Quantum computers allow certain problems to be solved exponentially faster than on any classical machine. Recent advances in the construction of small quantum processors have shown that there are no fundamental roadblocks to realizing this technology; however, significant challenges remain in scaling up devices to the millions of qubits that are required to build useful quantum machines.
In this webinar, Dr. Guilhem Ribeill will discuss how techniques borrowed from semiconductor fabrication have allowed superconducting qubits, one of the leading quantum platforms, to increase their quality by several orders of magnitude over the last two decades. He will also discuss outstanding problems in the fabrication, packaging, and control of superconducting quantum computers, and the future of the technology.
United States
8:00 am
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8:10 am
Introduction
8:10 am
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8:50 am
Guilhem Ribeill, Ph.D.
Scientist, Quantum Information Processing, Raytheon BBN Technologies
Speaker Biography
Guilhem Ribeill is a scientist at Raytheon BBN Technologies where he leads quantum device fabrication efforts for the Quantum Engineering and Computing group. With over ten years of experience in the design, fabrication and testing of classical and superconducting circuits he is involved in a variety of efforts to benchmark and improve the performance of quantum information processing systems. He earned his doctoral degree from the McDermott group at the University of Wisconsin-Madison, where his graduate research focused on novel qubit readout schemes including the first practical microwave single photon detector.
8:50 am
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9:00 am
Q&A
A SEMI Smart Data Hosted Webinar
Smart Data WEBINAR: Challenges and Solutions in Superconducting Qubit Fabrication
8:00 am - 9:00 am
Off
Add to Calendar2020-02-06 08:00:002020-02-06 09:00:00Smart Data WEBINAR: Challenges and Solutions in Superconducting Qubit FabricationA SEMI Smart Data Hosted WebinarUnited StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
How to Thrive and Accelerate Your Growth in the Semiconductor Industry
As we celebrate 10 years of Women in Semiconductor, this milestone event invites you to reflect on the progress made while boldly charting your path forward. In an industry where women remain underrepresented, success requires both strategic navigation and authentic leadership.
Through dynamic sessions, we will explore how to intentionally shape a career defined by influence and impact—on your own terms. Together, we’ll examine the realities of navigating a male-dominated industry and share practical strategies to build influence, expand opportunities, and lead with confidence.
At the core of this experience is the development of your personal leadership toolbox—a curated set of skills, relationships, insights, and decision-making frameworks designed to accelerate your growth. You’ll learn how to cultivate meaningful allyship, strengthen the competencies that set you apart, and proactively create opportunities rather than waiting for them.
Join us for this special anniversary as we celebrate a decade of progress and issue a call to action for the future. You’ll leave with practical resources, empowering insights, and a renewed sense of purpose—equipped to thrive authentically and shape the future of the semiconductor industry with confidence and clarity.
Who attends WiS? Company leaders, managers, team members, HR professionals, academia and students. We encourage attendance by everyone who is interested in building a stronger, more dynamic semiconductor ecosystem, and by anyone who is responsible for developing internal or external programs to support women.
"Attending the Women in Semiconductor Conference was an incredibly empowering experience. There is something uniquely impactful about coming together with other women who understand the challenges and opportunities of our industry. The conference created space for honest conversations, meaningful networking, and a sense of community. It is a reminder that we are not alone, and that together, we can drive change and support one another in powerful ways." (WiS 2025 attendee)
Please stay tuned for additional programs in 2026. We look forward to your participation.
To receive information about Women in Semiconductors events, make sure to complete our interest form.
The solicitation is issued by SEMI, a trade association representing the microelectronics manufacturing industry and conducted and co-managed by the FlexTech Group and the MEMS & Sensors Industry Group (MSIG) as incorporated strategic associated partners of SEMI. Funds distributed by SEMI are provided by the U.S. Government through the Combat Capabilities Development Command (CCDC) of the US Army Research Laboratory (ARL) for the purpose to advance positioning, navigation and timing solutions (PNT) technology.
In this webinar, we will review the focused solicitation, walk through the proposal process and answer any questions and provide guidance for the proposal preparation. If you have questions you would like answered privately following the webinar, please enter them in the question box during the webinar with [Exclusive Request] at the beginning of your question.
