Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Yee Ching (YC) Wong has joined the company’s senior leadership team as Vice President of Business Development for the Asia Pacific region.

Mr. Wong, who is based in Singapore, assumes overall responsibility for driving product penetration and for increasing backlog and revenue in the region. He will work closely with YES’s Global Sales team to meet booking and revenue targets, expand the customer base, and address new opportunities.

Prior to joining YES, Mr. Wong spent six years as Senior Director of Product Marketing at Veeco SE Asia Pte. Ltd. In that role, he successfully managed the integration of the Ultratech and Veeco sales teams in the region and delivered exceptional results with major customers. His tenure at Ultratech began in 2004 as a Senior Sales Manager in Shanghai and rose through Sales positions of increasing responsibility in Taiwan, China, Korea, and Singapore to become Ultratech’s General Manager of Litho Sales in Asia.

“I am very pleased to welcome YC to the YES senior team,” said Alex Chow, President of YES Asia. “YC is a proven leader and brings with him an impressive track record in the semiconductor capital equipment market. We expect his market understanding, business acumen, and well-honed teambuilding skills to serve him well in driving market share growth for YES in this dynamic region and strengthening key customer relationships at the C-suite and SVP level.”

Mr. Wong holds a bachelor’s degree in Business Administration from the University of Western Sydney, Australia, and an MBA from the National University of Singapore.

About YES
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.

• Read more about YC Wong Joins YES as VP of Business Development, Asia Pacific

Heidelberg, Germany – We are happy to announce that one hundred and fifty MLA 150 Maskless Aligners have been successfully installed worldwide at our customers facilities. First launched to the market in 2015, the revolutionary maskless technology of the MLA 150 has become firmly established within the advanced microfabrication community.

The MLA 150 was the first and only tool that has become a true alternative to mask-based aligners, offering extremely high exposure speed, high frontside and backside alignment accuracies, warpage compensation, high resolution and high accuracy, and the ability to expose on any substrate size from pieces that are a few square millimeters up to full 8” wafers. Further adding to the flexibility, the non-contact exposure technique for the MLA150 in addition to the simple ease of use makes this the ideal tool in rapid prototyping environments, for low to mid-volume production, and for research and development. Common application areas include MEMS, electronics, micro-optics, micro-fluidics, sensors, and many more.

École Polytechnique Fédérale de Lausanne (EPFL) – Pioneer in maskless technology
The beta-version of the MLA 150 was installed in August 2014 at the Center of MicroNanoTechnology (CMi) of the renowned École Polytechnique Fédérale de Lausanne (EPFL) located in Switzerland, being one of Europe’s most vibrant and cosmopolitan science and technology centres. The CMi is a complex of clean rooms and processing equipment devoted to microtechnology made accessible to trained academic and industrial users. The CMi is at the same time one of the pioneers in maskless lithography.

In 2022, the CMi purchased their second MLA 150 Maskless Aligner, which was installed most recently. “The MLA 150 is today one of the most important equipment in our facility, and there are many users that daily use the machine for printing. So, we wanted to have two of them”, emphasizes Julien Dorsaz, the manager of the photolithography division of the CMi. To get insights into the work at the CMi, and to learn about the MLA 150 experience of the users, we conducted a 30-minute interview with Julien Dorsaz. Get the full interview on our YouTube channel.

Today, the MLA 150 serves as a trusted, indispensable workhorse in many multi-user facilities, microfabrication labs, and research institutes. Since its market introduction, the MLA 150 has developed into one of our most important technologies in our company’s product portfolio. Setting the bar for state-of-the-art maskless lithography, the MLA 150 promises continuous market growth in the coming years.

For further information please visit: www.heidelberg-instruments.com

• Read more about An unparalleled success story – 150th Heidelberg Instruments' MLA 150 Maskless Aligner installed

Rochester, N.Y. -- Linton Crystal Technologies (www.lintoncrystal.com) announces Scott Blazey has joined the company as Director of Operations. Located in Henrietta, New York, Linton is the world leader in the design, development and manufacture of Czochralski silicon furnaces for production of monocrystalline silicon ingots for the semiconductor and solar industries.

