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Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, launches the new Plasma Enhanced Atomic Layer Deposition (PEALD) system, "AD-800LP". The main target of the system is gate oxide film deposition for next-generation power devices of silicon carbide (SiC) and gallium nitride (GaN) materials, which will play important role toward carbon neutral.

The plasma enhanced ALD system "AD-800LP" is a multi-purpose R&D system equipped with a unique ICP plasma source called "Tornado ICP", in addition to the conventional thermal ALD capability. AD-800LP enables various film deposition such as oxide or nitride films by Tornado ICP, which is Samco's proprietary plasma technology and is different from remote plasma. Tornado ICP enables stable plasma discharge even in the high-pressure range during ALD deposition.

“We are also considering a cluster ALD system that can connect multiple reaction chambers for production” says Tsukasa Kawabe, President and COO of Samco. “The launch of the AD-800LP will greatly enhance our presence in the world ALD equipment market.” Tsukasa adds.

As a global mid-sized company, Samco has successfully delivered numerous dry etch systems and plasma enhanced CVD systems for the electronic device field, mainly for compound semiconductors such as SiC, GaN, and GaAs, not only in Japan but also in the United States, Europe, Taiwan, Korea, China, Southeast Asia, India, and other countries.

The new Research Center for Nano Thin Films & Materials, which opened in February 2022, conducts research and development of unique thin film deposition, including ALD system. Samco will continue to utilize our "thin-film technology" to develop unique products and expand sales globally.

AD-800LP system photo

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including BAW filters, SiC power devices, GaN RF devices, GaAs VCSELs, InP lasers, microLEDs, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samcointl.com/.

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

Xpeedic confirmed today that Chipletz, a fabless substrate startup developing advanced packaging technology, adopted its Metis electromagnetic (EM) simulation tool for Chipletz’s soon-to-be released Smart Substrate™ products that will enable multiple ICs in a single package.

“The slowing of Moore’s Law and demand for compute performance is ushering in the era of advanced packaging and the increasing need for products like Xpeedic’s,” remarks Bryan Black, CEO of Chipletz. “Xpeedic and its Metis EM simulation tool are helping us meet our unique signal and power integrity analysis challenges by delivering unprecedented performance advantages for runtime and memory usage.”

“The Chipletz Smart Substrate products will be a welcome addition to toolkits of designers working on advanced 2.5D and 3D IC packaging,” says Feng Ling, CEO of Xpeedic. “Smart Substrate will facilitate multiple ICs from different vendors in a single package, especially important for the AI workloads, immersive consumer experiences and high-performance computing markets. We’re pleased to have a role in the delivery of this advanced packaging technology.”

Xpeedic’s Metis is a fast EM simulation tool for advanced package simulation integrated with IC and package design tools to address capacity, accuracy and throughput requirements. Its three-dimensional EM solver technology delivers unprecedented performance without compromising accuracy. The single solver covers simulation from DC to high frequencies. It also supports multi-scale problems that enables unified EM simulations of die, interposer, and package for advanced packaging designs.
About Xpeedic

Xpeedic is a leading EDA provider to accelerate designs and simulations of next generation high-frequency, high-speed intelligent electronic products. Powered by its proprietary electromagnetic, circuit, and multi-physics solver technologies, Xpeedic is addressing challenges in designing IC in advanced nodes, 3D IC with advanced packaging, high-speed digital, and RF systems for the markets including data center, automotive, communication, mobile, and IoT. Founded in 2010, Xpeedic has offices in both US and China. For more information, please www.xpeedic.com.

Engage with Xpeedic
www.xpeedic.com
Twitter: @xpeedic
LinkedIn

About Chipletz
Incorporated in 2021, Chipletz is a fabless substrate vendor developing advanced packaging technology that bridges the gap between the slowing of Moore's Law and the rising demand for compute performance. The company's Smart Substrate™ products facilitate multiple ICs in a single package for critical AI workloads, immersive consumer experiences, and high-performance computing. Chipletz is targeting delivery of its initial products to its customers and partners in early 2024. www.chipletz.com

Heterogenous integration in microelectronics requires advanced materials

Tapei, Taiwan – September 12, 2022 – Brewer Science, Inc., a global leader in developing and manufacturing next-generation materials and processes for the microelectronics and optoelectronics industries, will present new developments in temporary and permanent bonding material technologies for advanced packaging at SEMICON Taiwan, an international event connecting supply chain partners across the semiconductor industry.

