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West Chester, OH, June 23, 2021 -- OEM Group, a global manufacturer of new and remanufactured semiconductor capital equipment, announces its acquisition of Rite Track - a pioneer in innovative products and services for legacy markets for over 28 years. The combined team further announces the establishment of Shellback Semiconductor Technology. The new global entity is headed up by President & CEO Wayne Jeveli and the senior management teams from both OEM Group and Rite Track.

Regarding the news, Mr. Jeveli commented, “Rite Track has flourished for nearly thirty years in a demanding global market. They’ve created a brand that’s respected and loved across the industry and have become integral to our customers’ operations. Their expertise in Coat & Develop technologies is legendary, and their expansion into Wafer Carrier Inspection with the EAGLEi system is a game changer for fab productivity. Similarly, OEM has a 22-year track record of supplying iconic technologies from SEMITOOL, VARIAN and Applied P5000. We serve the same customers, and this union is symbiotic. We’ve respected Rite Track from afar for a long time for their complete focus on customer satisfaction. Now, we’ve got a chance to work together every day on the same team. Our industry is at an incredible inflection point where the need for chips is greater than it’s ever been. SHELLBACK will enable our customers to meet this challenge.

Rite Track President and CEO Tim Hayden added, “I’m so proud of the team we’ve built over the past 28 years and excited about the opportunities this union will create for our employees, our partners, and most importantly our customers. We have seen the strategic relationships that Wayne and the OEM Group have built over the years and very much look forward to working with his team to grow Shellback into a market leading position within the semiconductor industry.

With headquarters in Coopersburg, PA, Shellback Semiconductor Technology consists of approximately 150 employees around the globe. The company notably distinguishes itself by providing solutions for both front-end (FEOL) and back-end (BEOL) processing with a wide range of proprietary technologies, including SEMITOOL Spray Batch, STORM Wafer Carrier Cleaner, EAGLEi Wafer Carrier Inspection, and many more.

Shellback Semiconductor Technology will be making further announcements very soon. In the meantime, visit Shellback at www.shellbacksemi.com

ABOUT SHELLBACK SEMICONDUCTOR TECHNOLOGY:For over 400 years, intrepid mariners have embarked on long journeys into uncharted waters. Through a rite of passage, only the most experienced and storied adventurers would earn the honor of being called a “Shellback.” Taking on challenging endeavors, honing critical skills, and earning the trust of comrades, a Shellback enables the success of the voyage. In this tradition, Shellback Semiconductor Technology represents the union of two industry-leading proven semiconductor brands—OEM Group and RITE Track—with a combined 50-years of experience. Sharing a commitment to pioneering intellectual property and unparalleled customer service, Shellback provides new and remanufactured semiconductor capital equipment and services to enable emerging and legacy markets, such as LEDs, MEMS, Wireless, Power, Energy Harvesting, WLP, Data Storage, Analog, and Logic. With one of the industry’s largest installed bases of equipment at over 600+ customers world-wide, Shellback offers proprietary products from SEMITOOL, VARIAN, Applied P5000, SVG Track, and more, as well as a combination of best-in-class technologies for Wafer Carrier Inspection and Cleaning- the EAGLEi and STORM. Headquartered in Coopersburg, PA with facilities across the globe, Shellback was launched in 2021 and is led by President and CEO Wayne Jeveli. www.shellbacksemi.com

Taiwan Standards EHSS
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NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here

Online
Zhubei City, Hsinchu County
Taiwan

Standards

Date: Friday,  August 13, 2021

Time: 1:30-3:30 PM (Taiwan Time) 

via Virtual Meeting

 

 

Standards Contact Information:

Cher Wu 吳琇君

Senior Executive Consultant | Standards

SEMI Taiwan

+886-933-976766

[email protected]

1:30 pm - 3:30 pm Off Add to Calendar 2021-08-13 13:30:00 2021-08-13 15:30:00 3D Packaging & Integration Taiwan TC Chapter Meeting Date: Friday,  August 13, 2021 Time: 1:30-3:30 PM (Taiwan Time)  via Virtual Meeting   Agenda_3D P&I Taiwan TC Meeting_20210813.pdf   Standards Contact Information: Cher Wu 吳琇君 Senior Executive Consultant | Standards SEMI Taiwan +886-933-976766 [email protected] Online Zhubei City, Hsinchu County Taiwan SEMI.org [email protected] Asia/Taipei public Asia/Taipei
Taiwan Standards EHSS
Highlighted content