“Scott brings with him a wealth of experience in operations, as well as direct knowledge of our Czochralski furnaces and the silicon ingot growth process,” says Todd Barnum, president and COO of Linton Crystal Technologies. “This, combined with his track record in the areas of cost reduction, continuous improvement, quality control, and employee and business development, will help us take advantage of new opportunities in both solar and semiconductor.”

Blazey has a passion for problem-solving, quality control and employee and business development. He most recently served as senior manager of quality for Gleason Works in Rochester, New York. In this position, he focused on driving down the cost of poor quality through process development and continuous improvement. In his previous role, he managed operations and manufacturing for Gleason Works automation and CNC divisions. There, he implemented processes to reduce manufacturing variance and lead time while improving upon on-time delivery. As the operations manager, he successfully led the development, production and installation of many projects for tier one automotive manufacturers. Prior to joining Gleason, he worked for Kayex SPX. Over the course of five years there, he moved from field service engineer to field service site manager, and ultimately to project manager/process development engineer.

Linton specializes in silicon and produces equipment for materials such as germanium and gallium arsenide. They also provide technical support, process engineering support and replacement parts to help clients get businesses off the ground, improve productivity and continue to innovate. Linton has been the exclusive owner of Kayex technology since 2013.

For more information, visit www.lintoncrystal.com.

# # #

• Read more about Linton Crystal Technologies Welcomes Blazey as Director of Operations

Deventer, December 15, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and NOVELDA, the world leader in UWB (Ultra-Wideband) sensing solutions, today announce that the companies have reached agreement on the qualification, test and supply of NOVELDA’s new generation of UWB devices. The Ultra-Wideband Sensor can detect the tiniest movements, even breathing and heartbeat. This ability enables NOVELDA to offer the most reliable human presence sensor in the world. It will automatically activate a device like a laptop, an LCD screen or a ceiling lamp, when you need it, and turn the device off when you leave. This is useful in a variety of indoor applications in consumer electronics, building automation and in smart building systems. NOVELDA UWB Sensor enables new levels of user experience, increases safety, and reduces energy consumption.

The cooperation with RoodMicrotec as European partner enables NOVELDA to manage faster qualification and industrialization of new products. Effective collaboration, both on engineering and management level, and combining each partner’s expertise is allowing ‘first time right’ development of test solutions, qualification processes and rapid launch of production testing and supply. Furthermore, being a long-term partner, RoodMicrotec will support NOVELDA in continuously optimizing testing procedures to drive cost down over time.

RoodMicrotec will be partnering with NOVELDA in serving the global UWB market, which is forecasted by TSR (Techno System Research) to reach from 300 million units shipped in 2022 towards more than 1.8 billion units shipped by 2030.
“This collaboration provides us with faster time-to-market of our innovative UWB solutions, continuity of supply and constant focus on improvements both in quality and cost”, says Jan-Bjørnar Lund, NOVELDA’s CEO.
For RoodMicrotec, this partnership matches well within its portfolio of capabilities and services, as European leading test house.

Martin Sallenhag, CEO of RoodMicrotec, says: “This partnership is right within the sweet spot of our business proposition; combining our expertise with our customers' interests. We support our customers with state-of-the art RF test development and equipment in 24/7 highly flexible production test environment, complying with world class quality standards.”
 
About NOVELDA
NOVELDA, the world leader in UWB sensing solutions, provides the world’s most accurate, intelligent and reliable sensor solution for human presence detection. NOVELDA Ultra-Wideband (UWB) short-range impulse radar sensors help save energy and achieve new levels of user experience and interactivity in a variety of indoor applications, including consumer electronic devices and smart building systems. NOVELDA technology complies with worldwide UWB regulations and is protected by several design patents.

Further information
Tove Elisabeth Lutdal – VP Marketing
Phone: +47 90 73 49 49 Email: [email protected] Web: www.novelda.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Phone: +31 570 745623 Email: [email protected] Web: www.roodmcirotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

• Read more about RoodMicrotec and NOVELDA sign contract for strategic cooperation for UWB devices

Breker Verification Systems, the leading provider of advanced test content synthesis solutions, today unveiled the Breker Integrity FASTApps™ Portfolio, a library of automated test generation intellectual property (IP) elements targeting difficult-to-verify processor core and system-on-chip (SoC) scenarios.

