll Chen

TBD

Mr. 陳裕忠
處長, 日月光集團 l 高雄廠資訊技術處

10:45 am - 11:15 am
BV_SZ LIN
Mr. S.Z. Lin

如何應用國際標準加速全球佈局(暫訂)

Mr. 林上智
首席資安專家 / Bureau Veritas  新事業發展處 | 資訊安全部

11:15 am - 11:30 am

交流茶會

11:25 am - 12:00 pm
All Attendees

議題研討與經驗交流會議

-研討議題將於報名成功通知內提供
-此次研討簡報將不對外提供

12:00 pm

賦歸

*主辦單位保有隨時修改及終止本活動之權利
*本次活動中午備有便餐

Standards

隨著物聯網、AI技術,帶動製慧製造的浪潮,讓工廠遠端、連網需求不對斷提升,除了政府、金融業成為攻擊目標,對像也開始轉向製造業,面對變化多端的資安威脅,半導體供應鍊該如何利用資安標準制定資訊安全的防護策略,以降低資安風險,透過標準交流研討,提昇資安防禦能力與產業韌性

會議資訊: 

  • 日期: 2023年5月5日(五)
  • 時間: 10:00-12:00 (9:40-10:00 報到)
  • 地點: 新竹經濟部專業人員研究中心 514教室
  • 使用語言: 中文
  • 活動對像: 半導體設備、半導體製造相關產業

報名請洽:

報名連結點選

報名截止日期,額滿為止。

 

指導單位:

IDB LOGO

 

主辦單位:

SEMILOGO                 MIRDC logo

 

贊助單位:

BVLOGO

 

備註:

1.因為現場座位有限,歡迎盡早報名

2.請填妥此份報名表單,待主辦單位審核後通知,以確認報名成功

 

活動聯絡窗口:

SEMI Taiwan

Ada Tai l [email protected]

10:00 am - 12:00 pm Off Add to Calendar 2023-05-05 10:00:00 2023-05-05 12:00:00 SEMI Standards 半導體設備資安研討會議 隨著物聯網、AI技術,帶動製慧製造的浪潮,讓工廠遠端、連網需求不對斷提升,除了政府、金融業成為攻擊目標,對像也開始轉向製造業,面對變化多端的資安威脅,半導體供應鍊該如何利用資安標準制定資訊安全的防護策略,以降低資安風險,透過標準交流研討,提昇資安防禦能力與產業韌性。 會議資訊:  日期: 2023年5月5日(五) 時間: 10:00-12:00 (9:40-10:00 報到) 地點: 新竹經濟部專業人員研究中心 514教室 使用語言: 中文 活動對像: 半導體設備、半導體製造相關產業 報名請洽: 報名連結點選 報名截止日期,額滿為止。   指導單位:   主辦單位:                     贊助單位:   備註: 1.因為現場座位有限,歡迎盡早報名 2.請填妥此份報名表單,待主辦單位審核後通知,以確認報名成功   活動聯絡窗口: SEMI Taiwan Ada Tai l [email protected] 新竹經濟部專業人員研究中心 Room514 East District, Hsinchu City Taiwan SEMI.org [email protected] Asia/Taipei public Asia/Taipei
Taiwan standards
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NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

No. 3, Section 2, Guangfu Road, East District, Hsinchu City
Professional Training Center Minsitry of Economic Affairs, R.O.C
East District, Hsinchu City 300
Taiwan

Standards

Date: Friday, May 5, 2023 

Time: 8:30am - 10:00am [Taiwan Time]

via OVTCCM and Professional Training Center Minsitry of Economic Affairs, R.O.C., No. 3, Section 2, Guangfu Road, East District, Hsinchu City[Hybrid]


Agenda: 

 

Standards Contact Information:

Cher Wu

SEMI Taiwan

Email: [email protected]

