San Francisco
United States
Registration covers all 3 days of Workshops. No discounts given for partial attendance. Full refunds through December 17, 2022. December 18-January 19 - substitutions only.
SEMI, FlexTech, NBMC & NextFlex Members: $199
Non-Members: $499
If you have any questions, please contact Gity Samadi, [email protected].
SEMI has secured a Group Rate at the Staybridge Suites at 321 Cypress Drive, Milpitas, CA, at the special rate of $202/night with breakfast included.
To reserve the rate visit Staybridge Suite website and follow these steps:
Step 1 – Enter your dates
Step 2 – Choose Rate Preference, then group rate, type in SJ1
Alternatively, you may email the General Manager at [email protected]
Your health and safety are our top priority. We monitor developing federal, state, and local health and safety recommendations and requirements to determine the most appropriate safety protocols for our in-person events. For international attendees arriving from outside of the United States, please review the government travel guidance to confirm eligibility and requirements for travel.
FACE COVERINGS
Although masks are not required, attendees are encouraged to determine use based on their own personal comfort level as well as to be respectful of other's individual choice.
SEMI FlexTech FHE Technical Gap Analysis Workshop - Tues. 1/17 - 8 am-12 noon
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA
During this workshop the attendees will complete a Technical Gap Analysis in preparation for FlexTech’s next Request for Proposals (RFP), including exploring topics and technology development required to meet development objectives. Lunch will be served following the workshop.
SEMI NBMC Technical Gap Analysis Workshop - Tues. 1/17 - 1:00-5:00 pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA
Attendees will turn their sights to preparing the technical topics / gaps in the Nano-Bio Materials space to explore topics and technology development required to meet development objectives. A networking reception will follow the workshop.
SEMI FlexTech - FHE Standards Workshop - Wed 1/18 - 8:00am - 1:00pm
@ SEMI - 673 S. Milpitas Blvd - Milpitas, CA
Many topics and paths were identified at the previous, very successful workshop in July 2022. This workshop will take the work a step further and create scopes of work for this very important foundation required to propel the design in of FHE-based components. This workshop includes a continental breakfast and lunch.
NextFlex - Hybrid Electronics for Advanced Packaging Workshop - Wed 1/18 2:00 - 7:00 pm & Thurs 1/19 - 8:00 am - 5:00 pm
@NextFlex, 2244 Blach Place, Suite 150, San Jose, CA
As the community awaits the release of request for proposals (RFPs) for programs within the CHIPS and Science Act, NextFlex is hosting a workshop to align the ecosystem’s vision on how additive hybrid electronics manufacturing can shape the future of domestic advanced semiconductor packaging. Join us for presentations from visionary speakers on how their organizations plan to participate in the CHIPS and Science Act programs and participate in breakout sessions focused on information sharing, proposal concept refinement, and formation of proposal teams.
Breakout topics include:
SEMI & NEXTFLEX
Milpitas & San Jose, CA
United States
For a detailed program agenda for this workshop visit NextFlex.us
Join us for three-days of technology assessments, updates, discovery and planning workshops focused on the development of the electronics ecosystem and flexible, hybrid electronics, medical monitoring sensors, and their application to driving development in new electronics packaging approaches.
Industry experts and leaders will come together to focus on identifying gaps in technology development, including in design, manufacturing, standards and environmental sustainability.
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Harvey Kauget practices in the firm's Corporate Practice Group with a focus on intellectual property litigation and prosecution.
Harvey serves a wide-range of clients in the areas of patent, trademark and trade secret litigation, patent and trademark prosecution, IP risk management, portfolio licensing, and client counseling.
Harvey’s litigation and patent prosecution background consists of dealing with matters related to technologies such as: semiconductor processing, plasma dicing, welding systems, lighting and LEDs, hot plates, software, computer integration and networking, satellites, solar power, hydrogen fuel cells, biodiesel, gaming, jewelry, gift cards, cups, davit lift, suntan lotions, power tools, paint rollers, flow systems, nuclear control rods, shirt pressers, air filters, hot water systems, fans, contact lenses, blood plasma expander, disposable blood measuring device, urine analysis, teeth whitening, suture anchors, and medical devices. In addition, he also has experience in a wide-range of other areas including firearms, speakers, waste fuel flare stacks, furniture, exercise equipment, recycling equipment, cement materials, fence posts, and tidal gates.