The FASTApps provide commercial-grade, high-coverage verification for RISC-V processor cores and the SoC platforms that use them.

“The RISC-V Open ISA concept, while powerful, introduces verification challenges to engineering teams unfamiliar with processor complexities,” observes David Kelf, Breker’s CEO, an active RISC-V Consortium member involved with a public effort to improve RISC-V verification methodologies. “By automating test content generation, Breker’s years of verification experience can be encapsulated and applied across many projects, driving high test coverage with a minimal level of effort.”

Breker’s new Integrity FASTApps, ideal for the verification of processors based on the RISC-V Open Instruction Set Architecture (ISA) provide specific test sets for both processor core integrity and the System-on-Chip (SoC) that encompass these cores.
The Processor Core Integrity FASTApps include commonplace, but hard-to-verify scenarios such as load store integrity, random instruction testing, register-to-register hazards, conditionals and branches, exceptions, async. interrupts, privilege level switching, core security, exception testing (memory protection and machine-code integrity), virtual memory/paging and core coherency.

In addition, the SoC Integrity FASTApps include random memory and register tests, system interrupt testing (external, timing and software interrupts), multi-core execution, memory ordering, atomic operations, system coherency, system paging and memory management unit (MMU) operations, system security and power management.

Also available are apps for end-to-end multi-IP SoC testing and early firmware testing for RISC-V.

The FASTApps make full use of the Breker Test Suite Synthesis technology. Features include seamless portability across the entire verification flow and execution platforms, coverage-driven and pre-execution randomization for enhanced use models, powerful debug and performance profiling capability, and concurrent test set. They integrate fully with the Breker TrekApps such as the system coherency, security, power domain, networking and other system verification IP tests for fully comprehensive SoC and core-level verification.

Availability and Pricing
The Breker Integrity FASTApps for RISC-V as well as Arm and X86 based systems are available today.
Pricing is available upon request. Special introductory pricing applies to the FASTApps.
For more information, visit the Breker website or email [email protected].

Breker at the RISC-V Summit
Breker executives and technical staff will be part of the RISC-V Summit program held Tuesday, December 13, and Wednesday, December 14, at the San Jose Convention McEnery Center in San Jose, Calif.
John Sotiropoulos, principal engineer at Breker, will present “The New Verification Ecosystem that Supports RISC-V Verification for all Adopters” with Lee Moore, consulting engineer at Imperas Software, December 13 at 4:20 p.m. P.S. T.
Adnan Hamid, Breker’s CTO, will address “RISC-V SoC and Processor Integrity: Dealing with Unique RISC-V Integrity Issues” December 14 at 12:10 p.m. P.S.T.
Send email to [email protected] to arrange a meeting.

About Breker Verification Systems
Breker Verification Systems is a leading provider of Portable Stimulus solutions, a standard means to specify verification intent and behaviors reusable across target platforms. It is the first company to introduce graph-based verification and the synthesis of powerful test sets from intent-based, abstract scenario models based on AI planning algorithms. Breker’s Test Suite Synthesis and TrekApp library allows the automated generation of high-coverage, powerful test cases for deployment into a variety of UVM, SoC and Post-Silicon verification environments. Case studies that feature Altera (now Intel), Analog Devices, Broadcom, IBM, Huawei and other companies leveraging Breker’s solutions are available on the Breker website. Breker is privately held and works with leading semiconductor companies worldwide.

Engage with Breker at:
Website: www.brekersystems.com
Twitter: @BrekerSystems
LinkedIn: https://www.linkedin.com/company/breker-verification-systems/
Facebook: https://www.facebook.com/BrekerSystems/

• Read more about Breker Verification Systems Unveils Easy-To-Adopt Integrity FASTApps Targeting RISC-V Processor Core, SoC Verification Scenarios

microMIRA™ provides highly uniform, force-free lift-off of material layers at high speeds;
more than ten 3D-Micromac laser systems sold for microLED applications to date

Chemnitz, Germany, November 7, 2022—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, today announced that a leading optical solutions provider has purchased multiple microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production of microLED devices. The customer will install the new microMIRA systems in pilot- and production lines at its state-of-the-art LED chip factory in Asia.