Topics in this 2020 solicitation are:
A. Low-Cost Approaches to High-Performance, Battery-Powered Timing
B. Novel Materials, Fabrication, and Packaging for Low-SWaP-C Inertial and PNT Sensors
C. Advanced Lasers and Integrated Photonics for Low-SWaP-C Atomic Clocks and PNT Sensors
D. Advancements for Low-SWaP-C, GPS-Free PNT Solutions
The term “smart infrastructure” encompasses a variety of different technologies to improve roadway safety, reduce congestion and cut emissions. The impending introduction of connected and automated vehicles (CAVs) is an important factor for governments to consider when planning investment in new infrastructure. Several technologies are being introduced into roadway construction with the goal of delivering increased connectivity, efficiency, and safety for drivers and local residents. Intelligent systems are possible only with high-quality data. One sensor example is advanced video detection cameras with camera-based (edge) analytics bringing intelligence to our infrastructure, while at the same time reducing system complexity and costs.
The Webinar will discuss the benefits of camera-based (edge) analytics with embedded security, and how video-based detection brings intelligence to highway and urban infrastructure, including traffic management, thereby increasing safety, efficiency, and overall quality of life.
United States
8:00 am
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8:10 am
Introduction
8:10 am
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8:40 am
Frank Sgambati
Director, Business Development, North America, Robert Bosch
Speaker Biography
Frank Sgambati is director of business development - for the North America region. He is responsible for establishing and managing relationships with external stakeholders, with the objective to drive sales initiatives and go-to-market plan to complement and support Bosch Connected Solutions. He focuses specifically on defining and executing go-to-market strategies for connected communities and smart infrastructure solutions with internal Bosch business units and external partners. He works with state, municipality and private developer stakeholders to understand initiatives, and then develops strategy to design, build and deliver digital solutions. Mr. Sgambati is responsible for spearheading the strategy and collaboration for connected community solutions for mobility, infrastructure, energy and security.
Since joining Bosch in 1998, Mr. Sgambati has held a variety of positions with increasing responsibility in engineering, marketing, and management in the U.S., the U.K., and Germany, including several positions as project manager and regional key account manager. His most recent position was director of marketing for the Chassis System Controls division of Robert Bosch LLC. Prior to joining Bosch, Sgambati held various engineering and manufacturing positions at other industrial companies.
Mr. Sgambati earned a bachelor’s degree in mechanical engineering from Michigan Technological University, Houghton, Mich.
WEBINAR: Smart Infrastructure and the Interaction with Connected & Automated Vehicles
8:00 am - 9:00 am
Off
Add to Calendar2020-01-21 08:00:002020-01-21 09:00:00MSIG/Smart Mobility Webinar: Smart Infrastructure and the interaction with Connected and Automated VehiclesA SEMI-MSIG & Smart Mobility Hosted Webinar
United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
There has been a lot of talk about protecting corporate IP assets in a global environment but little has been demonstrated on how this can be done. This presentation will provide a real-world scenario that is currently running at KLA to protect corporate IP assets in a globally distributed environment and how by creating this IP catalog and ledger will prepare companies for future initiatives like blockchain. This presentation will be 60 minutes long and will be presented by Ravi Bhagat from KLA and Brian Christian from Flying Cloud Technologies.
United States
8:00 am
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8:05 am
Introduction
8:05 am
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8:25 am
Ravi Bhagat
Sr. Director, IT Infrastructure & Security Services, KLA Corporation
Biography
Ravi Bhagat is Sr. Director leading IT Infrastructure and Security services for KLA Corporation. Over 20+ years of Experience leading global infrastructure teams and services. Has held various executive and senior level IT positions at KLA, including client services, architecture, managed service operations and product system support. Before joining KLA, Ravi held various senior roles at PCL and managed a country wide LAN/WAN and system deployment initiatives. He earned his MBA in US and his bachelor's degree in Computer Science from Nagpur University in India. He is an avid reader and travel enthusiast who loves to go around the world with his family.
8:25 am
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8:50 am
Brian Christian
Founder CEO/CTO, Flying Cloud Technologies
Biography
Brian Christian is the Founder CEO/CTO of Flying Cloud Technologies, an IP security and protection company, and has been a luminary in the computer security industry for over 20 years. His roles have focused on enterprise security, software security and protection of corporate digital assets. Prior to Flying Cloud Technologies, Brian co-founded SPI Dynamics, the leading expert and industry thought leader in Web application security assessment and testing. SPI was purchased by Hewlett-Packard.
8:50 am
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9:00 am
Q&A
A SEMI Smart Data Hosted Webinar
SMART DATA Webinar: Protecting, Monitoring & Cataloging Your Sensitive IP Assets in a Global Environment
8:00 am - 9:00 am
Off
Add to Calendar2019-10-30 08:00:002019-10-30 09:00:00SMART DATA WEBINAR: Protecting, Monitoring & Cataloging Your Sensitive IP Assets in a Global EnvironmentA SEMI Smart Data Hosted WebinarUnited StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Since 2016, the International Technology Roadmap for Devices and Systems (IRDS) has been working together with SEMI on a unifying pre-competitive roadmap to focus and drive innovation. The Heterogeneous Integration Roadmap (HIR) represents an opportunity to combine the efforts of SEMI, other industry groups, and leading-edge manufacturers to re-establish this driving force and outline goals to be met in the era of heterogeneous integration and the challenges that must be overcome in the process.