Dr. Alvin Lee, Regional Director, at Brewer Science, garners over a decade of diverse experience in the semiconductor industry developing global partnerships to improve next-generation advanced packaging materials.

Dr. Lee is a featured speaker at the SEMICON Taiwan Heterogeneous Integration Global Summit, which focuses on comprehensive high density and automotive heterogeneous integration. His presentation, New Developments in Temporary and Permanent Bonding Material Technologies for Advanced Packaging, will address cost-effective solutions and innovative material technologies that enable advanced wafer-level packaging applications. Materials will be discussed that address the growing challenges in applications requiring thin wafer handling, die attach, high-temperature processing, permanent adhesives, dielectrics, and wafer cleaning.

The presentation will address advanced materials that enable

• Collective die-to-wafer hybrid bonding,
• Cu/polymer hybrid bonding,
• Advancement of temporary bonding/debonding technologies

Brewer Science will be exhibiting at SEMICON Taiwan and you can visit our booth J2242 to connect with a member of our team and explore our advanced packaging solutions. If you are unable to attend, but wish to learn more about Brewer Science’s advanced packaging materials, you can visit our website to view datasheets and schedule a call with an expert.

Brewer Science is also a proud sponsor of SEMICON Taiwan, providing a Platinum Sponsorship to the Heterogeneous Integration Global Summit. Additionally, Brewer Science is sponsoring the IC Forum and the Gala Dinner.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

PENANG, MALAYSIA - August 2022 ViTrox Technologies, aims to be the world’s most trusted vision inspection solutions provider to the Semiconductor and SMT PCB Assembly industries, is pleased to present the latest edition of Tray-based Vision Series - TH1000SEi Tray-to-tray vision handler. TH1000SEi is a user-friendly model designed that allows you to enjoy high-speed tray to tray inspection capabilities while improving cost efficiency.

TH1000SEi will be your first choice to fulfil all the stringent inspection requirements of today’s advanced integrated circuit (IC) packaging market. This special edition of the Tray-to-tray vision handler features the world's most cutting-edge vision technologies for various IC package sizes ranging from 3mm x 3mm to 40mm x 40mm with no conversion needed on its vision module for the 6-sided inspection.

With an auto-pitching mechanism, TH1000SEi allows you to enjoy speedy and reliable nozzle pitch conversion time with its fourteen (14) pick-up nozzles. Having fourteen (14) pick up nozzles optimizes the machine throughput up to 33,000 units per hour (UPH). Additionally, the warpage clamper flattens unbalanced trays during the process. With this user-friendly and simple operating model, you can enjoy the highest performance in your precise production environment.

Besides, TH1000SEi is designed with various innovative vision technologies to provide high speed, high accuracy, and one-stop vision inspection solutions. Our TH1000SEi supports leaded packages inspection, ball packages inspection, and leadless packages inspection, suitable for BGA, QFP, QFN, CSP, TSSOP, MSOP, SOP, etc. Apart from all these attractive features, we offer additional inspection capabilities add-ons such as 2D barcode inspection, mark inspection, package vision inspection, passive component inspection, top colour inspection, etc.

Apart from these features, TH1000SEi is also upgradeable with the tape module for more high speed tray to tape and reel inspection capabilities. Ultimately, the TH1000SEi maximises inspection capabilities, allowing you to achieve maximum machine throughput cost-effectively.

For more exclusive details on the Tray-based Vision Handler series or TH1000SEi, contact our experts at [email protected] for further assistance.

About ViTrox Technologies
Since its inception in 2000, ViTrox aims to be the World’s Most Trusted Technology Company to provide the most innovative, advanced, and cost-effective machine vision solutions of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances. ViTrox offers a full spectrum of advanced 3D vision inspection solutions, including Intelligent Advanced Robotic Vision System, PCB Assembly SMT Vision Inspection Solutions and Industry 4.0 Smart Manufacturing Solution. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States, along with sales and support sites globally. For more information about ViTrox’s products and services, please visit www.vitrox.com.