Laser Lift-Off an Enabling Process for microLEDs
MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime, and low power consumption. Potential applications include very large displays for indoor and outdoor use, as well as high-resolution displays for augmented reality (AR) and virtual reality (VR) wearable devices.

However, the microLED fabrication process is vastly more complex than LCD and OLED manufacturing, and faces several technical challenges that must be overcome before microLEDs can be readily available in the mass market. Among these challenges is detaching and transferring the processed microLED chips from the donor or growth substrate (e.g., sapphire) to an intermediate substrate for subsequent testing without damaging the expensive growth substrate, allowing it to be repurposed for future use. The microMIRA system from 3D-Micromac precisely addresses this task with superior performance.

3D-Micromac’s microMIRA system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

According to Uwe Wagner, CEO of 3D-Micromac, “This multiple system order is a testament to our ability to provide innovative and enabling laser micromachining solutions for industrial applications serving both mature and emerging markets. It also represents an important milestone for 3D-Micromac as we continue to expand our product offerings and services into the display industry, addressing the production needs for exciting new display technologies, including microLEDs. To date, 3D-Micromac has sold more than 10 laser processing systems for microLED applications, including our industry-benchmark microMIRA laser-lift-off system as well as our recently introduced microCETI™ micromachining platform.”

The microMIRA LLO system has been used successfully in mass production by electronics manufacturers globally for years. In addition to gallium nitride (GaN) lift-off from glass and sapphire substrates in microLED display manufacturing, the microMIRA system can also be used for layer separation in semiconductor and sensor manufacturing, as well as for laser annealing and crystallization for surface modification.

More information on microMIRA, including our latest white paper “Laser technologies for microLED production,” can be found at https://3d-micromac.com/laser-lift-off/micromira/.

About 3D-Micromac
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

• Read more about 3D-Micromac receives order for multiple Laser Lift-Off systems for microLED device manufacturing

Quartz Machining in Semicon- and Optical Industries
2022/06/28

Quartz Machining

What is Quartz and its Common Use?

Quartz Material Properties
Quartz can be manufactured into Quartz Glass, which is sometimes referred to as fused quartz or fused silica. The material is composed of silicon dioxide (SiO2), which has very low thermal expansion and can maintain its dimensional stability even at elevated temperatures.

Quartz glass has excellent electrical insulation property and is inert to attacks from all kinds of acids, even in very high concentrations, except for hydrofluoric acid. The material has high compressive strength, but also displays high hardness and brittleness. Defects on the surface may have a serious impact on its overall material strength.

References :
Top-Seioko - Fused silica : Key properties & popular applications
AZO Materials - Fused Silica/Quartz Glass - Properties and Applications of Fused Silica/Quartz Glass by Goodfellow Ceramic & Glass Division
IQS Directory - Quartz glass
Heraeus - Properties of fused silica

Common Applications of Quartz
Since quartz glass has a wide transparency range and superior light transmittance, this makes it an ideal material for multiple optical applications in optoelectronics industry, such as prisms, lenses, etc. Its material properties also gives it a wide range of applications in semiconductor industry, such as quartz ring, quartz crucible, quartz wafer boat, etc.

silicon wafers in plastic wafer boat
F1. silicon wafers in plastic wafer boat (quartz wafer boat is also applicable)

How Quartz Machining Works?

Quartz Machining 1 : Milling

Quartz Machining 1:industrial material machining milling process
F2. industrial material machining milling process

Machining quartz glass can be done using high precision CNC milling machines that are designed to machine ceramics and materials similar to glasses in terms of brittleness. Though quartz glass is also a hard and brittle material, its machinability is relatively good.

Quartz Machining 2 : Cutting

Quartz Machining 2:industrial material cutting with high pressure water jet
F3. industrial material cutting with high pressure water jet

Due to the hardness and brittleness of quartz glass, machining it may need diamond cutting tools and the machining parameters must be optimized. Band and wire saws, chop saws, CO2 lasers, and water jet cutters are common tools used to cut quartz glass.

