downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content
Default Banner Image

United States

MILPITAS, Calif. – August 16, 2021 – Helping to create pathways to careers in semiconductor manufacturing for U.S. military veterans, SEMI, the trade association representing the global electronics design and manufacturing supply chain, today announced a new partnership with Heroes MAKE America, an initiative of the Manufacturing Institute (MI) to build connections between the U.S. military community and the manufacturing industry. The MI is the 501(c)3 nonprofit workforce development and education partner of the National Association of Manufacturers.

SEMI logo“About 200,000 men and women transition out of the military each year, and many of them have the skills and experience that would position them to excel in our industry,” said Ajit Manocha, SEMI president and CEO. “These highly trained, team-focused, disciplined and talented individuals have the opportunity to be successful in challenging and mutually rewarding careers with SEMI member companies. Our industry has not been very visible to them, but our participation in the Heroes MAKE America Initiative will bring more awareness to the ecosystem around the production of the chips that are enabling innovations across our lives.”

SEMI’s partnership with Heroes MAKE America will give SEMI members access to resources to attract and retain military veterans transitioning to the workforce. The resources include profiles and resumes of military personnel who have graduated from training and certification courses geared toward manufacturing under the U.S. Department of Defense’s SkillBridge program.  

“When we launched Heroes MAKE America, we set out to create an initiative that went above and beyond to support transitioning service members, veterans and their families,”  said MI Executive Director Carolyn Lee. “Heroes isn’t just about helping our participants earn in-demand qualifications and industry-specific certifications. It is about helping to connect them to the manufacturing industry and, in turn, prepare them to find and excel in a lucrative career in manufacturing. We are honored to serve the military community through Heroes and are grateful for the support of SEMI and its members in this effort.”

To date, Heroes MAKE America has graduated participants from military installations in Kansas, Texas, North Carolina, Georgia and Kentucky. Graduates represent 136 different military specialties with an average of 11.5 years in service. More than 47% of the graduates are from minority populations. The program has a 92% placement rate at more than 250 companies across 39 states since its launch in 2018.

The shortage of skilled workers is among the greatest challenges faced by semiconductor manufacturers. According to a recent study by the MI and Deloitte, the U.S. manufacturing industry will need to fill four million jobs by 2030. As many as 2.1 million of those positions could go unfilled because of the worker shortfall.  

SEMI members interested in learning more about accessing Heroes MAKE America resources, including resumes, hosting tours and webinars, can contact Margaret Kindling of SEMI at [email protected].  

Heroes Connect Webinar

SEMI and the MI will host the Heroes Connect Webinar on August 25, 2021 at 3:00pm EDT to highlight semiconductor manufacturing career opportunities at two member companies. Registration for the webinar is open.

 

About The Manufacturing Institute

The Manufacturing Institute grows and supports the manufacturing industry’s skilled workers for the advancement of modern manufacturing. The MI’s diverse initiatives support all workers in America, including women, veterans and students, through skills training programs, community building and the advancement of their career in manufacturing. As the workforce development and education partner of the NAM, the MI is a trusted adviser to manufacturers, equipping them with resources necessary to solve the industry’s toughest challenges. For more information on the MI, please visit www.themanufacturinginstitute.org.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. – August 3, 2021 – With advanced materials a critical enabler of semiconductor growth applications, the stage is set for Strategic Materials Conference (SMC 2021), the premier event offering the latest market insights into drivers of advanced materials in the microelectronics supply chain. A live event September 27-29, SMC 2021 will highlight opportunities and demand for key enabling materials across the electronics supply chain. SMC registration is now open.

SMC LogoThemed Leading Future Technology Innovations with Materials, SMC 2021 will gather leaders from every segment of semiconductor manufacturing to provide the latest developments in advanced materials across topic areas including:

  • Economic and Market Trends
  • SEMI Materials Ecosystem in China, the U.S, and the European Union
  • Technology Roadmap
  • Materials Enablers for Next-Generation Nodes
  • Digital Transformation Enabling Efficiency in Materials Innovation
  • Diversity, Equity and Inclusion

SMC 2021 Keynotes

Mark Fuselier

Mark Fuselier, Senior Vice President of Technology
and Product Engineering, AMD

Innovating to Enable the Future of Compute

Amd
Shiva Shivaram

Siva Sivaram, PhD, President, Western Digital

Flash FORWARD, Materials Driving the Data Storage Revolution

Western Digital
Alexis Bjorlin

Alexis Bjorlin, PhD, Senior Vice President and General Manager, Optical Systems Division, Broadcom

