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SAN FRANCISCO, Calif. — July 13, 2023 — SEMI, the global industry association that unites the entire electronics manufacturing and design supply chain, today honored industry leaders for their outstanding accomplishments in developing Standards for the electronics and related industries. The SEMI Standards awards were announced July 11 at the SEMI International Standards reception at SEMICON West 2023 at the Moscone Center in San Francisco.

SEMI International Standards Excellence Award

LogoPresented since 1992, the Excellence Award this year honored the leadership teams of the Taiwan Fab & Equipment Information Security Task Force and the North America Fab & Equipment Computer and Device Security (CDS) Task Force developed SEMI E187 - Specification for Cybersecurity of Fab Equipment and SEMI E188 - Specification for Malware Free Equipment Integration, respectively. These complementary standards address major fab and semiconductor manufacturing equipment security issues. 

SEMI honored the following award recipients:

  • Richard Howard of Cimetrix by PDF Solutions
  • Ryan Bond of Intel
  • Ares Cho of ITRI
  • Leon Chang of TSMC

SEMI E187 significantly improves information security across the supply chain including semiconductor manufacturers, customers, and suppliers. SEMI E188 mitigates the spread of malware to manufacturing facilities during capital equipment delivery and helps both device manufacturers and equipment suppliers improve equipment reliability and uptime.

Corporate Device Manufacture Award

The North American SEMI International Standards Corporate Device Member Award recognizes a representative from a device manufacturer for outstanding contributions to the development of SEMI Standards.

  • Emily Liew of X-FAB Silicon Foundries SE was instrumental in revising wafer marking standards SEMI M12 and M13. Liew worked with key members of the Silicon Wafer Global Technical Committee to create additional specifications for laser marking on the back surface of 200mm wafers while clarifying the scope of both standards. She oversees the Traceability 5-Year Review Task Force and is an active participant in many other SEMI Global Technical Committees.

Merit Award

The North American SEMI International Standards Merit Award recognizes major contributions to the SEMI International Standards Program in solving complex problems at the task-force level and driving projects to completion.

  • Alexander Tregub of ATCP Consulting Services formed and leads the Chemical Mechanical Planarization Consumables (CMP-C) Task Force under the SEMI Liquid Chemicals North America Global Technical Committee. Tregub helped drive the publication of four new CMP-C standards for pads hardness, density and porosity, disks, and windows (SEMI C100C102C103C104) with two more in development (rings and PSA). Together, Tregub and the CMP-C Task Force, demonstrates tremendous effort, dedication, and support to advance the technology and fulfill the needs of semiconductor manufacturers.

Leadership Award

The North American SEMI International Standards Leadership Award recognizes individuals who have strengthened the SEMI Standards Program through member training, mentoring, and new member recruitment. Leaders play a critical role in preparing new volunteers to become productive committee contributors, efficiently guiding them through the standardization process.

  • Andrew Petraszak of Tokyo Electron guided the S1 (Safety Labels) Revision Task Force through consensus building to improve its industry relevance of SEMI S1 and alignment with best practices. He rallied his peers as well as his competitors to complete the revision of SEMI S1. Petraszak not only leads the S2 Mechanical Design Task Force, working to improve lifting equipment (§ 18.6) and hinged loads (§ 18.7) of the prominent SEMI S2, Safety Guideline for Manufacturing Equipment, he is also spearheading the improvements to SEMI S3 (heating systems).

Honor Award

The North American SEMI International Standards Honor Award recognizes individuals with a longstanding dedication to advancing SEMI Standards. 

  • Mohamed Saleem of Brooks Instrument/ITW has been an active participant in the SEMI Standards Program as a volunteer industry expert for more than 25 years. Saleem’s extensive experience in the SEMI Standards Program is critical in driving results to completion and he remains a key force in pushing topics through the SEMI Standards process. Saleem is a member of the North America Regional Standards Committee and chairs the Gases North America Global Technical Committee. He also leads three other Gases task forces and has authored many widely used standards such as SEMI F20 (316 SS distribution systems), F58 (test method for moisture dry-down in gas delivery systems), F70 (particle contribution), F105 (guide for metallic material compatibility), andSEMI E186 (EtherCAT ports in MFCs).
  • Koh Murai of KESG/MEGA has been an active participant in the SEMI Standards Program as a volunteer industry expert for over 12 years and is a member of the North America Regional Standards Committee. Murai chairs the Liquid Chemicals North America Global Technical Committee, leads the High Purity Task Force and provides support in many other Liquid Chemicals task forces. Murai has been instrumental in authoring and revising many known standards such as SEMI F31 (bulk chemical distribution systems), F39 (chemical blending systems), F41 (qualification of a bulk chemical distribution system), the E49 series (E49.2, E49.4, E49.5, E49.7 – Guide for High Purity and Ultrahigh Purity Piping Performance, Subassemblies, and Final Assemblies), other various chemical standards, and several new slurry standards.