Phone: +886.933.976.766

8:30 am - 10:00 am Off Add to Calendar 2023-05-05 08:30:00 2023-05-05 10:00:00 Information & Control Taiwan TC Chapter Meeting Date: Friday, May 5, 2023  Time: 8:30am - 10:00am [Taiwan Time] via OVTCCM and Professional Training Center Minsitry of Economic Affairs, R.O.C., No. 3, Section 2, Guangfu Road, East District, Hsinchu City[Hybrid] Agenda:  I&C TC Meeting Agenda_20230505.pdf   Standards Contact Information: Cher Wu SEMI Taiwan Email: [email protected] Phone: +886.933.976.766 No. 3, Section 2, Guangfu Road, East District, Hsinchu City Professional Training Center Minsitry of Economic Affairs, R.O.C East District, Hsinchu City 300 Taiwan SEMI.org [email protected] Asia/Taipei public Asia/Taipei

PENANG, MALAYSIA - MARCH 2023 ViTrox, which aims to be the world’s most trusted technology company, is excited to announce the launch of the enhanced Tray-based Vision Handler, TR1000S⁺i!

The semiconductor business is continually changing and has grown significantly in recent decades. Some industry developments worth noticing in recent years, particularly for Integrated Circuit (IC) packages, have emerged. These trends include miniaturisation and the increased demand for IC packages due to the growth of the consumer electronics market, the automotive industry, and the medical industry.

Additionally, manufacturers are actively looking for cost-effective and well-performing equipment to secure product quality, which also includes automating inspections. Hence, we are bringing you our enhanced Tray-based Vision Handler, TR1000S⁺i! This solution is designed to cater for 360° inspection of BGA, QFP, QFN, CSP, TSSOP, MSOP, and SOP packages handled in tray-to-tape inspections.

Our TR1000S⁺i is now enhanced with an improved PP3 design with an added nozzle. The users can experience faster unit pick-and-place with three nozzles and the inspection speed is greatly improved. This translates to an average UPH increase of 24%!

The TR1000S⁺i also houses the following features:
1) Built-in de-taping module: reduces conversion time with a movable linear guide with a built-in jig.
2) Fetcher module: shortens translation time and unit pick-up time to higher throughput.
3) Auto pitching mechanism: expedites nozzle pitch conversion.
4) Easy 3D calibrations: simplifies calibration process (place and slot, no adjustments needed)‏, fast (only 5 minutes) and auto-illuminated.

In general, TR1000S⁺i is the enhanced version of the previous TR1000Si system. With the enhancement of the Tape & Reel as well as the additional nozzle piece, it will greatly reduce the Pick & Place bottleneck and generate higher throughput which compliments the high-speed vision inspection time. Thus, our TR1000S⁺i will guarantee you both quality assurance and productivity which is worth the low cost of investments. To ensure that they have a smooth automation journey with ViTrox, we have a team of technical support experts that are ready to provide top-notch services to you.

Ready to kickstart your automation journey? Reach out to us at [email protected] to learn more about how you can automate your IC package inspection effectively!

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company and the leading solutions provider through the most innovative, advanced, and cost-effective machine vision solution of excellent quality to its customers by integrating its technologies, people, and strategic alliances.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Electronics Communication Systems, and Industry 4.0 Manufacturing Intelligence Solutions. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States and sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.

Rochester, N.Y. – Linton Crystal Technologies announces Edward Przybycien has joined the company as principal engineer. His responsibilities will include overseeing the research, development, design and optimization of Linton’s crystal growing machines, supporting processing equipment and accessories. As such, Przybycien will serve as design lead throughout the product realization process. Located in Henrietta, New York, Linton is the world leader in the design, development and manufacture of Czochralski (CZ) silicon furnaces for production of monocrystalline silicon ingots for the semiconductor and solar industries.

“We are thrilled to have Ed join our team,” says Scott Blazey, director of operations. “With more than 25 years of mechanical design and cost reduction experience specific to crystal growing furnace and hot zone design, Ed will be an integral part of our continued growth at Linton Crystal Technologies.”

Przybycien is a technical professional with a wide range of mechanical design and engineering management experience. This is complemented by business experience as the principal of Przybycien Consulting LLC, through which he provided technical trade compliance services for more than a decade prior to joining LCT.