Quartz Machining 3 : Drilling

Quartz Machining 3:industrial material drilling on milling machine
F4. industrial material drilling on milling machine

The material can also be drilled by using a diamond drill. In order to prevent the tools from premature wear-out, it is important to make sure the proper cooling device is available.

Difficulties in Quartz Machining

Quartz Machining Challenges in Quality
Though quartz glass possesses high compressive strength, it is still a very hard and brittle material. Even small defects on the surface may have serious impact on its overall material strength. Especially in quartz glass drilling, there will easily be serious subsurface damage with improper cutting force. Another downside of machining quartz glass is that machining it produces great deal of powder and clogs the diamond cutting tools. This not only affects the stability of tool life, but also severely damages the quality of the workpiece.

Quartz Machining Challenges in Efficiency
Though quartz glass is considered to have relatively good machinability, it is a hard and brittle material. The control of cutting force is important when machining quartz glass, since it may be easily chipped or cracked under excessive cutting force. This usually results in a very time-consuming machining process, and leaves the processing manufacturers a huge headache when dealing with this material.

Quartz Machining Challenges:enhancing machining efficiency while maintaining required quality
F5. the challenge of enhancing machining efficiency while maintaining required quality

What Does HIT Ultrasonic Machining Bring to Quartz Machining?

HIT’s ultrasonic-assisted machining technology provides the superimposition of the tool rotation with a high-frequency oscillation in longitudinal direction, generating over 20,000 times of micro-vibration per second. The mechanism helps reduce cutting forces and facilitates chip removal process.

HIT s ultrasonic machining technology
F6. HIT's ultrasonic machining technology with high-frequency oscillation in longitudinal direction facilitates chip removal process

The reduction in cutting forces not only decreases frictions between tools and workpieces, but also allows feed rates to be increased. This greatly improves the quality of workpieces and the stability of tool life, and saves quite an amount of processing time.

HIT s ultrasonic machining technology helps reduction in cutting force
F7. HIT's ultrasonic machining technology helps reduction in cutting force, bringing more stability in tool life

Facilitating chip removal process diminishes frictions on both tools and workpieces caused by excessive amount of chips. HIT’s ultrasonic high-frequency micro-vibration allows chips to break easily and lessens the occurrences of entangled chips. This also displays a great benefit to both the quality of workpieces and the stability of tool life.

The technology specializes in micro-drilling and deep hole drilling hard and brittle advanced materials, including technical ceramics, quartz glass, super alloys, etc. The high-frequency micro-vibration displays the ability to control the cutting force in stable manner, decreasing the possibilities of severe subsurface damage. Offering a better way to improve the machining process by effectively enhancing machining efficiency, stabilizing the tool life, and bettering the quality of workpieces.

HIT s ultrasonic machining technology displays outstanding results on quartz micro-drilling and deep hole drilling
F8. HIT's ultrasonic machining technology displays outstanding results on quartz micro-drilling and deep hole drilling

More information on HIT Ultrasonic Machining Technology

Two Successful HIT Cases of Quartz Machining

Quartz Machining Case 1 : Micro-Drilling

Quartz Machining Case1:Quartz glass micro-drilling workpiece
F9. Quartz glass micro-drilling workpiece

HIT conducted a Φ0.3x5.4mm micro-drilling on a 60x30x20mm quartz glass workpiece. Using HIT’s ultrasonic tool holder HSKE40 with the integration of CTS, ATC, and CNC automation system, HIT managed to drill 300 micro-holes in total, with the processing time within 40 seconds/per hole. The outcome, in terms of machining efficiency, prevailed over the machining results provided by the tool suppliers and clients. The precision repeatability is well-maintained with no obvious edge-cracks on the hole wall.

Quartz Machining Case2:Quartz glass micro-drilling process
F10. Quartz glass micro-drilling process

This feature is widely applied in the Semiconductor industry, especially being used for quartz plates, quartz rings, quartz substrate lens board, etc.

