Munich, Germany – November 4, 2024 – SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion today announced the 2024 20 Under 30 Award Recipients, honoring exceptional young professionals who are driving innovation and success in the semiconductor industry.

This prestigious award highlights the most promising leaders under 30-years-old who are making significant contributions within the microelectronics supply chain, fostering a more diverse and inclusive environment in a critical sector.

"Recognizing the innovators of tomorrow is crucial for the growth and sustainability of our industry," said Laith Altimime, President of SEMI Europe. "The 20 Under 30 Award not only honors exceptional talent but also inspires a new generation to drive change and foster collaboration in the semiconductor sector. By proudly showcasing these talented individuals, SEMI Europe aims to foster a culture of recognition that empowers young professionals to pursue their ambitions and drive change."

2024 20 Under 30 Award Recipients

The 2024 award recipients represent a diverse range of roles and specializations within the European semiconductor landscape:

• Abel Andemichael, PCB Layout Designer, Comet AG
• Alicia Pang Li Si, Process Engineer, Soitec
• Anne-Mary YEBOAH, Technology Manager, Soitec
• Annika Schnell, Application Specialist, DR YIELD
• Augustin Detruit, Head of Production/Production Manager, ERS electronic GmbH
• Charis Kalantzi, Lead Application Engineer, Cadence Design Systems
• David Coenen, Senior researcher Silicon Photonics Thermal Management, imec
• Elisabeth Brierley, Sustainable Graduate, Edwards – Atlas Copco group
• Felix Holtsch, Engineer 2 – Product Specialist, Tokyo Electron Europe (TEL)
• Felix Kohler, Use Case Manager, Electronics business of Merck KGaA, Darmstadt, Germany
• Giulia Cioffi, Asic Digital Design Staff Engineer, Synopsys
• James McGrath, CVD Process Engineer, KLA (SPTS Division)
• Kamal Rudra, R&D Integration Engineer, IBM
• Lizzie Boakes, Researcher, imec
• Luca Sinkó, R&D Team Leader, SEMILAB
• Mouadh Ayache, Senior Engineer, Synopsys
• Pascal Fasel, Process Engineer / Project Manager, Comet AG
• Pheobe Kuo, Customer Engineer, Applied Materials
• Steve Kalkbrenner, Senior Software Developer, Kontron-AIS
• Thibaud Rebotier, Senior Industrial Engineer, ASM International

"As professionals in the semiconductor industry, it's our collective responsibility to nurture new talent as well as spark curiosity and passion for our dynamic field," said Stephan Haferl, CEO of Comet. "By supporting SEMI in honoring the young leaders who will shape our future, Comet proudly contributes to this mission."

Dan Collins, General Manager of KLA's SPTS Division, said, "We congratulate all the shortlisted individuals and feel it is important to recognize and celebrate these worthy winners as they continue their career journeys to shape this industry and lead it to a bright future."

"We are proud to partner with the SEMI 2024 20 Under 30 Award," said Olga Needham, Senior HR Director, Tokyo Electron Europe (TEL). "This award is dedicated to recognizing and empowering young leaders who are making significant contributions to their organization and customers. At TEL, we believe that by investing in the next generation, we are not only helping to shape the future but also creating opportunities for growth and innovation in our industry."

The 2024 20 Under 30 Award is sponsored by Comet Group, KLA and Tokyo Electron Europe (TEL), highlighting their commitment to nurturing emerging talent in the semiconductor field.

SEMI Europe will host the award ceremony during SEMICON Europa 2024, which will take place from November 12-15 at Messe München in Munich, Germany. Co-located with electronica, this premier exhibition and conference for the microelectronics supply chain will showcase keynotes from thought leaders in design, manufacturing, academia, and government. Registration is open.

For more information about the 20 Under 30 Award or to learn about future nomination opportunities, visit SEMI Europe 20 Under 30 Award. For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#SEMICONEuropa).