His engineering experience includes several years as a professional engineering consultant providing specialized design expertise for hot zone development, vacuum chamber design, and development of retrofit devices for semiconductor processing equipment, as well as 13 years with Kayex, Linton’s predecessor. With Kayex, he began as a mechanical project engineer developing custom assemblies, was the project manager for the 300mm grower and then served as engineering manager. In this last role, he directed the activities of 12 mechanical, electrical, and software engineering personnel and managed order engineering, R&D and product maintenance worldwide.

Przybycien earned his B.S. in Mechanical Engineering magna cum laude from State University of New York at Buffalo. Additionally, he completed training in Complying in U.S. Export Controls and Encryption and Technical Data Controls from the U.S. Bureau of Industry and Security, as well as several trainings regarding U.S. export transactions and controls from the Export Compliance Training Institute.

About Linton
Linton specializes in silicon and produces equipment for materials such as germanium and gallium arsenide. They also provide technical support, process engineering support and replacement parts to help clients get businesses off the ground, improve productivity and continue to innovate. Linton has been the exclusive owner of Kayex technology since 2013.
For more information, visit www.lintoncrystal.com.

SLiM 100 delivers real-time detection and quantification of VOCs to the 1 ppb level

Santa Clara, CA — March 14, 2023 — Picarro Inc., a leading provider of chemical metrology systems for advanced semiconductor fabs, today announced the SLiM 100 Lithography Process Tool Monitoring System. The new 1-ppb class chemical metrology solution detects volatile organic compounds (VOCs) in the lithography process in real time, enabling semiconductor manufacturers to quickly take steps to prevent excursions and detect non-visual defects, thereby improving yield.

As design features shrink, small amounts of airborne molecular contamination (AMC) from VOCs are resulting in significant increases in non-visual defects on reticles and wafers. Crystal growth defects on reticles, hazing of scanner optics, and t-topping of photoresists are some of the serious problems that are caused by the presence of undesired VOCs. Ultimately, these contaminants not only damage expensive lithography tools; they result in yield loss on the wafer.

To mitigate the negative effects of VOCs in the lithography process, fab operators need real-time measurements of VOCs at very low concentration levels. This is very difficult to do in the fab environment with traditional technologies because they are slow and difficult to use.

The SLiM 100 system is a real-time measurement system that is designed to run 24/7 in the fab environment. It is a fully integrated chemical metrology system that is robust, easy to operate, and is ideal for use as a high-volume process monitoring and control system. It measures and monitors 10 organic compounds that negatively affect the lithography process with concentration sensitivity down to 1 part per billion. The system can also accommodate analyzers that measure inorganic molecules at parts-per-trillion concentration levels.

“The Picarro SLiM 100 enables fab operators to detect and resolve semiconductor manufacturing issues much faster than other solutions,” said Dr. Sanjay Yedur, Director of Product Management at Picarro. “This robust system will allow them to reduce costs by halting production of defective wafers sooner and minimize downtime of lithography tools for maintenance and repair."

About Picarro Semiconductor Solutions
Picarro’s Semiconductor business offers industry leading solutions for airborne molecular contamination (AMC) and chemical contaminant monitoring within fabs and process tools. Picarro’s Semiconductor solutions respond to contaminants in seconds, not hours, enabling semiconductor manufacturers to quickly mitigate contamination events in cleanrooms, FOUP, and lithography process equipment – improving production yield. For more information, visit semi.picarro.com.

Deventer, March 8, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today announces that its wholly owned subsidiary RoodMicrotec GmbH has entered into an agreement for a full and final settlement with Prime Capital Debt SCS, SICAV-FIS – Robus Recovery Sub-Fund ("Robus") regarding the perpetual bond that RoodMicrotec GmbH issued in 2010 and which is held by Robus.