Taiwan
Highlighted content

Hsinchu
Taiwan

Standards

3D P&I Taiwan TC Chapter meeting

Sep. 2, 2022

Time: 1:30-3:30 PM (Taiwan Time)

Venue: Web Meeting

Agenda:

 

Standards Contact Information:

Cher Wu 吳琇君

Senior Executive Consultant | Standards

SEMI Taiwan

+886-933-976766

[email protected]

1:30 pm - 3:30 pm Off Add to Calendar 2022-09-02 13:30:00 2022-09-02 15:30:00 3D Packaging & Integration Taiwan TC Chapter Meeting 3D P&I Taiwan TC Chapter meeting Sep. 2, 2022 Time: 1:30-3:30 PM (Taiwan Time) Venue: Web Meeting Agenda: Agenda_3D P&I Taiwan TC Meeting_20220902.pdf   Standards Contact Information: Cher Wu 吳琇君 Senior Executive Consultant | Standards SEMI Taiwan +886-933-976766 [email protected] Hsinchu Taiwan SEMI.org [email protected] America/Los_Angeles public

In the two-day event, leading manufacturing partners will show how application visions in manufacturing are implemented through concrete software solutions and considerations. You will experience first-hand the presentation of application case details from various industrial manufacturers and their ongoing collaboration with partner camLine.

In association with Elisa IndustrIQ, you will get first insights into camLine’s AI-driven manufacturing strategy. Development highlights of camLine’s sophisticated LineWorks Suite, InFrame Synapse, XperiDesk, and Cornerstone software products will also be presented for discussion. Several solution demo stations will be available in the foyer.

In the User Group Meetings, participants are given the opportunity to vote on the priorities of future product
developments.

Register now: https://www.camline.com/forum-registration/

On-Demand Pricing

FULL CONFERENCE
SEMI Member: $149.00
Non-Member: $225.00

DAY 1—Tuesday, November 8, 2022
SEMI Member: $49.00
Non-Member: $75.00

DAY 2Wednesday, November 9, 2022
SEMI Member: $49.00
Non-Member: $75.00

DAY 3Thursday, November 10, 2022
SEMI Member: $49.00
Non-Member: $75.00

STUDENTS—FREE
Contact us at [email protected] with a picture of your student ID to receive your discount code.

CONTACT
Mark da Silva
[email protected]

+
Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Register Now Global Smart Manufacturing Conference 2022 Business Technical

Sponsorship Contact

[email protected]
Sr. Sales Manager, SEMI
Tel: +1.408.943.7047 
Email: [email protected]

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2022 Organizing Committee

  • John Behnke | INFICON

  • Holland Smith | INFICON

  • Chan Pin Chong | KULICKE & SOFFA

  • Michael Arnold | PEER GROUP

  • Bobby Mitra | TEXAS INSTRUMENTS

  • James Lin | UMC

United States

TUESDAY, NOVEMBER 8, 2022 | TIMES IN PT

SESSION 1—Intelligent ACQUIRE: Data Sources, Variety and Acquisition

7:00 am
Mark da Silva
Mark da Silva
SEMI

Opening Remarks

7:02 am
Ajit Manocha
SEMI

Conference Opening Remarks

7:15 am
Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Keynote: Autonomous Smart Factory of the Future

7:35 am
Michael Arnold
Michael Arnold
PEER Group

Moderator Welcome

7:40 am
Praneetha Poloju
Praneetha Poloju
Chief Technologist
Microsoft

Azure Data Estate for Foundry Data Connectivity and Architecture Modernization​

Bella Chan
Bella Chan
Microsoft

Azure Data Estate for Foundry Data Connectivity and Architecture Modernization

8:05 am
Doug Suerich
Doug Suerich
PEER Group

End-to-End Smart Manufacturing: Using EDA to Advance the Backend ​

8:30 am
Fahad Golra
Dr. Fahad Golra
Research & Innovation Coordinator
Agileo Automation

Challenges in Edge to Cloud Level Data Sharing Across Value Chains in Semiconductor Industry

8:55 am
Padmanabha Kannampalli
Padmanabha Kannampalli
Engineer
Teradyne

Data Connectivity in Semiconductor Test—Challenges

9:20 am
Alan Weber
Alan Weber
Vice President, New Product Innovations
Cimetrix by PDF Solutions

Seeing is Understanding: Improving the Visibility into Smart Manufacturing Operations by Raising Our Standards​

