Healthcare has traditionally focused on one-size fits-all medication to treat populations instead of tailoring treatments to individual patients. Recent advances in stem cell technology allow researchers to create disease models for personalized medicine. SEMI spoke with Thomas Pauwelyn, Postdoctoral Researcher at imec, about trends in medical technology innovation such as organ-on-chip devices and their applications. Pauwelyn shared his views ahead of his presentation at the SEMI SMART MedTech Forum, 13-14 November, in Hall B2 (Inspiration Hub) at SEMICON Europa, 12-15 November, 2019, in Munich, Germany. Join us at the event to meet experts from imec.xpand and other key industry influencers. Registration is open. Participation is free of charge for SEMICON Europa visitors. SEMI: What triggered the healthcare move from a one-size fits-all medication to treat populations to tailored treatments? What advancements allowed researchers to create models for personalized medicine? Pauwelyn: One of the main triggers for this transition is the inefficiency of the current healthcare system. The top 10 highest grossing drugs in the U.S. are effective for only between 1 in 25 to 1 in 4 patients. Not only do most medicines only help a small share of the patients, but they are often developed in classical clinical trials with predominantly western or male participants.Recent advances in stem cell technology allow researchers to create disease models for individual patients. In other words, researchers can reprogram cells from a patient’s skin or blood sample to various cell types, including cardiac or neuronal cells, through stem cell techniques. These samples reflect the traits that make a patient unique.However, patient-in-a-dish models expose cells to very artificial environments. So these models look very different from their counterparts in the body. Organ-on-chip systems address these issues by exposing cells to physiologically relevant conditions and create more mature models. SEMI: What is exactly an organ-on-chip? Pauwelyn: Organ-on-chip devices are microfluidic cell culture chips that can revolutionize the development of drugs and personalized treatments. These devices model the pathophysiological behavior of organs and tissues. Inside these chips, cell cultures are grown and exposed to conditions that better resemble in vivo microenvironment. Different organ models can be created by exposing different cell types to an engineered microenvironment. Common examples are the heart-on-chip, lung-on-chip, gut-on-chip or brain-on-chip.SEMI: Medical technology has made astonishing advances over the years. As new medical devices emerge, what are the main challenges?Pauwelyn: Meeting stringent regulatory requirements is one of the main challenges for medical devices. Technologies related to personalized medicine do not neatly fit in existing health technology assessments and reimbursement processes.In the case of organ-on-chip devices, there are challenges related to production, qualification and adoption. Increased standardization will also help scientists compare and interpret their findings. Currently, various research groups obtain different results from own organ-on-chip systems. These systems may be fabricated from different or exotic materials, expose cells to different microenvironments or rely on other cell models. Often, only a few devices are available for testing due to limited fabrication scalability.SEMI: What did imec do to overcome those challenges?Pauwelyn: imec turned to its expertise in chip design and technology to develop a novel organ-on-chip platform in close collaboration with Micronit Microtechnologies in the InForMed project funded by the ECSEL Joint Undertaking (ECSEL2014-2-662155). The platform’s main requirements were that it could reduce handling variability by microfluidic automation, be fabricated with conventional materials compatible with production upscaling, and produce high-quality electrical recordings of cellular activity. Another essential requirement was the compatibility of the device to the standard workflow of pharmaceutical research. The user interface is based a conventional 96-well plate, and peristaltic pumps are integrated into the device.SEMI: How does the CMOS-based microelectrode array work and where do you see potential for applications in the field of personalized medicine?The imec-developed CMOS-based microelectrode array is the sensor in our organ-on-chip system that monitors the cell culture. The sensor consists of 16,384 electrodes distributed over 16 independent microfluidic wells. It detects cellular activity down to the single-cell level, including intracellular action potentials or extracellular signals from electrically active cells or impedance caused by cells growing directly over the electrode.We believe