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BIOGRAPHY Dr. Da Yang is Senior Director of Product at NVIDIA, where he leads the AI product development for Semiconductor and EDA applications. Before joining NVIDIA, Da was Vice President of...

BIOGRAPHY As President of SEMI Americas, Joe Stockunas leads efforts to increase the value SEMI Americas delivers to members, directs North America sales and services, and drives events and...

Advanced Topography Correction Planarization Technology for Yield EnhancementABSTRACTThe evolution of advanced semiconductor processes, such as Backside Power Delivery Networks (BSPDN) and wafer...

Controlled Cracking-Induced Delamination for Polymer-Based CleaningABSTRACTThe continuous miniaturization of microelectronic devices imposes increasingly strin gent requirements on surface...

Improvement of Hybrid Bonding By Controlling Surface with Copper Pads Using Functional WaterABSTRACTThe strong demand for higher device integration density in advanced semiconductor manufacturing has...

BIOGRAPHYNasser Peyghambarian, PhD, is an Emeritus professor of Optical Sciences and Materials Science and Engineering at the University of Arizona. He is currently the Technical Director of the...

BIOGRAPHYOver 33 years of experience at leading semiconductor companies (TSMC, Applied Materials, Global Foundries), with expertise in all aspects of management, from advanced 3DIC R&D to...

Megasonic Removal of Flux Entrained in Narrow Gaps in Packaging StructuresABSTRACTIn electronic packaging, Solder Paste Reflow process is routinely used to attach capacitors on a chip to copper pads...

BIOGRAPHYMike Glavin is Program Director of Workforce Development at the SEMI Foundation, where he leads global, employer-driven strategies to strengthen the semiconductor talent pipeline. He...

Dummy Gate Poly Wet Etch Studies in GAA Nanosheet FlowABSTRACTDummy gate polysilicon wet etch clean studies were conducted in the advanced nanosheet based gate all around (GAA) process flow. The...

An Innovative Low-Azole Metal Hard Mask Etchant with an Environmentally Sustainable Cu/Co Integration SchemeABSTRACTIn advanced BEOL manufacturing at the Sub-14 nm node, copper interconnects are...

Improved Cu Recess Control via Surfactant-Modulated Electrochemical Kinetics in Post-CMP CleaningABSTRACTHybrid Cu bonding has become crucial in fine-pitch 3D semiconductor integration for achieving...