microMIRA™ provides highly uniform, force-free lift-off of material layers at high speeds;
more than ten 3D-Micromac laser systems sold for microLED applications to date

Chemnitz, Germany, November 7, 2022—3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, glass and display markets, today announced that a leading optical solutions provider has purchased multiple microMIRA™ Laser Lift-Off (LLO) systems from 3D-Micromac for use in the production of microLED devices. The customer will install the new microMIRA systems in pilot- and production lines at its state-of-the-art LED chip factory in Asia.

Laser Lift-Off an Enabling Process for microLEDs
MicroLEDs have the potential to revolutionize the display industry, promising a variety of advantages such as superior viewing angle, high dynamic range with perfect black luminance and high brightness, wide color gamut, fast refresh rates, long lifetime, and low power consumption. Potential applications include very large displays for indoor and outdoor use, as well as high-resolution displays for augmented reality (AR) and virtual reality (VR) wearable devices.

However, the microLED fabrication process is vastly more complex than LCD and OLED manufacturing, and faces several technical challenges that must be overcome before microLEDs can be readily available in the mass market. Among these challenges is detaching and transferring the processed microLED chips from the donor or growth substrate (e.g., sapphire) to an intermediate substrate for subsequent testing without damaging the expensive growth substrate, allowing it to be repurposed for future use. The microMIRA system from 3D-Micromac precisely addresses this task with superior performance.

3D-Micromac’s microMIRA system provides highly uniform, force-free lift-off of different layers on large-area substrates at high processing speeds without the need for costly and polluting wet chemical processes. The unique line beam system is built on a highly customizable platform that can incorporate different laser sources, wavelengths and beam paths to meet each customer’s unique requirements. The system is capable of processing different substrate materials and sizes, and can achieve processing speeds (including handling) of up to 60 eight-inch wafers per hour.

According to Uwe Wagner, CEO of 3D-Micromac, “This multiple system order is a testament to our ability to provide innovative and enabling laser micromachining solutions for industrial applications serving both mature and emerging markets. It also represents an important milestone for 3D-Micromac as we continue to expand our product offerings and services into the display industry, addressing the production needs for exciting new display technologies, including microLEDs. To date, 3D-Micromac has sold more than 10 laser processing systems for microLED applications, including our industry-benchmark microMIRA laser-lift-off system as well as our recently introduced microCETI™ micromachining platform.”

The microMIRA LLO system has been used successfully in mass production by electronics manufacturers globally for years. In addition to gallium nitride (GaN) lift-off from glass and sapphire substrates in microLED display manufacturing, the microMIRA system can also be used for layer separation in semiconductor and sensor manufacturing, as well as for laser annealing and crystallization for surface modification.

More information on microMIRA, including our latest white paper “Laser technologies for microLED production,” can be found at https://3d-micromac.com/laser-lift-off/micromira/.

About 3D-Micromac
Founded in 2002, 3D-Micromac AG is the industry leader in laser micromachining, delivering powerful, user-friendly and leading-edge processes with superior production efficiency. We develop processes, machines and turnkey solutions at the highest technical and technological level. 3D-Micromac systems and services have been successfully implemented in various high-tech industries worldwide including photovoltaic, semiconductor, glass and display industries, micro diagnostics, and medical technology. For more information, visit the company’s website at http://www.3d-micromac.com.

• Read more about 3D-Micromac receives order for multiple Laser Lift-Off systems for microLED device manufacturing

Quartz Machining in Semicon- and Optical Industries
2022/06/28

Quartz Machining

What is Quartz and its Common Use?

Quartz Material Properties
Quartz can be manufactured into Quartz Glass, which is sometimes referred to as fused quartz or fused silica. The material is composed of silicon dioxide (SiO2), which has very low thermal expansion and can maintain its dimensional stability even at elevated temperatures.

Quartz glass has excellent electrical insulation property and is inert to attacks from all kinds of acids, even in very high concentrations, except for hydrofluoric acid. The material has high compressive strength, but also displays high hardness and brittleness. Defects on the surface may have a serious impact on its overall material strength.

