semiconductor manufacturing

RITdb is a semiconductor manufacturing database project organized as a Working Group under SEMI’s CAST (Collaborative Alliance for Semiconductor Test) Technology Community. Originally, RITdb was the “Rich Interactive Test Database” and the original goal was to create a shared architecture that supports smart adaptive testing for semiconductor makers by providing ready access to integrated, consistent, easy-to-use data across the entire manufacturing and test process. Figure 1 illustrates this process for making integrated circuits and how RITdb will collect data from the entire manufacturing flow. Figure 1: Manufacturing Flow for Making Integrated Circuits RITdb’s end goal is to enable access to any sort of manufacturing data across the life of a product from inside or outside of the factory that made the product.Adaptive test has two scopes: The Historical Scope: Make disparate data obtained from many different sources available on demand while dealing with issues of sharing, trust, and data security amongst all database users. The Immediate Scope (Now): Enable real-time decision making about processes and parts moving through the manufacturing process based on process history, results, and feedback. Figure 2 illustrates a manufacturing flow that takes advantage of the RITdb database to make real-time decisions based on test results for devices as they move onward from the immediately preceding process step and from rules that have been developed over multiple manufacturing runs using previous test data in the historical manufacturing record. Figure 2: Real-Time Manufacturing Flow that Makes Decisions based on RITdb data. Image Source: IEEE Electronics Packaging Society HIR (Heterogeneous Integration Roadmap) One of the development issues that the CAST RITdb Working Group has wrestled with is how to make data as easy to extract from the database as it is to put into the database. Many previous manufacturing database development efforts have stumbled over this goal, yet it’s imperative that data be easily accessible if it’s to be used for real-time decision making.The end goal is for RITdb to become an “interplanetary” file system, which means that the database should be distributed over both time and distance. It should be available everywhere it’s needed. In addition, the data in the database has attached metadata to permit content-aware access. The metadata allows a data-consuming application to extract just the data it needs from the database, which reduces the amount of traffic over the manufacturing networking system and speeds database transactions.Further, the database must maintain data integrity, which means that it uses hash-based naming and immutable files to make the data easy to find, so that the data-consuming application knows that the data it obtains from the database is correct, and to prevent data deletion. The database must also be secure, with access controls and encryption to protect data. Finally, the RITdb database employs versioning so that any changes made to the database can be easily tracked and traced over time.RITdb GoalsThe RITdb project has been driven by several goals: Enable plug-and-play database access so that many types of testing tools can feed data into the database in support of diverse test and manufacturing applications. Support generation of and access to real-time streaming data as well as to data previously stored in the database. Allow data from different producer tools to be merged, synchronized, and then delivered to data-consuming applications. Permit new data types to be easily added to the database without adversely affecting the existing database model. This goal allows new data types to be added to the database even before there’s an idea of how to use this new data. Integrate cleanly with the Adaptive Test Model. The Data in the LakeTo meet all of these objectives, RITdb employs a “data lake” instead of a “data-warehouse” model. The data-warehouse model is a more traditional “big data” approach to databases where data is cleaned and normalized when it’s imported into the one, large database. A database using the data-lake model stores a pool of disparate but related data, which is cleaned and normalized at the point of creation. This approach better serves the goals of the RITdb database project by allowing real-time decision making based on prepared, good data with provenance.Data provenance encompasses many data characteristics that require answers to many questions regarding: Identity: What is this data? Integrity: Who created this data, where was this data created, and is this truly the data that was created? Security: Who can access this data? Locality: Is this data grouped with other data based on some characteristic? Lineage: Where did this data come from? In addition, RITdb incorporates other features to satisfy the “Now” scope. It supports a streaming data-flow model using RITdb packets and events. It uses a real-time messaging infrastructure based on IOT bidirectional, machine-to-machine communications and the MQTT (Message Queuing Telemetry Transport) protocol, an ISO standard (ISO/IEC PRF 20922) for publish-and-subscribe messaging, and the CBOR (Concise Binary Object Representation, a serialized, binary data format loosely based on JSON) format for payload data within the messages. Finally, the RITdb streaming protocol permits real-time rules checking so that an application program can look at data streaming in from a test cell and make real-time decisions based on that data.Currently, planned submission for RITdb specification to SEMI for balloting is scheduled for 1Q19. To learn more about the SEMI CAST Technology Community, its RITdb activity, and/or to engage in this effort, please contact Paul Trio, senior manager of Strategic Initiatives) at SEMI, at [email protected] Ajouri is a systems integration engineer at Texas Instruments.

