SHANGHAI – June 28, 2023 ─ SEMICON China 2023, the world’s largest semiconductor conference and exhibition, opens tomorrow at the Shanghai New International Expo Centre to highlight critical industry themes including sustainability, smart manufacturing, automotive, innovation and talent. The June 29-July 1 event will gather industry leaders and visionaries for insights into the latest developments and trends across the electronics supply chain. Registration is open.

SEMICON China 2023 will feature 1,100 exhibitors and more than 4,200 booths in 90,000 square meters of exhibit space – all record highs.

SEMICON China is a key enabler of collaboration and innovation across the entire electronics supply chain including chip design, manufacturing, assembly and test, equipment and materials, and the region is a vital contributor to global industry growth. China remains the world's largest semiconductor equipment market for the third consecutive year, accounting for $28.3 billion in billings as global semiconductor equipment billings hit a record high of US $107.6 billion in 2022, according to the recent Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

SEMICON China 2023 Highlights

Grand Opening Keynotes – Global industry leaders including executives from the top three segments in China – foundry, memory, and design – will explore the latest global business, technology, and market investment trends.

Forums – Industry experts and visionaries will provide insights into key areas of semiconductor industry growth.

• Innovation and Investment
  • Supply Chain Theme – SEMI Innovation & Investment Forum
  • Design Innovation Forum – Automotive IC
  • New: SCC Carbon Neutrality and Sustainable Development Summit Forum

• Power and Compound Semiconductor
  • Power & Compound Semiconductor International Forum
  • Power & Compound Semiconductor Applications in Automotive Summit Forum

• IC manufacturing Technology and Supply Chain
  • Advanced Material Forum
  • IC Manufacturing Forum
  • Advanced Packaging Forum - Heterogeneous Integration
  • Sustainable Development (Green High-Tech Facility) Forum
  • Smart Manufacturing Forum - Factory of the Future

• Display on Silicon
  • CDC Metaverse

• Workforce Development
  • SEMI Workforce CXO Talent Forum

Theme Pavilions

• IC Manufacturing Pavilion
• Compound Semiconductor Pavilion
• SEMI Workforce Pavilion
• Smart Mobility Pavilion
• Micro-LED Pavilion

See the full SEMICON China 2023 agenda.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Cherry Sun/SEMI China
Email: [email protected] 
Phone: +86.21.6027.8548

Michael Hall/SEMI U.S.
Email: [email protected]
Phone: 1.408.943.7988

• Read more about SEMICON China 2023 Opens Tomorrow With Innovation, Sustainability, Smart Manufacturing, Automotive and Talent in Focus

MILPITAS, Calif. — July 10, 2023 — Electronic System Design (ESD) industry revenue increased 12% from $3,527.7 million in the first quarter of 2022 to $3,951.1 million in the first quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 12.7%.

“The electronic design automation (EDA) industry continued to post double-digit gains in Q1 2023, with increases in all product categories and geographic regions,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories Computer Aided Engineering, IC Physical Design and Verification, Printed Circuit Board and Multi-Chip Module, and Services all reported double digit increases.”

The companies tracked in the EDMD report employed 57,696 people globally in Q1 2023, a 12.9% jump over the Q1 2022 headcount of 51,093 and up 4.5% compared to Q4 2022.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category – Year-Over-Year Change

• Computer-Aided Engineering (CAE) revenue rose 15.1% to $1,434.1 million. The four-quarter CAE moving average increased 18.6%.

• IC Physical Design and Verification revenue jumped 24.6% to $675.8 million. The four-quarter moving average for the category increased 14.6%.

• Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 25.6% to $368.4 million. The four-quarter moving average for PCB and MCM rose 15.7%.

• Semiconductor Intellectual Property (SIP) revenue increased 0.4% to $1,330.6 million. The four-quarter SIP moving average grew 5.7%.

• Services revenue increased 17.2% to $142.2 million. The four-quarter Services moving average rose 16.8%.

Revenue by Region – Year-Over-Year Change

• The Americas, the largest reporting region by revenue, procured $1,698.2 million of electronic system design products and services in Q1 2023, a 12.7% increase. The four-quarter moving average for the Americas rose 12.5%.

• Europe, Middle East, and Africa (EMEA) procured $530.1 million of electronic system design products and services in Q1 2023, a 21.6% increase. The four-quarter moving average for EMEA grew 9.6%.