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

Online
Zhubei City, Hsinchu County
Taiwan

Standards

Aug. 6, 2021

Time: 2:30-4:30 PM (Taiwan Time)

Online via Virtual Meeting

 

 

Standards Contact Information:

Cher Wu 吳琇君

Senior Executive Consultant | Standards

SEMI Taiwan

+886-933-976766

[email protected]

2:30 pm - 4:30 pm Off Add to Calendar 2021-08-06 14:30:00 2021-08-06 16:30:00 FPD Metrology Taiwan TC Chapter Meeting Aug. 6, 2021 Time: 2:30-4:30 PM (Taiwan Time) Online via Virtual Meeting   FPD_M TC Meeting Agenda_20210806.pdf   Standards Contact Information: Cher Wu 吳琇君 Senior Executive Consultant | Standards SEMI Taiwan +886-933-976766 [email protected] Online Zhubei City, Hsinchu County Taiwan SEMI.org [email protected] Asia/Taipei public Asia/Taipei

Contact

If you have any questions, please contact Ms. Grace Cheng / 0933-487-181 / [email protected], thanks!

Taiwan McKinsey%20Webinar%20main%201.png Featured Speakers
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Register before 7/1

During this sharing, SEMI invites Globalfoundries to share not only their wisdom and experience, how they use smart manufacturing as tool to ease the pain points; actions and suggestions that Taiwan can benefit from will also be included.

Online
Taiwan

GF
Dan Steele
Senior Director and the APAC Head of Environmental, Health, Safety, and Security (EHS&S)
GLOBALFOUNDRIES (GF) Singapore
1:15 pm

Online Registration

1:30 pm

Welcome Remark

Ms. Ana Li, senior director, SEMI

1:35 am

Navigating Our Way Through the Pandemic: People, Company & Government

Keynote: TBD
Speaker: Mr. Dan Steele, Senior Director and the APAC Head of Environmental, Health, Safety, and Security (EHS&S) 

2:15 pm

QA & Networking Time

SEMI Taiwan host member seminar regularly to update member current market information, industry observation, current trends. During the COVID infection is outbreaking and starting affecting the workforce in semiconductor industry from foreign workers confirmed cases in Taiwan recently, how to stay healthy and at the same time sustain manufacturing operation is truly a difficult question, Singapore met similar challenges when the COVID outbreak in 2020, what they did to keep manufacturing fabs production sustained can also be a good reference.

 
1:30 pm - 2:30 pm Off Add to Calendar 2021-07-06 13:30:00 2021-07-06 14:30:00 Learn From Singapore: COVID Challenges And Practice Sharing to Taiwan High-Tech Manufacturers SEMI Taiwan host member seminar regularly to update member current market information, industry observation, current trends. During the COVID infection is outbreaking and starting affecting the workforce in semiconductor industry from foreign workers confirmed cases in Taiwan recently, how to stay healthy and at the same time sustain manufacturing operation is truly a difficult question, Singapore met similar challenges when the COVID outbreak in 2020, what they did to keep manufacturing fabs production sustained can also be a good reference.   Online Taiwan SEMI.org [email protected] America/Los_Angeles public

ESPOO, Finland, 24th June 2021 – Picosun Group extends its global sales and service partner network further by signing a partner agreement with Hermes-Epitek Corporation Pte. Ltd. Hermes-Epitek Corporation, headquartered in Taiwan, is one of the world’s largest high-tech equipment distributors. The company provides equipment for semiconductor and optoelectronic manufacturing, as well as tech services and parts sales.

“We look forward to cooperate as Picosun’s sales representative and external field service provider targeting both 8-inch and 12-inch ALD markets in all Southeast Asia countries”, states Teo Kim Leong, Director, Hermes-Epitek Corporation.