For more information, visit the SEMI International Standards webpage.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

SAN FRANCISCO — July 13, 2023 — Recognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), SEMI FlexTech, a SEMI Technology Community, yesterday presented the 2023 FLEXI Awards at the FLEX Conference and Exhibition, co-located with SEMICON West 2023 in San Francisco.

LogoThe FLEXI Awards spotlight FHE contributions in five categories: R&D Achievement, Product Innovation and Commercialization, Environmental Sustainability, Workforce Development and Industry Leadership.

2023 FLEXI Award Winners

LogoR&D Achievement – Pradeep Lall, MacFarlane Endowed Distinguished Professor and Director at Auburn University, was recognized for his landmark contributions in developing additive manufacturing processes and reliability testing for additive printed flexible electronics. His research has been instrumental in achieving surface-mount assembled additively printed circuits. He has regularly presented papers at the FLEX Conference focusing on process, material, and reliability advancements for additively printed FHE and is the academic co-lead of the SEMI Task Force on FHE Reliability Standard Development.

LogoProduct Innovation and Commercialization – Dr. Azar Alizadeh, Principal Scientist, and her team at GE Research won a FLEXI for developing low-cost wireless, flexible, and wearable medical devices for both military and clinical use. The wireless vital sign monitoring system has significantly advanced low-power, wearable, wireless multi-parameter devices and analytics capable of monitoring heart rate, respiration rate, blood oxygenation, continuous changes in blood pressure and skin temperature for ambulatory patient monitoring and decision making.

LogoEnvironmental Sustainability – Robert Prainoco-founder and COO of CHASM, received a FLEXI for leading a project with U.S. Department of Energy to advance the decarbonization of cement through the CHASM NTeC-C additive that reduces the amount of cement in concrete, eliminating 0.7 metric tons of CO2 per ton of concrete. For new semiconductor fabs between 8 million and 15 million square feet, the additive could reduce CO2 from the floor construction alone by 18,000 to 36,000 metric tons.

LogoWorkforce Development – Dr. Peter Doerschuk of Cornell University was recognized as a key advocate and intellectual partner in applying AI/ML approaches to optimize cleanroom processes. He has been instrumental in training master’s degree students in image processing and deep learning, many hired by top develop AI tool developers. His work has led to a deep neural net that will be used by several Cornell engineering students in the coming years. A key focus of Dr. Doerschuk is to help grow the workforce needed to develop next-generation micro- and nano-scale manufacturing strategies for both FHE and traditional chip manufacturing.

LogoIndustry Leadership – Dr. Nancy Stoffel, Platform Leader for Flexible Hybrid Electronics at GE Research, won a FLEXI for her outstanding leadership in advancing FHE manufacturing. She has led roadmapping and gap analysis workshops critical to identifying future project topics and building out a robust FHE infrastructure. Dr. Stoffel is also addressing the need for more STEM workers and advocates tirelessly for diversity in science and engineering by supporting and speaking on the topic at workshops, panels, programs and other forums.

About the FLEXI Awards Committee

The FLEXI Awards committee consists of representatives from Applied Materials, Eli Lilly, STMicroelectronics and UES.
 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

SAN FRANCISCO, Calif. – July 13, 2023 – The Echo Opto-Acoustic Metrology System from Onto Innovation, Inc. has won the 2023 Best of West award, SEMI and Semiconductor Digest announced today at SEMICON West 2023, July 11-13 at the Moscone Center in San Francisco. Presented by SEMI and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.

LogoThe Echo™ opto-acoustic metrology system delivers non-destructive wafer-level metrology for measurements of single and multi-layer opaque films ranging in thickness from 50Å to 35µm. It uses Picosecond laser ultrasonic (PULSE™) technology, a semiconductor industry workhorse for over 20 years that provides comprehensive metal film thickness metrology.

“The Echo system provides metal thickness and characterization for a variety of devices, including RF filters for 5G communications, and power devices for the rapidly growing electric vehicle (EV) and high-speed portable charger markets,” said Pete Singer, Editor-in-Chief of Semiconductor Digest. “Congratulations to Onto Innovation for winning the Best of West competition two years in a row.”

The company’s Atlas V Optical Critical Dimension Metrology Tool won the award in 2022.