this technology has great potential for developing miniaturized patient models in the lab. By using patient cells reprogrammed to the desired cell types through stem cell technologies, we can develop patient-on-chip systems. These systems would be able to predict which treatment is best suited for a specific patient or how drugs affect certain subpopulations.SEMI: What are your expectations for the SMART MedTech Forum at SEMICON Europa 2019 in Munich? Pauwelyn: The SMART MedTech Forum brings together an interesting mixture of researchers, entrepreneurs and stakeholders in the future of healthcare. I look forward to hearing their perspectives and to discuss how personalized medicine and MedTech will help tackle current challenges.SEMI: Can you share one prediction for the future of MedTech? Pauwelyn: I believe that MedTech in the future will help us tailor treatments to each patient. Doctors will have a wide arsenal of tools available to predict which treatment will deliver both the highest chance of success and the lowest chance of adverse reactions. One of these tools could be a human-patient-on-chip system. It would consist of interlinked organ-on-chip modules with patient-derived cell models. In this way, the reaction of patients to specific treatments could be predicted without ever exposing them to potentially harmful compounds.Dr. Thomas Pauwelyn currently is a post-doctoral researcher with an Innovation Mandate grant from VLAIO, investigating strategies to valorize the results from his research. Pauwelyn’s research focuses on developing novel organ-on-chip systems for predictive toxicology and drug development. He also investigates how organ-on-chip devices may help stratify patients and help enable personalized medicine. Pauwelyn has studied at KU Leuven, Belgium, since 2008. He earned his BSc in Bioscience Engineering specializing in Catalytic Technologies in 2011 and a Master’s in Nanoscience and Nanotechnology with the Bioscience Engineering option in 2013. He completed an IWT fellowship for a PhD at KU Leuven and imec’s Life Science Technologies group in 2018.Serena Brischetto is senior manager, marketing and communications, at SEMI Europe.

The microelectronics industry is entering the era of Cloud Engineering Simulation to slash the costs and risks of new technology development and speed time-to-market in spaces like semiconductors, MEMS sensors, RF front ends, biomedical and driverless cars. In the run-up to SEMICON Europa, 12-15 November, 2019, in Munich, Germany, SEMI spoke with Ian Campbell, CEO of OnScale, about the new paradigm of Cloud Engineering Simulation. Campbell shared his views ahead of the SMART Design Forum, 14 November, 2019, 14:30 to 17:00, in Hall B1, TechARENA 1 at SEMICON Europa. Registration is open. Join the forum to meet experts from OnScale and other key industry influencers. Attendance is free of charge for all SEMICON Europa visitors.SEMI: How did your adventure with OnScale start?Campbell: I’m an engineer. When I was still in high school, I took a night class at Nashville Tech to learn AutoCAD R14, and I’ve been designing and engineering things ever since. I was introduced to Desktop Simulation in my bachelors of mechanical engineering program and used many types of simulation tools for massive design studies at the Aerospace Systems Design Lab at Georgia Tech. I’m a simulation junkie.I started my first Silicon Valley high-tech company, NextInput, in 2012 with Dr. Ryan Diestelhorst (now VP of Strategy at OnScale), to commercialize new ForceTouch and 3D Touch technologies based on our patented MEMS force sensors. At NextInput, we bought hundreds of thousands of dollars of engineering software, but were always frustrated by slow, inaccurate engineering simulation results. We dreamed about running massive simulations on Cloud Supercomputers and creating true Digital Prototypes that could replace costly, time-consuming, and risky physical prototypes.When I got the chance to join the team that became OnScale in 2017, I jumped at the opportunity. At OnScale, we took engineering simulation solvers that had been developed for the U.S. military to run on U.S. Department of Defense and DARPA supercomputers and built a cloud supercomputer platform on Amazon Web Services to run the solvers. The net-net is the world’s first on-demand, infinitely scalable Cloud Engineering Simulation platform. Now, we routinely run massive multi-billion degree of freedom simulations for Fortune 100 companies, including many from the semiconductor and MEMS industries. Since our business model is to charge per core-hour for simulations, the incredible capability we built is cost-effective and available to small startups as well. SEMI: How is the semiconductor design ecosystem evolving? How is Cloud Engineering Simulation applied to semiconductor