Breaking the Bandwidth Barrier: Silicon Photonics 
Optical I/O

Broadcom logo
Robert Chau

Robert Chau, PhD, Director of Components Research Organization, Senior Fellow, Intel Corporation

Forward-Looking Process and Packaging Research and Innovations for the Next Decade

 

intel

 

Industry leaders presenting at SMC 2021 include:

  • Anji Microelectronics
  • Broadcom
  • GlobalFoundries
  • Imec
  • Lam Research Corporation
  • McKinsey & Company
  • Semiconductor Research Corporation
  • Yole Développement
  • Applied Materials
  • EMD Electronics
  • Goldman Sachs & Co.
  • Intel Corporation
  • Linx Consulting
  • Micron Technology
  • Siemens EDA
  • Boston Consulting Group
  • Entegris
  • IBM Research
  • JSR Corporation
  • Lux Research
  • Rain Neuromorphics
  • Stanford University

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

HSINCHU, Taiwan – August 3, 2021 The journey to SEMICON Taiwan 2021 begins in September with five live online forums featuring expert insights into critical semiconductor industry areas – Power and Opto chips, Smart Manufacturing, Sustainable Manufacturing, Smart Medtech and Cybersecurity. Registration for the forums is open with early bird discounts available until the end of August. The forums will extend through October and be available on-demand after the live events through November 30.

SEMICON Taiwan logoSEMICON Taiwan 2021, the region’s premier gathering of the entire electronics manufacturing and design supply chain, was postponed due to the resurgence of COVID-19 cases in Taiwan. SEMI Taiwan will announce the new date for SEMICON Taiwan 2021, tentatively planned for December, once the event has been rescheduled. Pre-registration is open.

Themed SEMICON Taiwan 2021 is a Journey: Forward as One, the three-month online and on-site exhibition experience will bring together companies from across the microelectronics industry to promote industry growth through technology development and exchange.

Online Forums

  • Power and Opto Semiconductor Week – Sept. 7-9: An in-depth analysis of the competitive advantages of emerging generation semiconductors developed in Taiwan, with the following technologies in focus:
    • Compound semiconductors in radio frequency (RF)
    • Power and Opto semiconductors
    • Semiconductor industry trends driven by electric vehicles and 5G

The Hon Hai (Foxconn) Research Institute will hold its NExT Forum during Power and Opto Semiconductor Week, marking the first time the institute has worked with SEMI Taiwan. NExT Forum will feature speakers from TSMC, WIN Semiconductors and Foxconn and include Nobel Prize winners.

  • Smart Manufacturing Forum – Sept. 23-24: Forum speakers will discuss how businesses are using artificial intelligence (AI), 5G, edge and hybrid cloud, digital twins, and other technologies to drive their digital transformation. The experts will also offer best practices and insights into supply chain resiliency, production efficiency across regions and facilities, and high-tech smart factories.
  • SEMI ESG and Sustainable Manufacturing Summit – Oct. 6-8: The summit will include a discussion of high-tech and environmental sustainability and Environmental, Social and Governance (ESG). SEMI will share future roadmaps for technological development in energy management, zero waste, net-zero emission, circular economy and green manufacturing.
  • Smart MedTech Forum – Oct. 13: Emerging technologies and artificial intelligence (AI), big data, and digital technology applications will be under discussion. Speakers will also examine the critical role of microelectronics in a cross-sector cooperation in healthcare to fuel the buildout of an ecosystem focused on precision preventive medicine and health promotion.
  • Cybersecurity Global Summit – Oct. 20-21: Experts will discuss trends in supply chain cybersecurity for high-tech manufacturing, global cybersecurity standards, cybersecurity guidelines for business, network security and cybersecurity governance strategies.

A 20% discount is available by registering online for the forums before August 31st. Groups of at least five people save an additional 10%.

SEMICON Taiwan 2021 Pre-Registration

SEMICON Taiwan QR code

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contacts

Elma Fang

Email: [email protected]

Phone: +886.3.560.1777 ext. 207

 

Connie Lin

Email: [email protected]

Phone: +886.3.560.1777 ext. 211

SINGAPORE — July 27, 2021 — With the resurgence of COVID-19 cases in Southeast Asia, SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced that SEMICON Southeast Asia (SEA) – 23-27 August 2021 – will be held as a virtual platform to ensure the safety of exhibitors, partners and guests. Registration is open.