References :
Top-Seioko - Fused silica : Key properties & popular applications
AZO Materials - Fused Silica/Quartz Glass - Properties and Applications of Fused Silica/Quartz Glass by Goodfellow Ceramic & Glass Division
IQS Directory - Quartz glass
Heraeus - Properties of fused silica

Common Applications of Quartz
Since quartz glass has a wide transparency range and superior light transmittance, this makes it an ideal material for multiple optical applications in optoelectronics industry, such as prisms, lenses, etc. Its material properties also gives it a wide range of applications in semiconductor industry, such as quartz ring, quartz crucible, quartz wafer boat, etc.

silicon wafers in plastic wafer boat
F1. silicon wafers in plastic wafer boat (quartz wafer boat is also applicable)

How Quartz Machining Works?

Quartz Machining 1 : Milling

Quartz Machining 1:industrial material machining milling process
F2. industrial material machining milling process

Machining quartz glass can be done using high precision CNC milling machines that are designed to machine ceramics and materials similar to glasses in terms of brittleness. Though quartz glass is also a hard and brittle material, its machinability is relatively good.

Quartz Machining 2 : Cutting

Quartz Machining 2:industrial material cutting with high pressure water jet
F3. industrial material cutting with high pressure water jet

Due to the hardness and brittleness of quartz glass, machining it may need diamond cutting tools and the machining parameters must be optimized. Band and wire saws, chop saws, CO2 lasers, and water jet cutters are common tools used to cut quartz glass.

Quartz Machining 3 : Drilling

Quartz Machining 3:industrial material drilling on milling machine
F4. industrial material drilling on milling machine

The material can also be drilled by using a diamond drill. In order to prevent the tools from premature wear-out, it is important to make sure the proper cooling device is available.

Difficulties in Quartz Machining

Quartz Machining Challenges in Quality
Though quartz glass possesses high compressive strength, it is still a very hard and brittle material. Even small defects on the surface may have serious impact on its overall material strength. Especially in quartz glass drilling, there will easily be serious subsurface damage with improper cutting force. Another downside of machining quartz glass is that machining it produces great deal of powder and clogs the diamond cutting tools. This not only affects the stability of tool life, but also severely damages the quality of the workpiece.

Quartz Machining Challenges in Efficiency
Though quartz glass is considered to have relatively good machinability, it is a hard and brittle material. The control of cutting force is important when machining quartz glass, since it may be easily chipped or cracked under excessive cutting force. This usually results in a very time-consuming machining process, and leaves the processing manufacturers a huge headache when dealing with this material.

Quartz Machining Challenges:enhancing machining efficiency while maintaining required quality
F5. the challenge of enhancing machining efficiency while maintaining required quality

What Does HIT Ultrasonic Machining Bring to Quartz Machining?

HIT’s ultrasonic-assisted machining technology provides the superimposition of the tool rotation with a high-frequency oscillation in longitudinal direction, generating over 20,000 times of micro-vibration per second. The mechanism helps reduce cutting forces and facilitates chip removal process.

HIT s ultrasonic machining technology
F6. HIT's ultrasonic machining technology with high-frequency oscillation in longitudinal direction facilitates chip removal process

The reduction in cutting forces not only decreases frictions between tools and workpieces, but also allows feed rates to be increased. This greatly improves the quality of workpieces and the stability of tool life, and saves quite an amount of processing time.

HIT s ultrasonic machining technology helps reduction in cutting force
F7. HIT's ultrasonic machining technology helps reduction in cutting force, bringing more stability in tool life

Facilitating chip removal process diminishes frictions on both tools and workpieces caused by excessive amount of chips. HIT’s ultrasonic high-frequency micro-vibration allows chips to break easily and lessens the occurrences of entangled chips. This also displays a great benefit to both the quality of workpieces and the stability of tool life.

The technology specializes in micro-drilling and deep hole drilling hard and brittle advanced materials, including technical ceramics, quartz glass, super alloys, etc. The high-frequency micro-vibration displays the ability to control the cutting force in stable manner, decreasing the possibilities of severe subsurface damage. Offering a better way to improve the machining process by effectively enhancing machining efficiency, stabilizing the tool life, and bettering the quality of workpieces.

HIT s ultrasonic machining technology displays outstanding results on quartz micro-drilling and deep hole drilling
F8. HIT's ultrasonic machining technology displays outstanding results on quartz micro-drilling and deep hole drilling

More information on HIT Ultrasonic Machining Technology

Two Successful HIT Cases of Quartz Machining

Quartz Machining Case 1 : Micro-Drilling

Quartz Machining Case1:Quartz glass micro-drilling workpiece
F9. Quartz glass micro-drilling workpiece

HIT conducted a Φ0.3x5.4mm micro-drilling on a 60x30x20mm quartz glass workpiece. Using HIT’s ultrasonic tool holder HSKE40 with the integration of CTS, ATC, and CNC automation system, HIT managed to drill 300 micro-holes in total, with the processing time within 40 seconds/per hole. The outcome, in terms of machining efficiency, prevailed over the machining results provided by the tool suppliers and clients. The precision repeatability is well-maintained with no obvious edge-cracks on the hole wall.