9:40 am
Michael Arnold
Michael Arnold
PEER Group

Closing Remarks

SESSION 2—Intelligent INSIGHTS: Current Point Systems

5:00 pm
James Lin, UMC
MODERATOR
James Lin
UMC

Welcome Remarks

5:05 pm
CS Tan
CS Tan
Group VP & General Manager
STMicroelectronics

Product/Process Digitalization for Smart Manufacturing—Future is OPTIMIZED​

5:30 pm
John Foley
John Foley
Kulicke & Soffa

Big Data Analytics for Back-End Assembly Equipment​

5:55 pm
Bappaditya Dey
Bappaditya Dey
Senior R&D Engineer
imec

Deep Learning Denoiser Assisted Framework for Robust SEM Contour Extraction and Analysis for Advanced Semiconductor Node

6:20 pm
Ivan Aduna
Ivan Aduna
KY Technology

Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory​

6:45 pm
Anis Rahman
Anis Rahman
Chief Technology Officer
AR Photonics

A New Technique of Continuous Wave Cameraless T-Ray Imaging for Semiconductor Interfaces Analysis and Wafer Scale Die Sorting ​

7:35 pm
James Lin
UMC

Closing Remarks

WEDNESDAY, NOVEMBER 9, 2022 | TIMES IN PT

SESSION 3—Intelligent DIGITAL TWIN: Multi-Level Digital Twin

7:00 am
Holland Smith
MODERATOR
Holland Smith
Inficon

Welcome Remarks

7:05 am
Marc Engel
Marc Engel
Agileo Automation

How Existing Semiconductor Equipment Can Benefit From Digital Twins

7:30 am
Sarbajit Ghosal
Sarbajit Ghosal
SC Solutions

Development of Digital Twins for Manufacturing Applications

7:55 am
Basil Milton
Basil Milton
Kulicke & Soffa

Wire Bonding Digital Twin Enhancements for Smart Manufacturing

8:20 am
Shankar Ranganathan
Shankar Ranganathan
Associate General Manager R&D
HCL Technologies

Scalable Options to Support Semiconductor Capital Equipment's

8:45 am
Sriny Sundararajan
Sriny Sundararajan
CTO
Clip Automation

Ensuring Trust & Traceability: Secure Data Exchanges for Real-Time, Multi-Party Data Sharing in Industry 4.0 and Smart Manufacturing

Vikrant Kahlir
Vikrant Kahlir
Vendia
9:10 am
Anuj Mahendrum
Anuj Mahendru
Global Director, Semiconductor and Hi-Tech Industries
Rockwell Automation

Cleanroom Redefined—Addressing the Wafer Transport Challenge

9:35 am
Holland Smith
Holland Smith
Inficon

Closing Remarks

SESSION 4—Intelligent PREDICT: AI/ML Solution Integration

5:00 pm
Chan Pin Chong
MODERATOR
Chan Pin Chong
Kulicke & Soffa

Welcome Remarks

5:05 pm
KEYNOTE | John Herlocker, PhD | TIGNIS
Jon Herlocker, PhD
CEO
Tignis

KEYNOTE: Empowering Process Engineers With Self-Service AI/ML

5:30 pm
Jasper van Heugten
Jasper van Heugten
minds.ai

An Overview of How AI Is Reshaping Semiconductor Manufacturing: A Case Study in Fab Scheduling Using Deep Reinforcement Learning

5:55 pm
Jimmy Bramante
Jimmy Bramante
Inficon

Blurring Boundaries: Overcoming Context to Enable Deep Learning on Process Data​

6:20 pm
Nikunj Mehta
Nikunj Mehta
Founder & CEO
Falkonry

Automated, Field Deployed, Time Series Anomaly Detection With Time Series AI

6:45 pm
Erik Collart
Erik Collart
Global Product Manager SCADA
Edwards

Effective Use of Vacuum Assets Through Smart Manufacturing

7:10 pm
Yak Hua Khoo, ViTrox Technologies
Yak Hua Khoo
ViTrox Technologies

SMT Electronic Smart Close-Loop Prediction System​

7:30 pm
Chan Pin Chong
Chan Pin Chong
Kulicke & Soffa

Closing Remarks

THURSDAY, NOVEMBER 10, 2022 | TIMES IN PT

SESSION 5—Intelligent AUTONOMY: Smart, Autonomous Control

7:00 am
Bobby Mitra
MODERATOR: Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Welcome Remarks

7:05 am
Christoph Koegler, Infineon
Christoph Koegler
Director Innovation, Digitalization & AI
Infineon

A Flood of Problems Drained—Fixing Valves the Smart Way​

7:30 am
Gautham Unni
Gautham Unni
AWS

AWS for Semiconductor Smart Manufacturing ​

7:55 am
Peter Lendermann
Peter Lendermann
Chief Business Development Officer
D-SIMLAB Technologies