About SEMI

SEMI^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON^® expositions and events, technology communities, standards and market intelligence help advance our members' business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Maria Daniela Perez / SEMI Europe
Phone: +49 160 2562977
Email: [email protected]

Samer Bahou/SEMI Corporate
Phone: 1.408.943.7870
Email: [email protected]

• Read more about SEMI Europe Announces 2024 20 Under 30 Awards Celebrating Innovation and Leadership

MUNICH, Germany ─ October 14, 2024 ─ Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of the semiconductor market. Co-located with electronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain. Registration is open for APC and FMF.

"Global collaboration across the semiconductor industry is essential for driving sustainable, exponential growth,” said Laith Altimime, president of SEMI Europe. ”SEMI Europe Advanced Packaging Conference and Fab Management Forum provide invaluable platforms for stakeholders to share insights and innovations, ensuring we leverage cutting-edge technologies and strategies that enhance performance while paving the way for a more sustainable future." 

Advanced Packaging Conference ─ 
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency 

Demand for High Performance Computing (HPC) is increasing, driven by advancements in artificial intelligence and Large Language Models like ChatGPT. HPC’s expansion requires innovative solutions in chiplet design, heat dissipation, and power optimization. The upcoming APC will provide a platform to explore enhancing each of these developments, highlighting collaboration among academia, industry, and government.   

This year’s APC will focus on:

• The Role of Chiplets in Enhancing Performance and Efficiency
• Power Optimization Techniques for Next-Generation Applications
• Advances in Miniaturization and Material Integration
• Innovations in Heat Dissipation and Thermal Management
• Collaborations Across Academia, Industry, and Government   

Speakers include experts from Amkor Technology, ASE Global, Atotech an MKS Brand, Besi, Chip Integration Technology Center (CITC), Comet Yxlon, EV Group (EVG), Evatec, GlobalFoundries, Guangdong Fenghua Semiconductor Technology, Henkel, IBM, Infineon Technologies, JCET, Koh Young Europe, QuantumDiamonds, RHP-Technology, RoodMicrotec, Robovision, STATS ChipPAC, and SUSS MicroTec.

The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, IBM, Koh Young Europe and SUSS MicroTec.

Fab Management Forum ─
Driving Innovation: Competitive, Sustainable and Collaborative Strategies 

To meet its evolving demands, the semiconductor industry must adopt competitive, sustainable, and collaborative strategies that enhance fab efficiency and performance. Industry stakeholders can develop innovative solutions for a sustainable future by integrating cutting-edge technologies and fostering partnerships.  This year’s FMF will focus on:

• Key Strategies in a Global Market Landscape
• Advancing Smart Manufacturing Solutions
• Europe's Environmental Transition: Stability to Sustainability
• Next-Gen Core Technologies for Future Fabs

Speakers include experts from Algorismic, ams OSRAM, BMW Group, Comet Yxlon, Flexciton, Infineon Technologies, INFICON, imec, Kontron AIS, minds.ai, Robert Bosch Semiconductor Manufacturing, STMicroelectronics, Synopsys, Texas Instruments, Tokyo Electron Europe, Watlow, and X-Fab.

The forum is sponsored by Comet Yxlon, Flexciton, INFICON, Lynceus, Tokyo Electron Europe (TEL), and Watlow.

Other SEMICON Europa 2024 Highlights

• CxO Summit: Top executives will share strategies for sustainable growth in Europe's semiconductor sector, focusing on navigating the evolving landscape through sustainability, supply chain resilience, and technological advancements.
• III-V Summit – Integrated Photonics: This summit will examine the role of III-V compound semiconductors in advancing next-generation electronics, focusing on their impact on high-performance, energy-efficient devices in telecommunications, computing, and photonics.
• ITF Chip into the Future - Powered by imec: This session will cover the EU Chips Act's implementation and impact on Europe's semiconductor ecosystem, highlighting collaborative research and innovations in chip design and manufacturing.
• MEMS & Imaging Sensors Summit: This summit will explore recent advancements in MEMS and imaging sensor technologies, focusing on their impact on agriculture, automotive, and healthcare, along with the integration of AI, machine learning, and data fusion in next-generation applications.
• Executive Forum Programs: These sessions will provide updates on key technological trends, including Silicon Carbide (SiC) power semiconductors, smart mobility solutions, and AI-driven manufacturing processes. Industry experts will also address sustainable energy and challenges related to electrification, presenting the latest innovations aimed at overcoming these obstacles.
• TechARENA Programs: Focused on emerging technologies, TechARENA sessions will explore advancements in fields such as medical technology, quantum computing, and cybersecurity. The discussions will also address global challenges related to supply chain management, sustainability, and talent development, with an emphasis on the role of European research and innovation in driving the growth of the semiconductor industry.