SEMI’s Environment, Health Safety (EHS) Advocacy program has been helping the semiconductor manufacturing supply chain collectively address common challenges for over 20 years. Now, as national and regional governments worldwide increasingly weigh legislation that could impact the industry, SEMI continues to ensure that microelectronics industry understands the potential impact and provides an effective platform for taking collective member-led action.Olivier Corvez recently joined SEMI to focus exclusively on shaping SEMI’s EHS Advocacy program to meet escalating demands on the industry. He recently sat down with SEMI’s communications team to discuss SEMI's evolving EHS Advocacy program. SEMI Communications: As senior manager of EHS Advocacy, based at SEMI’s Milpitas, California, headquarters, what do you see as the major issues impacting EHS Advocacy for electronics manufacturing worldwide?Corvez: EHS is a vast topic that cuts across many different types of issues such as regulatory compliance obligations, management systems performances, as well as sustainability related public disclosures. SEMI’s global members are engaged on all these fronts, while creating advanced materials, sophisticated tools and managing a complicated and extensive supply chain.On the regulatory side, there has been exponential growth in the number of EHS laws considered and adopted by legislatures worldwide. Often these new regulations generate shockwaves across the globe as member companies are required to adapt to new requirements that spread across the entire manufacturing supply chain.Many new regulations are originating from Europe and demand much of my attention. We are paying especially close attention to the Stockholm Convention on eliminating persistent organic pollutants. A chemical called PFOA has been a subject of much effort at SEMI for years now and we are heartened by the reception of our position by the European Commission.SEMI Communications: What do you find most interesting about operating the EHS Advocacy program at SEMI?Corvez: The first word that comes to mind is “variety.” This role involves a blend of strategy, regulatory interpretation skills, project management, communication and even accounting. There is always something new to learn and positions and strategies to develop.SEMI, as a member-driven, collaborative platform, needs a high level of knowledge sharing and communications. I am working to establish a workspace where members can share previously-created analyses and minimize “recreating the wheel.” We have ambitious plans to deploy additional tools and a redesigned website that will improve our knowledge-sharing capabilities and best serve our members.We also plan to renew collaboration with other industry associations such as SIA and SESHA. Partnering with other associations means our voice is stronger, our messaging is reinforced, and our efforts are coordinated. Last but not least, I believe that maintaining a sense of geographical proximity for SEMI’s worldwide efforts is important. SEMI’s local advocacy efforts are facilitated by SEMI regional staff and I look forward to collaborating with them as they maintain ongoing dialogue with our local members and their local, state and national governments. SEMI Communications: What is the most challenging part of your role?Corvez: The most challenging aspect will be to reinvigorate participation in all of our EHS activities and find ways to create a state of fruitful collaboration among members worldwide. Secondly, establishing a new EHS governance structure is a significant challenge, but it is incredibly important to have a strong leadership group and decision-making mechanism that will efficiently help define our vision and priorities.Our new direction will require members to lead our activities at all levels. We believe there is a strong ROI for companies to dedicate resources to address the issues or topics we need to pursue to keep them and their products, accepted, profitable and the industry to grow. While SEMI provides the platform for collaboration, we must supplement our efforts with members providing the manpower to ensure our activities are a success.SEMI Communications: Tell us about your background. Corvez: I bring 20 years of diverse experience as a consultant, auditor and corporate EHS program management across most economic sectors on a global scale. Recently, I managed an EHS team distributed across 10 countries, dedicated to providing EHS compliance support to Cisco facilities worldwide.In addition to compliance experience, I have worked on implementing EHS Management systems at ABB or Total while in France (primarily) in the late 1990s. While at KPMG in Paris I was involved in over 400 due diligence projects for transactions services for electronics, chemicals, auto industry, aeronautics, etc. On the sustainability reporting side, I was lucky to be involved with large corporations and spent five years verifying EHS and social performances disclosed in sustainability annual reports. I received my formal training and received a Masters of Science in Environmental Sciences from Universite de Rouen, France, and my Bachelors of Science in Environmental Geology from Northeastern University in Boston. I also trained as an ISO 14001 auditor at DNV Sweden.All of these experiences have led me to this current position at SEMI, where I look forward to making effective and meaningful impact.Have questions or suggestions for Olivier? He can be reached at [email protected] or at +1.408.943.6957. To learn more about the EHS advocacy program at SEMI, please click here.Heidi Hoffman is senior director of Technology Communities Marketing at SEMI.