“Southeast Asia is one of Picosun’s important market areas, where the demand for industrial ALD solutions is constantly increasing. For almost ten years now, Picosun has successfully provided world leading ALD solutions to numerous customers and partners in both academies and industries in Southeast Asia. I’m happy that with the partnership with Hermes-Epitek Corporation we are able to serve our customers in the region even better”, says Edwin Wu, CEO, Picosun Asia Pte. Ltd.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Edwin Wu
CEO
Picosun Asia Pte. Ltd.
Tel. +358 40 480 3449
Email: [email protected]
www.picosun.com

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Welcome to the FOA 2021 Q2 Meeting!

Held over three days, this FOA members-only meeting will focus on key speakers, open forums, market updates, and content that you have come to expect. Please plan on joining fellow industry peers at the meeting to network and share insights and best practices on the latest business, and technology trends affecting the electronics manufacturing industry. The FOA community stays connected and continues the good dialogue on keeping our fabs productive with the innovative solutions that members continue to drive even in the virtual environment.

About Fab Owners Alliance (FOA)

The Fab Owners Alliance, a SEMI technology community, is an international, group of semiconductors & MEMS fab owners and industry suppliers who meet regularly to discuss and act on common manufacturing issues, combining strengths and resources to maintain and increase their global competitiveness. Established in 2004, the FOA consists of 25+ device companies with over 120 semiconductor manufacturing facilities and 65+ suppliers to the industry. With a network of global offices, the FOA connects fab managers and accelerates manufacturing excellence at semiconductor fabs around the world. 

Learn more at www.semi.org/FOA, or contact FOA staff at [email protected]    

United States

- FOA 8:00 am - 11:30 am Off Add to Calendar 2021-06-22 08:00:00 2021-06-24 11:30:00 Fab Owners Alliance 2021 Q2 Meeting United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

FREMONT, Calif. – June 14, 2021 – YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has become a member of the Silicon Saxony industry association. YES, which recently established a German presence in Dresden, expects the high-tech networking group to be a valuable resource in marketing advanced process equipment and solutions to an expanding customer base across Europe, particularly in Germany. In addition, the company plans to strengthen communication and alliances with fellow members of Silicon Saxony.

“Silicon Saxony brings together companies that are leading the electronics industry in Europe,” said Dragan Cekic, YES’s Vice President of Sales for Europe and the Americas. “We are excited to join their ongoing conversation about trends and technologies that will affect us all.”
“Change is a given in the markets we serve. The opportunities facing our industry are complex, and the rapid pace of technological developments is unprecedented. We look forward to participating in Silicon Saxony’s high-tech network with the aim of addressing today’s exciting semiconductor roadmaps,” said Rezwan Lateef, President of YES.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit www.yieldengineering.com.

About Silicon Saxony
With more than 350 members, Silicon Saxony e. V. is the largest high-tech network in Saxony and one of the largest microelectronics and IT clusters in Germany and Europe. Founded in 2000, Silicon Saxony is a self-financed association linking manufacturers, suppliers, service providers, universities, research institutes, public institutions as well as industry-relevant start-ups. Its focus is on the technological trends of the present and future: artificial intelligence, robotics, automation, Internet of Things, sensor technology, energy efficiency, and neuromorphic and edge computing. As a high-profile information, communication and cooperation platform, the association promotes the regional, national and international networking of its members by participating in and organizing industry events.

IC’Alps Builds a Secure Infrastructure for Ultimate Protection of Customers’ Data

Meylan, FRANCE – June 08, 2021 – In wake of the recently announced partnership with Tiempo Secure for silicon implementation of CC (Common Criteria) EAL5+ grade Secure Element IP, IC’Alps has deployed an infrastructure that complies with the highest security standards.

IC’Alps is a French semiconductor company specializing in the design and supply of exclusive and custom-made ASIC solutions (Application Specific Integrated Circuits). As part of the improvements, the company has set up a secure access management system including premises complementary access control, dedicated and secure design room, and an isolated and secure IT network. This revamp increases the security in IC’Alps’ Head Office as demanded by security-sensitive customers or partners, requiring such a high level of data protection and associated traceability.