Quartz Machining Case2:Quartz glass micro-drilling process
F10. Quartz glass micro-drilling process

This feature is widely applied in the Semiconductor industry, especially being used for quartz plates, quartz rings, quartz substrate lens board, etc.

More information on Quartz : Micro-drilling

Quartz Machining Case 2 : Deep Hole Drilling

Quartz Machining Case3:Quartz glass deep hole drilling workpiece
F11. Quartz glass deep hole drilling workpiece

HIT carried out a Φ3x65mm deep hole drilling on a 100x100x30mm quartz glass workpiece. Using HIT’s ultrasonic tool holder HSKA63 with the integration of CTS, ATC, and CNC automation system, HIT completed the machining process by enhancing the material removal rate (MRR) from 65.54 mm3/min (non-ultrasonic) to 533.64 mm3/min (HIT ultrasonic). This helps reduce the overall processing time over 85%, from 26 minutes 44 seconds to 3 minutes 17 seconds.

Quartz Machining Case3:Quartz drilling process
F12. Quartz drilling process

This feature is widely applied in the Optoelectronics industry and Defense and Aerospace industry, especially being used for quartz lens, quartz reflector lens, quartz lens for gyroscope etc.

More information on Quartz : Deep hole drilling

Quartz Machining FAQ

Q1 When machining quartz glass, it often produces great deal of powder. The accumulated powder may severely clog the diamond cutting tool and have a serious impact on both the tool life and the quality of workpieces. How does HIT's ultrasonic technology deal with this situation?

A1 HIT's ultrasonic-assisted machining technology provides the superimposition of the tool rotation with a high-frequency oscillation in longitudinal direction, generating over 20,000 times of micro-vibration per second. The mechanism helps reduce cutting forces and facilitates chip removal process. HIT’s ultrasonic high-frequency micro-vibration allows chips to break easily and lessens the occurrences of entangled chips. With the assistance of high pressure (70bar) coolant through spindle (CTS), it allows the chip removal process even smoother.

HIT ultrasonic machining driver module
F13. HIT ultrasonic machining driver module

More information on HIT Ultrasonic Machining Module

Q2 How to adjust feed rates and amplitude when I start machining Quartz with HIT's ultrasonic machining module system?

A2 HIT aims to help clients face the challenges in Quartz machining. This includes providing the optimum machining parameters and services to ensure clients having the best experiences in using HIT’s ultrasonic machining module system. It is not just buying a product from HIT, but obtaining the knowledge, services, and efforts from the most professional team.

HIT ultrasonic tool holders
F14. HIT ultrasonic tool holders

Quartz Machining? Choose HIT
Contact us if you are looking for a better way to improve machining efficiency, quality, and tool life.

• Read more about Ultrasonic Machining of Quartz Glass Shines Bright in Semiconductor Industry｜Hantop Intelligence Tech.

• Total income of EUR 4.3 million in Q3 2022, a year-over-year growth of 19%
• Order book value has further grown since the beginning of the quarter
• New investments to increase capacity and capabilities

Deventer, October 13, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the third quarter of 2022. The total income for the quarter was EUR 4.3 million, which is 19% higher than the total income in the third quarter of 2021 (EUR 3.6 million). The test operations department is continuing to grow with existing and new customers. The total income for the first nine months of 2022 was EUR 11.6 million, which is 6% higher than the total income for the first nine months of 2021 (EUR 10.9 million). Due to long-term contracts and increasing demand from new customers, the value of the order book is higher than at the beginning of the quarter. This generates a good basis for the upcoming quarters.

“We are very pleased with the high total income throughout the year and especially with the third quarter, which drew the highest quarterly total in the last 20 years”, says Martin Sallenhag, CEO of RoodMicrotec. “We keep investing in new equipment to be able to support the increasing demands from our customers. During 2022, we have purchased new handlers and testers as well as new equipment for the Qualification and Failure Analysis department.”