• Japan’s procurement of electronic system design products and services increased 4.3% to $272.7 million. The four-quarter moving average for Japan rose 2.3%.

• Asia Pacific (APAC) procured $1,449.9 million of electronic system design products and services in Q1 2023, a 9.6% increase. The four-quarter moving average for APAC grew 16%.

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents Electronic Design Automation (EDA), SIP and services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

• Revenue by product category (CAE, IC Physical Design and Verification, Semiconductor IP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
• Revenue by geographic region (Americas, EMEA, Japan and APAC)
• Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

About the Electronic System Design Alliance
The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI
SEMI® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG) and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

Press Contacts

Paul Cohen
ESD Alliance
A SEMI Technology Community
978-769-2106

Jack Taylor
Siemens EDA PR
Siemens Digital Industries Software
512-560-7143 

• Read more about Electronic System Design Industry Logs $4 Billion in Revenue in Q1 2023, ESD Alliance Reports

MILPITAS, Calif. — June 13, 2023 — Global 300mm fab equipment spending for front-end facilities next year is expected to begin a growth streak to a US$119 billion record high in 2026 following a decline in 2023, SEMI highlighted today in its quarterly 300mm Fab Outlook Report to 2026. Strong demand for high-performance computing, automotive applications and improved demand for memory will fuel double-digit spending in equipment investments over the three-year period.

After the projected 18% drop to US$74 billion this year, global 300mm fab equipment spending is forecast to rise 12% to $US82 billion in 2024, 24% to US$101.9 billion in 2025 and 17% to US$118.8 billion in 2026.

“The projected equipment spending growth wave underscores the strong secular demand for semiconductors,” said Ajit Manocha, SEMI President and CEO. “The foundry and memory sectors will figure prominently in this expansion, pointing to demand for chips across a wide breadth of end markets and applications.”
 

Regional Growth

Korea is expected to lead global 300mm fab equipment spending in 2026 with US$30.2 billion in investments, nearly doubling from US$15.7 billion in 2023. Taiwan is forecast to invest US$23.8 billion in 2026, up from US$22.4 billion this year, and China is projected to log US$16.1 billion in spending in 2026, an increase from US$14.9 billion in 2023. Americas equipment spending is expected to nearly double from US$9.6 billion this year to US$18.8 billion in 2026.

Segment Growth

Foundry is projected to lead other segments in equipment spending at US$62.1 billion in 2026, an increase from US$44.6 billion in 2023, followed by memory at US$42.9 billion, a 170% increase from 2023. Analog spending is forecast to increase from US$5 billion this year to US$6.2 billion in 2026. The microprocessor/microcontroller, discrete (mainly power devices), and optoelectronics segments are expected to see spending declines in 2026, while investments in logic is forecast to rise.

The SEMI 300mm Fab Outlook Report To 2026 report lists 369 facilities and lines globally, including 53 high-probability facilities expected to start operation during the four years starting in 2023.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Christian G. Dieseldorff/SEMI US
Phone: 1.408.943.7940
Email: [email protected]

Chih-Wen Liu/SEMI Taiwan
Phone: 886.3.560.1777
Email: [email protected]

• Read more about Global 300mm Fab Equipment Spending Forecast to Reach Record $119 Billion in 2026, SEMI Reports

MILPITAS, Calif. — June 13, 2023 — Global semiconductor materials market revenue grew 8.9% to $72.7 billion in 2022, surpassing the previous market high of $66.8 billion set in 2021, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today in its Materials Market Data Subscription (MMDS).

Wafer fabrication materials and packaging materials revenue in 2022 reached $44.7 billion and $28.0 billion, respectively, increasing 10.5% and 6.3%. The silicon, electronic gases, and photomask segments showed the strongest growth in the wafer fabrication materials market, while the organic substrates segment largely drove packaging materials market growth.

For the 13th consecutive year, Taiwan, at $20.1 billion, was the world's largest consumer of semiconductor materials on the strength of its foundry capacity and advanced packaging base. China continued to register strong year-over-year results, ranking second in 2022, while Korea finished as the third largest consumer of semiconductor materials. Most regions registered high single- or double-digit growth last year.
 

The Materials Market Data Subscription (MMDS) from SEMI provides annual revenue with 10 years of historical data and a two-year forecast. The annual subscription includes quarterly updates for the materials segment and reports revenue for seven market regions (North America, Europe, Japan, Taiwan, South Korea, China and Rest of World). The report also features detailed historical data for silicon shipments and revenues for photoresist, photoresist ancillaries, process gases and lead frames.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.

