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Deventer, October 12, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and CERN, the European Laboratory for Particle Physics, are expanding their collaboration with the Compact Muon Solenoid (CMS) Outer Tracker ASICs project. The long-standing partners are thus jointly facing another large and significant project.

The ASICs tested for the CMS will enable the collection of essential data during experiments in the Large Hadron Collider (LHC). The LHC is purpose-built to help scientists in addressing fundamental questions within the field of particle physics.
As part of the planned 2026 upgrade to the CMS detector, CERN will again use RoodMicrotec's expertise and testing services. RoodMicrotec will test and deliver over 1,000 12" silicon wafers. The three ASIC modules on the wafers will become an integral part of the detectors. They will collect and process the enormous amounts of data that emerge during the generation of collision experiments.

"We are very pleased to have this long-standing partnership with RoodMicrotec. In the past, we have been able to successfully test and apply the ASIC components that are so important for science," says Kostas Kloukinas, project manager of the CMS Outer Tracker ASICs project at CERN.

For RoodMicrotec, the cooperation with CERN also means a lot. Especially the opportunity to contribute to the progress of science is very fascinating. Furthermore, the project helps to advance the company's own expertise even further.

"The employees of RoodMicrotec are proud to be able to significantly contribute with their services to the basic research of the large CERN family," says Martin Sallenhag, CEO of RoodMicrotec.

About CERN
CERN, the European Laboratory for Particle Physics was founded in 1954 and is the world's leading laboratory for particle physics. Here, physicists and engineers explore the fundamental structure of the universe to find out what it is made of and how it works. For their studies of the basic constituents of matter – the elementary particles – they use the world’s largest and most complex scientific instruments. To investigate those particles, they are accelerated to almost the speed of light and thus made to collide. The resulting events tells physicists how particles interact and provide insights into fundamental laws of nature. CERN has 23 member states and further nations from all over the world that contribute to its research programs.
For more information please visit https://home.cern/science/experiments/cms

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

Deventer, September 28, 2023 – RoodMicrotec N.V., a leading independent company for semiconductor supply and quality services, and Angst+Pfister Sensors and Power AG, an independently operating company of the Angst+Pfister Group, today announce their cooperation for testing semiconductor-based temperature sensors. These highly accurate sensors are able to measure extremely fine temperature differences down to +/-0.1 °C in wide temperature ranges from -45 °C to 130 °C.

Such sensitive and particularly accurate sensors will subsequently be used in industrial applications, in medical technology, and in the automotive sector and thus have to be tested with the greatest precision. In addition, these sensors have a very small drift, a repetition accuracy of 0.01 °C and a extremely fast reaction speed. Another advantage is that the sensor can be customized. The housing, the sensor technology, or the cables can be specially adapted to customer requirements.

"For this project, it was important for us to have a reliable partner who works with the utmost care. As our high-quality components are often used in very sensitive areas, they need to be tested at the highest level," says Robin Ellinger, Product Manager Temperature Sensors of Angst+Pfister Sensors and Power.

For RoodMicrotec, this collaboration means a great appreciation of its capabilities, as the company specializes in the precise testing of highly sensitive components.

"We are really pleased that the quality of our work and our capabilities are so highly appreciated in the semiconductor business. For us, the most fundamental basis of a strong cooperation is mutual trust," says Martin Sallenhag, CEO of RoodMicrotec.
About Angst+Pfister Sensors and Power AG

About Angst+Pfister
Angst+Pfister Sensors and Power AG belongs to the Angst+Pfister Group. The Group´s headquarter is located in Switzerland. It has been a leading developer and manufacturer of technical components and engineering solutions for more than 100 years. With local sales and technical support units as well as logistics centers all over the world, the company serves more than 20,000 customers of numerous industries in over 50 countries. Angst+Pfister operates state-of-the-art research and development centers in Switzerland, Turkey, and Italy. Furthermore, the company runs its own production facilities for elastomer and rubber-metal parts and compounds in Switzerland, Turkey, Italy, Denmark, China, and Vietnam. To complement the capabilities, Angst+Pfister has production partners in over 15 countries, thus enabling the Group to always be at the cutting edge of technology.

Angst+Pfister attaches the utmost importance to reliability and flexibility as well as the respectful and fair treatment of all people who are somehow correlated with them. In proactively implementing the principles of the "United Nations Global Compact", Angst+Pfister pursues the goal of sustainability in all its activities in order to have a positive impact on our planet and society through pragmatic, meaningful, and measurable initiatives.

For more information please visit www.sensorsandpower.angst-pfister.com

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

Industry survey finds 83% of respondents would be more inclined to buy used equipment with money-back guarantee.

Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced changes to its industry-first “Money Back Guarantee” (‘MBG’) program that will expand access to buyers by eliminating the premium previously associated with this warranty. Moov will now offer its no-questions-asked, money-back guarantee free of charge for end users (semiconductor manufacturers) who purchase semiconductor equipment and parts through Moov’s global marketplace, valid on over 90% of inventory. This announcement comes as Moov’s marketplace surpasses another milestone, exceeding $4bn FMV in active listings for pre-owned semiconductor manufacturing equipment.

Historically, reliability has been a significant barrier for semiconductor manufacturers looking to incorporate secondhand equipment in their procurement strategies. In fact, this problem has been so pervasive that 81% of industry respondents surveyed by Moov “strongly agree” or “agree” that reliability is a top barrier to purchasing secondhand semiconductor manufacturing equipment.

“Reliability is arguably the biggest barrier to the growth of the global secondary equipment market, and the growth of used equipment as a percentage of fabs’ overall equipment spend,” said Steven Zhou, CEO and cofounder of Moov Technologies. “In growing Moov to become the world’s largest marketplace for used equipment, solving the reliability challenge is at the core of just about everything we’ve built – from verified listings to digital inspections, white-glove logistics, and most importantly our no-questions-asked money-back guarantee.”

A money-back guarantee fundamentally shifts risk away from buyers and significantly impacts manufacturers’ willingness to purchase used equipment. Indeed, 83% of industry respondents agreed that they would be more inclined to purchase secondhand equipment if offered a 100% no-questions asked money-back guarantee.

Moov’s decision to offer its MBG free to all buyers reflects its commitment to quality.

“We eliminated the small premium on this program because Moov stands by the quality of our service and inventory on our marketplace,” said Raymond Mahon, Head of Customer Success at Moov. “All eligible purchases on Moov will now include our no-questions-asked, money-back guarantee so that buyers can fully leverage the secondary market as an integral part of their procurement strategy – without the risk historically associated with purchasing secondhand equipment.”

To learn more about Moov’s Money Back Guarantee program visit www.moov.co/services.

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov's platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

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PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

This webinar will address the what, why, and how of PFAS in the semiconductor industry. Laurie Beu, noted semiconductor EHS consultant and leader of SIA’s Semiconductor PFAS Consortium, will provide an overview of PFAS materials, concerns about health effects, and the current state of regulatory response. Laurie’s talk will be followed by Ralph Dammel, Technology Fellow at EMD Electronics, who will provide insights from a materials manufacturer’s perspective on the use of PFAS in the multiple markets addressed by EMD. He will discuss the importance of PFAS in lithography chemicals, the impact of potential new regulations, and options to reduce or eliminate the use of PFAS in semiconductor applications.

Virtual, Online
United States

Laurie Beu
Laurie S. Beu, P.E.
Consultant
Laurie S. Beu Consulting
Ralph R. Dammel
Ralph R. Dammel
Technology Fellow, CTO Office
EMD Electronics
James Amano
Moderator
James Amano
Sr. Director, EHS
SEMI
EMG FOA Standards

PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector. 

 

10:00 am - 11:00 am Off Add to Calendar 2023-10-18 10:00:00 2023-10-18 11:00:00 Spelling semiconductors without “F” (luorine) PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue. Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector.    Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

SANTA BARBARA, CA – September 1, 2023 – Sikama International Inc., in collaboration with AirProducts Inc.™, is proud to announce the full commercial launch of its acid-free Electron Attachment (EA) Fluxless Reflow Soldering System, a revolutionary step for the Advanced Packaging Semiconductor sector.

The innovative technology behind this system is based on the Electron Attachment (EA) principle for activating hydrogen, a method that AirProducts has been refining for the past 15 years to efficiently reduce surface oxides. The EA technology is engineered to break down H₂ molecules into hydrogen anions, which are then targeted towards the soldering surfaces to effectively clean and reduce oxides before the reflow process. Additionally, this technology operates at ambient pressure and temperatures well within the window of traditional reflow processes.

The key advantages of this technology include:
• Truly Residue-Free: Enhanced reflow quality without flux-induced solder voids and wafer contamination. No post-reflow cleaning equipment is required and significantly less oven cleaning.
• In-line Process: Easily integrated into existing manufacturing lines without batch processing. The EA process occurs immediately before the reflow process.
• Environmental Impact: The EA flux-free process is entirely residue-free and environmentally benign with no organic vapors, hazardous residues, or CO2 emission.
• Ambient Pressure and sub-reflow temperatures: No vacuum requirements and safely processes substrates.

Sikama, as the exclusive global integrator of this technology and partner with AirProducts, views the technology and equipment commercialization as “a game-changer for this industry, as the need for advanced solutions to packaging evolutions in the semiconductor industry continue to evolve”, according to Herb Weigel, President and CEO of Sikama International.