Programs in halls C1, C2 and Entrance West are complimentary for all SEMICON Europa and electronica visitors. For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#SEMICONEuropa).

SEMICON Europa 2024 

• Platinum: 
  Comet Yxlon, Edwards, INFICON, Invest in Pomerania, Koh Young Europe, Lam Research, Merck KGaA, Darmstadt, Germany, Schneider Electric, Siemens, Soitec, SUSS MicroTec and Tokyo Electron Europe (TEL)
• Gold: 
  Exyte, KLA and Synopsys
• Silver: 
  Adeia, EBARA, HCLTech, Honeywell, Kanken and Semilab
• Event:
  ASE Global, Atotech an MKS Brand, Catalonia Trade & Investment, CI Semi, Comet Group, DB Schenker, Entegris, EV Group (EVG), Flexciton, Fluor, IBM, imec, Lynceus, SCREEN, and Watlow 

About SEMI 

SEMI ^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts 

Maria Daniela Perez / SEMI Europe
Phone: +49 160 2562977 
Email:  [email protected] 

Samer Bahou / SEMI Corporate
Phone: +1 408 943 7870
Email: [email protected]

• Read more about SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future

PDF Solutions, Inc. (Nasdaq: PDFS), a leading provider of comprehensive data solutions for the semiconductor and electronics ecosystems, today announced it will host an Executive Conference on the power of AI to transform semiconductor design and manufacturing. This event will take place on December 12, 2024, in downtown San Francisco, CA, following the 70th Annual IEEE International Electron Devices Meeting.

This one-day Executive Conference will feature presentations from PDF Solutions executives, industry thought leaders, solutions partners and customers on the state of art and best practices to design, deploy, scale, and manage trusted AI/ML solutions across the global semiconductor industry.

Additional information including agenda, logistics, and registration, will be available in the coming weeks.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics ecosystems to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

• Read more about Save the Date: PDF Solutions announces an Executive Conference on the power of AI to transform semiconductor design and manufacturing

Brewer Science Elevates Veteran Leader and Welcomes New Market Strategy Officer to Propel Future Growth in Semiconductor Industry
Corporate leadership developments to drive projected growth and innovation

Rolla, MO – September , 2024 – Brewer Science, Inc., a global leader in developing and manufacturing innovative materials used to advance next-generation computing technologies, is elevating a senior leader and welcoming a new Chief Strategy Market Officer in order to embrace the projected company growth.

Projected Industry Growth Requires Strategic Leadership
Brewer Science is an industry leader for innovative materials used in the fabrication of microelectronics. Brewer Science’s unique expertise in both advanced packaging and photolithography technologies makes the company well placed for the projected growth in artificial intelligence and to enable the ever-increasing desire for faster computing and lower power devices. Our long history in antireflective coatings helped drive device miniaturization through advances in photolithography. Now these devices are combined in an intricate manufacturing process to form stacked microprocessors and high-bandwidth memory (HBM) using our advanced packaging materials. The strategic marriage of expertise in these two industries is critical for Brewer Science's continued innovation, thus leading to new leadership opportunities.