IC’Alps successfully passed CC audit of secure room and associated IT infrastructure commissioned by Tiempo Secure, audit performed by a security evaluation labs (ITSEF) licensed by the ANSSI. The audit states that the silicon physical implementation work entrusted by Tiempo Secure to IC’Alps passed the very strict requirements.

“Since the company was founded, IC’Alps has invested significant financial and human resources into IT. We are proud to pass this CC audit for this customer’s project. This is an independent recognition of our commitment to providing the highest level of quality, data security and customer service”, said Jean-Luc Triouleyre, CEO of IC’Alps.

In addition to ISO 13485 (medical) and EN 9100 (aeronautics) certifications, joining an elite group of companies providing a design environment complying with the highest security standards, will strengthen IC’Alps’ business opportunities for silicon implementation of custom chips and hard macros targeted for security-sensitive markets such as, but not limited to, banking, defence, government and implantable medical devices.

ABOUT IC’ALPS
IC’Alps is your one-stop-shop ASIC partner. The company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. From its technical centre in France (Grenoble area), IC’Alps supports multiple projects in the demanding medical, industrial, transport, IoT, and mil/aero sectors. The highly qualified engineering teams cover every expertise needed and have a long experience of on-demand analog, mixed-signal and digital integrated circuits on technologies from 0.35 µm down to 16 nm. Moreover, IC’Alps has a proven track record of success with sensor/MEMS AFE interfaces, low power consumption designs, high-resolution converters, signal processing, multiprocessors architectures, hardware accelerators, to name a few. Being a partner of major semiconductor foundries, IP providers, as well as packaging and test houses, IC’Alps is well placed to support customers with full life-cycle solutions. We are proud to be Arm® approved Design Partner, a member of X-FAB’s design and supply chain partner network, as well as an Imec IC-link partner. These accreditations assure that we provide expert support and that we have the design expertise to create highly innovative ASIC designs. IC’Alps is ISO 9001, ISO 13485, EN 9100 certified, as well as Common Criteria ready. More information can be found at www.icalps.com

An opportunity to boost development for Additive Manufacturing & Semicon industry.

Inventec Performance Chemicals, a global provider of Soldering, Cleaning & Coating solutions, acquired PUS (Pure Ultrasonic System) in April 2021. PUS’ main activities are the production of equipment (solder powder atomizers and sieving machines) and the production of solder powders, from its own process.

By acquiring PUS, Inventec saw an opportunity to create a synergy in the additive manufacturing industry. Inventec supplies the 3D market for high-tech application, with its cleaning, particle elimination & finishing products, while PUS provides sieving, recycling and depowdering, to provide a circular economy solution for this fast-developing market.

Furthermore, the addition of PUS will strengthen Inventec’s know-how in metallurgy, for the development of solder pastes, with ultrafine powders and specialty alloys for the semicon industry. Adapting to an evolving industry, this acquisition allows Inventec to innovate and meet worldwide customers’ needs.

ABOUT INVENTEC
INVENTEC PERFORMANCE CHEMICALS is a global provider of soldering, cleaning & coating materials for electronic, semiconductor and industrial applications.

For more than 50 years we have shown leadership in innovation by putting environment & health impact, sustainability and reliability at the core of our product development.

With iso 9001 & 14001 production sites in France, Switzerland, USA, Mexico, Malaysia and China we can guarantee a smooth and cost-effective supply chain. On top of this, all our production facilities are equipped with a cleaning application centre, where customers are invited to test our proposed cleaning solutions.

Inventec supplies to many industries and the excellent performance of our products in applications demanding high reliability, leads us to focus especially on the automotive, aerospace, semiconductor, automation & energy and medical industry.
For more information about Inventec Performance Chemicals, visit https://www.inventec.dehon.com/en/

ABOUT PUS
PURE ULTRASONIC SYSTEMS is a French expert for ultrasonic atomization and ultrasonic sieving. At its creation, PUS first specialized in atomization and sieving equipment, manufacturing devices for ultrasonic atomization of solder powder for electronic assembly. 10 years later, PUS is still innovating to develop new equipment and powders for the Additive Manufacturing Market.
For more information about PUS, visit https://www.pus-net.fr/en/