The Sikama EA1200 Solder reflow oven is certified to EN 600204-1, SEMI S2/S8/S22/S23/F47/E6, is CE certified, and is verified to be compliant with NFPA79 in installed applications. Nearly 50 Worldwide Patents have been issued on this technology. The technology is well suited to provide significant benefits to small geometries in wafer bumping, copper pillar, and flip chip applications.

Established in 1982, Sikama International, Inc. designs and produces its products in Santa Barbara, California. Their reflow system offerings provide exceptional performance, with the fluxless systems set to redefine industry standards.

Reliable. Repeatable. Responsible. Reflow.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

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Highlighted content

Abstract:

For many generations of technology nodes, Moore’s Law has reliably delivered the doubling of transistor density every 1.5-2 years while bringing down the cost per transistor. However, in recent advanced nodes, Moore’s Law has slowed down and the cost of advanced node chips has increased.

To keep up with performance demands, manufacturers have continued to increase chip size to have large System on Chip (SoCs), and we have seen chip sizes reach the lithographic reticle limits. Moreover, increasing chip size beyond reticle limits also decreases chip yields and contributes to increasing the cost of manufacturing. Thus, increasing chip sizes beyond reticle limits is not a solution.

The semiconductor industry needs to be on the path of delivering more performance and functionality at reasonable prices despite the slowing of Moore’s Law.

One popular approach the industry is adopting to deliver improved performance is focusing on advanced packaging, including the use of chiplets, hybrid bonding and state of the art 3D stacked systems. This course will discuss the meaning and the need for advanced packaging and dive deeper into each one of these advanced packaging approaches. 

Outline

  1. Need to Advanced Packaging
  2. Types of Advanced Packaging
  3. 3D bonding and Intro to Hybrid Bonding for Advanced Packaging
  4. Types of Hybrid Bonding, Current Status and Challenges
  5. Future opportunities in Hybrid Bonding
  6. Summary

Featured Speaker Biography:

Arsalan Alam is a Sr. Packaging Engineer at AMD’s Advanced Packaging Group in Austin, Texas. He completed his PhD in Electrical and Computer Engineering with the Center for Heterogeneous Integration and Performance Scaling (CHIPS) group at the University of California, Los Angeles, in 2021. He received his Master’s degree in Microelectronics and VLSI from IIT Roorkee, India and his Bachelor’s degree in Electronics and Communication Engineering from the Zakir Hussain College of Engineering and Technology, India. His research interest is in advanced packaging, including FOWLP, 2.5D, and 3D. He holds about 20 publications and two patents with multiple patents pending. He was the winner of the IEEE EPS Packaging Vision Award, 2020 and recipient of the Broadcom Foundation Fellowship, 2017-2018.

Virtual
United States

Arsalam Alam
Arsalan Alam, PhD
Senior Packaging Engineer
AMD
Gity Samadi
Moderator
Gity Samadi, PhD
Senior Director, R&D Programs
SEMI
FlexTech

This course will discuss the meaning and the need for advanced packaging such as chiplets, and 3D stacked systems, with a deep dive into hybrid bonding.

Our speaker will be a young, but distinguished engineer from AMD's Advanced packaging Group in Austin, Texas, Dr. Arsalan Alam. Come up to speed quickly and efficiently on the latest thinking on how the semiconductor industry will be delivering more performance and functionality despite the physical limitations of the atom.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles

[August 7, 2023 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 6 - 8, 2023. Visit booth #I2800 to experience the latest in Smart Factory Semiconductor Inspection.

TRI's AI-powered AOI solutions for the Semiconductor and Advanced Packaging Industry can inspect Die and Wire Bonding, wafer surface and bumps, epoxy, and foreign material detection.

For the first time, TRI will be exhibiting the Wafer Inspection Platform, TR7950Q SII, equipped with a state-of-the-art mechanical structure, an optimal 2.5 µm high resolution, with an outstanding 25MP camera. The TR7950Q SII is equipped with an innovative optical module for the inspection of highly reflective surfaces, specialized for Wafer Inspection.

TRI will showcase the latest 3D SPI with a 3.5 µm high-resolution 25MP Camera, TR7007Q SII, and the AI-powered 3D AOI, TR7700Q SII, with the improved 25MP 2.5 µm configuration. The TR7007Q SII and the TR7700Q SII represent TRI's latest inspection innovations for the Advanced Packaging and Semiconductor Industry. The lineup will also include an X-ray Inspection Demo Station and TRI's innovative AI Solutions, which include the AI Station, AI Training Tool, and the AI Verify Host.

Visit TRI's Booth No. I2800 at SEMICON Taiwan 2023 to learn more about TRI's SEMI applications and the latest innovations in Test and Inspection for the Advanced Packaging Industry.

About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

Sikama International, a trusted provider of state-of-the-art reflow systems is proud to announce their new partnership with CMT, a global leader specializing in back-end semiconductor solutions.