Last year the industry posted another remarkable double-digit revenue growth year. IC shipments eclipsed one trillion units for the first time and continued to enable an ever-expanding array of silicon intensive-applications.2018 was also a pivotal year of transformation at SEMI. Setting our sights firmly on building more value for SEMI members, we doubled down on priorities I established this time last year. We advocated intensively on global trade policies, industry talent needs, and critical environment, health and safety (EHS) concerns. To underpin our efforts around talent, we took the bold step to reinvigorate the industry’s identity with a dynamic image campaign. Above all, we targeted critical industry-wide issues to help us realize the ambition of becoming a trillion-dollar industry in the next decade. Workforce DevelopmentRedefining our approach to talent development in 2018 was and remains a top priority. A diverse, highly skilled workforce is crucial to the industry’s ability to innovate. Last year we ramped up a number of SEMI High Tech U (HTU) programs to inspire young people and attract them to careers in high-tech manufacturing. To date, more than 130,000 students have been touched by HTU – through student or teacher programs.Over the past year, we designed a new university outreach program and established partnerships with 100 institutions. We established Workforce Pavilions at SEMICON events in Southeast Asia, the U.S., Taiwan, Europe and Japan for students to explore career opportunities and meet with recruiters. We thrilled at seeing sponsors hire young talent at SEMI events. This year, all SEMICONs worldwide will feature Workforce Pavilions.SEMI also formalized its commitment to Diversity and Inclusion (D I) with the establishment of a D I council to shape new programs including the recently launched Spotlight on SEMI Women. To localize and fully optimize our D I programs, we established regional workforce councils in every region we serve. We unveiled the SEMI Mentoring Program to support students and young professionals on this journey by facilitating one-on-one mentoring relationships with industry professionals. Hundreds of mentees have enrolled. But we still need more mentors. I urge you to join the program. During the year, SEMI also expanded its workforce staff and developed a comprehensive workforce strategy with programs that engage students as early as elementary school and inspires them through high school and college. The program provides pathways to professional careers, building a pipeline to fill the short-term and long-term talent needs of the industry. Industry Image CampaignAs we developed the comprehensive workforce development program, we knew we had to refresh the industry’s image and appeal to the next generation through contemporary media and communications channels. So we recently launched a bold, innovative campaign to raise industry awareness and attract students and recent graduates to careers in semiconductor manufacturing.Our You’re Welcome campaign is a novel, creative approach that blends entertainment, media and storytelling to excite students about the industry. The campaign went viral immediately and within weeks had more than 5.5 million social media impressions and 2.3 million video views.Trade Policy AdvocacyRising trade tensions between the U.S. and China catapulted global trade policy to the forefront of industry concerns in 2018. Since the tariffs have taken force, semiconductor companies have faced higher costs, greater uncertainty, and difficulty selling products abroad. The tariffs have forced many SEMI member companies to pause or rethink their investment strategies.SEMI quickly engaged U.S. policymakers and provided resources for SEMI members. We formed a member trade task force, staged trade compliance seminars in China, and convened meetings with over 110 U.S. congressional, agency and administration officials, and provided testimony on the importance of the free trade to the industry.SEMI continues to educate policymakers about the critical importance of free and fair trade, open markets, and respect and enforcement of IP for all players in the global electronics manufacturing supply chain. As part of this initiative, we distributed “10 Principles for the Global Semiconductor Supply Chain in Modern Trade Agreements” and encouraged their adoption in various trade negotiations. These principles outline the primary considerations for balanced trade rules that benefit SEMI members around the world, strengthen innovation and perpetuate the societal benefits of affordable microelectronics.Environment, Health and SafetyEnvironmental regulations are proliferating globally even as advanced semiconductor manufacturing technology relies increasingly on a host of new materials. With dozens of new fabs and fab line upgrades, our industry must align on best practices, sensibly respond to materials restrictions, and renew efforts toward sustainable manufacturing.That’s why the revitalization of SEMI EHS efforts became another priority in 2018. Two months ago, we hosted the inaugural EHS Summit at SEMI Headquarters. Fully, 70 EHS professionals and company executives met to form the basis for the future SEMI EHS program.The Year AheadDespite a softening in the market, compounded by Apple’s first-ever announcement of a revenue decline in 16 years, a geopolitical whirlwind on trade and an extended shutdown of much of the U.S. government, the future is bright.At SEMI’s annual Industry Strategy Symposium (ISS 2019) in Half Moon Bay, Calif. in early January, the sense of optimism was palpable. In her keynote address, Dr. Ann Kelleher, Sr. VP and General Manager, Technology and Manufacturing Group, at Intel, observed that data is powering the fourth industry revolution and the expansion of compute. With customers expecting continual improvements in applications, Kelleher highlighted the tremendous opportunity for the chip industry to meet these expectations.At ISS 2019, we announced a Memorandum of Understand between SEMI and imec. The MOU will enable us to accelerate our members’ engagement in SEMI’s Smart vertical market platforms, in particular Smart MedTech and Smart Transportation. Our partnership with imec will also allow us to boost SEMI Standards activities in non-CMOS technologies, deepen technology roadmap efforts and augment our SEMI Think Tank initiative in thought leadership at a global level.Over the course of this coming year, will we begin our global rollout of key building blocks of our comprehensive workforce development program to engage schoolchildren as young as 10 and learners all the way to veterans who return to the workforce. We are now able, with the invaluable help of our Workforce Development Council and the passionate engagement of many SEMI member companies, to offer a solution to the talent crisis in our industry.We will continue to be the leading voice for our members and the end-to-end semiconductor supply chain across Talent, Trade, Tax and Technology as we work to ensure free, fair trade that protects IP while preserving vital access to markets to grow the supply chain. Vertical Market PlatformsOur vertical market platforms are an important part of this growth. For example, in Smart MedTech, SEMI looks forward to working with the Nano-Bio Materials Consortium to advance human monitoring technology for telemedicine and digital health after winning $7 million to fund the renewed program. In Smart Transportation, we will leverage the Global Automotive Advisory Council (GAAC) we formed last year to represent the full automotive supply chain and the Smart Transportation and Smart Automotive forums featured at all our SEMICON events to enable the industry to identify and seize opportunities in autonomous driving. At ISS 2019, Sujeet Chand of Rockwell Automation noted that “digitization will grow faster in the next 10 years than it did in the past 50,” a trend calling for semiconductor fab architectures that transform data into business value. We will continue to bring the industry together at our Smart Manufacturing venues to help uncover ways to deploy deep learning, edge computing and other Smart technologies to deliver this value and meet the challenges of automation as artificial intelligence’s (AI) sprawling influence reshapes industries including manufacturing.I am filled with optimism and thrilled about the opportunities I see on the horizon for our members as we build on our 2018 accomplishments to enable your prosperity in 2019 and beyond. My heartfelt thanks to all of you for your participation in our programs and events.I look forward to another successful year as we connect, collaborate and innovate together!Ajit Manocha is president and CEO of SEMI.

