SANTA BARBARA, CA – September 1, 2023 – Sikama International Inc., in collaboration with AirProducts Inc.™, is proud to announce the full commercial launch of its acid-free Electron Attachment (EA) Fluxless Reflow Soldering System, a revolutionary step for the Advanced Packaging Semiconductor sector.

The innovative technology behind this system is based on the Electron Attachment (EA) principle for activating hydrogen, a method that AirProducts has been refining for the past 15 years to efficiently reduce surface oxides. The EA technology is engineered to break down H₂ molecules into hydrogen anions, which are then targeted towards the soldering surfaces to effectively clean and reduce oxides before the reflow process. Additionally, this technology operates at ambient pressure and temperatures well within the window of traditional reflow processes.

The key advantages of this technology include:
• Truly Residue-Free: Enhanced reflow quality without flux-induced solder voids and wafer contamination. No post-reflow cleaning equipment is required and significantly less oven cleaning.
• In-line Process: Easily integrated into existing manufacturing lines without batch processing. The EA process occurs immediately before the reflow process.
• Environmental Impact: The EA flux-free process is entirely residue-free and environmentally benign with no organic vapors, hazardous residues, or CO2 emission.
• Ambient Pressure and sub-reflow temperatures: No vacuum requirements and safely processes substrates.

Sikama, as the exclusive global integrator of this technology and partner with AirProducts, views the technology and equipment commercialization as “a game-changer for this industry, as the need for advanced solutions to packaging evolutions in the semiconductor industry continue to evolve”, according to Herb Weigel, President and CEO of Sikama International.

The Sikama EA1200 Solder reflow oven is certified to EN 600204-1, SEMI S2/S8/S22/S23/F47/E6, is CE certified, and is verified to be compliant with NFPA79 in installed applications. Nearly 50 Worldwide Patents have been issued on this technology. The technology is well suited to provide significant benefits to small geometries in wafer bumping, copper pillar, and flip chip applications.

Established in 1982, Sikama International, Inc. designs and produces its products in Santa Barbara, California. Their reflow system offerings provide exceptional performance, with the fluxless systems set to redefine industry standards.

Reliable. Repeatable. Responsible. Reflow.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

• Read more about Sikama International Announces Full Commercialization of Acid-Free “Electron Attachment” Fluxless Solder Reflow System

Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023
Innovative bonding materials presented at leading Asia technology conferences

Tapei, Taiwan – August 28, 2023 – Brewer Science, Inc., will present new developments in temporary and permanent bonding material technologies for advanced packaging this week at Asia’s two premier technology conferences, Advanced Packaging Summit on September 5th and SEMICON Taiwan from September 6th – 8th.

Dr. Dongshun Bai, Brewer Science's Senior Technologist & Business Development Director, spearheads a decade-spanning journey in semiconductor advancements. His expertise will be on display at the Advanced Packaging Summit, hosted by SEMI, where he will delve into his presentation titled "Novel Materials for Advanced Packaging". Dr. Bai will discuss new material improvements for advanced packaging, focusing on excellent bonding uniformity, optimizing adhesion for high-density substrates, ensuring high-temperature stability, and groundbreaking innovations in surface modification.

Brewer Science continues at SEMICON Taiwan, hosted at the TaiNEX 1&2 in Taipei from September 6th to 8th. Ms. Rama Puligadda, Chief Technical Officer at Brewer Science, takes the stage at the Heterogeneous Integration Global Summit. Scheduled for September 7th at 11:50am (Taipei Time), her presentation, "Recent Advances in Materials for Advanced Packaging", will illuminate advancements powering hybrid bonding, fan-out packaging, 3D/2.5D technology, and embedded solutions for heterogeneous semiconductor integration.

Ms. Puligadda's presentation will underscore the pivotal role of materials innovation in enabling cutting-edge packaging technologies. Addressing challenges in 3D/2.5D packaging, flexible solutions, and fan-out packaging, her insights will unveil how Brewer Science's advanced materials enable innovative packaging design, miniaturization, functionality, and cost-effectiveness.

In conjunction with the events, Brewer Science announces the launch of BrewerBOND® 703 laser release material, which reduces the risk of UV damage during laser debonding. The new material combines high UV absorption capabilities with ultra-low UV transmittance properties to provide a safeguard against UV laser energy interference on delicate device wafers. Learn more about this material by visiting Brewer Science's booth at SEMICON Taiwan or submitting an inquiry through the company's official website.