Enhanced Predictions, Smarter Actions: A Few Lessons Learnt on the Path towards 'Autonomy' in Frontend Production​

8:20 am
Ivy Qin
Ivy Qin
Senior Director of Engineering
Kulicke & Soffa

Road to Autonomous Wire Bonder

8:45 am
Matthew Putman
Matthew Putman
CEO
Nanotronics

Inspect, Correct, Protect

9:10 am
Christophe Curny
Christophe Curny
Soitec

Soitec 4.0 Journey​

9:35 am
Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

Closing Remarks

SESSION 6 — Foundational Topics

5:00 pm
John Behnke
MODERATOR
John Behnke
General Manager FPS Product Line
Inficon

Welcome Remarks

5:05 pm
Koen de Backer
Koen de Backer
Vice President Smart Manufacturing and Artificial Intelligence
Micron

KEYNOTE: Leveraging Smart Manufacturing to Achieve Sustainability Goals

5:30 pm
Ming Chang Wu
Ming-Chang (Bright) Wu
Hon Hai Research Institute, Foxconn

Toward Digital Resilience – Transforming Management Practices Based on Cybersecurity 2.0 Standards​

5:55 pm
Jim Montgomery
Jim Montgomery
Principal Solution Architect
TXOne Networks

Is Wait-and-See a Good OT Security Strategy?

6:20 pm
Houng Sun
Dr. Houng Sun
Mirle

Advanced Automation for Smart Manufacturing​

6:45 pm
Andrew Seward, TEL
Andrew Seward
Field Solutions Product Marketing and Analytics Manager
TEL
David Gross, Siemens
Dave Gross
Portfolio Development Executive
Siemens

SEMI Smart Manufacturing Maturity Assessment Model 

7:10 pm
John Behnke
John Behnke
General Manager FPS Product Line
Inficon

Conference Closing Discussion—Where do we go from here?​

Bobby Mitra
Chair, SEMI Smart Manufacturing Global Executive Committee
Bobby Mitra
IEEE Fellow; WW Director Smart Manufacturing
Texas Instruments

7:35 pm
John Behnke
John Behnke
General Manager FPS Product Line
Inficon

Closing Remarks

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Deventer, July 27, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and Rohde & Schwarz GmbH & Co. KG, a market leader in the fields of measurement technology and communications, today announce the continuation of their longstanding partnership through several new projects in ASIC development.

The two companies have been working together for over 10 years and in this period RoodMicrotec has carried out the test development for various high frequency ASICs used by Rohde & Schwarz in their products. RoodMicrotec performs wafer and component level tests as well as qualifications prior to product launch. For the coming years, further projects of this kind are already scheduled.

"At Rohde & Schwarz, we rely on our own in-house expertise to develop our high-performance ASICs and therefore count on partners who share our high standards. We appreciate the quality RoodMicrotec offers - from quotation to test development, qualification and volume testing," says Bastian Nagel, Senior Director Mixed Signal ASIC Development at Rohde & Schwarz.

RoodMicrotec also appreciates the collaboration with Rohde & Schwarz, especially the respectful interaction and the high level of professional expertise.

Jan de Koning Gans, Managing Director of RoodMicrotec GmbH says: "Our projects with Rohde & Schwarz constantly pose new technical challenges, thus allowing us to broaden our know-how and the quality of our work from project to project."

About Rohde & Schwarz
The Rohde & Schwarz technology group develops, produces and sells a wide range of electronic capital goods. The company’s entire product portfolio represents a valuable contribution to a secure and networked world. In the markets of test & measurement, secure communications, networks & cybersecurity, as well as broadcast & media, customers around the world rely on Rohde & Schwarz and its technologically leading solutions. In addition to its well-established business areas, the Group invests in future technologies such as artificial intelligence, Industrial Internet of Things (IIoT), 6G, cloud, and quantum technology.

Further Information
Email: [email protected], Web: www.rohde-schwarz.com

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

RoodMicrotec N.V. publishes the unaudited Interim Report for 2022

• Total income EUR 7.3 million (HY1 2021: EUR 7.3 million)
• EBITDA EUR 1.4 million (HY1 2021: EUR 1.3 million)
• Net profit EUR 0.6 million (HY1 2021: EUR 0.4 million)

Deventer, July 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the unaudited Interim Report and the half-year results for the period ended on June 30, 2022.