Download a sample of the MMDS report.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Semiconductor Materials Market Revenue Reaches Record $73 Billion in 2022, SEMI Reports

MILPITAS, Calif. – June 6, 2023 – Global semiconductor equipment billings increased 9% year-over-year to US$26.8 billion in the first quarter of 2023, SEMI announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report. Quarter-over-quarter billings slipped 3%. 

“Semiconductor equipment revenue in the first quarter was robust despite macroeconomic headwinds and a challenging industry environment,” said Ajit Manocha, SEMI president and CEO. “The fundamentals remain healthy for the long-term strategic investments needed to support major technology advancements for AI, automotive, and other growth applications.”

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry. 

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. The subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

Download a sample of the EMDS report.

For more information about the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. More details are also available on the SEMI Market Data webpage.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Q1 2023 Global Semiconductor Equipment Billings Grow 9% Year-Over-Year, SEMI Reports

SEMI, TECHCET and TechSearch International Highlight Diverse Growth Drivers in New Report

MILPITAS, Calif. – May 23, 2023 – Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022, SEMI, TECHCET and TechSearch International announced today in their new Global Semiconductor Packaging Materials Outlook report.

High-performance applications, 5G, artificial intelligence (AI) and the adoption of heterogeneous integration and system-in-package (SiP) technologies are increasing demand for advanced packaging solutions. The development of new materials and processes to enable chips with higher transistor density and greater reliability are also contributing to market growth.
 

“The semiconductor packaging materials industry is undergoing significant changes as new technologies and applications are driving demand for more advanced and diverse materials,” said Jan Vardaman, President and founder of TechSearch International. “Advances in dielectric materials and underfill are driving strong demand for fan-in and fan-out wafer level packaging (FOWLP), flip chip, and 2.5D/3D packaging. New substrate technologies such as silicon interposers and organic interposers using RDL (Re-Distribution Layer) are also key growth drivers of packaging solutions. At the same time, research on laminate substrates with finer features continues with the development of glass cores for build-up substrates.”

The Global Semiconductor Packaging Materials Outlook report provides a comprehensive analysis of the current and forecast market for semiconductor packaging materials, covering substrates, leadframes, bonding wires, encapsulation materials, underfill materials, die attach, wafer level package dielectrics, and wafer-level plating chemicals.

Features of the report include:

• Technology trends
• Regional market size
• Five-year market forecast to 2027
• Market size in revenue and units
• Excel workbook file summarizing market information
• Supplier market share
• Capacity and utilization trends

The report is available for purchase from SEMI. 

About SEMI

SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027

MILPITAS, Calif. — May 22, 2023 — SEMI today announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, co-founder, CFO and COO of Breker Verification Systems, and Michael Lercel, Senior Director of Global Strategic Marketing at ASML. 

The Board appointments took effect April 18, 2023. Members serve a three-year term. The principal advocate for member companies located in North America, the NAAB provides guidance on SEMI Americas programs designed to advance their business interests and address significant challenges in the electronics manufacturing and design supply chain.

“The SEMI North America Advisory Board is committed to broad representation of SEMI member companies,” said Joe Stockunas, president SEMI Americas. “With Breker Verification Systems a strong up-and-coming player in the design community and ASML a leading lithography supplier, the addition of Maheen and Michael furthers our diversity to give voice to a wider range of SEMI members.”

As Senior Director of Global Strategic Marketing at ASML, Michael Lercel guides corporate strategy. He joined ASML in 2015 and is based in Wilton, Conn. Lercel’s wide experience in semiconductor manufacturing is highlighted by his emphasis on lithography and patterning. He helped develop a number of next-generation lithography techniques and was involved in pioneering EUV work in 1998.

Lercel holds a Bachelor of Science degree in physics from MIT and a Ph.D. in physics from Cornell University. After graduation, he joined IBM Microelectronics, working in positions in advanced photomask development, lithography research, and microelectronics equipment strategy. In 2010 he joined Cymer as Senior Director of EUV Product Marketing and later at SEMATECH held various positions including Lithography Director and Chief Technologist.

As CFO and COO of Breker Verification Systems, a cutting-edge San Jose, Calif.-based software company, Hamid oversees the company’s operational growth as it moves from startup to established software supplier. She drives the company’s strategic direction, corporate communications and branding.