and design industries?Campbell: The entire industry is experiencing a massive acceleration in product launch cycles and increased competition. New markets like IoT and 5G are reducing semi/MEMS product cycles from years to months. That, in turn, puts enormous pressure on semiconductor and MEMS designers. Missing a key product introduction like a flagship smartphone launch can literally make or break a company.A reliance on traditional engineering methods – schematic capture and layout of a chip, taping out (physically prototyping the chip), performing engineering validation on an e-bench, qualifying the chip (or not qualifying it and going back to the drawing board), and finally launching mass production – is no longer sustainable from a competitive perspective.Instead, market-leading firms are turning to Cloud Engineering Simulation and Digital Prototypes to explore massive design spaces, find optimum designs that beat the competition in every KPI (size, power, performance), and digitally qualify designs before ever cutting silicon, ensuring that designs are robust over their intended operating environments and performance envelopes. Large thermal analysis of a chip on a circuit board executed quickly on the OnScale Cloud Simulation Platform SEMI: Can you give us an example? Campbell: A great example is thermal analysis. Thermal effects have always had huge impacts on MEMS device performance and, more recently, they are beginning to impact performance of next-gen semiconductors, especially GaN power electronics for electric vehicles (EVs).Conducting a full system-level thermal analysis of something like an EV power management system – a power IC in a package, on a board, in an enclosure, under various loading conditions – has been a challenge from a simulation complexity perspective (degrees of freedom) and from a parametric sweep perspective (running hundreds or thousands of simulations to optimize chip placement, routing, etc.). To run these sets of simulations using legacy desktop simulation would take weeks, perhaps even a month or more. To run these massive simulations in parallel on cloud supercomputers using OnScale takes days or even hours.Our customers routinely run very large simulation studies on OnScale Cloud for thermal simulations, RF filter simulations, MEMS simulations, packaging simulations (what we call Digital Qualification), and many more use cases.SEMI: What’s one of your strategic objectives for 2020? Campbell: For 2020, we’re doubling down on MEMS and semi simulation capabilities. We will be launching additional solver capabilities like EM that will be critical in our strategic markets like 5G. We will also be launching a Cloud API so that engineers can integrate OnScale directly into their existing engineering workflows (e.g. MATLAB or EDA/CAD tools) with just a few Python commands.SEMI: Can you share one prediction for the future of semiconductor design solutions? share?Campbell: I think we will continue to see MEMS and semi designers push the envelope and bring smaller, more performant, more cost-effective solutions to market. I’d like to see more highly cost-effective flexible semi/MEMS designs come to market to enable next-gen IoT and IIoT applications. I’d also like to see more biomedical applications – biomems, microfluidics, and labs on a chip for all sorts of life-enhancing applications.SEMI: What are your expectations regarding the SMART Design Forum at SEMICON Europa 2019 in Munich? Campbell: I’m looking forward to getting back to my roots in MEMS/semi design and chatting with other designers about the future of engineering and the future of semi! Ian Campbell is a twice venture-backed Silicon Valley CEO and expert in MEMS sensors, semiconductor technology, and engineering software. Most recently, Ian co-founded OnScale, a Cloud Engineering Simulation startup backed by Intel Capital and Google’s Gradient Ventures. OnScale is revolutionizing engineering by combining world-class multiphysics solvers with Cloud supercomputers, machine learning, and artificial intelligence. Prior to co-founding OnScale, Campbell served as founder and CEO of NextInput, where he led the startup through multiple rounds of funding – totaling $12 million and an additional $4 million in research contracts with government and industry partners – and built a world-class team of engineers and scientists who developed 3D Touch and ForceTouch technologies for smartphones, wearables, industrial, and automotive interface applications. He also secured the first major smartphone OEM design wins in Asia. Campbell earned his B.S. in mechanical engineering from Middle Tennessee State University, and his MSAE in aerospace engineering and MBA from Georgia Institute of Technology.Serena Brischetto is senior manager, marketing and communications, at SEMI Europe.

