Kirk Wheeler received his Bachelor’s (2003) and Ph.D. (2010) Degrees in Mechanical Engineering from Arizona State University with emphasis in Solid Mechanics and Next-Generation Ceramic Nuclear Fuel Development. Prior to joining Intel Kirk held a variety of jobs ranging from a Long Distance Truck Driver, Lecturer at ASU in the Engineering Department, and visiting scientist at Los Alamos National Labs. Kirk joined Intel in 2010 as a senior process engineer in the Media Development Module where he owned the development of Intel’s first high temperature JEDEC tray-based assembly process. In 2013 Kirk moved into the CAM/TCB module where he was the TCB (Thermal Compression Bonding) platform lead for Intel’s Client products and developed the TCB process for Intel’s newly released ‘Foveros’ program. In 2018 Kirk moved into a staff pathfinding role in ATTDs MIHL (Media, Inspection, Handling, Laser) assembly module. Kirk has published numerous articles in The Journal of Nuclear Materials, conference proceedings, technical reports to Congress and the US Department of Energy.