BIOGRAPHY
Over 33 years of experience at leading semiconductor companies (TSMC, Applied Materials, Global Foundries), with expertise in all aspects of management, from advanced 3DIC R&D to large-scale manufacturing operations. Demonstrates strong leadership skills in multinational teams, successful startups of new fab operations and new businesses, and proven track record in commercializing cutting-edge technologies.
CURRENT ROLE
Advanced Ion Beam Technology, Inc. | President
Hermes-Epitek Corp. | Senior Vice President, Research & Development
- Leading R&D strategies focused on the design and manufacturing of advanced semiconductor equipment, MOCVD, ICP etcher for semiconductors and SiPh .
- Overseeing core technological development in Ion Beam Technology, MOCVD (Metal-Organic Chemical Vapor Deposition), and High Temperature Dry Etching systems.
- Driving innovation in equipment engineering to meet the evolving demands of next-generation semiconductor fabrication.
- Developing and selling innovative equipment for extending Moore’s Law as well as thinner & higher quality GaN 2DEG power devices for 2000VDC operation.
- P&L +Overall operating responsibility for Advanced Ion Beam Technology, Inc.
EXPERIENCE
Taiwan Semiconductor Manufacturing Company (TSMC) | 2003 – 2023 20-Year Tenure with Progressive Leadership Roles
- Sr. Director of Technology | TSMC Japan 3DIC R&D Center (2019-2023)
- Spearheaded the development of next generation 3DIC packaging technologies and advanced semiconductor process R&D.
- Director | Manufacturing Technology Center (2015 – 2019)
- Vice President, Operations | TSMC Solid State Lighting (2011 – 2015)
- Director | New Business Fab Operation (2010 – 2011)
- Fab Operation Positions, Engineering Mgr and Deputy Director in TSMC Fabs
AXT, Inc. | California, USA | 2001 – 2003
Division Vice President, Operations (Optoelectronics Division)
- Managed operational performance and global supply chain strategies for the Optoelectronics business unit in Silicon Valley.
EDUCATION
- Ph.D. in Materials Science and Engineering | Rutgers University, New Jersey, USA
- M.S. in Mechanics & Materials Science | Rutgers University, New Jersey, USA
PATENTS & PUBLICATIONS
- Intellectual Property: 38 Granted US Patents (USPTO)
- TSMC (34), Applied Materials (5), GlobalFoundries (2), AXT (1).
- Publications: Over 40 Technical Papers in peer-reviewed journals and conference proceedings.
- Thought Leadership: Over 30 Invited Presentations at international technical conferences and global workshops.