Ashwin Rao, Ph.D., Chief Market Strategy Officer ('CMSO')
Brewer Science welcomes Ashwin Rao, Ph.D., as our Chief Market Strategy Officer. Prior to joining Brewer, Ashwin was responsible for driving Henkel’s Go-To-Market strategy development in the North American adhesives market. With 20 years of experience in strategy, innovation and marketing at leading global specialty chemicals suppliers, Dr. Rao is well suited to fulfill the responsibilities of CMSO. His main goal is to leverage leadership and technical expertise of the company and steer the organization toward continued growth in its core and adjacent markets. Ashwin received his Ph.D. in Polymer Science from the University of Akron and an MBA from NYU’s Stern School of Business.

Dan Sullivan, Ph.D., Chief Product Development Officer ('CPDO')
Dr. Sullivan began his career at Brewer Science in 2004 after earning his Ph.D. in Chemistry from Michigan State University. He served as the Executive Director of Semiconductor Materials for six years, leading a team of talented researchers focused on inventing new technologies that solve semiconductor industry-related challenges. His expertise in chemistry, advanced lithography, and process integration has enabled Brewer Science to add to an increasing portfolio of products and processes that advance the semiconductor industry. In his new role as CPDO, Dr. Sullivan will have an increased focus overseeing the development of new products and capabilities. He will deliver new commercialized products that bring high value to the customer and set the direction for chemical characterization and engineering of products. Dr. Sullivan is eager to initiate a flawless transfer to high-volume manufacturing.

"We are thrilled to welcome our new Chief Strategy Market Officer, Dr. Rao, as well as elevate Dr. Sullivan to Chief Product Development Officer," said Dan Brewer, Chief Resource Officer at Brewer Science. "These talented individuals embody our company mission of being a company of the people, by the technology, for the customer, to achieve fulfillment. Their dedication, innovative spirit, and customer-centric approach are instrumental in our success. As we prepare for projected growth and respond to increasing industry demand, their leadership will be crucial in guiding us forward and continuing to deliver exceptional value to our customers."

Learn more about Brewer Science’s leadership team on the website.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique quality monitoring systems for water and air applications. We are Certified Employee-Owned and a Certified B Corporation™, using our business as a force for good. Our headquarters are in Rolla, Missouri, with customer support throughout the world. Learn more at: www.brewerscience.com.

• Read more about Brewer Science Elevates Veteran Leader and Welcomes New Market Strategy Officer to Propel Future Growth in Semiconductor Industry

Chip Integration Technology Center (CITC) today announced the appointment of Toni Versluijs as the new chairman of its Supervisory Board. Versluijs will serve as the incoming chairman from September through December. Effective January 1, 2025, he will take over the responsibilities from chairman Roel Fonville who is retiring.

Versluijs has an extensive background of more than 25 years in the semiconductor industry, of which more than 15 years in general and executive management roles. Prior to this appointment, he worked for NXP, where he led the In-Vehicle Networking product line and was NXP Nijmegen site director and statutory director of NXP Netherlands. Most recently, he led the Business Group MOS at Nexperia, served as statutory director for Nexperia in the UK and was part of the company’s global executive leadership team.

He explains his choice for CITC: “I look forward to using my many years of experience in the semiconductor industry to contribute to the success of CITC in Nijmegen. Nijmegen is a location with a long heritage in semiconductor packages that have changed the world. CITC is a unique venture and has a unique position between private parties, the academic world and knowledge institutes.”

CITC is a smaller and different kind of organization than his previous employers, but Versluijs sees the potential: “CITC has attracted quite some talent in recent years, built partnerships and initiated new developments. In short: it has laid the foundation for growth, and it will flourish in the coming years. I am convinced that it has the potential to change the world of semiconductor packaging again.”

The current chairman of the CITC Supervisory Board, Roel Fonville, adds: “The Supervisory Board is very pleased to welcome Toni Versluijs to our midst. His personality and broad experience in the industry and in the Nijmegen region will help the Board to fulfill its role in securing the continued development of the organization.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC's contribution to the ecosystem is to provide access to innovation, infrastructure, and education. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by local and regional governments.
www.citc.org

• Read more about Toni Versluijs to chair CITC Supervisory Board from January 2025

MUNICH, Germany ─ August 19, 2024 ─ Themed Innovation and Collaboration: Powering Sustainable Exponential Growth, SEMICON Europa 2024 will gather industry experts November 12-15 at Messe München in Munich, Germany for insights into the latest innovations and trends in sustainability, mobility, healthcare, materials, packaging, fab management and workforce. Co-located with electronica, SEMICON Europa, Europe’s premier exhibition and conference for the microelectronics supply chain, will feature keynotes from the electronics design and manufacturing ecosystem, academia and governments. Registration is open. 