Over the past two decades, Hamid has been instrumental in establishing Breker as a key player in the Electronic Design Automation (EDA) industry. She was recently named one of Silicon Valley’s 100 most influential women by the Silicon Valley Business Journal. Hamid is a Governing Council member of the Electronic System Design (ESD) Alliance, a SEMI Technology Community. Hamid holds a Bachelor of Business Administration degree from North South University and a Masters of Business Administration from the University of Texas at Austin.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI North America Advisory Board Welcomes New Members From ASML and Breker Verification Systems

PENANG, Malaysia — 22 May 2023 — SEMICON Southeast Asia, the region’s premier event for the global electronics manufacturing and design supply chain, opens tomorrow with critical semiconductor industry topics including supply chain resilience, sustainability, Smart Manufacturing, Smart Mobility, Smart MedTech, and workforce development in focus. Themed Boosting Agility and Resiliency for the Electronics Supply Chain, the May 23-25 exhibition and conferences at the Setia SPICE Convention Centre and Arena in Penang are expected to draw nearly 300 exhibitors and more than 10,000 attendees.

SEMICON Southeast Asia 2023 will gather experts and visionaries for insights into the latest semiconductor industry developments, trends and innovations. With the industry’s sights set on reaching $1 trillion in revenue by 2030, the event will also bring together chip manufacturing and equipment companies, private and public partners, and other key industry stakeholders to explore new collaboration and growth opportunities.

Semiconductor Industry Agility and Resiliency

The CxO Summit at SEMICON Southeast Asia 2023 will convene industry thought leaders to discuss modernizing supply chain strategies in response to ongoing industry disruptions and geopolitical instability. Focusing on building a more agile and resilient semiconductor industry supply chain, the summit will feature the following speakers:

• Bettina Weiss, Chief of Staff and Corporate Strategy, SEMI – Opening Remarks
• Lim Bee Vian, Deputy Chief Executive Officer of Investment Development, Malaysian Investment Development Authority (MIDA) – Opening Speech
• Kent Rossman, Corporate Senior Vice President of Global Operations, ASM – Whack a Mole: The New Supply Chain Fight
• Frederic Godemel, Executive Vice President, Schneider Electric – Is Digitalization Really Worth it? The Latest Approaches for Fab Efficiency and Resilience
• Amarjit Sandhu, Corporate Vice President, Assembly and Test NAND Operations, Micron Malaysia and Singapore – Leveraging a Global Manufacturing Footprint to Deliver Quality Products on Time
• Theo Kneepkens, Senior Vice President, Global Operations, KLA – Supply Chain Resilience Brings Growth Opportunities for Southeast Asia
• Randeep Kapur, Chief Technology Officer and Field Director, Global Industries, Asia Pacific and China, Dell Technologies – Accelerate from Ideas to Innovation

Speakers will also participate in the panel discussion Boosting Agility and Resiliency of the Electronics Supply Chain in Southeast Asia to culminate the CxO Summit. The panel will include Tan Yew Kong, Senior Vice President and General Manager, GlobalFoundries.

Other SEMICON Southeast Asia 2023 Highlights

• SEA Investment Forum will explore opportunities in the Southeast Asia semiconductor supply chain.
• Workforce and Talent Development Pavilion will feature a career fair and presentations, the SEMI University Bootcamp, and SEMI University, a new online learning management system with courses for professionals in the semiconductor and electronics industries.
• Forums
  • Market and Industry Trends
  • Sustainability
  • SMART Mobility
  • SMART Enterprise
  • SMART MedTech
  • Advanced Packaging
  • Advanced Product Testing
• SMART Innovators Showcase will spotlight Industry 4.0 best practices, while the Startups Showcase will feature leading-edge semiconductor manufacturing solutions.
• Industry VIP Networking Night will gather attendees to connect with industry leaders and experts.

Visit the SEMICON Southeast Asia 2023 website for more information.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Media Contacts

Ryan Teo/SEMI Southeast Asia
Phone: +65 9859 0883
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Reshvinder Kaur/Din Communications
Phone: +6017 275 7985
Email: [email protected] / [email protected]

• Read more about SEMICON Southeast Asia 2023 Opens Tomorrow With Chip Industry Resilience and Growth in Focus

MILPITAS, Calif. ─ May 22, 2023 – Advances driving the next generation of medical, environmental and mobility applications will take center stage at the SEMI MEMS & Sensors Technical Congress (MSTC 2023), opening tomorrow at the Samberg Conference Center, Chang Building, at Massachusetts Institute of Technology (MIT) in Cambridge.