Mr. Kauget has experience presenting cases before the Court of Appeals for the Federal Circuit and Eleventh Circuit. He is also a registered patent attorney admitted to practice before the U.S. Patent and Trademark office. Before Harvey began his legal career, he worked as an engineer and as a product manager in the semiconductor industry as well as a certified high school chemistry and physics teacher.
Honors & Recognitions
United States
CAST EMG ESD Alliance FlexTech MSIG SOIReceive practical information on designing, writing and protecting your patents from an experienced and knowledgeable source. This course will review the latest thinking in what is a patentable invention and how to protect your invention. You will learn the basics of disclosing your invention for maximizing your protection, with an opportunity for Q&A at the end. A course useful to inventors at every stage of your careers and every stop in our industry ecosystem.
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Flexible hybrid electronics (FHE) is an emerging manufacturing methodology that combines the best of conventional and printed circuitry. By enabling flexibility and digital manufacturing without compromising on processing capability, it promises to remove the constraints of rigid PCBs while reducing costs and hence enable new applications.
This webinar from Dr Matthew Dyson of IDTechEx provided the status of FHE, including examples that are already commercialized.
Standards and other attributes required for mass manufacturing was outlined, and the scope for FHE to be used for novel applications (including harsh environments) assessed. Finally, a roadmap covering the near, medium, and long term was presented, including how FHE development fits with the ongoing development of heterogeneous integration.
ABOUT THE SPEAKER
Matthew is a Senior Technology Analyst at IDTechEx, specializing in printed/organic/flexible/hybrid electronics and sensors. He has an MRes and PhD in Physics from Imperial College London, which aimed to better establish processing/structure/property relationships in organic semiconductors. This was followed by two years post-doctoral researcher at Eindhoven Technical University in the Netherlands, focusing primarily on organic photodetectors (OPDs). His academic research, which has been cited over 500 times, also included work on perovskite photovoltaics and aggregation induced emission materials.
At IDTechEx, Matthew analyses technical innovations and applications across the printed/flexible/hybrid landscape, attending multiple conferences and interviewing companies to establish a clear picture of the technical and commercial landscape. This analysis is published in reports on topics such as 3D electronics and printed/flexible sensors, and applied to consulting projects evaluating commercialization opportunities across printed/flexible electronics. He also manages a team of analysts covering wearable technologies, AR/VR, and emerging photovoltaics.
United States
This webinar featured Dr. Matthew Dyson of IDTechEx outlining the status of FHE, including examples that are already commercialized. Standards and other attributes required for mass manufacturing were discussed, and the scope for FHE to be used for novel applications (including harsh environments) assessed. In addition, he presented a roadmap covering the near, medium, and long term will be presented, including how FHE development fits with the ongoing development of heterogeneous integration.
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Current electromechanical design practice is predicated on the exercise of expert-level judgement through an interactive and iterative design and fabrication process that requires skilled humans at every step. This approach doesn't scale because it is labor intensive, and therefore biases robots toward longer-lasting, more general-purpose (and expensive) designs in order to justify the development and fabrication costs. Though appropriate in some cases, not all applications are well-served by this process. Many robot applications might be better-served by rapidly-built special-purpose or single-use machines, but automated design and fabrication tools will be critical to control costs, accelerate development, and be responsive to application needs.
The overall goal is to make electromechanical systems (robots) so easy to design and fabricate that we could enable people who are application experts (but not necessarily robot design or fabrication experts) to rapidly create robots for their specific needs. Although Roboticists claim that robots are for dull, dirty, and dangerous use-cases, the community predominantly uses them for the first case, because robots are currently expensive and slow to build, which makes them precious. If we change this situation by making robots practically disposable/expendable, we could potentially re-imagine many robot use-cases.
With this future in mind, new design tools to convert high-level requirements specified by non-experts into concrete electromechanical design plans, new materials that leverage multi-material additive manufacturing, and new multi-material 3D printing methods to automatically convert these designs into functional robots are being developed. During this course we will describe these various areas of current study as well as possible applications for 3D printed robotics.
Dr. Robert MacCurdy is an assistant professor in Mechanical Engineering at the University of Colorado Boulder where he leads the Matter Assembly Computation Lab (MACLab). He is developing new algorithms, materials, and fabrication tools to automatically design and manufacture electromechanical systems, with a focus on robotics. Rob did his PhD work with Hod Lipson at Cornell University and his postdoctoral work at MIT with Daniela Rus. He holds a B.A. in Physics from Ithaca College, a B.S. in Electrical Engineering from Cornell University, and an M.S. and PhD in Mechanical Engineering from Cornell University.