Throughout the events, Brewer Science's experts will be stationed at booth K2470 in the SEMICON Taiwan Exhibit Hall, available for engaging discussions and insightful demonstrations. Join them on:
• Wednesday, September 6: 10:00am–5:00pm
• Thursday, September 7: 10:00am–5:00pm
• Friday, September 8: 10:00am–4:00pm

For those unable to attend the conferences, Brewer Science extends an open invitation to explore their Temporary Bonding and Debonding Services and Permanent Bonding Materials webpages. You can also request datasheets or schedule expert-led consultations through the company's website.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at www.brewerscience.com.

• Read more about Brewer Science unveils innovative advanced packaging solutions at SEMICON Taiwan and Advanced Packaging Summit 2023

Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced it will be expanding its presence in Taipei with a new office located in Taipei and dedicated staff on the ground. The company will also be exhibiting at Semicon® Taiwan booth N1191 (Hall 1 – 4F).

“We are excited and humbled by our success in the world’s more important semiconductor manufacturing market, said Steven Zhou, co-founder and CEO of Moov Technologies. “We already work with over 700 companies in the region to help end users source equipment to meet their production needs and easily offload idle assets. Our expansion in the region will continue to support our end-to-end procurement and resale capabilities, including inspection, logistics, and assurance services.”

To support expansion in the region, Moov has hired 5 full-time employees in its new Taipei office, including sales manager Joe Tseng, who joins Moov from Keyence Corporation where he served as National Sales Director.

While political tides are changing when it comes to an international semiconductor supply chain, Moov’s global marketplace for buying and selling pre-owned semiconductor manufacturing equipment helps chipmakers continue to benefit from the global trade of these high value, highly sought-after assets, while staying in line with current trade regulations.

“There is immense value in enabling fabrication centers to buy and sell equipment from other fabrication centers around the world,” said Zhou. “The world’s demand for chips will continue to grow. To meet it, a secondary market for semiconductor manufacturing equipment is critical to provide manufacturers with increased flexibility to adapt to changing markets.”

Moov’s announcement comes at a time when semiconductor equipment manufacturers are also planning increased investment to support the local TSMC foundry ecosystem, according to reporting by Digitimes. According to data from SEMI, the world’s leading trade association for electronics design and manufacturing supply chain, Taiwan currently leads the world in spending on semiconductor manufacturing equipment. Easy access to equipment is critical for fabrication centers looking to expand local capacity quickly.

“One aspect we pride ourselves on at Moov is our ability to get fabrication centers the tools they need expediently and seamlessly, and to provide transparency throughout the procurement process,” said Moov’s Director of Customer Success, Raymond Mahon. “We’re able to expedite the turnaround time on obtaining a replacement tool by months. In operating costs, this could equate to hundreds of millions of dollars. In addition, Moov’s platform provides transparency in buying used equipment, where historically there has been none. Knowing exactly where and how your cargo is being transported is vital given the high-dollar value of this equipment.”

Additionally, Moov eliminates purchase risk for manufacturers sourcing used equipment with its no-questions-asked, money-back guarantee, according to SEMI, the California-based global association that represents the electronics and supply-chain design industries.

If you are a company in the region looking to buy or sell semiconductor manufacturing equipment, contact [email protected].

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov’s platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

• Read more about Moov, the Largest Global Marketplace for Semiconductor Equipment, Expands Presence in Taipei

[August 7, 2023 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 6 - 8, 2023. Visit booth #I2800 to experience the latest in Smart Factory Semiconductor Inspection.

TRI's AI-powered AOI solutions for the Semiconductor and Advanced Packaging Industry can inspect Die and Wire Bonding, wafer surface and bumps, epoxy, and foreign material detection.

For the first time, TRI will be exhibiting the Wafer Inspection Platform, TR7950Q SII, equipped with a state-of-the-art mechanical structure, an optimal 2.5 µm high resolution, with an outstanding 25MP camera. The TR7950Q SII is equipped with an innovative optical module for the inspection of highly reflective surfaces, specialized for Wafer Inspection.