As a follow on to the Strategic Materials Conference, in this webinar we will explore the HIR itself and issues that arise as new materials and architectures meet to solve integration challenges. The webinar will cover the HIR from the perspective from a semiconductor materials supplier, followed by Jeff Gambino, Senior Process Integration Engineer at ON Semiconductor, who will outline their efforts in this space and the materials issues being addressed from the fab perspective.
If you have any questions about the webinar or having issues registering please email Ayo Kajopaiye - [email protected]
United States
10:00 am
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10:05 am
Introduction
10:25 am
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10:50 am
Bill Bottoms, Ph.D
President and CEO, Third Millennium Test Solutions - Co-Chair, Heterogeneous Integration Roadmap Committee
Speaker Biography
Dr. Bottoms received a B.S. degree in Physics from Huntington College in Montgomery, Alabama in 1965, and a Ph.D in Solid State from Tulane University in New Orleans in 1969 and is currently Chairman of Third Millennium Test Solutions. He has worked as a faculty member in the department of electrical engineering at Princeton University, manager of Research and Development at Varian Associates, founding President of the Semiconductor Equipment Group of Varian Associates and general Partner of Patricof & Co. Ventures. He has served as Chairman and CEO of many companies both public and private.
Dr. Bottoms has also served in a number of Government Advisory positions including Chairman of the Board on Assessment for NIST and a member of the Technical Advisory Committee on export controls for the US Commerce Department.
Dr. Bottoms has participated in the start up and growth of many companies through his venture capital activity and through his own work as an entrepreneur. These include companies in a wide range of industries.
Emeritus Member of the Board of Tulane University
Co-Chair of the Heterogeneous Integration Roadmap
Chairman of the SEMI’s Awards Committee
Chairman of the Packaging and Package Substrates Technical Working Group for INEMI
Member of the Board of MIT’s Microphotonic Center
Chairman of Fluence Analytics
Chairman of Third Millennium Test Solutions
10:05 am
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10:25 am
Jeff Gambino, Ph.D.
Senior Process Integration Engineer, ON Semiconductor
Speaker Biography
Dr. Gambino received the B.S. degree in materials science from Cornell University, Ithaca, NY, in 1979, and the PhD degree in materials science from the Massachusetts Institute of Technology, Cambridge, MA, in 1984.
He joined IBM, Hopewell Junction, NY, in 1984, where he worked on silicide processes for Bipolar and CMOS devices. In 1992, he joined the DRAM development alliance at IBM's Advanced Semiconductor Technology Center, Hopewell Junction, NY. While there, he developed contact and interconnect processes for 0.25-, 0.175-, and 0.15-um DRAM products. In 1999, he joined IBM's manufacturing organization in Essex Junction, VT, where he worked on copper interconnects, CMOS image sensors, RF devices, and 3D integration.
He joined ON Semiconductor, Gresham, OR, in 2015. He is currently working on CMOS image sensors and high voltage semiconductors. He has published over 200 technical papers and holds over 500 patents.
A SEMI Electronic Materials Group (EMG) Hosted Webinar
EMG WEBINAR - Beyond Moore's Law: Heterogeneous Integration Roadmap & Implications for the Materials Industry
10:00 am - 11:00 am
Off
Add to Calendar2019-10-16 10:00:002019-10-16 11:00:00EMG WEBINAR - Heterogeneous Integration Roadmap & Implications for the Materials IndsutryA SEMI Electronic Materials Group (EMG) Hosted WebinarUnited StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
MSIG Webinar: An Exciting Glimpse into the Future of MEMS
MEMS and Sensors Executive Congress 2019
Register for this year's MEMS & Sensors Executive Congress, October 22-24, 2019 in Coronado, California, USA. This year will see a different format to truly focus on the needs of the decision making executives in our industry. Industry economic and business updates will be covered from different aspects of the ecosystem together with forward-looking strategic and technology trends.
Jérôme Azemar, Yole Développement will be speaking during Session 3: Markets, Applications and Technology Trends.
Register before September 20, 2019 for Early Bird Pricing!