The total income in the first half-year of 2022 is EUR 7.3 million, which is equal to the total income reported for the first half-year of 2021 and for the second half of 2021. The stable total income is driven by a continued strong delivery level, especially in the test operations unit. In the first half of 2021 we ordered and received wafers for one of our SCM customers to manage the supply chain during a planned change of an assembly house. About EUR 0.4 million was realized for these wafers as total income and approximately the same amount was accounted for in the cost for raw materials and consumables. This resulted in a higher total income and a higher cost of materials in the first half of 2021 without an impact on the net profit. These parts will be delivered during the second half of 2022 where only part of the selling price will be recognized in the total income. The profit will therefore be positive.

EBITDA increased from EUR 1.3 million for the first half of 2021 to EUR 1.4 million for the first half of 2022. The lower cost of raw materials together with a good cost control have continued to reduce the overall costs in the first half-year of 2022.

Compared to the first half of 2021, the depreciation was lower in the first half of 2022 due to lower investments during 2021. The financing costs remained unchanged.

The net profit for the first half-year of 2022 increased by 47% to EUR 0.6 million compared to the first half-year of 2021.

(x EUR 1,000) Unaudited
HY1 2022 Unaudited
HY1 2021
Total Income 7,317 7,282
EBITDA 1,440 1,317
Net profit 644 437


Net cash flow from operating activities was positive with EUR 0.3 million (2021: positive with EUR 0.9 million). The change is the result of an increase in working capital during the first half of 2022. Net cash flow was negative with EUR 0.6 million (2021: positive with EUR 0.6 million). This was mainly due to the lower net cash from operating activities as well as investments and redemption of the 2012 perpetual bond during the first half of 2022.

The order book increased considerably compared to December 31, 2021, which is encouraging and indicates that a big part of the forecasted increase in total income for 2022 over last year is now covered with orders.

“Despite the general supply chain situation in the world, we have been able to continue our test operations at a high utilization level. This shows that we have logistics under control and are well prepared for the future increase in demand”, says Martin Sallenhag, CEO of RoodMicrotec. “The global shortage of semiconductor supplies as well as logistic challenges may still impact our ability to meet our plan for the full-year 2022, but we are closely monitoring the situation to be able to act if necessary.”

Unaudited Interim Report 2022
You will find the complete unaudited Interim Report 2022, which is available only in English and as an electronic version, on our corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.

Conference call
CEO Martin Sallenhag and CFO Arvid Ladega will present the unaudited Interim Report 2022 and respond to questions. You are invited to join RoodMicrotec’s conference call for media, analysts and shareholders (a Microsoft TEAMS event) on Thursday, July 21, 2022 at 9:30 CEST

Login-information:
Join with your computer or mobile app Click here to join the meeting
Or call in (audio only)
+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich

Find a local number – in case you are in another country
Phone Conference ID: 760 330 187#

Financial calendar
July 21, 2022 Conference call for media, analysts and shareholders
October 13, 2022 Trading update quarter 3-2022
January 26, 2023 Publication (preliminary) annual total income 2022

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com
Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is only published in English. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

Established in July of 1982 by Sig, Kail, and Mariellen Wathne (hence the name, “SiKaMa”), Sikama was founded to design, develop, and manufacture high quality reflow soldering and curing systems utilizing a first of its kind high efficiency conductive heating technology to support the demands of the electronics industry.

After nearly 40 successful years, Sikama was purchased by Herb Weigel. Keeping with the mission originated by the founders, Herb’s goal is to elevate Sikama’s products to keep pace with the demands of the industry and exceed customer expectations. With an enhanced product roadmap and a growing number of services to support customers, Sikama is positioned better than ever to meet the increasing demands of its customers.

Sikama continues to grow its production space and team to meet the increasing demand for small footprint, high efficiency, and long-lasting products. In addition, with the launch of the fluxless EA UP1200, the company is positioned better than ever to meet the needs of the most demanding applications.

Here’s what was happening in 1982 when Sikama was founded:

• Time Magazine’s Machine of the Year was The Computer
• Biggest Blockbuster of 1982 was E.T.: The Extra-Terrestrial
• Superbowl XVI Champions were the San Francisco 49ers
• Billboard’s #1 Song was Physical by Olivia Newton-John
• Adobe was founded in California by Chuck Geschke and John Warnock