TRI will showcase the latest 3D SPI with a 3.5 µm high-resolution 25MP Camera, TR7007Q SII, and the AI-powered 3D AOI, TR7700Q SII, with the improved 25MP 2.5 µm configuration. The TR7007Q SII and the TR7700Q SII represent TRI's latest inspection innovations for the Advanced Packaging and Semiconductor Industry. The lineup will also include an X-ray Inspection Demo Station and TRI's innovative AI Solutions, which include the AI Station, AI Training Tool, and the AI Verify Host.

Visit TRI's Booth No. I2800 at SEMICON Taiwan 2023 to learn more about TRI's SEMI applications and the latest innovations in Test and Inspection for the Advanced Packaging Industry.

About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

• Read more about Advanced Packaging Inspection at SEMICON Taiwan 2023

Sikama International, a trusted provider of state-of-the-art reflow systems is proud to announce their new partnership with CMT, a global leader specializing in back-end semiconductor solutions.

CMT was formed in August 2010 by Mr. CW Kwak, who has over 30 years experience in the semiconductor industry. CMT offers both material and equipment solutions in the back-end semiconductor assembly market.

CMT is a unique global marketing and sales company. CMT focuses on a micro-level marketing working directly with clients and customers through offering specific projects, right beta sites, and global project management. CMT focuses on short-term projects to deliver sales on client’s current products, then offers mid-term projects for next 2-3 years, and long-term programs 5-10 years out to deliver continuous long-term growth and sustainability.

Sikama’s new partnership with CMT will enable both companies to expand their reach to provide customers with an expansive range of solutions on a global platform.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

• Read more about Sikama International Strengthens Worldwide Distributor Network by Partnering with CMT Global to Support Korean and International Markets

Sikama’s sintering pre-dry ovens offer conductive heating in a controlled environment with adjustable O2 levels as low as 5ppm in a footprint of less than 1 square meter. With their compact design, highly efficient conductive thermal transfer to high-mass components, and the lowest carbon footprint in the industry, Sikama’s products are the perfect fit for any power electronics production line. Additionally, with only 15 minutes before reaching temperature set points, energy costs and gas requirements are kept to a minimum.

With SMEMA and SECS/GEM capability and customizable profiling, their Ultra Profile and Falcon series ovens seamlessly integrate into the automated production line. Providing accurate and consistent temperatures, controlled cooling rates, and each zone fully adjustable to within 1°C, the guesswork is removed from the pre-drying process. With multidirectional process flow using either sweeper bar or walking beam transport systems and the lowest vibration and power consumption in the industry, Sikama has a configuration for any need.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

• Read more about Sikama International Announces Product Support for Copper and Silver Sintering Applications Used in the Power Electronics and EV Markets

Wooptix SL, a company based in Tenerife, Madrid and San Francisco, has announced the signing of a 10-million-dollar Series B financing round. The round includes participation by: Bullnet Capital, CDTI (Centre for the Development of Technology and Innovation), Danobatgroup, European Innovation Council Fund (EIC), Fagor Automation, Intel Capital, Mondragón Promotion and Tel Ventures.

The company is focused on commercializing semiconductor metrology equipment incorporating wavefront phase imaging. “Phemet®, the system developed by Wooptix, measures the silicon wafer warpage, and its accuracy is a “significant advance in the industry,” affirms José Manuel Ramos, Founder and CEO of the company.

Wooptix's patented technology enables blank and patterned wafer-shape measurement in less time and with higher resolution than current systems being used in the industry. "Wooptix's wavefront sensor and its semiconductor applications are generating interest from key players in the semiconductor industry as evidenced by the Series B financing round,” explains Javier Elizalde, Co-founder and COO.

The company has been recognized as well by the EIC Accelerator Program through a 2.5M€ grant in addition to the equity investment. The grant and investment support Wooptix's product introduction and future technological innovation including the manufacture, delivery, and installation of three semiconductor metrology tools in Japan, the USA and the Netherlands this year.

"Keeping in mind that each Phemet® is only a metric ton weight, together with the sensitivity of the instrument components that enable measurements at the nanometer scale, Wooptix demonstrates a world-class engineering and operations capability,” continues Elizalde.

Next steps
Wooptix has a well defined roadmap for each product line to meet the needs of lab and fab customers. In the case of the semiconductor metrology business unit, the next step is to automate Phemet®. Enhanced automation will reduce risk of contamination of wafers under measurement and provide consistent reproducibility to the system. Due to the flexibility of Wooptix’s design, another step is to integrate Phemet® into existing semiconductor equipment platforms from tool vendors.