New SEMI Taiwan Testing Committee to strengthen the last line of defense to ensure the reliability of advanced semiconductor applications.Mobile, high-performance computing (HPC), automotive, and IoT – the four future growth drivers of semiconductor industry, plus the additional boost from artificial intelligence (AI) and 5G – will spur exponential demand for multi-function and high-performance chips. Today, a 3D IC semiconductor structure is beginning to integrate multiple chips to extend functionality and performance, making heterogeneous integration an irreversible trend. As the number of chips integrated in a single package increases, the structural complexity also rises. Not only will this make identifying chip defects harder, but the compatibility and interconnection between components will also introduce uncertainties that can undermine the reliability of the final ICs. Add to these challenges the need for tight cost control and a faster time to market, and it’s clear that semiconductor testing requires disruptive, innovative change. Traditional final-product testing focusing on finished components is now giving way to wafer- and system-level testing.In addition, the traditional notion of design for testing, an approach that enhances testing controllability and observability, is now coupled with the imperative to test for design, which emphasizes drawing analytics insights from collected test data to help reduce design errors and shorten development cycles. Going forward, the relationship among design, manufacturing, packaging, and testing will no longer be un-directional. Instead, it will be a cycle of continuous improvement.This paradigm shift in semiconductor testing, however, will also create a need for new industry standards and regulations, elevate visibility and security levels for shared data, require the optimization of testing time and costs, and lead to a shortage of testing professionals. Solving all these issues will require a joint effort by the industry and academia. "With leading technologies and $4.7 billion in market value, Taiwan still holds the top spot in global semiconductor testing market," said Terry Tsao, President of SEMI Taiwan. "When testing extends beyond the manufacturing process, it can play a critical role in ensuring quality throughout the entire life cycle from design and manufacturing to system integration while maintaining effective controls on development costs and schedules. Taiwan's semiconductor industry is in dire need of a common testing platform to enable the cross-disciplinary collaboration necessary for technical breakthroughs."The SEMI Taiwan Testing Committee was formed to meet that need, gathering testing experts and academics from MediaTek, Intel, NXP Semiconductors, TSMC, UMC, ASE Technology, SPIL, KYEC, Teradyne, Advantest, FormFactor, MJC, Synopsys, Cadence, Mentor, and National Tsing Hua University to collaborate in building a complete testing ecosystem. The committee addresses common technical challenges faced by the industry and cultivates next-generation testing professionals to enable Taiwan to maintain its global leadership in semiconductor testing.The SEMI Taiwan Testing Platform spans communities, expositions, programs, events, networking, business matching, advocacy, and market and technology insights. For more information about the SEMI Taiwan Testing platform, please contact Elaine Lee ([email protected]) or Ana Li ([email protected]). Emmy Yi is a marketing specialist at SEMI Taiwan.

SEMI and imec are joining forces to drive innovation and deepen industry alignment on technology roadmaps and international standards while adding technology depth to SEMI’s five vertical application platforms including Smart Transportation, Smart MedTech and Smart Data.Under a Memorandum of Understanding announced today at ISS 2019, the two organizations have set their sights on bringing together key industry players to advance cutting-edge technologies including Internet of Things (IoT), artificial intelligence (AI) and machine learning that enable new capabilities across healthcare, automotive and semiconductor manufacturing. The partnership also aims to speed the time to better business results for SEMI and imec members and partners. SEMI brings to the partnership access to the $2 trillion global electronics manufacturing supply chain and imec its global research and development (R D) and innovation leadership in nanoelectronics and digital technologies.Under the MOU, the two organizations will co-produce SEMI Think Tanks, extend SEMI’s International Standards platform to non-CMOS technologies, identify and fill gaps in technology roadmaps, and tighten imec’s engagement with SEMI in European workforce development efforts.Bettina Weiss is Chief of Staff at SEMI.