Onto Innovation is a leader in process control, combining global scale with an expanded portfolio of leading-edge technologies that include:

  • Un-patterned wafer analysis
  • 3D metrology spanning chip features from nanometer scale transistors to large die interconnectsLogo
  • Macro defect inspection of wafers and packages
  • Metal interconnect composition
  • Factory analytics
  • Lithography for advanced semiconductor packaging

Onto Innovation will receive the Best of West award today at SEMICON West 2023.
 

About Semiconductor Digest
Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest (www.semiconductor-digest.com), is dedicated to providing global information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Semiconductor Digest consists of a website, magazine and topic-focused newsletters.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Semiconductor Digest Contact

Pete Singer, Editor-in-Chief
Phone: 1.978.470.1806
Email: [email protected]

SAN FRANCISCO — July 11, 2023 — Global sales of total semiconductor manufacturing equipment by original equipment manufacturers next year are forecast to bounce back from a projected contraction of 18.6% to $87.4 billion in 2023 following the industry record of $107.4 billion in 2022, SEMI announced today in its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective at SEMICON West 2023. The expected 2024 recovery – to $100 billion – will be driven by both the front-end and back-end segments.

Logo“Despite current headwinds, the semiconductor equipment market is set to see a strong rebound in 2024 after an adjustment in 2023 following a historic multi-year run,” said Ajit Manocha, SEMI president and CEO. “Projections for robust long-term growth driven by high-performance computing and ubiquitous connectivity remain intact.”

Semiconductor Equipment Sales by Segment

Sales of wafer fab equipment, which includes wafer processing, fab facilities and mask/reticle equipment, are projected to decrease 18.8% to $76.4 billion in 2023 – more than the 16.8% decline predicted by SEMI in the 2022 year-end forecast. The wafer fab equipment segment is projected to account for the bulk of the recovery to $100 billion in 2024, generating $87.8 billion in sales, a 14.8% increase.

The 2022 decline in back-end equipment segment sales is expected to continue in 2023 due to challenging macroeconomic conditions and softening semiconductor demand. Semiconductor test equipment market sales are projected to contract by 15% to $6.4 billion in 2023, while assembly and packaging equipment sales are expected to drop by 20.5% to $4.6 billion in the same year. However, the test equipment and assembly and packaging equipment segments are expected to expand by 7.9% and 16.4%, respectively, in 2024.

Semiconductor Equipment Sales by Application

Equipment sales for foundry and logic applications, accounting for more than half of total wafer fab equipment receipts, are expected to drop 6% year-over-year to $50.1 billion in 2023, reflecting softer end-market conditions. Demand for leading-edge foundry and logic in 2023 is expected to remain stable, with a slight softening balanced out by a rise in spending on mature nodes. Foundry and logic investments are projected to increase 3% in 2024.

DRAM equipment sales are expected to fall 28% to $8.8 billion in 2023 due to continuing weak consumer and enterprise demand for memory and storage but rebound 31% to $11.6 billion in 2024. NAND equipment sales are projected to decrease 51% to $8.4 billion in 2023 and surge 59% to $13.3 billion in 2024.

Semiconductor Equipment Sales by Region

China, Taiwan and Korea are expected to remain the top three destinations for equipment spending in 2023 and 2024. While Taiwan is forecast to regain the lead in 2023, China is projected to return to the top position in 2024. Equipment spending for most regions tracked is expected to fall in 2023 before returning to growth in 2024.

The following results reflect market size by segment and application in billions of U.S. dollars:

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Source: SEMI July 2023, Equipment Market Data Subscription

* Total equipment includes new wafer fab, test, and assembly and packaging. Total equipment excludes wafer manufacturing equipment. Totals may not add due to rounding.
 

The SEMI forecast is based on collective input from top equipment suppliers, the SEMI Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and the industry-recognized SEMI World Fab Forecast database.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

  • Monthly SEMI North American Billings Report, an early perspective of equipment market trends
  • Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments
  • Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

For more information online, please visit SEMI Market Data.
 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Concurrent with SEMICON West, FLEX Conference 2023 to Spotlight Flexible Hybrid Electronics Innovations

SAN FRANCISCO – July 10, 2023 – Critical semiconductor industry topics will take center stage at SEMICON West 2023, opening tomorrow with leading CEOs gathering at the Moscone Center in San Francisco for the latest insights into industry growth opportunities, sustainability, and workforce development. The July 11-13 event, North America’s premier exhibition and conference for the microelectronics supply chain, will also feature presentations and executive panels on other key industry topics with thought leaders from the electronics design and manufacturing ecosystem, academia, and government.

LogoConcurrent with SEMICON West at the Moscone Center, FLEX Conference 2023 will showcase flexible hybrid electronics innovations from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTechSEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.

Registration for both events is open.

SEMICON West 2023 Highlights

Before the show floor opens, each day of SEMICON West 2023 will kick off with CEO Summit presentations on Path to $1T, Path to Net Zero and Path for Talent.