Outlook
RoodMicrotec expects the total income in 2022 to be in the range of EUR 15.0 million to EUR 15.6 million with a positive result before tax. The current situation in the world regarding lead-times for wafers and packaging as well as shipment delays may impact the ability to achieve the expected total income. The war in Ukraine as well as the current energy crisis could also have an impact on the business but in the short term we don’t see any significant impacts. RoodMicrotec is keeping a close eye on the situation and is doing everything possible to mitigate any impact.

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, political situation, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

Financial calendar
January 26, 2023 Publication (preliminary) annual total income 2022
April 13, 2023 Trading update for the first quarter of 2023
April 20, 2023 Publication annual report 2022
April 20, 2023 Conference call for press and analysts
June 6, 2023 Annual general meeting of shareholders
July 20, 2023 Publication interim report 2023
July 20, 2023 Conference call for press and analysts
October 19, 2023 Trading update for the third quarter of 2023

Audit
The financial data in this press release have not been audited.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well established as a highly valued partner for many companies worldwide. The Company provides full turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions, the English version shall prevail.

• Read more about RoodMicrotec reports a 19% year-over-year growth rate for the third quarter of 2022

Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, launches the new Plasma Enhanced Atomic Layer Deposition (PEALD) system, "AD-800LP". The main target of the system is gate oxide film deposition for next-generation power devices of silicon carbide (SiC) and gallium nitride (GaN) materials, which will play important role toward carbon neutral.

The plasma enhanced ALD system "AD-800LP" is a multi-purpose R&D system equipped with a unique ICP plasma source called "Tornado ICP", in addition to the conventional thermal ALD capability. AD-800LP enables various film deposition such as oxide or nitride films by Tornado ICP, which is Samco's proprietary plasma technology and is different from remote plasma. Tornado ICP enables stable plasma discharge even in the high-pressure range during ALD deposition.

“We are also considering a cluster ALD system that can connect multiple reaction chambers for production” says Tsukasa Kawabe, President and COO of Samco. “The launch of the AD-800LP will greatly enhance our presence in the world ALD equipment market.” Tsukasa adds.

As a global mid-sized company, Samco has successfully delivered numerous dry etch systems and plasma enhanced CVD systems for the electronic device field, mainly for compound semiconductors such as SiC, GaN, and GaAs, not only in Japan but also in the United States, Europe, Taiwan, Korea, China, Southeast Asia, India, and other countries.

The new Research Center for Nano Thin Films & Materials, which opened in February 2022, conducts research and development of unique thin film deposition, including ALD system. Samco will continue to utilize our "thin-film technology" to develop unique products and expand sales globally.

AD-800LP system photo

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including BAW filters, SiC power devices, GaN RF devices, GaAs VCSELs, InP lasers, microLEDs, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samcointl.com/.

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

• Read more about Samco Unveils Plasma Enhanced ALD System for SiC and GaN Power Devices

Xpeedic confirmed today that Chipletz, a fabless substrate startup developing advanced packaging technology, adopted its Metis electromagnetic (EM) simulation tool for Chipletz’s soon-to-be released Smart Substrate™ products that will enable multiple ICs in a single package.

“The slowing of Moore’s Law and demand for compute performance is ushering in the era of advanced packaging and the increasing need for products like Xpeedic’s,” remarks Bryan Black, CEO of Chipletz. “Xpeedic and its Metis EM simulation tool are helping us meet our unique signal and power integrity analysis challenges by delivering unprecedented performance advantages for runtime and memory usage.”

“The Chipletz Smart Substrate products will be a welcome addition to toolkits of designers working on advanced 2.5D and 3D IC packaging,” says Feng Ling, CEO of Xpeedic. “Smart Substrate will facilitate multiple ICs from different vendors in a single package, especially important for the AI workloads, immersive consumer experiences and high-performance computing markets. We’re pleased to have a role in the delivery of this advanced packaging technology.”

Xpeedic’s Metis is a fast EM simulation tool for advanced package simulation integrated with IC and package design tools to address capacity, accuracy and throughput requirements. Its three-dimensional EM solver technology delivers unprecedented performance without compromising accuracy. The single solver covers simulation from DC to high frequencies. It also supports multi-scale problems that enables unified EM simulations of die, interposer, and package for advanced packaging designs.
About Xpeedic

Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both US and China. For more information, please www.xpeedic.com.