SEMICON SEA 2021 Virtual logoSEMICON SEA 2021 will gather industry experts to highlight the latest developments, innovations and trends in segments of electronics and semiconductors including smart manufacturing, smart mobility, smart data, AI and 5G as technology continues to reshape the way people work and live. SEMICON SEA is the premier electronics manufacturing event in Southeast Asia.

Themed Powering Innovation – 5G and Beyond, SEMICON SEA 2021 Virtual will consist of the following two segments:

  • 23-25 August 2021 – A 3-day conference offering a compelling range of plenary and conference sessions.
  • 23-27 August 2021 – A complimentary exposition for attendees with business-matching, chat rooms, a new online networking lounge, the popular Meet-the-Experts lounge for updates on the latest technology developments and other opportunities to help exhibitors and attendees grow their businesses.

The health and safety of SEMICON SEA 2021 participants is SEMI’s top priority. Staging SEMICON SEA 2021 as a virtual event is part of SEMI’s commitment to protecting participants while ensuring uninterrupted business exchanges and opportunities for them to expand their industry connections.

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contact

Travers Lim/SEMI

Program and Marketing Manager
Phone: 65.6391.9519
Email: [email protected]

MILPITAS, Calif. — July 26, 2021 — North America-based semiconductor equipment manufacturers posted $3.67 billion in billings worldwide in June 2021 (three-month average basis), according to the June Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 2.3% higher than final May 2021 billings of $3.59 billion and 58.4% higher than June 2020 billings of $2.32 billion.

SEMI logo“The semiconductor equipment market demonstrated extraordinary growth in the first half of 2021,” said Ajit Manocha, SEMI president and CEO. “We are witnessing a structural shift in the industry marked by higher capital investments as demand for the semiconductors needed to power technologies unleashed by innovation and the digitization of economies continues to grow.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
 

  

Billings
(3-mo. Avg.)

Year-Over-Year

January 2021

$3,038.2

29.8%

February 2021

$3,143.1

32.4%

March 2021

$3,273.9

47.9%

April 2021

$3,428.9

50.3%

May 2021 (final)

$3,588.5

53.1%

June 2021 (prelim)

$3,671.3

58.4%

Source: SEMI (www.semi.org), July 2021


SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

 

Notes

Next SEMI Billings report is August 23, 2021 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp. 

MILPITAS, Calif. — July 27, 2021 — Worldwide silicon wafer area shipments increased 6% to 3,534 million square inches in the second quarter of 2021, surpassing the historical high set in the first quarter, the SEMI Silicon Manufacturers Group (SMG) reported in its quarterly analysis of the silicon wafer industry. Second quarter 2021 silicon wafer shipments grew 12% from the 3,152 million square inches recorded during the same quarter last year.

SEMI logo“Demand for silicon continues to see strong growth driven by multiple end-applications,” said Neil Weaver, chairman SEMI SMG and Vice President, Product Development and Applications Engineering at Shin Etsu Handotai America. “The supply of silicon for both 300mm and 200mm applications is tightening as demand continues to outstrip supply.”
 

Silicon Area Shipment Trends – Semiconductor Applications Only

 

Millions of Square Inches

 

1Q 2020

2Q 2020

3Q 2020

4Q 2020

1Q 2021

2Q 2021

Total

2,920 

3,152

3,135

3,200

3,337

3,534

                                                                                           Source: SEMI (www.semi.org), July 2021

 

Data cited in this release include polished silicon wafers such as virgin test and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for the majority of semiconductors, which are vital components of all electronics including computers, telecommunications products, and consumer devices. The highly engineered thin disks are produced in diameters of up to 12 inches and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

The SMG is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi). The purpose of the SMG is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics on the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

MILPITAS, Calif. — July 13, 2021 — Global sales of semiconductor manufacturing equipment by original equipment manufacturers are forecast to surpass $100 billion next year, a new high, after jumping 34% to $95.3 billion in 2021 compared to $71.1 billion in 2020, SEMI announced today in releasing its Mid-Year Total Semiconductor Equipment Forecast – OEM Perspective at the Innovation for a Transforming World virtual conference. Continuing investments by device makers in secular growth drivers are fueling the expansion of both the front-end and back-end semiconductor equipment segments.