Phemet® and the Series B financing round demonstrate Wooptix’s growth and maturity as it begins initial tool deliveries to customers. "It is really valuable for us to transition now from an R&D company to become a product and manufacturing company. With this objective in mind, we are building the necessary infrastructure, including procedures and certifications to protocols and management teamwork, to support customers as we enter the market," explains José Manuel Ramos.

Semiconductor Equipment Industry in Numbers
According with SEMI (the global semiconductor industry association) the semiconductor equipment sales forecast for 2023 is $87 billion. "The semiconductor equipment market will see a strong rebound in 2024,” said Ajit Manocha, SEMI President and CEO. "Projections for robust long-term growth driven by high-performance computing and ubiquitous connectivity remain intact.”

As reported by SEMI, the wafer fab equipment segment is projected to account for the bulk of the recovery to $100 billion in 2024, generating $87.8 billion in sales, a 14.8% increase.

About Wooptix
Wooptix is a leader in semiconductor metrology through wavefront phase imaging, a technique derived from adaptive optics research in astronomy. With a multidisciplinary team, Wooptix aims to disrupt the semiconductor metrology industry with the highest lateral resolution and fastest measurement technique for inline fab measurements.

The company has developed Phemet®, a wafer shape lab tool for blank and patterned wafers, ahead of the upcoming fully automated fab tool, expected in 2024. Wooptix has already deployed Phemet® at several customer sites worldwide.

Wooptix is based at Tenerife, Madrid (Spain) and San Francisco (USA).

• Read more about Wooptix closes $11 million Series B financing round

PENANG, MALAYSIA - AUGUST 2023 ViTrox, which aims to be the world’s most trusted technology company, is excited to announce its first-ever participation in ELEXCON Shenzhen 2023, one of the influential trade shows in Southern China, at Hall 9, Booth #9G17 in Shenzhen Convention & Exhibition Center (SZCEC), China from 23rd to 25th August 2023.

ViTrox will be showcasing its latest Back-end Semiconductor Inspection Solutions, which are the Tray-Based Vision Handler – TR3000i and the Post Seal Vision Handler – VR20i G2 during the event.

Introducing the Tray-to-Tape & Reel Vision Inspection Handler –TR3000i, the cutting-edge solution tailored for 5G, IoT, Automotive, and Industry 4.0 industries. Its high-resolution 6-sided vision system ensures comprehensive inspections, supporting sizes from 1.8x1.8mm to 130x130mm without conversion. The TR3000i's robust handling features auto-pitching, tape width conversion, 8 active approaches for Smart Taper Precision, and up to 3x14 pick-and-place nozzles. With additional hardware configurations like the Smart Reel Changer, Auto Nozzle Changer, AUX Tray, and Extended Track, it guarantees high efficiency and high throughput. Fully automated and A.I.-powered, it optimises production yield, setting new standards for efficiency, connectivity, and precision in emerging industries.

ViTrox’s Post Seal Vision Handler – VR20i G2 is a game-changer in reel-to-reel inspection. Designed for tape widths from 8mm to 32mm, it features advanced visual inspection capabilities and automated mechanisms for track and dummy reel width adjustment, ensuring precise component handling. The system supports various package types with multiple vision inspections, enabling comprehensive and high-quality results. With dual-track to improve productivity, it enhances throughput by processing over 130K UPH for a 2mm pocket pitch and 80K UPH for a 4mm pocket pitch, while fast changeovers for different carrier tapes minimise downtime. The VR20i G2 guarantees maximum efficiency, reduces human error, and greatly reduces the return on investment (ROI) period, making it the ideal solution to automate your final gate inspection.

Start your productivity-boosting journey with ViTrox's advanced solutions! Secure an appointment to meet our technical experts and experience live product demonstrations by clicking the registration link. If you want to know more about our solutions, feel free to reach out to us at [email protected]. Get ready to take your productivity to the next level!

Registration Link: https://wj.qq.com/s2/12764140/8c87/

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company and the leading solutions provider through the most innovative, advanced, and cost-effective machine vision solution of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Electronics Communication Systems, and Industry 4.0 Manufacturing Intelligence Solutions. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States and sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.

• Read more about ViTrox to Demonstrate Next-Generation Vision Inspection Systems at ELEXCON Shenzhen 2023!