As Project Development Director at Yole Développement (Yole), Jérôme Azémar is supporting the development of strategic projects, following leading customers of the company within the semiconductor industry, from manufacturing to packaging. His mission is to develop Yole’s business and technical knowledge in the industry, maintain long term relationships with its accounts and meet their expectations.
Jérôme is a member of Yole since 2013 and worked as a senior analyst, managing the day to day production of technology & market reports as well as custom consulting projects. He also deeply contributed to the business development of the Advanced Packaging & Semiconductor Manufacturing activities.
Jérôme is the author of numerous analysis and international publications covering advanced packaging, power electronics and semiconductor manufacturing. He is also regularly involved in international conferences, giving presentations, delivering keynotes, as well as organizing committees.
Along his career, Jérôme has developed a large network in the industry, being in touch with CEOs, CTOs, Marketing Managers, Business Development Managers…
Prior to this and upon graduating from INSA Toulouse (France) with a Master’s in Microelectronics and Applied Physics, Jérôme joined ASML and worked in Veldhoven (The Netherlands) for three years as an Application Support Engineer specializing in immersion scanners. During this time, he acquired Photolithography skills which he then honed over a two-year stint as a Process Engineer at STMicroelectronics (France).
Despite a 2018 year when both automotive and consumer markets have stagnated, the MEMS market did not recess compared to 2017. Its market value reached $11.6B in 2018, with consumer applications accounting for more than 60% of the total market. The MEMS market will experience +8.3% annual growth in value driven by pressure (for TPMS), RF (for V2X 5G communications), inertial (for ADAS) and future MEMS (such as pMUT for ultrasonic fingerprint).
Additionally, sensor fusion is becoming more and more relevant since many billion MEMS sensors are made per year. The upcoming 5G revolution will make connectivity easier than ever, creating exponentially more data. This leads to “Big data”, an industry born of recent advancements in AI and machine learning, built upon and fueled by a wealth of new data from ever-expanding sensor applications. An upcoming trend is edge computing, with sensors and MEMS driving a new age of technology. Sensors are digitizing the human experience, and as the real and virtual worlds move closer together, it will be sensors that bind them, enabling new experiences for users everywhere. Running AI at the edge, coupled with sensor fusion, will open new applications for MEMS in audio, motion, olfactometry, and imaging.
MSIG Webinar: An Exciting Glimpse into the Future of MEMS
8:00 am - 8:30 am
Off
Add to Calendar2019-10-03 08:00:002019-10-03 08:30:00MSIG Webinar: An Exciting Glimpse into the Future of MEMSA MEMS and Sensors Industry Group Hosted Webinar
Despite a 2018 year when both automotive and consumer markets have stagnated, the MEMS market did not recess compared to 2017. Its market value reached $11.6B in 2018, with consumer applications accounting for more than 60% of the total market. The MEMS market will experience +8.3% annual growth in value driven by pressure (for TPMS), RF (for V2X 5G communications), inertial (for ADAS) and future MEMS (such as pMUT for ultrasonic fingerprint).
Additionally, sensor fusion is becoming more and more relevant since many billion MEMS sensors are made per year. The upcoming 5G revolution will make connectivity easier than ever, creating exponentially more data. This leads to “Big data”, an industry born of recent advancements in AI and machine learning, built upon and fueled by a wealth of new data from ever-expanding sensor applications. An upcoming trend is edge computing, with sensors and MEMS driving a new age of technology. Sensors are digitizing the human experience, and as the real and virtual worlds move closer together, it will be sensors that bind them, enabling new experiences for users everywhere. Running AI at the edge, coupled with sensor fusion, will open new applications for MEMS in audio, motion, olfactometry, and imaging.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Analog Devices - Who We Are Our customers are at the center of our identity, and we are endlessly committed to their success. We listen to our customers and anticipate their needs, working with and alongside them to reduce complexity and co-create the innovations that disrupt markets and help solve the world’s most pressing challenges. Whether discussing the role of technology in helping to mitigate global sustainability concerns or rolling up our sleeves and designing solutions at the Intelligent Edge, ADI has the industry and technology expertise to help our customers succeed.