SEMI is excited to recognize Debbie Gustafson, CEO of Energetiq Technology as the SEMI Spotlight on Women honoree for Q3 2019!Spotlight on SEMI Women celebrates the many accomplished women who work in the global microelectronics industry. Nominees in the quarterly spotlight include women who are beacons of knowledge, leaders of organizations and initiatives, hidden heroes and innovators in our industry. They are volunteers, protectors, intellectual disruptors and activists. Learn how you can nominate a woman for Spotlight on SEMI Women.Debbie sat down with us to discuss her journey as a leader and her belief in the importance of creating an inclusive workforce.SEMI: What skills have set you apart and led you to your career success?Gustafson: I’m good at what I do – listening and understanding customers is at the core of my success. You should know and also ask for what you want. If I was working towards a promotion, I always let my manager know where I wanted to go and asked about the expectations for me to get to the next level. Don’t be afraid to ask for help – during my journey in becoming a leader I had some extremely strong mentors along the way, helping me to navigate the industry. We make mistakes and learn from them, but having a mentor can really help you figure out those areas of weakness sooner rather than later. I credit these skills and mindset for our successful acquisition by Hamamatsu Photonics. When I was asked to move from the COO role to the CEO role at Energetiq, I realized that the only way we would be successful in this huge endeavor was if I had the right understanding of both our needs as an organization, and the needs of our future partner.SEMI: You mentioned the importance of mentors. Can you recount a time that your mentor helped you succeed?Gustafson: One of my first mentors taught me how to be successful in Japan during a time when women weren’t really present in the business side of the workforce. Going into a new culture, there are a lot of nuances. My mentor prepared me by helping me understand the behaviors that I would need to establish and let me take the lead as the expert. As a result, I was able to earn the respect of the customer and the Japanese market became part of our growth. I believe that my mentor’s preparation helped me getting there much faster.SEMI: Did you always want to be an engineer?Gustafson: I came to a crossroads as I approached the end of high school. I had an interest in engineering and automotive design in particular and appreciated the stability that a technical career could provide. I also had a passion for dance and had eyes towards becoming a dancer on Broadway. In the end, the idea of job security won out and I started my journey as a mechanical engineer. I was one of three women in my major, so I realized early on that I was entering a male-dominated field. After graduation I landed a job in the HVAC space. From there I moved into a variety of roles, including a sales job, that helped me realize that I enjoyed working in the semiconductor industry and that I had a passion for helping my customers.SEMI: Can you tell us about the changes you have implemented at Energetiq Technology to create a culture of inclusivity?Gustafson: My door is always open – even as the CEO. What gets me excited every morning is helping people to be successful. It’s not just about women, or minorities, or young people – it’s about everyone. We need to change as an industry to foster success and give everyone the opportunity to succeed. You can’t say you’re going to change as an organization and then not implement programs to help foster that change. I knew that we needed to find ways to get people to join and to stay – that’s the challenge. At Energetiq we have implemented a mindset of inclusivity in many of our programs.We have unconscious bias training that everyone takes regardless of job level. We’ve implemented a flexible working environment and provide sick time to help our employees have work-life balance. We are an employer that realizes the world is changing – we offer paternity leave as well as maternity leave and do everything in our power to support individuals during their major life events. Energetiq supports Employee Resource Groups, and we host a quarterly diversity luncheon where we encourage all employees to participate in open dialogue. As a company we continue to try and find ways to promote everyone’s success.SEMI: How do you feel the microelectronics industry is doing in terms of attracting and retaining diverse talent?Gustafson: The semiconductor industry has done a lot in the recent past but there is still a lot of work to be done. I think all the right things are starting to happen, and we are moving towards attracting more diversity into our organizations. We have been shifting our company culture to highlight that the industry is an exciting place to work. The progress has been tremendous and there are more opportunities ahead of us to take advantage of. People are just starting to acknowledge the changes that need to happen, and we are striving to create flexible work environments that are conducive to inclusivity. Diversity is not just going to happen – we need to change the culture in our organizations for diversity to flourish. The industry mindset is shifting, and I am looking forward to seeing where we go next. I am going to help wherever I can to help keep us moving in the right direction.SEMI: Are there other ways outside of your work at Energetiq Technology that you are influencing the mindset towards diversity in our industry?Gustafson: Volunteering my time outside of my job to try and change the attitude and the culture of the industry is extremely important to me. Aside from providing mentorship, I am involved with a number of committees and boards across the industry. I am always vocal among my C-level peers about how our industry needs to foster a diverse and inclusive workforce. I really like working with other people to find solutions as I don’t know all the answers. I like to get insight into how we can make this happen and I like to hear about what works and what doesn’t from other leaders. The goal is to allow people to feel comfortable with who they are at work.Cristina Sandoval is manager of Workforce Development at SEMI.