Region’s Fab Capacity Expansion Picks up PaceUnwavering in its drive to build a strong, self-sufficient semiconductor supply chain, China plans more new fab projects than any other region in the world from 2017 to 2020, and its expansion of fab capacity recently picked up pace on the strength of new foundry and memory projects from both domestic and foreign companies, according to SEMI’s 2018 China Semiconductor Silicon Wafer Outlook report. China’s installed fab capacity is forecast to grow at a 12 percent CAGR from 2.3 million wafers per month (wpm) in 2015 to 4 million wpm in 2020, faster than all other regions.Well known for its semiconductor packaging prowess, China in recent years shifted its focus to front-end semiconductor fabs and a few key material markets. In 2018, the region’s surge in fab investment thrust it past Taiwan as the second largest capital equipment market in the world, behind only Korea. However, China’s semiconductor manufacturing growth faces strong headwinds. Chief among them is the tight supply of silicon wafers over the past two years due in large part to the sector oligopoly’s firm control of global production, with the top five wafer manufacturers accounting for over 90 percent of market revenue. In response, China’s central and local governments has made the development of its domestic silicon wafer supply chain a key initiative, funding multiple silicon wafer manufacturing projects.According to the 2018 China Semiconductor Silicon Wafer Outlook report, many of China’s domestic silicon suppliers capably provide wafers 150mm in size and smaller. And the while the region lags peers in 200m and 300mm processing technology and capacity, strong domestic demand and favorable policies have fueled progress in 200mm and 300mm silicon manufacturing with some Chinese suppliers having reached key large-diameter manufacturing milestones.However, it will take these new suppliers several years before they can meet capacity and yield requirements of the larger-diameter silicon wafer market. Company plans and announcements indicate that by the end of 2020, total silicon supply capacity in China will reach 1.3 million wpm for 200mm, possibly leading to a slight oversupply, and 750,000 wpm for 300mm.China’s equipment suppliers, particularly crystal furnace vendors, are also investing in the development of 300mm wafer manufacturing, and domestic tool suppliers have developed most of the necessary tools for wafer manufacturing, except for inspection.While China’s silicon wafer suppliers continue to lag international peers in manufacturing capabilities, the region’s silicon manufacturing ecosystem is maturing and becoming better integrated. The sector’s growth is driven and accelerated by significant domestic market demand and favorable policies.About the China Semiconductor Silicon Wafer OutlookSEMI’s 2018 China Semiconductor Silicon Wafer Outlook is a comprehensive research report with a Microsoft Excel® workbook containing in-depth analysis of China’s silicon wafer manufacturing ecosystem as it relates to the global semiconductor wafer industry. The report covers the latest developments in China’s silicon wafer supply chain, including details on the rise of China’s silicon manufacturing, polysilicon, and silicon wafer-related equipment companies. The report also examines policies, funding and their implications for China’s silicon wafer supply chain.Clark Tseng is director in Industry Research and Statistics at SEMI.

Semiconductor fabs have been getting smarter and smarter over the past 30 years. It’s a natural evolution – the direct outcome of numerous continuous-improvement efforts. The really important difference on the road to smarter fabs, the one change that’s enabling the Industry 4.0 revolution, is the concept of a cyber-physical system or digital twin. If you don’t have a thorough, detailed, high-fidelity digital twin of your entire fab operation, then you cannot have “Smart Manufacturing.” That’s really the definition of a smart site. A digital twin is simply a requirement for all smart factories of the future. One caveat: No matter what you build today from a smart perspective, your digital twin’s fidelity will improve over the next 20 years. A factory’s digital twin has two facets: the operational aspect and the yield aspect. Each of these two facets places different requirements on a database including the types of data, the frequency of data generated, the retention of data, and even the AI/ML techniques used to analyze the data. A combination of these data requirements are needed to create a digital twin – the virtual representation of your entire factory operation, whether it’s on the wafer-fab front end or the assembly and test back end. What’s most important here is that facility-wide data sets and databases must be able to communicate with each other using refined summary statistics to create a practical digital twin. For example, a lot of information is collected on the yield side to feed the deep-learning models needed to manage processes. However, the factory scheduler, driven largely by the smart operational database, needs only summary statistics from the yield database to be able to act in the next moment or over the next 24 hours. Figure 1 illustrates the needs of and the interaction between a smart operational and a yield database. Figure 1: The Operational and Yield databases in a Smart Factory need to exchange summary statistics. Today, we find that although these databases generally speak to each other in smart factories, they’re still not sufficiently connected to permit the use and analysis of data needed to realize the full potential of a smart factory. That level of interconnectedness is still in the future. Some solution providers have created what is essentially a “smart learning warehouse” (“database” has become too limited a term here). This warehouse collects, analyzes and learns from the extensive amount of information that a fab generates. Game-changing, more holistic applications become possible when this information can be combined in new and informative ways. As it turns out, a data source is just a data source, but users in different factory areas need to extract different information from these common data sources. They need different applications and portals – in other words “views” – that are adapted and adjusted for each area’s needs. Aren’t we smart enough? Some people think that 300mm fabs are already smart. That’s true. They are. But, they could be a lot smarter. No 300mm fab in use today has attained the full, utopian vision of what a smart factory can deliver over the next 10 years. When you finally integrate all of the disparate databases in a fab – when you’re able to use all of those different data sources as one common data source – that’s when your Smart Factory will