Analog Devices 14320 SW Jenkins Rd Beaverton, OR97005 United States
July 29, 2025 - Day 1: Women's Breakfast/Discussion & Social Activity, Golf Event, & Networking Reception
8:00 am
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11:00 am
Women in FOA -Breakfast (Analog Devices)/Discussion & Social Activity
Meeting room: Washington Park
11:00 am
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5:00 pm
FOA Golf Event - The Reserve Vineyards & Golf Club
Address:
4805 SW 229th Ave
Aloha, OR 97007
6:00 pm
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9:00 pm
Welcome Reception - The Reserve Vineyards & Golf Club
Address:
4805 SW 229th Ave
Aloha, OR 97007
July 30, 2025 - Day 2: Full Membership Meeting, Fab Tour & Networking Event
8:00 am
-
12:30 pm
Device Maker Morning Meeting, Fab Tour & Feed Back Session - Analog Devices
Meeting Room: Washington Park
10:00 am
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12:30 pm
Solution Provider Morning Meeting - Analog Devices
Meeting room: Beaverton Cafe
12:30 pm
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2:00 pm
Lunch
All FOA members: Analog Devices
Lunch to be held in: Beaverton Cafe
2:00 pm
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6:00 pm
Full Membership Meeting - Analog Devices
Meeting room: Beaverton Cafe
4:00 pm
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6:00 pm
Fab Tour
Fab Tour - Murel and Robotics Upskilling Lab
7:00 pm
-
10:00 pm
Evening Social Event - KingPins - Beaverton
Address:
2725 SW Cedar Hills Blvd
Beaverton, OR 97005 United States
Major investments are developing in semiconductor fab capacity expansion globally and North America. Join industry colleagues online Friday, October 22, for a thought-provoking, VIRTUAL forum on the outlook, competitive environment, market, and technology trends driving fab expansion investment in the semiconductor industry. The discussion includes an analysis of the opportunities and challenges presented by end market drivers.
Hear our panel of industry and Wall Street experts discuss the latest technology trends, the global competitive environment, and the decision-making process for regional and state-level investments. Topics include:
Market and Technology Trends Driving New Investment
Emerging Technologies, Integration Schemes, and Manufacturing Processes
Economic, Geopolitical, and the Global Competitive Environment (includes US-China Tensions)
Factors that Influence Global and State-Level Decisions on Where Fab Investment Occurs
Venture Capitalism in the Industry and Growth Trends
Semiconductor Chip Shortage
And more
Explore industry trends from the economic, market, technology, and manufacturing perspectives, plus valuable information from the viewpoint of each speaker.
Virtual Event, Pacific Time United States
Friday, October 22, 2021
8:30 am
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8:35 am
Janell Centers
Marketing Manager, Semiconductor and Technology
Macquarie Electronics
Welcome, Introduction
8:35 am
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9:00 am
Charles Shi, PhD
Vice President & Research Analyst, Semiconductor Capital Equipment
Needham & Company
KEYNOTE—The War for Semiconductor Process and Packaging Leadership in the Era of a Slowing Moore’s Law
For more information on sponsorship, please contact Eric Rude - [email protected]
In addition to presentations from recognized thought leaders for each smart manufacturing Topic, there will be breakout sessions which will enable individuals to further explore use cases with subject-matter-experts. Workshop topics include:
How to use ROI to select Smart Manufacturing solutions. Leverage data access, communications protocols and data sharing practices to enable new applications?
Compare and contrast common solutions for data flow architectures and material handling for improving cycle time and yield.
Best practices for Data Security Audits and cyber-attack prevention.
Where is machine-learning and artificial intelligence best used to improve overall productivity and automation?
SEMI Global Headquarters 673 S. Milpitas Blvd Milpitas, CA95035 United States
Wednesday, September 11
5:30 pm
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7:30 pm
Evening Reception
Rockwell Automation Electric Vehicle (EV) Innovation Center
111 N. Market Street, San Jose, CA 95113
SEMI’s Smart Manufacturing Technology Community invites you to a one-day workshop to discuss solutions to critical issues to realize the benefits of smart manufacturing across the Semi/OSAT/PCBA segments of the electronic manufacturing supply chain. Walk away with ideas on how to maximize the impact of smart manufacturing solutions deployed across the electronics manufacturing industry and opportunities for collaboration across the supply chain using smart manufacturing principles.
Smart Manufacturing Workshop: Successful Implementation and Opportunities for Enabling Technologies
8:00 am - 5:00 pm
Off
Add to Calendar2019-09-12 08:00:002019-09-12 17:00:00Smart Manufacturing Workshop: Successful Implementation and Opportunities for Enabling TechnologiesA SEMI Smart Manufacturing Workshop
SEMI’s Smart Manufacturing Technology Community invites you to a one-day workshop to discuss solutions to critical issues to realize the benefits of smart manufacturing across the Semi/OSAT/PCBA segments of the electronic manufacturing supply chain. Walk away with ideas on how to maximize the impact of smart manufacturing solutions deployed across the electronics manufacturing industry and opportunities for collaboration across the supply chain using smart manufacturing principles.SEMI Global Headquarters 673 S. Milpitas Blvd Milpitas, CA 95035 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