Day 1 – July 11

CEO Summit: Path to $1T

  • Welcome by Joe Stockunas, President of SEMI Americas, and opening remarks by Ajit Manocha, President and CEO of SEMI
  • SEMI International Board Message – Axcelis Technologies
  • Keynotes:
    • The Virtual Path to a Trillion-Dollar Reality – Lam Research
    • Keys to Creating $1T in Shared Value – Tokyo Electron Limited
    • Compound Semiconductors: Taking Center Stage – Coherent
    • Navigating the Semiconductor Supply Chain Transformation – DHL Supply Chain
    • Combining Accuracy and Throughput for Next Semiconductor Industry Challenges – JOHANNES HEIDENHAIN GmbH
  • Climate Equity and Social Impact Session

FLEX Conference Keynotes

  • Simplifying the IC Ecosystem – Pragmatic Semiconductor
  • The Very Big Picture on Materials: All of the Options Fit to Print – Rice University
  • Advancing Additively Manufactured Electronics (AME) for Heterogeneous Integration – Meta Reality Labs

Other Sessions and Networking Opportunities

  • Executive Panel – Navigating Supply Chain Uncertainty: How Do You Build Agile Supply Chains? – Representatives from Dell, Intel, KLA, McKinsey & Company and Resilinc will examine government investment in chip manufacturing and supply chain resilience.
  • TechTALKS
    • Sustainable Synergy: Balancing Semiconductor Growth and Environmental Responsibility
    • Enabling New Products with Advanced Substrates
  • Networking Events:
    • SEMI Corporate Savings Program Wine and Cheese Mixer
    • New: SemiSisters Reception – SemiSisters is a group of female semiconductor engineers, scientists, technologists, market analysts, executives, marketing and public relations professionals and journalists.
    • SEMI Standards 50th Anniversary Celebration and Awards Ceremony

Day 2 – July 12

CEO Summit: Path to Net Zero

  • Welcome by Mousumi Bhat, Ph.D., VP of SEMI Sustainability Programs, and opening remarks by Ajit Manocha, President and CEO of SEMI
  • Keynotes:
    • Pursuing Sustainable Growth – Intel Corporation
    • A Collaborative Pathway to Net Zero – Applied Materials
    • Showing Our True Colors: Co-Creating a Brighter Future for the Chip Industry – Schneider Electric
    • Inventing What’s Next in Sustainable Computing – IBM
  • Sustainability & EHS Forum
  • SEMI Sustainability Wall of Fame – Recognition of semiconductor value chain leaders inspiring the Path to Net Zero
  • SEMI Sustainability Award – Recognition of outstanding efforts to launch the Semiconductor Climate Consortium
  • America’s Path Forward in Semiconductors
    • Focusing on government support of the U.S. semiconductor industry, representatives from the Arizona Commerce Authority, BDO USA, Boston Consulting Group, Compass, Covington & Burling, mySilicon, the State of Indiana, and theS. Department of Commerce will present.

Other Sessions and Networking Opportunities

  • TechTALKS
    • Latest Trends in Sensorization
    • Heterogeneous Integration: HPC and Hyperscale Computing
  • Bulls & Bears panel with experts from Bernstein Research, Jefferies, Parnassus Investments, Reuters Network, and Tudor Investment Corporation
  • Networking events:
    • Sustainability & EHS Forum Reception
    • SEMI Member Breakfast
    • Global Automotive Advisory Council (GAAC)
    • Advanced Packaging & Heterogeneous Integration
    • MEMS & Sensors Industry Group (MSIG)
    • Silicon Manufacturers Group (SMG)
    • Workforce Development
    • Smart Manufacturing
    • Smart Mobility

Day 3 – July 13

CEO Summit: Path for Talent

  • Welcome by Ajit Manocha, President and CEO of SEMI, and opening remarks by Shari Liss, Executive Director of the SEMI Foundation
  • Keynotes:
    • One Trillion Reasons to Join Our Industry – Axcelis Technologies
    • Building the Future: Workforce Development in the Semiconductor Manufacturing Industry – SkyWater Technology
    • Transforming Pathways to Transformative Semiconductor Careers – University of California, Berkeley
  • Chip In Roadtrip Nation Panel – Accenture, Aeris LLC, Roadtrip Nation, SEMI Foundation, and University of Texas Austin
  • SEMI Foundation Excellence in Achievement Award – Recognition of significant contributions to global microelectronics industry workforce development and diversity, equity and inclusion

Other Sessions

Test Vision Symposium

On Days 2 and 3, the Test Vision Symposium will bring together industry experts to explore the future of test, discussing upcoming trends, innovations, and industry requirements.