have the ability to self-optimize its future actions and react quickly to real-time events. The largest semiconductor manufacturers tend to develop these smart factory applications on their own. The remaining semiconductor fabs need to work together with other fabs and their solution providers to develop these smart factory applications. Why now? Why is everyone talking about “Smart” now? It’s because the semiconductor industry has helped to create all of the enabling technology: the compute power, the networking and networking standards, and even the industry’s maturation into a multi-tiered organization of solution providers. We’ve reached the point where we can collect data from a widespread sensor network along with tool-health data and we can then warehouse this data so that it can be applied to more intelligent decision-making. While there may be one or two sensors on a tool today, in the future there will be many such sensors connected over an IoT network or networks that provide mountains of data to the warehouse. All of this data will feed into the digital-twin version of the fab. One of the biggest changes on the horizon made possible by all of this accessible data is advanced scheduling. Despite all of the automation advancements made over the past 25 years, including robotic handling, it’s still hard to decide “where, what, and when?” for every single lot in the factory. Today, no factory in the world is more complex than a semiconductor fab. Optimizing a semiconductor manufacturing process is the most complex manufacturing-optimization task in the world. Do it for ROI ROI is the chief reason for having a digital twin. Once you can make a truly smart, holistic schedule of the fabs operations — not a dispatch or rule-based dispatch list — then you can create an operationally smart factory. Rule-based dispatching systems primarily focus on tools and tool-centric views. Although they incorporate knowledge from current WIP and tool conditions to make decisions better than simple dispatch systems, smart factories are not just about tools and the current WIP at them. Smart factories use the status of every tool and lot in the factory to make fab-centric optimizations instead of tool-specific optimizations. Once you have a digital twin, you’re optimizing for global functions such as line linearity and on-time delivery. These functions are not just about the moment. The transition to a smart factory thus represents a huge philosophical change. When you know exactly what’s going to happen in a factory over the next 12 hours for every single lot, every single wafer carrier, and every single entrance port of every tool in the factory, then you suddenly have control over the factory’s idle time. You know when you can optimally perform PM (preventive maintenance). You know how to best redirect material or labor resources to maximize output. You can create a smart schedule for every maintenance person in the factory that comprehends each person’s skill set and tool downtime so that there’s no negative impact on the factory’s productivity. You can only do all of this when you know the future. Figure 2 illustrates the opportunity. Imagine that a factory contains 1,500 tools. Use of these tools is scheduled for the next twelve hours. The information depicted in Figure 2 encompasses process changes from one chemistry to another, implant changes, reticle changes, and the status of every single consumable for all 1,500 tools. The white spaces that appear between processes in Figure 2 represent opportunities to intelligently schedule events such as maintenance to maximize factory productivity. Figure 2: Smart scheduling permits factory-wide optimization to maximize productivity. Once you have a schedule, you need to translate that schedule into actions or movement. It’s not easy to do this and most material-control systems today make overly simplistic decisions based on modeled assumptions and typical cases rather than the actual time each lot needs to be at a precise location, which can only come from a schedule. Once the data from all of the tools is connected, a smart scheduling system can use the digital twin to make far better process decisions. The larger the factory (or more complex the factory), the more important it is to make smarter decisions. Note: SEMI has a Smart Manufacturing Technology Community. For more information or to get involved, click here. If you would like to discuss Smart Manufacturing more with John directly, he can be contacted at [email protected]. John Behnke is general manager of the Final Phase Systems product line at INFICON.

Environment, Health and Safety (EHS) has steadily evolved to become a key element within SEMI’s Advocacy and Standards activities. On November 29th, 2018, nearly 60 members representing equipment, materials and device manufacturers gathered at SEMI’s Milpitas headquarters for our first EHS Summit. The main agenda for the day was related to discussing the new “EHS 2.0” strategy – and priorities – to better align with the current landscape facing members in various parts of the world. “SEMI will not compromise our commitment to EHS,” said SEMI president and CEO Ajit Manocha in is kickoff speech at the Summit, calling on members to rise to the challenge. “We also understand the importance of EHS for our industry. SEMI EHS staff is here to facilitate a program that achieves the highest priorities of our members – but we need you, our members, to be clear on your priorities.” SEMI’s EHS program has had many successes globally, including a strong suite of safety standards, since it launched in the 1980’s. Since then, exponential growth of EHS regulatory requirements worldwide has intensified pressure on members to become more transparent on environmental and social issues. The pressure to disclose on EHS performances has become more visible and challenging for members to manage across the entire supply chain. During facilitated breakout sessions, members were invited to share their views on various industry issues. Some of the most pressing raised related to changes in the REACH European Regulations, or implications from the Stockholm Convention that will affect what products or hazardous chemicals can be used. Some of the topics identified throughout the day included: Circular economy/green/sustainability Global RoHS and REACH regulations Used equipment machine safety Current and future prohibited substances tracking such as Perfluorooctanoic acid (PFOA) After the summit’s success, SEMI is now planning three EHS summits in 2019 and other events to further address the various issues facing members. To receive invitations and stay abreast of SEMI’s EHS activities, please join our EHS interest list by clicking here. Olivier Corvez is senior manager of Environment, Health, Safety and Sustainability at SEMI.