CMT was formed in August 2010 by Mr. CW Kwak, who has over 30 years experience in the semiconductor industry. CMT offers both material and equipment solutions in the back-end semiconductor assembly market.

CMT is a unique global marketing and sales company. CMT focuses on a micro-level marketing working directly with clients and customers through offering specific projects, right beta sites, and global project management. CMT focuses on short-term projects to deliver sales on client’s current products, then offers mid-term projects for next 2-3 years, and long-term programs 5-10 years out to deliver continuous long-term growth and sustainability.

Sikama’s new partnership with CMT will enable both companies to expand their reach to provide customers with an expansive range of solutions on a global platform.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

Sikama’s sintering pre-dry ovens offer conductive heating in a controlled environment with adjustable O2 levels as low as 5ppm in a footprint of less than 1 square meter. With their compact design, highly efficient conductive thermal transfer to high-mass components, and the lowest carbon footprint in the industry, Sikama’s products are the perfect fit for any power electronics production line. Additionally, with only 15 minutes before reaching temperature set points, energy costs and gas requirements are kept to a minimum.

With SMEMA and SECS/GEM capability and customizable profiling, their Ultra Profile and Falcon series ovens seamlessly integrate into the automated production line. Providing accurate and consistent temperatures, controlled cooling rates, and each zone fully adjustable to within 1°C, the guesswork is removed from the pre-drying process. With multidirectional process flow using either sweeper bar or walking beam transport systems and the lowest vibration and power consumption in the industry, Sikama has a configuration for any need.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

Wooptix SL, a company based in Tenerife, Madrid and San Francisco, has announced the signing of a 10-million-dollar Series B financing round. The round includes participation by: Bullnet Capital, CDTI (Centre for the Development of Technology and Innovation), Danobatgroup, European Innovation Council Fund (EIC), Fagor Automation, Intel Capital, Mondragón Promotion and Tel Ventures.

The company is focused on commercializing semiconductor metrology equipment incorporating wavefront phase imaging. “Phemet®, the system developed by Wooptix, measures the silicon wafer warpage, and its accuracy is a “significant advance in the industry,” affirms José Manuel Ramos, Founder and CEO of the company.

Wooptix's patented technology enables blank and patterned wafer-shape measurement in less time and with higher resolution than current systems being used in the industry. "Wooptix's wavefront sensor and its semiconductor applications are generating interest from key players in the semiconductor industry as evidenced by the Series B financing round,” explains Javier Elizalde, Co-founder and COO.

The company has been recognized as well by the EIC Accelerator Program through a 2.5M€ grant in addition to the equity investment. The grant and investment support Wooptix's product introduction and future technological innovation including the manufacture, delivery, and installation of three semiconductor metrology tools in Japan, the USA and the Netherlands this year.

"Keeping in mind that each Phemet® is only a metric ton weight, together with the sensitivity of the instrument components that enable measurements at the nanometer scale, Wooptix demonstrates a world-class engineering and operations capability,” continues Elizalde.

Next steps
Wooptix has a well defined roadmap for each product line to meet the needs of lab and fab customers. In the case of the semiconductor metrology business unit, the next step is to automate Phemet®. Enhanced automation will reduce risk of contamination of wafers under measurement and provide consistent reproducibility to the system. Due to the flexibility of Wooptix’s design, another step is to integrate Phemet® into existing semiconductor equipment platforms from tool vendors.

Phemet® and the Series B financing round demonstrate Wooptix’s growth and maturity as it begins initial tool deliveries to customers. "It is really valuable for us to transition now from an R&D company to become a product and manufacturing company. With this objective in mind, we are building the necessary infrastructure, including procedures and certifications to protocols and management teamwork, to support customers as we enter the market," explains José Manuel Ramos.

Semiconductor Equipment Industry in Numbers
According with SEMI (the global semiconductor industry association) the semiconductor equipment sales forecast for 2023 is $87 billion. "The semiconductor equipment market will see a strong rebound in 2024,” said Ajit Manocha, SEMI President and CEO. "Projections for robust long-term growth driven by high-performance computing and ubiquitous connectivity remain intact.”

As reported by SEMI, the wafer fab equipment segment is projected to account for the bulk of the recovery to $100 billion in 2024, generating $87.8 billion in sales, a 14.8% increase.

About Wooptix
Wooptix is a leader in semiconductor metrology through wavefront phase imaging, a technique derived from adaptive optics research in astronomy. With a multidisciplinary team, Wooptix aims to disrupt the semiconductor metrology industry with the highest lateral resolution and fastest measurement technique for inline fab measurements.

The company has developed Phemet®, a wafer shape lab tool for blank and patterned wafers, ahead of the upcoming fully automated fab tool, expected in 2024. Wooptix has already deployed Phemet® at several customer sites worldwide.

Wooptix is based at Tenerife, Madrid (Spain) and San Francisco (USA).