Dr Gregory Whiting is an Associate Professor in the Department of Mechanical Engineering and a member of the Materials Science and Engineering Program at the University of Colorado Boulder (CU). At CU he leads the Boulder Experimental Electronics and Manufacturing (BEEM) Laboratory, which is focused on studying and developing materials, processes and devices for novel and additively manufactured electronic systems used in applications including distributed sensing (particularly for environmental monitoring) and robotics. Prior to joining CU in 2017, Greg was a member of the Rapid Evaluation Team at Google[X] and managed the Novel Electronics Area at the Palo Alto Research Center. He received a PhD from Cambridge University in 2007 and a BS from UC Berkeley in 2002.
United States
Fabricating robots using additive design and manufacturing methods has the potential to transform when, where and how the advantages of robots are brought to bear.
Take this FlexTech Master Class to explore the potential applications and how to use new design tools, 3D printing methods and multi-material additive manufacturing to convert ideas into solid electromechanical robotic systems.
Led by Dr. Robert MacCurdy and Prof. Greg Whiting of the University of Colorado, Boulder, this course will provide you new ways to approach manufacturing, additive design and the role of robots.
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Printed, flexible and hybrid electronics (PFHE) enable emerging applications in IoT, medical sensing, smart packaging and labels, structural monitoring, human wellness and performance, monitors, extreme environment, and display applications. At the same time, PFHE approaches can also provide faster product development, prototyping, and manufacturing cycles for single, custom items to large areas, low-cost mass manufacturing scales in additive, more sustainable pathways for electronics as they become even more ubiquitous in our world.
This class covers the basics of PFHE processing technologies, from dispensing and inkjet printing to roll to roll printing and coating, along with the materials and supplementary thermal processes that enable these processes.
Next-generation technologies are also explored for high-resolution PFHE and additive manufacturing that could provide new form factors and manufacturing approaches and exceed the performance of conventionally-processed electronics. These technologies also have impact on unmet heterogeneous integration possibilities in fields ranging from electronics to optics and quantum materials.
Example PFHE and printed energy materials topics:
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J. Devin MacKenzie is the Washington Research Foundation Professor of Clean Energy and an Associate Professor of Materials Science and Engineering and Mechanical Engineering at UW. Dr. MacKenzie is also the director of the Washington Clean Energy Testbeds, an open access laboratory with world-class printed electronics, flexible electronics and energy device fabrication and testing capabilities. Dr. MacKenzie has 20 years of experience co-founding or leading startups in novel fabrication including as a co-founder and CEO of Imprint Energy commercializing printed flexible batteries, as CTO of Add-Vision, a printed flexible OLED display company that was acquired in 2011, and as a VP at Kovio, an MIT spin out, leading printed Si RF device integration. Devin also co-founded the world’s first printed electronics company, Plastic Logic Ltd. in the United Kingdom. Previously Dr. MacKenzie was a researcher at AT&T Bell Laboratories. Prior to entering the start-up world, Devin was a postdoc in Physics at the University of Cambridge and earned PhD, MS, and BS degrees from the University of Florida and MIT. Dr. MacKenzie has over 220 patents and publications and has been cited over 10,000 times. |
This is the 11th Flexible Electronics Master Class. This and previous classes are available On Demand. See the full list.
United States
FlexTechThe field of printed, flexible and hybrid electronics (PFHE) and energy devices provides pathways to new products and form factors for ultralight, thin, flexible and large-area electronics, sensors, processing, I/O, photonics, and power. Indeed, flexible electronics is quietly transforming packages and enabling radical changes in electronics from the inside out.
In this Flexible Electronics Experts Class (recorded on June 22, 2022) you will learn the basics and the next generation improvements in processing technologies, from dispensing and inkjet printing to roll-to-roll printing and coating. The instructor also addressed the latest materials and updates on supplementary thermal processing needs.
This course is appropriate for newcomers to the field, as well as those looking to rapidly gain information on the latest materials and equipment advancements.
China
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Off Add to Calendar 2022-11-01 00:00:00 2022-11-01 00:00:00 SEMICON China Executive Summit China SEMI.org [email protected] America/Los_Angeles publicChina
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Off Add to Calendar 2022-11-01 00:00:00 2022-11-01 00:00:00 SEMICON China 高峰论坛 China SEMI.org [email protected] America/Los_Angeles publicShanghai
China
Shanghai
China