New this year at SEMICON West are the local Taste of San Francisco cuisine and a daily networking happy hour.

FLEX Conference 2023

LogoFLEX Conference will feature keynotes, startup and venture capitalist panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible hybrid electronics, printed electronics and advanced packaging including heterogeneous integration.

“FLEX will showcase advancements in next-generation electronics packaging accelerating industry growth,” said Melissa Grupen-Shemansky, CTO and Vice President of Technology Communities at SEMI. “Companies pushing the boundaries of heterogeneous integration will join FlexTech, NBMC and NextFlex innovators as they present cutting-edge research and development to advance industry technical knowledge through papers, posters, and product information.”

Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2023.

Follow SEMICON West on LinkedIn and Twitter: #SEMICONWest
 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

SAN FRANCISCO – July 11, 2023 – Cerebras Systems, provider of the fastest artificial intelligence (AI) accelerator, has won the 2023 SEMI Award for North America for process and technology integration at SEMICON West. SEMI honored Cerebras for developing the world's largest integrated circuit chip for complex artificial intelligence (AI) computation applications training with very large AI databases as a single data core, enabling game-changing performance.

LogoTo achieve this milestone, Cerebras Systems, based in Sunnyvale, Calif., implemented wafer-scale integration with advanced packaging and system design for AI and other deep-learning applications as standalone units and in clusters for large-scale data centers. The chip’s integrated logic and memory cores contain 2.6 trillion transistors and 40 gigabytes of on-chip memory with an active area of 46,225 mm2 fabricated on 300mm silicon wafers using TSMC's 7nm complementary metal-oxide semiconductor (CMOS) technology. The Cerebras Wafer-Scale Engines (WSE-2) are deployed in stand-alone units of the company’s CS-2 Artificial Intelligence system and incorporated as accelerators in large-scale AI computing centers. 

“We are honored to be recognized by SEMI for our work in revolutionizing AI compute for generative AI,” said Dhiraj Mallick, SVP, Hardware Engineering and Operations, Cerebras Systems. “Our Wafer-Scale Engine, the industry’s largest AI processor which powers our CS-2 systems, enables the AI community to train truly large-scale models efficiently and easily.”

LogoThe Cerebras WSE-2 is the largest processor ever built. It is 56 times larger than the largest GPU, has 123 times more cores, 1,000 times more on-chip memory, 12,000 times more memory bandwidth, and 45,000 times more fabric bandwidth. The WSE-2 is the size of a dinner plate, while the largest graphic processing unit is the size of postage stamp.

“For more than 40 years, the SEMI Award for North America has recognized transformative semiconductor innovations, many of them enabled by miniaturizing or shrinking integrated circuits,” said Joe Stockunas, President of SEMI Americas. “This year's award shifts direction to recognize Cerebras Systems for developing and commercializing the world's largest integrated circuits to enhance AI applications, one of the fastest growing markets enabled by semiconductors this decade.”

“AI’s ever-growing hunger for computing power demands uncanny innovation in chip technology,” said Witek Maszara, a member a SEMI Award for North America Committee. “Cerebras stepped up to deliver.”

Microprocessors have made enormous advancements over their 50-year history: transistors shrank by 1,500x, the clock frequency rose by 200x and operations-per-second by an astounding 1013.  Yet the physical size of the largest chips has not kept pace, rising a mere 50x due to limitations with lithography and manufacturing yield. In 2015, Cerebras Systems embarked on an effort to increase die size, in five years matching the progress of the entire industry over the previous 50 years. The Cerebras WSE, introduced in 2019, overcame both the lithography and yield limits and delivered a computing system using wafer-scale integration to dozens of commercial customers.

The highest honor conferred by the SEMI Americas region, the SEMI Award for North America, was established in 1979 to recognize outstanding technical achievement and meritorious contributions by individuals and teams in the areas of Semiconductor Materials, Wafer Fabrication, Assembly and Packaging, Process Control, Test and Inspection, Robotics and Automation, Quality Enhancement, and Process Integration.

Nominations are open to individuals or teams from industry and academia whose accomplishments have a broad commercial impact and technical significance for the semiconductor industry. SEMI invites 2024 SEMI Award for North America nominations from individuals or teams with North American-based SEMI member companies. See list of past award recipients.

Learn more at SEMICON West 2023.  