"Leaders from across the value chain at SEMICON Europa will discuss innovations and collaboration strategies that are driving semiconductor industry growth in Europe and globally," said Laith Altimime, president of SEMI Europe. "The industry remains committed to ensuring harmony between technological advancement and environmental progress. We look forward to hosting visionaries as they offer insights into achieving sustainable growth and overcoming the talent gap."

A key highlight of the event, the CxO Summit, will bring together visionary leaders from across the value chain to discuss how Europe’s microelectronics ecosystem can collaborate to uphold strategic leadership. The Summit will serve as a stage for fostering insightful partnerships on pressing and emerging challenges throughout SEMICON Europa. Executives from AMS Osram, Bosch, Comet Group, Inficon, Porsche, Schneider Electric, Siemens, STMicroelectronics, and other leading companies will share insights on the critical issues shaping the foundation for sustainable exponential growth in the European semiconductor industry.

SEMICON Europa 2024 will feature the launch of the III-V Compound Summit that will showcase the critical importance and emerging impact of III-V compound semiconductors in driving the future of electronics.

“Advancements in III-V compound semiconductor materials are crucial for the next generation of high-performance, energy-efficient devices, supporting the industry to overcome manufacturing complexities, boost efficiency and reduce costs,” said Ajit Manocha, SEMI President and CEO. “The III-V Compound Summit at SEMICON Europa will be an indispensable discussion in how these technologies will transform the electronics landscape, marking the beginning of a new era of technological progress.” 

Additional SEMICON Europa Highlights

• ITF Chip into the Future - Powered by imec: Industry leaders will examine how the EU Chips Act can advance Europe’s semiconductor industry through collaboration, innovation, and investment. Discussions will cover key drivers, best practices, and the future of chip research and manufacturing.
• Advanced Packaging Conference: Leading experts will discuss innovations in chiplets, heat dissipation, miniaturization, and other advanced packaging techniques essential for meeting the high-performance computing demands of modern AI applications.
• Fab Management Forum: Presenters will explore strategies to enhance semiconductor manufacturing efficiency and performance. Topics include global market strategies, smart manufacturing, innovations, environmental sustainability, supply chain resilience, and next-gen technologies.
• MEMS & Imaging Sensors Summit: Sessions will examine how advancements in MEMS and imaging technologies are enhancing connectivity and driving innovation across sectors such as agriculture, automotive, and healthcare, with a focus on the integration of AI/ML and data fusion in next-generation applications.
• SEMI Networking Night: Industry stakeholders will gather to connect with peers and explore new business partnerships.

Executive Forum Programs 

• Cultivating a Thriving SiC Market: This session will feature insights from industry leaders addressing the challenges and solutions in Silicon Carbide (SiC) power semiconductors, crucial for automotive and AI applications.
• Electrification and Power Semiconductors: Examining key innovations in power semiconductors driving global electrification, this session will cover focus areas including efficiency, cost-performance, manufacturing technologies, and the role of semiconductors in advancing sustainable energy and electric vehicles.
• Global Automotive Advisory Council Summit - Smart Mobility Forum: Addressing current challenges and opportunities in automotive semiconductor technology, this forum will bring together stakeholders and innovators to explore trends, such as autonomous, electric and software defined vehicle, towards a sustainable future in mobility.
• Innovation Showcase: Attendees will learn about innovations in the microelectronics and semiconductor space.
• Integrated Photonics: This session will explore how photonic integrated circuits (PICs) are transforming various industries by combining optical and electronic systems into compact, high performance, energy and cost-efficient designs.
• Meet the SEMIs: Session attendees will have opportunities to network with SEMI European Committee Members, exchange ideas, and discuss ways to advance the industry.
• Smart Manufacturing: This session will explore AI solutions for smarter semiconductor manufacturing operations, including data acquisition, digital twins, and autonomous production, with a focus on climate. 