More information on Quartz : Micro-drilling

Quartz Machining Case 2 : Deep Hole Drilling

Quartz Machining Case3:Quartz glass deep hole drilling workpiece
F11. Quartz glass deep hole drilling workpiece

HIT carried out a Φ3x65mm deep hole drilling on a 100x100x30mm quartz glass workpiece. Using HIT’s ultrasonic tool holder HSKA63 with the integration of CTS, ATC, and CNC automation system, HIT completed the machining process by enhancing the material removal rate (MRR) from 65.54 mm3/min (non-ultrasonic) to 533.64 mm3/min (HIT ultrasonic). This helps reduce the overall processing time over 85%, from 26 minutes 44 seconds to 3 minutes 17 seconds.

Quartz Machining Case3:Quartz drilling process
F12. Quartz drilling process

This feature is widely applied in the Optoelectronics industry and Defense and Aerospace industry, especially being used for quartz lens, quartz reflector lens, quartz lens for gyroscope etc.

More information on Quartz : Deep hole drilling

Quartz Machining FAQ

Q1 When machining quartz glass, it often produces great deal of powder. The accumulated powder may severely clog the diamond cutting tool and have a serious impact on both the tool life and the quality of workpieces. How does HIT's ultrasonic technology deal with this situation?

A1 HIT's ultrasonic-assisted machining technology provides the superimposition of the tool rotation with a high-frequency oscillation in longitudinal direction, generating over 20,000 times of micro-vibration per second. The mechanism helps reduce cutting forces and facilitates chip removal process. HIT’s ultrasonic high-frequency micro-vibration allows chips to break easily and lessens the occurrences of entangled chips. With the assistance of high pressure (70bar) coolant through spindle (CTS), it allows the chip removal process even smoother.

HIT ultrasonic machining driver module
F13. HIT ultrasonic machining driver module

More information on HIT Ultrasonic Machining Module

Q2 How to adjust feed rates and amplitude when I start machining Quartz with HIT's ultrasonic machining module system?

A2 HIT aims to help clients face the challenges in Quartz machining. This includes providing the optimum machining parameters and services to ensure clients having the best experiences in using HIT’s ultrasonic machining module system. It is not just buying a product from HIT, but obtaining the knowledge, services, and efforts from the most professional team.

HIT ultrasonic tool holders
F14. HIT ultrasonic tool holders

Quartz Machining? Choose HIT
Contact us if you are looking for a better way to improve machining efficiency, quality, and tool life.

• Read more about Ultrasonic Machining of Quartz Glass Shines Bright in Semiconductor Industry｜Hantop Intelligence Tech.

• Total income of EUR 4.3 million in Q3 2022, a year-over-year growth of 19%
• Order book value has further grown since the beginning of the quarter
• New investments to increase capacity and capabilities

Deventer, October 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the third quarter of 2022. The total income for the quarter was EUR 4.3 million, which is 19% higher than the total income in the third quarter of 2021 (EUR 3.6 million). The test operations department is continuing to grow with existing and new customers. The total income for the first nine months of 2022 was EUR 11.6 million, which is 6% higher than the total income for the first nine months of 2021 (EUR 10.9 million). Due to long-term contracts and increasing demand from new customers, the value of the order book is higher than at the beginning of the quarter. This generates a good basis for the upcoming quarters.

“We are very pleased with the high total income throughout the year and especially with the third quarter, which drew the highest quarterly total in the last 20 years”, says Martin Sallenhag, CEO of RoodMicrotec. “We keep investing in new equipment to be able to support the increasing demands from our customers. During 2022, we have purchased new handlers and testers as well as new equipment for the Qualification and Failure Analysis department.”

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine as well as the current energy crisis could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, political situation, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

Financial calendar
January 26, 2023 Publication (preliminary) annual total income 2022
April 13, 2023 Trading update for the first quarter of 2023
April 20, 2023 Publication annual report 2022
April 20, 2023 Conference call for press and analysts
June 6, 2023 Annual general meeting of shareholders
July 20, 2023 Publication interim report 2023
July 20, 2023 Conference call for press and analysts
October 19, 2023 Trading update for the third quarter of 2023

Audit
The financial data in this press release have not been audited.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well established as a highly valued partner for many companies worldwide. The Company provides full turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions, the English version shall prevail.

• Read more about RoodMicrotec reports a 19% year-over-year growth rate for the third quarter of 2022