Follow SEMICON West on Twitter: #SEMICONWest

About Cerebras Systems

Cerebras Systems is a team of pioneering computer architects, computer scientists, deep learning researchers, and engineers of all types. The company builds a new class of computer system, designed for the singular purpose of accelerating generative AI work. Its flagship product, the CS-2 system, powered by the world’s largest AI processors, makes training large models simple and easy by avoiding the complexity of distributed computing. Cerebras solutions are available via the cloud through the Cerebras AI Model Studio or on premises

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

SAN FRANCISCO – July 10, 2023 – SEMI and Semiconductor Digest today announced finalists for the Best of West award to be presented at SEMICON West 2023, July 11-13 at the Moscone Center in San Francisco. The Best of West Award winner will be announced at SEMICON West 2023 on Thursday, July 13.

LogoPresented by SEMI Americas and Semiconductor Digest each year, the Best of West award recognizes innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability.

The following Best of West 2023 finalists will showcase their products at their booths on the SEMICON West 2023 show floor:

Lam Research: Selective Etch Products

Collaborating closely with its customers, Lam Research developed an innovative suite of selective etch products – Argos®, Prevos® and Selis®. This product portfolio applies breakthrough wafer fabrication techniques and novel chemistries to support chipmakers in the creation of their advanced logic and memory solutions for a smarter, more connected world.

Booth W4

Logo

 

Onto Innovation: Echo Opto-Acoustic Metrology System

The Echo™ opto-acoustic metrology system delivers non-destructive wafer-level metrology for measurements of single and multi-layer opaque films ranging in thickness from 50Å to 35µm. It utilizes Picosecond laser ultrasonic (PULSE™) technology, a semiconductor industry workhorse for over 20 years that provides comprehensive metal film thickness metrology.

Booth 629

Logo

 

SPEA S.p.A.: DOT Tester Auto Maintenance

Featuring a combination of smart sensors, artificial intelligence, and instrument architecture, the DOT Testers Auto Maintenance feature enables semiconductor test equipment to autonomously run complete diagnostics and calibrations. The product preserves normal tester operation and requires no operator intervention.

Booth 1161

Logo

 

Santec: High-Accuracy Wafer Thickness Mapping System TMS-2000

The TMS-2000 maps the thickness distribution of semiconductor wafers with sub-nanometer repeatability even under conditions of temperature instability or environmental vibrations, circumstances where conventional wafer thickness mapping techniques may struggle. The system captures key wafer flatness measurements including global flatness, site flatness and edge flatness.

Booth 1840

Logo

 

 

About Semiconductor Digest
Through a mix of news, contributed articles and staff-written articles, Semiconductor Digest is dedicated to providing global information about the design, manufacturing, packaging and testing of semiconductors and other types of electronic devices, including MEMs, LEDs, displays, power electronics, optoelectronics/photonics, biomedical devices, solar cells, thin film batteries and flexible electronics. Semiconductor Digest consists of a website, magazine and topic-focused newsletters.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

SEMI Contact

Michael Hall
Phone: 1.408.943.7988
Email: [email protected]

Semiconductor Digest Contact

Pete Singer, Editor-in-Chief
Phone: 1.978.470.1806
Email: [email protected]

DRESDEN, Germany — June 26, 2023 — 3D integration and systems for semiconductor manufacturing applications will take center stage at SEMI 3D & Systems Summit as the event opens today with leading experts sharing the latest developments and insights into the 3D roadmap, heterogeneous integration and system-in-package (SiP) technologies for smarter systems. Registration is open for the 26-28 June summit in Dresden, Germany.

Logo“We’re excited to welcome industry leaders to Dresden to share perspectives on near-term packaging solutions and explore how deeper collaboration can drive innovation for emerging heterogeneous integration applications and European semiconductor industry growth,” said Laith Altimime, President of SEMI Europe.

Advanced packaging technologies have become critical enablers of continuing semiconductor innovation and extending Moore’s Law. Heterogeneous integration architectures such as chiplets combine separately manufactured electronics components into a higher level assembly to enhance semiconductor functionality and operating characteristics.

Themed Smarter Systems through Heterogeneous Integration, this year’s summit will feature a broader scope of topics including: 

  • Advanced Packaging: Enabling Moore’s Law, The Next Frontier
  • Market Briefing and Technical Roadmap
  • Industrialization and Mass Adoption of 3D Technologies
  • Hybrid Bonding Developments
  • Chiplet Design Packaging: Architectures and Challenges
  • Novel Processes and Interconnect Solutions for 3D
  • Photonics Integration
  • Sustainability
  • Applications Enabled by 3D

3D & Systems Summit Highlights

Global Leaders to Present

Distinguished speakers will address new technology challenges and requirements across the entire 3D IC supply chain.