SEMI logoThe wafer fab equipment segment, which includes wafer processing, fab facilities, and mask/reticle equipment, is projected to surge 34% to a new industry record of $81.7 billion in 2021, followed by a 6% increase in 2022 to more than $86 billion.

The foundry and logic segments, accounting for more than a half of total wafer fab equipment sales, will grow 39% year-over-year to reach $45.7 billion in 2021 on strong demand for leading-edge technologies powered by the digitization of industries worldwide. The growth momentum is expected to continue in 2022 with the foundry and logic equipment investments rising another 8%.

Robust demand for memory and storage are driving spending on NAND and DRAM manufacturing equipment. The DRAM equipment segment is expected to lead the expansion in 2021, surging 46% to surpass $14 billion. The NAND flash equipment market is projected to increase 13% in 2021 to $17.4 billion and 9% in 2022 to $18.9 billion, respectively.

The assembly and packaging equipment segment is forecast to grow 56% to $6 billion in 2021, followed by a 6% increase in 2022, driven by advanced packaging applications. The semiconductor test equipment market is expected to grow 26% in 2021 to $7.6 billion and expand another 6% in 2022 on demand for 5G and high-performance computing (HPC) applications.

Regionally, Korea, Taiwan and China are projected to remain the top three destinations for equipment spending in 2021, with Korea at the top on the strength of a robust memory recovery and strong investments in leading-edge logic and foundry. Equipment spending for all regions tracked are expected to grow in 2021.   

The following results reflect market size by segment and application in billions of U.S. dollars:
 

2021 Mid-Year Forecast charts

Source: SEMI July 2021, Equipment Market Data Subscription


New equipment includes wafer fab, test, and assembly & packaging. Total equipment excludes wafer manufacturing equipment. Totals may not add due to rounding.

 

The current SEMI forecast is based on collective input from top equipment suppliers, the SEMI Worldwide Semiconductor Equipment Market Statistics (WWSEMS) data collection program and the industry-recognized SEMI World Fab Forecast database.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

  • Monthly SEMI NA Billings Report, an early perspective of equipment market trends
  • Monthly WWSEMS, a detailed report of semiconductor equipment billings for seven regions and more than 22 market segments
  • Bi-annual Total Semiconductor Equipment Forecast – OEM Perspective, an outlook for the semiconductor equipment market

For more information online, please visit the SEMI EMDS page.

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Industry Reports 17% Revenue Growth in Q1 2021

MILPITAS, Calif. July 14, 2021 — Electronic System Design (ESD) industry revenue increased 17% to $3,157.17 million in Q1 2021, the strongest first-quarter growth ever, the ESD Alliance, a SEMI Technology Community, announced today in the Q1 2021 Electronic Design Market Data (EDMD) report. The first-quarter revenue compares to $2,698 million in Q1 2020. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 15%, the highest annual growth since 2011.

SEMI ESDA logo“The industry reported substantial, double-digit year-over-year revenue growth for Q1 2021,” said Walden C. Rhines, Executive Sponsor, SEMI Electronic Design Market Data report. “All product categories significantly contributed, with double-digit growth in the Computer Aided Engineering (CAE), IC Physical Design and Verification, Printed Circuit Board and Multi-Chip Module (PCB and MCM), and Semiconductor IP (SIP) segments.”

“Geographically, the Americas; Europe, Middle East, and Africa (EMEA); and Asia Pacific (APAC) also reported double-digit growth,” Rhines said. “Q1 2021 marked a new high for quarterly growth of total license and maintenance revenue, as well as IC physical design and verification.”

The companies tracked in the EDMD report employed 49,024 people in Q1 2021, a 6.7% increase over the Q1 2020 headcount of 45,938 and up 1.1% compared to Q4 2020.

The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.

Revenue by Product and Application Category

  • CAE revenue increased 14% to $974.1 million compared to Q1 2020. The four-quarter CAE moving average increased 12.5%.
  • IC Physical Design and Verification revenue surged 34.4% to $682.5 million compared to Q1 2020. The four-quarter moving average for the category rose 23.6%.
  • Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 15.3% to $289.2 million compared to Q1 2020. The four-quarter moving average for PCB and MCM increased 5.3%.
  • SIP revenue rose 12.9% to $1,113 million compared to Q1 2020. The four-quarter SIP moving average grew 17.1%.
  • Services revenue increased 0.1% to $98.9 million compared to Q1 2020. The four-quarter Services moving average held steady with no growth.