Part 1 of this article discussed the Memory Inventory Cycle Index and compared it with memory device sales and memory fab equipment investments. This article, the second of the two-part series, illustrates how the Memory Inventory Cycle Index starts to weaken before memory sales of the top three memory suppliers decline. It also shows how the Memory Inventory Cycle Index peaked in the fourth quarter of last year along with YoY growth rates for both memory sales and memory fab equipment investments.In addition to the weakening signaled by the Memory Inventory Cycle Index, memory suppliers are facing headwinds in the form of tariffs as mentioned in Micron’s most recent earnings call. The U.S.-China trade dispute could reduce Micron’s profitability; China granted a preliminary injunction to prevent Micron’s Chinese subsidiary from manufacturing and selling in China this July. However, it is very difficult to quantify the risk the tariffs pose to the future of the memory market.On the other hand, the YoY growth rate of semiconductor sales according to the World Semiconductor Trade Statistics is closely tied to China’s manufacturing sector as shown by the Purchasing Managers Index (PMI) New export orders and Orders in hand sub-indexes. Figure 3 shows that as the growth rate of new exports and order backlog slows, the YoY growth rate of semiconductor sales will be adversely impacted. As the largest consumer of semiconductors in the world, China will bear the brunt of the slowing market. Figure 3. Memory Inventory Cycle Index China manufacturing sector PMI’s sub-indices * RemarksChina PMI’s sub-indices are on the basis of the data published by NBS (National Bureau of Satistics of China). Also those data were calculated based on 12MMA (12-month moving average) to minimize seasonal fluctuation. The YoY growth rate of the 3-month moving average of semiconductor sales in China alone, China and Asia Pacific, and all regions showed additional declines in July (Figure 4). Monitoring the Orders in hand and New export orders sub-indices for China and China’s semiconductor consumption and WSTS sales revenue in China can help track the risk of trade disputes. Figure 4. YoY growth rate of semiconductor sales revenue in China and Asia Pacific * Remarks1) Regions as defined by WSTS’ Bluebook.2) Sales revenue were calculated based on 3MMA (3-month moving average value). A review of the relationship between the Memory Inventory Cycle Index, semiconductor sales, and memory fab equipment investment growth rates suggests we have passed the peak in the current cycle. However, bear in mind that the Work In Process (WIP) to Finished-goods inventory ratio has sharply increased since 2017 as shown in Figure 5. The increase in WIP inventory could be attributed to the increasing technical challenges associated with 3D NAND stacking and DRAM scaling. As a result, the proportion of finished-goods inventory in total inventory remained low until the second quarter of 2018, possibly implying that memory demand remained healthy in spite of the contraction modeled by the Memory Inventory Cycle Index. Figure 5. The proportion of finished-goods inventory in the total inventories * Remarks 1) All inventories data from 3 companies’ financial reports were calculated based on 4-quarter moving average.2) Total Inventory accounts for the sum of Finished-Goods, WIP, and Raw materials inventory.3) Company data complied by SEMI. The Memory Inventory Cycle Index has entered a period of contraction, which is supported by Micron’s weak guidance for its fiscal first quarter of 2019 (September to November). The outlook for memory sales and memory fab equipment investments reported by WSTS and SEMI, respectively, also suggests that a market correction is underway. While the low proportion of finished-goods inventory does not threaten the market yet, it should remind industry observers to view high WIP inventories with caution. Unlike past inventory cycles, the high inventory levels could burden the memory market in the absence of sustainable demand.Sungho Yoon is a senior market research analyst in Industry Research and Statistics at SEMI. SEMI China IC Ecosystem ReportLearn more about 30 new fab construction projects underway or planned in China in the newly released SEMI China IC Ecosystem Report. The research report is a comprehensive update and analysis of China's IC manufacturing ecosystem with charts, graphs, tables and maps.