Engage with Xpeedic
www.xpeedic.com
Twitter: @xpeedic
LinkedIn

About Chipletz
Incorporated in 2021, Chipletz is a fabless substrate vendor developing advanced packaging technology that bridges the gap between the slowing of Moore's Law and the rising demand for compute performance. The company's Smart Substrate™ products facilitate multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing. Chipletz is targeting delivery of its initial products to its customers and partners in early 2024. www.chipletz.com

• Read more about Chipletz Selects Xpeedic’s Metis Tool for its Smart Substrate Products

Heterogenous integration in microelectronics requires advanced materials

Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON Taiwan, an international event connecting supply chain partners across the semiconductor industry.

Dr. Alvin Lee, Regional Director, at Brewer Science, garners over a decade of diverse experience in the semiconductor industry developing global partnerships to improve next-generation advanced packaging materials.

Dr. Lee is a featured speaker at the SEMICON Taiwan Heterogeneous Integration Global Summit, which focuses on comprehensive high density and automotive heterogeneous integration. His presentation, New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging, will address cost-effective solutions and innovative material technologies that enable advanced wafer-level packaging applications. Materials will be discussed that address the growing challenges in applications requiring thin wafer handling, die attach, high-temperature processing, permanent adhesives, dielectrics, and wafer cleaning.

The presentation will address advanced materials that enable

• Collective die-to-wafer hybrid bonding,
• Cu/polymer hybrid bonding,
• Advancement of temporary bonding/debonding technologies

Brewer Science will be exhibiting at SEMICON Taiwan and you can visit our booth J2242 to connect with a member of our team and explore our advanced packaging solutions. If you are unable to attend, but wish to learn more about Brewer Science’s advanced packaging materials, you can visit our website to view datasheets and schedule a call with an expert.

Brewer Science is also a proud sponsor of SEMICON Taiwan, providing a Platinum Sponsorship to the Heterogeneous Integration Global Summit. Additionally, Brewer Science is sponsoring the IC Forum and the Gala Dinner.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

• Read more about Brewer Science presents advanced packaging innovations at SEMICON Taiwan 2022

PENANG, MALAYSIA - August 2022 ViTrox Technologies, aims to be the world’s most trusted vision inspection solutions provider to the Semiconductor and SMT PCB Assembly industries, is pleased to present the latest edition of Tray-based Vision Series - TH1000SEi Tray-to-tray vision handler. TH1000SEi is a user-friendly model designed that allows you to enjoy high-speed tray to tray inspection capabilities while improving cost efficiency.

TH1000SEi will be your first choice to fulfil all the stringent inspection requirements of today’s advanced integrated circuit (IC) packaging market. This special edition of the Tray-to-tray vision handler features the world's most cutting-edge vision technologies for various IC package sizes ranging from 3mm x 3mm to 40mm x 40mm with no conversion needed on its vision module for the 6-sided inspection.

With an auto-pitching mechanism, TH1000SEi allows you to enjoy speedy and reliable nozzle pitch conversion time with its fourteen (14) pick-up nozzles. Having fourteen (14) pick up nozzles optimizes the machine throughput up to 33,000 units per hour (UPH). Additionally, the warpage clamper flattens unbalanced trays during the process. With this user-friendly and simple operating model, you can enjoy the highest performance in your precise production environment.

Besides, TH1000SEi is designed with various innovative vision technologies to provide high speed, high accuracy, and one-stop vision inspection solutions. Our TH1000SEi supports leaded packages inspection, ball packages inspection, and leadless packages inspection, suitable for BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP, etc. Apart from all these attractive features, we offer additional inspection capabilities add-ons such as 2D barcode inspection, mark inspection, package vision inspection, passive component inspection, top colour inspection, etc.

Apart from these features, TH1000SEi is also upgradeable with the tape module for more high speed tray to tape and reel inspection capabilities. Ultimately, the TH1000SEi maximises inspection capabilities, allowing you to achieve maximum machine throughput cost-effectively.

For more exclusive details on the Tray-based Vision Handler series or TH1000SEi, contact our experts at [email protected] for further assistance.

About ViTrox Technologies
Since its inception in 2000, ViTrox aims to be the World’s Most Trusted Technology Company to provide the most innovative, advanced, and cost-effective machine vision solutions of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances. ViTrox offers a full spectrum of advanced 3D vision inspection solutions, including Intelligent Advanced Robotic Vision System, PCB Assembly SMT Vision Inspection Solutions and Industry 4.0 Smart Manufacturing Solution. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States, along with sales and support sites globally. For more information about ViTrox’s products and services, please visit www.vitrox.com.

• Read more about ViTrox Unveiling An All-in-One Special Edition of TH1000SEi Tray-based Vision Solution