SEMICON Japan 2021 Returns Live in Tokyo to Highlight Semiconductor Industry Innovation, Growth Opportunities
TOKYO – October 19, 2021 – Leading-edge technologies including artificial intelligence (AI), 5G, Internet of Things (IoT), MEMS and sensors, quantum computing and advanced 3D packaging will take center stage at SEMICON Japan 2021 Hybrid as visionary keynote speakers and industry leaders gather December 15-17 to share insights into the latest trends and innovations driving semiconductor industry growth. The largest and most influential exhibition in Japan for electronics manufacturing, SEMICON Japan returns to Tokyo Big Sight with a full-scale, in-person exposition and conferences combined with online access. Registration is open for exhibits and all programs.
Themed Forward as One, SEMICON Japan 2021 Hybrid will showcase opportunities for the semiconductor manufacturing and design supply chain to enable a smarter world through advances in Smart Mobility, mobile communications and other applications powering industry growth. The rising importance of semiconductor manufacturing sustainabilty will also come into sharp focus as more companies across the supply chain work to reduce their carbon footprint.
With Japan producing more than 40% of the equipment and materials for global semiconductor manufacturing, SEMICON Japan is a critical source for the latest technology and business developments from key suppliers.
Industry Visionaries Presenting at SEMICON Japan 2021
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Peng Bai, Corporate Vice President, Manufacturing, Supply Chain and Operations General Manager, Global Sourcing for Equipment and Materials, Intel Keynote |
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Chris Chern, Advanced Packaging Development: 3DIC RD Center in Japan, TSMC Advanced Packaging Development: TSMC 3DIC RD Center in Japan |
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Lawrence Vivolo, Senior Business Development Manager, Automotive & Semiconductor Design, Unstructured Data Solutions, Dell Technologies A Revolution in Smart Factories is Coming. Are You Ready? |
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Prabu Raja, Senior Vice President, Semiconductor Products Group, Applied Materials PPACt™ Scaling in the AI Era: A New Way Forward for the Semiconductor Industry |
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Handel Jones, CEO, International Business Strategies Opportunities and Challenges for Electronics, Semiconductors, and AI in China, and Perspective on 2025 and 2030 |
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SEMICON Japan 2021 Sponsors
- Platinum sponsors include Disco Corporation, Hightec Systems Corporation, Hitachi High-Tech Corporation, Screen Semiconductor Solutions Co., Ltd., and Tokyo Electron Limited.
- Gold sponsors include Advantest, Applied Materials, Ebara, JSR, Kokusai Electric, Lam Research, Nikon, and Tokyo Seimitsu.
Learn more at SEMICON Japan 2021 Hybrid.
About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.
Association Contact
Hiroki Yomogita, Marketing Director, SEMI Japan
Phone: 81.3.3222.5755
Email: [email protected]