Even for someone who has been in this industry since the days of the TI Datamath 4-function calculator and the TMS1100 4-bit microcontroller (yes, that’s been a LONG time – the movie Grease premiered the same year!), it is sometimes hard to grasp the scope and complexity of what happens in today’s leading-edge semiconductor gigafabs. In fact, the only way to comprehend the enormous volume of transactions that occur is to consider what happens in a single minute – this is illustrated in the infographic we have labeled “The Gigafab Minute.”* It’s amazing enough to think that a single factory can start 100,000 wafers every month on their cyclical journey through 1500 process steps… and have 99%+ of them emerge 4 months later to be delivered to packaging houses and then on to waiting customers. It’s quite another to realize that all of this happens continuously (24 x 7) and automatically. “How is this possible?” you ask.Well, a big part of the solution is the body of SEMI standards which have evolved since the early 80s to keep pace with the ever-changing demands of the industry. From an automation standpoint, many of these standards deal with the communications between manufacturing equipment and the factory information and control systems that are essential for managing these complex, hyper-competitive global enterprises.A significant characteristic of these standards is that they have been carefully designed to be “additive.” This means that new generations of SEMI’s communications standards do not supplant or obsolete the previous generations, but rather provide new capabilities in an incremental fashion. To appreciate the importance of this in actual practice, consider how the GEM, GEM300, and EDA/Interface A standards support the transactions that occur in a single Gigafab Minute.Starting at 1:00 o’clock on the infographic and moving clockwise, you first notice that 2.31 wafers enter the line. Of course, these are actually released in 25-wafer 300mm FOUPs (Front-Opening Unified Pod), but 100K wafers per month translates to 2.31 per minute. Since these factories run continuously, once the line is full, it stays full. And with an average total cycle time of 4 months, this means that there are 400K wafers of WIP (work in process) in he factory at any given time. This number, and the total number of equipment (5000+), drive the rest of the calculations.GEM (Generic Equipment Model) – SEMI E30, etc.The GEM messaging standards were initially defined in the early 90s to support the factory scheduling and dispatching applications that decide what lots should go to what equipment, the automated material handling systems that deliver and pick-up material to/from the equipment accordingly, the recipe management systems that ensure each process step is executed properly, and the MES (Manufacturing Execution System) transactions that maintain the fidelity of the factory system’s “digital twin.”Every minute of every day, GEM messages support and chronicle the following activities: 240 process steps are completed (i.e., 240 25-wafer lots are processed), 300 recipes are downloaded along with a set of run-specific adjustable control parameters, and 600 FOUPs are moved from one place to another (equipment, stockers, under-track storage, etc.). For each of these activities, the factory’s MES is notified instantaneously.GEM300 – SEMI E40, E87, E90, E94, E157With the advent of 300mm manufacturing in the mid-to-late 90s, a global team of volunteer system engineers from the leading chip makers defined the GEM300 standards to support fully automated manufacturing operations. Starting at 5:00 o’clock on the infographic, the number of transactions per minute jumps almost 3 orders of magnitude, from the monitoring of 900 control jobs across 4000 process tools to the tracking of 360,000 individual recipe step change events. This level of event granularity is essential for the latest generation of FDC (Fault Detection and Classification) applications, because precise data framing is a key prerequisite for minimizing the false alarm rate while still preventing serious process excursions. In this context, more than 6000 recipe-, product- and chamber-specific fault models may be evaluated every minute.Simultaneously, the applications that monitor instantaneous throughput to prevent “productivity excursions” and identify systemic “wait time waste” situations depend on detailed intra-tool wafer movement events. In a fab with hundreds of multi-chamber, single-wafer processes, 75,000 or more of these events occur every minute. EDA (Equipment Data Acquisition) – SEMI E120, E125, E132, E134, E164, etc.Rounding out the SEMI standards in our example gigafab is the suite of EDA standards which complement the command and control functions of GEM/GEM300 with flexible, high-performance, model-based data collection. The EDA standards enable the on-demand collection of the volume and variety of “big data” required from the equipment to support the advanced analysis, machine learning, and other AI (Artificial Intelligence) applications that are becoming increasingly prevalent in leading semiconductor manufacturers. As EUV (Extreme Ultraviolet) lithography moves from pilot production to high-volume manufacturing at the 7nm process node and beyond, the litho process area will become a major source of process data by itself, generating 10 GB of data every minute. This is in addition to the 100 GB of data collected from other process areas. The End ResultThe final wedge (12:00 o’clock) in our infographic highlights the real objective – which is producing the millions of integrated circuits that fuel our global economy and provide the technologies that are an integral part of our modern way of life. Assuming a nominal die size of 50 square mm (typical of an 8 GB DRAM), the 2.31 wafers we started at 1:00 o’clock result in almost 3200 individual chips. But none of this would be possible without the pervasive factory automation technology we now take for granted. So, as you finish reading this posting on whatever device you happen to be using, take a micro-moment to acknowledge and thank the hundreds of standards volunteers whose insights and efforts made this a reality!You may not be responsible for running a gigafab anytime soon, but the SEMI standards used in this setting are no less applicable to any Smart Manufacturing environment. Give us a call if you’d like to know more about how these technologies can benefit your operations for many years to come.Alan Weber is Vice President, New Product Innovations, at Cimetrix Incorporated. Previously he served on the Board of Directors for eight years before joining the company as a full-time employee in 2011. Alan has been a part of the semiconductor and manufacturing automation industries for over 40 years. He holds bachelor’s and master’s degrees in Electrical Engineering from Rice University. For more information on SEMI Standards, please click here.