Revenue by Region

  • The Americas, the largest reporting region by revenue, purchased $1,285.3 million of electronic system design products and services in Q1 2021, a 15% increase compared to Q1 2020. The four-quarter moving average for the Americas rose 13.5%.
  • Europe, Middle East, and Africa revenue increased 14% to $447.3 million compared to Q1 2020. The four-quarter moving average for EMEA grew 6.7%.
  • Japan revenue decreased 3.7% to $258.8 million compared to Q1 2020. The four-quarter moving average for Japan rose 4.3%.
  • Asia Pacific revenue increased 26.9% to $1,166.3 million compared to Q1 2020. The four-quarter moving average for APAC increased 23.8%.

About the EDMD Report

The ESD Alliance Electronic Design Market Data (formerly the Market Statistics Service) report presents EDA, SIP and services industry revenue data quarterly. Both public and private companies contribute data to the report available from SEMI. Each quarterly report is published approximately three months after quarter close. EDMD report data is segmented as follows:

  • Revenue by product category (CAE, IC Physical Design and Verification, Semiconductor IP, PCB/MCM Layout, and Services) including numerous detailed sub-categories
  • Revenue by geographic region (Americas, EMEA, Japan and APAC)
  • Total employment at participating companies

For information about SEMI market research reports, visit the SEMI Market Research Reports and Databases Catalog.

 

About the Electronic System Design Alliance

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, is the central voice to communicate and promote the value of the semiconductor design ecosystem as a vital component of the global electronics industry. As an international association of companies providing goods and services throughout the semiconductor design ecosystem, it is a forum to address technical, marketing, economic and legislative issues affecting the entire industry. For more information about the ESD Alliance, visit http://esd-alliance.org.

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

The information supplied by the ESD Alliance is believed to be accurate and reliable, but the ESD Alliance assumes no responsibility for any errors that may appear in this document. All trademarks and registered trademarks are the property of their respective owners.

 

Press Contacts                                                                                 

Paul Cohen

ESD Alliance

A SEMI Technology Community

978-769-2106             
 

Jack Taylor

Siemens EDA

512-560-7143 

MEDIA ADVISORY

SEMI logo

 

Mid-Year Forecasts to Provide Global Chip Industry Insights

 Join the virtual Innovation for a Transforming World forum, July 13-14 – Presented by SEMI

11 briefings on microelectronics industry and Wall Street forecasts and global economic opportunities
 

Innovation for a Transforming World


WHAT: Annual mid-year semiconductor equipment, materials, fab capacity and economic forecasts will provide timely insights. Additionally, the forum will explore the COVID-19 pandemic’s acceleration of digital transformation and new solutions and business models for the microelectronics industry.

WHO: Featuring Dell, IBM, Deloitte, Bank of America Merrill Lynch, Altimeter and SEMI market analysts

  • Live Q&A to follow presentations

WHERE: Innovation for a Transforming World 2021 Virtual Forum

WHEN: July 13-14, 8:30am – 12:00pm PDT

HOW: Members of the media interested in attending should contact Scott Stevens

([email protected]) for a pass. Other attendees can sign up using general registration.

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas

Phone: +1.512.288.4050

Email: [email protected]

HSINCHU, Taiwan — June 29, 2021 — SEMICON Taiwan, the region’s premier gathering of the entire electronics manufacturing and design supply chain, has been postponed from September 8-10 to December 2021 or January 2022 in response to a resurgence of COVID-19 cases in Taiwan, SEMI Taiwan announced today. The new event date will be announced once it has been confirmed.   

SEMICON Taiwan logoThe rise in new COVID-19 cases has prompted the Taiwan government to raise the pandemic alert to Level 3, forcing the closure of facilities for large gatherings such as exhibitions and conferences. SEMICON Taiwan typically draws as many as 50,000 attendees from around the world. 

After establishing the new event date, SEMI Taiwan will fully comply with Taiwan Centers for Disease Control guidelines for preventing the spread of COVID-19 to ensure the safety of exhibitors and visitors at SEMICON Taiwan as their well-being remains SEMI’s top priority.

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI Taiwan on Facebook and LinkedIn.

 

Association Contacts

Elma Fang /SEMI Taiwan

Phone: 886.3.560.1777 ext. 207

Email: [email protected]

 

Connie Lin /SEMI Taiwan

Phone: 886.3.560.1777 ext. 211

Email: [email protected]