As announced on 21 February 2022, Robus had initiated legal proceedings against RoodMicrotec GmbH before the Regional Court of Frankfurt am Main. Robus claimed being entitled to an 11.7% compensation payment in relation to 2017, 2018 and H1-2021. In addition, alleging non-compliance by RoodMicrotec GmbH of the terms and conditions of the 2010 perpetual bond, Robus claimed the immediate and full repayment of the nominal amount of the perpetual bond asserting grounds for the extraordinary termination of the perpetual bond. The total amount claimed by Robus in the proceedings amounted to EUR 2,568k to be increased with 11.7% interest for the applicable period.

Following an oral hearing held on 7 March 2023, the parties have reached agreement on a full and final settlement that was reached before and confirmed by the Regional Court of Frankfurt am Main. Pursuant to the settlement, RoodMicrotec GmbH shall pay a total amount of EUR 2,194k, in four equal instalments of EUR 548k each, by 31 March, 30 June, 30 September and 31 December 2023. RoodMicrotec will be able to pay the installments from free available cash.

RoodMicrotec is pleased that the ongoing litigation procedure is now settled and the dispute is closed.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors.
RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

Brewer Science’s new silicon-rich gapfill material enables a robust process necessary for advanced-node patterning
Advanced and legacy processes are improved by this next-generation material having superior gapfilling and planarizing capabilities and simplified, defect-free, and extremely clean removal.

Rolla, MO – February 8, 2023 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials for the microelectronics and optoelectronics industries, announces the launch of OptiStack® PL200 series material, a silicon-rich high-aspect ratio gapfill material designed to provide superior planarization, solving problems faced in sacrificial gapfill applications. This material series also facilitates next-generation advanced-node patterning by providing a protective, easily strippable, gapfill material that overcomes challenges with nanosheet architectures.
Gapfill for About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

PENANG, MALAYSIA - FEBRUARY 2023 Wafer inspection is always a critical stage for quality assurance for wafer foundry, integrated device manufacturing (IDM), fabless, and outsourced semiconductor assembly & test (OSAT). Since semiconductor devices are continuously getting smaller and more complex, the requirement for wafer inspection has become more stringent to accommodate these changes. However, defects on the wafer may be overlooked and may pass through the final stages of fabrication and assembly if they are not eliminated or filtered out, which could be a costly mistake for the manufacturers. Consequently, this will lead to increasing demand for quality wafer production.

At ViTrox, we aim to be the World’s Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions. Therefore, we would like to introduce our all-new Wi8i G2 PRO Wafer Vision Inspection Handler, which is designed to offer high flexibility in wafer handling, cover different semiconductor processes and high-accuracy inspection results to the users of the semiconductor market, and is also an expansion to the inspection capabilities of our existing Wafer Vision Inspection Hander - Wi8i G2.

One Solution For Two Semiconductor Processes
The all-new Wi8i G2 PRO solution is enhanced with hardware and programming features to accommodate both bare wafers (pre-dicing process) and mounted wafers (post-dicing process) inspection requirements. This innovative configuration eliminates the need for hardware conversion on the wafer robot arm when inspecting these two wafer types of the same size, which is suitable for production involving both pre-and-post-dicing processes and/or having a high-mix-low-volume of bare and mounted wafers. Hence, our Wi8i G2 PRO is the ideal solution to deliver high overall equipment effectiveness (OEE) which guarantees excellent wafer quality without any machine stop time.

Ability To Handle Up To 12” Wafers & FOUP
Based on the current market trend, there is a demand for wafer inspection equipment to cater to larger wafers due to the increasing number of chip-related productions. To address this, our Wi8i G2 PRO offers a significant enhancement in catering to a new type of wafer carrier box, Front Opening Unified Pod (FOUP) which is particularly important to users with such production practice to accommodate 12 inches of bare wafer transferring. Nowadays, FOUPs are the preferred carrier boxes to handle raw water because FOUPs offer a sealed wafer environment that provides static protection, white-light shielding, and control of moisture and oxygen. Today’s FOUPs not only address particles, but also minimize and control volatile organic compounds (VOCs), oxygen, and relative humidity. Any of these potential contamination sources can negatively impact device yield. Alternatively, should the user need to handle framed wafers, they can opt for a metal cassette instead.