Experts from the following global leaders will also present:

  • ASML
  • Besi
  • CEA-Leti
  • EPIC
  • EV Group
  • Fraunhofer Group for Microelectronics
  • Fraunhofer IIS-EAS
  • Fraunhofer IZM-ASSID
  • imec
  • Intel
  • KLA
  • MKS-Atotech
  • Research Fab Microelectronics Germany (FMD)
  • Siemens EDA
  • SPTS Technologies Ltd., a KLA company
  • SÜSS MicroTec

Exhibition

The most prominent names in 3D integration for microelectronics manufacturing will showcase their latest products and technologies at the exhibition area, including:

  • Adeia
  • Amkor
  • ASE Global
  • Besi
  • Carl Zeiss Research Microscopy
  • CEA-Leti
  • Comet Yxlon
  • Confovis
  • DISCO Hi-TEC Europe
  • ERS electronic
  • Evatec
  • Fraunhofer IZM-ASSID
  • Koh Young Europe
  • Lidrotec
  • LPKF Laser & Electronics
  • OPTIM Wafers
  • ProSys
  • Racyics
  • SUSS MicroTec
  • ULVAC
  • Win Source

Exclusive Networking Opportunities

The 3D & Systems Summit will feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities. This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise. To reserve a seat, contact [email protected].

For more details, please visit the 3D & Systems Summit website and connect with SEMI Europe onTwitter or LinkedIn – @SEMIEurope, #3DSummit

Premium Sponsors

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. – June 26, 2023 – Critical semiconductor industry topics will come into sharp focus at SEMICON West 2023 as leading CEOs gather July 11-13 at the Moscone Center in San Francisco for the latest insights into the industry’s path to $1 trillion, sustainability and workforce development. The event, North America’s premier exhibition and conference for the microelectronics supply chain, will also feature other presentations and executive panels with thought leaders from the electronics design and manufacturing ecosystem, academia and government. Registration is open.

LogoThemed Building a Path Forward, SEMICON West 2023 will also address key topics including government investment in chip manufacturing, supply chain resilience, heterogeneous integration, smart mobility, smart medtech and smart manufacturing.

CEO Summit Keynotes at SEMICON West 2023
 

Path to $1 Trillion

HS

Tim Archer, President and CEO
Lam Research

The Virtual Path to a Trillion-Dollar Reality

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HS

Tony Kawai, President and CEO
Tokyo Electron Limited

Keys to Create $1 Trillion in Value

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HS

Vincent Mattera, Jr., Ph.D., Chair and CEO
Coherent

Compound Semiconductors: Taking Center Stage

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HS

Oscar de Bok, CEO
DHL Supply Chain

Navigating the Semiconductor Supply Chain
Transformation

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HS

Lutz Rissing, Managing Director and Executive Officer
Heidenhain

Combining Accuracy and Throughput for Next
Semicon Industries Challenges

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Path to Net Zero

HS

Keyvan Esfarjani, Executive VP, Chief Global Operations Officer; General Manager, Manufacturing, Supply Chain and Operations
Intel Corporation

Pursuing Sustainable Growth

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HS

Gary Dickerson, President and CEO
Applied Materials

A Collaborative Pathway to Net Zero

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HS

Aamir Paul, President, North America
Schneider Electric

Showing Our True Colors: Co-Creating a Brighter Future for the Chip Industry

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HS

Mukesh Khare, Ph.D., General Manager
IBM

Inventing What’s Next in Sustainable Computing

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Path to Talent

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Mary Puma, Executive Chairperson
Axcelis Technologies

One Trillion Reasons to Join our Industry

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HS

Thomas Sonderman, President and CEO Director
SkyWater Technology

Building the Future: Workforce Development in the Semiconductor Manufacturing Industry

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HS

Tsu-Jae King Liu, Ph.D., Dean and Roy W. Carlson Professor of Engineering
University of California, Berkeley

Transforming Pathways to Transformative
Semiconductor Careers

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Building a Path to Net Zero – Sustainability Programs

This track will include the Path to Net Zero CEO Summit keynotes and the following sessions.

  • Climate Equity & Social Impact
    • The session will showcase big-picture environmental, social and governance (ESG) topics and collaborative solutions to the most daunting challenges presented by the world’s rapidly changing climate. Focus areas include advancing the United Nations’ sustainable development goals (SDGs), establishing equitable economic opportunities, and leveraging public-private partnerships to develop climate equity programs.
  • Sustainability & EHS Forum 2023
    • Speakers and panels will discuss the status of disclosures, incentives, tax implications, regulations, and new proposals for research related to per-and polyfluoroalkyl substances (PFAS), phenol, isopropylated phosphate (PIP) and greenhouse gases (GHG). They’ll also explore strategies for navigating the evolving regulatory environment.
  • Startups for Sustainable Semiconductors Pitch & Pavilion
    • The session will highlight the role of startups in the semiconductor industry’s path to net zero. Panels of venture capitalists and corporate venture capitalists will discuss their funding of new technology solutions for decarbonization.
    • SEMI Startups for Sustainable Semiconductors program finalists will pitch their solutions to the corporate venture capital arms of leading semiconductor makers and equipment manufacturers. The Startups program is part of the SEMI Sustainability Initiative to enable a greener chip industry.