TechARENA Programs 

• 20 Under 30 Recognition Program: The 2024 SEMI Europe 20 Under 30 will honor young leaders in the microelectronics supply chain for their career success, leadership, commitment, community involvement, and collaborative innovation.
• Advocacy and Geopolitics: Exploring the European Economic Security Strategy's impact on the semiconductor industry, this session will feature presenters discussing how new policies affect global supply chains and the need for international cooperation to ensure competitiveness and long-term growth.
• Breakthroughs in Medical Technology: This session will explore how advanced medical electronics and semiconductors are advancing digital healthcare for the future.
• Building the Talent Pipeline – SEMI Initiatives: Session attendees will discover how SEMI initiatives are fostering a robust talent pipeline for the semiconductor industry through university partnerships, STEM outreach, ongoing training, and diversity programs.
• End-to-End Cybersecurity: Experts will come together to explore comprehensive solutions for securing semiconductor supply chains, protecting intellectual property, and ensuring product integrity in a connected world.
• EU Digital Forum: Partners from HiCONNECTS and other R&D EU-funded projects will demonstrate how innovative heterogeneous integration (HI) core technologies address major societal and technical challenges.
• European Projects for a Diverse Talent Pipeline: Speakers will highlight European Commission funded projects under the EU Chips Act aimed at addressing the urgent talent gap in the semiconductor industry by enhancing STEM education, re-skilling and up-skilling, promoting diversity, and sharing best practices in recruitment and onboarding.
• Future Disruptions: Experts will share actionable insights and strategies on critical topics such as supply chain management, sustainability, ESG, PFAS regulations, and geopolitical impacts to navigate future disruptions in the semiconductor industry.
• Future of Computing: This session will examine how advancements in quantum computing, neuromorphic computing, and trusted electronics are addressing global challenges and transforming the future of information processing with innovative solutions.
• Future of Work: Industry leaders will discuss how inclusive leadership can address the global talent shortage, develop the next generation of industry leaders, and foster a diverse and sustainable workforce.
• Materials Innovation: This session will examine how innovations in materials are advancing Moore’s Law, supporting sustainable semiconductor manufacturing, and addressing global environmental challenges.
• SCREEN─ Innovation For a Sustainable World: Experts will present updates on new equipment platforms and solutions for Industry 4.0, 3D-Integration, and More-than-Moore devices, drawing from 25 years of collaboration with European partners.
• Tackling Investment in Semiconductors Start-Ups: This session will feature demonstrations on how European innovations are enabling future technology roadmaps and scaling up start-ups in the industry. 

For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#SEMICONEuropa).

Press and media partners can register for free by contacting Sitong He at [email protected].

SEMICON Europa Sponsors 

• Platinum: Comet Yxlon, Edwards, INFICON, Invest in Pomerania, Koh Young Europe, Lam Research, Merck KGaA, Darmstadt, Germany, Schneider Electric, Siemens, SUSS MicroTec and Tokyo Electron Europe (TEL)
• Gold: KLA and Synopsys
• Silver: Adeia, EBARA, Honeywell, Kanken and Semilab
• Event: ASE Global, Atotech an MKS Brand, Catalonia Trade & Investment, CI Semi, Comet Group, DB Schenker, Entegris, EVGroup(EVG), Flexciton, Fluor, IBM, imec, SCREEN, and Watlow 

About SEMI

SEMI ^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Maria Daniela Perez / SEMI Europe 
Phone: +49 160 2562977 
Email: [email protected]

Samer Bahou / SEMI Headquarters
Phone: +1 408 943 7870
Email: [email protected]

• Read more about SEMICON Europa 2024 to Spotlight Innovation and Collaboration Powering Sustainable Growth