Users are also able to configure their load ports based on their production needs, which can be either:
FOUP + Metal cassette
FOUP + FOUP
Metal cassette + Metal cassette

This load port design accommodates both 8 inches and 12 inches of metal cassettes on the load ports, which translates to cost-effectiveness on different-sized wafer inspections!

Robust Wafer Inspection With Our Advanced Vision Optics
Wi8i G2 PRO is not only equipped with robust vision optics that provides high-quality image under different magnification lenses but also integrates an advanced deep-learning algorithm in defect detection and determining the defect types. When a user’s wafer has a complex circuit design and/or is required to inspect different defect types at different regions, this algorithm is the perfect solution for enhancing the accuracy of defect detection.

With the combination of cutting-edge wafer handling mechanisms and robust wafer vision inspection, our latest Wafer Inspection Solution is guaranteed to solve your production pain points! Additionally, we also seek to better understand our customers’ needs in their production line and boost their production yield and also significantly reduce their long-term costs.

Interested to know more about our Wi8i G2 PRO? Do get in touch with our Sales Expert Ms Kong Poh Mei ([email protected]). To top it off, we also invite you to visit us here at ViTrox Campus 2.0 in Penang, Malaysia for a demonstration of the solution. We look forward to serving you!

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company to provide the most innovative, advanced, and cost-effective machine vision solutions of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Electronics Communication Systems, and Industry 4.0 Manufacturing Intelligence Solutions. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States, as well as sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.

CUPERTINO, Calif., Feb. 01, 2023 (GLOBE NEWSWIRE) -- Xpeedic today released Notus, an electronic design automation (EDA) platform for package/board SI/PI/thermal analysis, at DesignCon 2023 at the Santa Clara Convention Center in Santa Clara, Calif.

Notus, powered by Xpeedic’s electromagnetic and multiphysics solver engine, helps designers to meet the SI, PI, and thermal requirements in an efficient and automated way. It provides a comprehensive simulation flow, including DC IR-drop and AC impedance analysis, decoupling capacitor optimization, signal topology extraction, signal interconnect modeling, and thermal analysis.

In addition to Notus, Xpeedic also announced today upgrades to its Advanced Packaging and High-Speed Digital Solutions.

Metis, the EM simulation tool for 2.5D/3DIC advanced packaging designs, now delivers further improvement on performance. The unique speed-balanced-accuracy multi-mode capability is enhanced to achieve optimal accuracy-speed tradeoff.

Hermes, Xpeedic’s 3D EM simulation tool, further improves its adaptive mesh technology to achieve desired accuracy with faster convergence. It enhances the editing function associated with via, trace, and shape operation for package and PCB. It supports board-level antenna analysis and near-field and far-field view with integrated powerful data post-processing capability.

ChannelExpert, the diagram GUI-based circuit simulation platform, provides a fast, accurate and simple approach to analyze high-speed channels. It supports IBIS/AMI simulations and integrates compliance specs for various SerDes and DDR standards. ChannelExpert provides a comprehensive analysis for high-speed channels including frequency-domain S-parameter, time-domain eye diagram, statistic eye, and channel operating margin (COM) with parameter sweep and optimization. In this release, ChannelExpert integrates Hermes and Notus EM modeling tools for EM-circuit co-simulation and supports the AMI modeling and the latest DDR5 standard.

Other tools within the Xpeedic expert suite including SnpExpert, ViaEpxert, CableExpert and TmlExpert are improved with the usability and additional built-in templates to enable easy and quick evaluations of S-parameter, via, cable, and transmission line, respectively.

Availability and Pricing
Notus and the entire Xpeedic portfolio is shipping now. Pricing is available upon request.

Visit the Xpeedic website for additional information or requests for a demonstration. Email requests should be sent to [email protected].

Xpeedic at DesignCon
Xpeedic will be in DesignCon Booth #633 today and tomorrow, February 1 and February 2, at the Santa Clara Convention Center.

About Xpeedic
Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D-IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both U.S. and China. For more information, please www.xpeedic.com.

Engage with Xpeedic
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