Supply Chain Management and CHIPS Act Investments

  • Navigating Uncertainty – How Do You Build Agile Supply Chains?
    • With business agility never more important to overcome industry disruptions, this panel will discuss foundational requirements for an agile supply chain and strategies for addressing challenges in a rapidly changing environment.
  • America's Path Forward in Semiconductors, A SEMICON West Session on Government and the Semiconductor Industry
    • This session will provide updates on available federal funding, program priorities, forecasts of new chip fabs expected from the CHIPS Act incentives, and an outlook for supply chain growth.

SEMICON West 2023 Pavilions

  • Smart Manufacturing Pavilion
    • Highlights will include discussions on automation and equipment for fully autonomous factories, wireless connectivity and security, extended chip capacity, supply chain agility, data ecosystems, and manufacturing operations enabled by artificial intelligence and machine learning.
  • Smart Mobility Pavilion
    • Key themes will include affordable electrification, intelligent sensors for smart mobility, and the role of silicon carbide (SiC) in the automotive ecosystem.
  • Smart MedTech Pavilion
    • Industry leaders, innovators, and venture capitalists will discuss future opportunities in the medical technology sector and showcase the latest innovations.
  • Workforce Development Pavilion
    • Targeting new strategies for recruiters, students and job seekers, the pavilion will highlight why microelectronics is a smart career choice, feature discussions on building a diverse and inclusive workforce, and host an interactive day with high-school students to help spark their interest in microelectronics careers.

FLEX Conference

  • FLEX Conference & Exhibition is the annual premier industry event focused on flexible hybrid electronics (FHE), hybrid electronics, printed electronics, and advanced packaging innovations, connecting players across the device-making supply chain. This year’s event will feature keynotes by experts at Meta, Rice University and Pragmatic Semiconductor on new ways of combining solid state devices and system interconnection through heterogeneous integration and advanced packaging.

Business Programs

  • The SEMI Market Symposium will provide a midyear update of key market trends and drivers as well as a forum to discuss pertinent business issues. Speakers will present market forecasts and analysis for the semiconductor, equipment, materials and other industries in the electronics design and manufacturing supply chain.
  • Bulls & Bears will again feature unique and diverse perspectives from Wall Street analysts on the microelectronics industry.

TechTALKS

Technology experts will explore key themes such as silicon wafers and advanced wafer technology, market dynamics and sustainability in electronic materials, the latest trends in sensorization, heterogeneous integration, and accelerating the pace of lithography and scaling innovation.

New this year at SEMICON West 2023 is local Taste of San Francisco cuisine and daily networking happy hours. The event will also feature networking opportunities at show floor lounges and receptions.

Design Automation Conference (DAC), the premier gathering focused on the design and design automation of electronic circuits and systems, will co-locate with SEMICON West 2023.

Follow SEMICON West on Twitter: #SEMICONWest

About SEMI

SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

SHANGHAI – June 28, 2023 ─ SEMICON China 2023, the world’s largest semiconductor conference and exhibition, opens tomorrow at the Shanghai New International Expo Centre to highlight critical industry themes including sustainability, smart manufacturing, automotive, innovation and talent. The June 29-July 1 event will gather industry leaders and visionaries for insights into the latest developments and trends across the electronics supply chain. Registration is open.

LogoSEMICON China 2023 will feature 1,100 exhibitors and more than 4,200 booths in 90,000 square meters of exhibit space – all record highs.

SEMICON China is a key enabler of collaboration and innovation across the entire electronics supply chain including chip design, manufacturing, assembly and test, equipment and materials, and the region is a vital contributor to global industry growth. China remains the world's largest semiconductor equipment market for the third consecutive year, accounting for $28.3 billion in billings as global semiconductor equipment billings hit a record high of US $107.6 billion in 2022, according to the recent Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

SEMICON China 2023 Highlights

Grand Opening Keynotes – Global industry leaders including executives from the top three segments in China – foundry, memory, and design – will explore the latest global business, technology, and market investment trends.

Forums – Industry experts and visionaries will provide insights into key areas of semiconductor industry growth.

Theme Pavilions

See the full SEMICON China 2023 agenda.

 

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Cherry Sun/SEMI China
Email: [email protected] 
Phone: +86.21.6027.8548

Michael Hall/SEMI U.S.
Email: [email protected]
Phone: 1.408.943.7988