Themed Technology to Better Survive and Thrive, MSTC 2023 will feature keynotes, panels and technical sessions as industry visionaries and experts gather to discuss the latest MEMS and sensors trends and innovations. Highlights at the May 23-24 conference also include business networking opportunities and posters showcasing novel applications from the next generation of innovators.

Sponsored by the SEMI MEMS & Sensors Industry Group (MSIG), MSTC 2023 will offer a deep dive into how to bring sensor products to market, from design through fabrication and testing and packaging to end-use applications. Industry experts will explore the software and systems needed to expand both legacy and emerging MEMS and sensors to open new markets and business opportunities.

MSTC 2023 Keynotes

	Joshua Windmiller, Ph.D., Head of New Analytes and Sensing Platforms Dexcom Empowering People to Take Control of Health
	Doruk Senkal, Ph.D., Head of Motion Sensors Reality Labs Meta MEMS & Sensors in the Metaverse

MSTC 2023 Technical Sessions

MSTC 2023 will also showcase MEMS and sensors applications in the following areas:

• Automotive including electric vehicle sensors
• Augmented reality (AR) and virtual reality (VR) metaverse technology
• Positioning, navigation and timing
• Smart environmental sensors 
• Health and biotechnology sensors and wearables
• Innovations in emerging applications

More MSTC 2023 Session Highlights

• Market and technology trends, forecast and CHIPS and Science Act
• MEMS and sensors testing process showdown  
• MIT lab tours
• Networking reception showcasing technology application posters created by students from MIT and Northeastern University

See complete agenda for MSTC 2023. Follow MSTC 2023 on Twitter and LinkedIn.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about MSTC 2023 Opens Tomorrow With Latest MEMS and Sensors Advances Driving Medical, Environmental and Mobility Innovations in Focus

MILPITAS, Calif. – May 15, 2023 – FlexTech, a SEMI Technology Community focused on driving flexible hybrid electronics (FHE) innovations, today issued a Request for Proposals (RFP) for advances in materials, FHE design tools, additive-enabled processing, hybrid electronics packaging, FHE manufacturing, AI/ML applications, soft robotics, and power solutions. Selected projects will receive cash awards ranging from $250,000 to $1 million. The program is funded by the Army Research Laboratory (ARL).

Organizations submitting proposals will be evaluated based on their capabilities, experience, and strengths including team diversity. See the SEMI FlexTech 2023 Request for Proposals for more details on the evaluation process.

White paper submissions, the first step in responding to the RFP, are due June 5, 2023. To help organizations prepare their proposals, FlexTech staff will review the RFP topics and the submission and review process during a live webinar on May 25, 2023, at 10:00 a.m. PDT. The webinar is open to organizations considering submitting a proposal. A recording will be available for registrants unable to attend the event. Registration for the event is open. 

Following the review of white papers by the RFP Review Committee, consisting of FlexTech Council members and other subject matter experts (SMEs), FlexTech will invite selected organizations to submit full proposals. The evaluation criteria include:

• Rationale
• Budget
• Collaboration value
• Dual-use (industry and military) applicability
• Relevance to the FHE ecosystem
• Schedules and milestones
• Reasonable and stretch deliverables
• Overall proposal quality

FlexTech supports technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals. Research and development efforts funded by FlexTech are in the U.S. government’s Technology Readiness Level (TRL) and Manufacturing Readiness Level (MRL).

FlexTech encourages partnerships among industrial companies, R&D organizations, and university teams. ARL funding will be matched with contributions by grant recipients to cover the total project cost. Development partners retain ownership of intellectual property developed under FlexTech contracts.

About SEMI FlexTech

SEMI FlexTech is an industry-led public/private partnership that brings together scientists, engineers, and business development professionals from industry, government, and universities to collaboratively initiate research and the development of the infrastructure required to develop world-class flexible hybrid electronics (FHE) devices and products. Learn more.

About SEMI
SEMI^® connects more than 2,500 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA), the MEMS & Sensors Industry Group (MSIG), Nano-Bio Materials Consortium (NBMC), and SOI Consortium are SEMI Strategic Technology Communities. Visit www.semi.org, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter to learn more.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

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