Famous for its warmth and hospitality, Japan always welcomes visitors from around the world with a gracious embrace. But when is the best season to visit? It depends on the interest of each visitor of course. For Instagrammers, the April cherry blossoms or November autumn leaves – a masterpiece of art with their rainbow gold, red and yellow hues – are ideal for snapping memorable pictures. For foodies, winter delights with tuna, toro sushi and other seafood at their tastiest. Wagyu peaks in richness, too, when the cold weather sets in. For anime and manga enthusiasts, August is definitely the time to visit. That’s when COMIKET, the world’s largest comic market – drawing more than a half million people – takes place in Tokyo. But for people in the electronics value chain, the perfect time to pack their bags and hop a flight to Tokyo is December, when SEMICON Japan – December 11-13 at Tokyo Big Sight – opens its doors with its own form of hospitality.Why should you attend? Here are the five top reasons.Reason 1: Japan is home to leading electronics industry suppliersAccording to VLSI Technology, seven of the top 15 semiconductor equipment suppliers in 2018 are headquartered in Japan, and many Japanese companies also lead backend equipment segments. For decades, Japanese companies have supplied about one third of the equipment for the global semiconductor equipment industry, according to SEMI and the Semiconductor Equipment Association of Japan (SEAJ). Most of these companies typically set up a booth on the SEMICON Japan show floor to welcome your visit.True, many Japanese suppliers also exhibit at SEMICON shows outside of Japan to meet with customers. But you will find many more engineers, managers and executives of equipment suppliers on their home ground at SEMICON Japan, where suppliers typically debut new equipment. Their booths are also ideal locations for visitors to meet with suppliers to ask questions, exchange opinions and negotiate new business deals.Japanese materials suppliers enjoy an even larger market share, providing about half the materials for the global semiconductor industry. These suppliers dominate in silicon wafers, photomasks, photoresists, sputtering targets, packaging substrates, bonding wires, leadframes, mold compounds and wafer level packaging dielectrics. Unlike equipment suppliers, not all materials companies exhibit. Instead, many participate as speakers and attend to connect with customers.Reason 2: Get ready for the next semiconductor industry upturnA year ago, in late 2018, we expected chip inventory to stabilize by mid-2019, yet the industry still struggles with high inventory overall and low average selling price for memory. The SEMI 2019 equipment billing forecast was lowered accordingly from -4.0 percent growth (2018 year-end forecast) to -18.4 percent (2019 mid-year forecast). However, the two forecasts still predict positive growth in 2020. As SEMICON Japan 2019 is underway, we should be at the beginning of the next upturn.The chart below shows that more wafer process fabs will start construction in 2020 than this year. (Please see article: Nearly $50 Billion in Fabs to Start Construction in 2020.) Custer Consulting Group also pointed to “a resumption in semiconductor chip and capital equipment growth in late 2019 or early 2020.” (Please see article: Semiconductor Industry Upturn by Early 2020?.)With better times ahead, SEMICON Japan 2019 will be an opportune time to exchange opinions with key players across the supply chain and start negotiations for the coming robust recovery of the equipment, components and materials markets.Reason 3: Glimpse the future at SuperTHEATERSEMICON Japan SuperTHEATER will feature industry and technology insights from global visionaries. Asako Eda, Japan’s chief representative officer of the World Economic Forum and the former president of Intel Japan, will open the SuperTHEATER with her keynote on how we live in an era where the fourth industrial revolution, climate change, disparity and geopolitical risks are affecting our lives and with the speed we have never experienced. She will explore the growing role of innovation and social responsibility and how the World Economic Forum is addressing associated challenges. The opening keynote session will also feature Nandan Nayampally, vice president and general manager of the Immersive Experience group at Arm.In all, the SuperTHEATER will host seven keynote forums over three days at SEMICON Japan including: Semiconductor Executive Forum – Terushi Shimizu, representative director and president of Sony Semiconductor Solutions, and Atsuyoshi Koike, president of Western Digital Japan, will discuss their business strategies and prospects. Manufacturing Innovation Summit – Executives from Applied Materials, KLA, Nikon and Tokyo Electron will discuss business and technology issues as well as innovations that will drive growth to 2030. All seven SuperTHEATER programs will be simultaneously translated to English for international audiences.Reason 4: Connect to application communitiesCollaboration across the value chain has never been more important to industry innovation and growth – the very reason SEMI has expanded its reach beyond the semiconductor manufacturing supply chain (equipment and materials) to include design, systems and products.The SEMICON Japan show and conferences will connect you to key application segments of the value chain. The SuperTHEATER will host two SMART transportation forums highlighting the latest developments in autonomous driving and sky transportation (flying cars). In the SMART Applications Zone on the show floor, you’ll find electronics products and technologies showcased for automotive and manufacturing automation as the autonomous driving pavilion highlights emerging technologies that are driving semiconductor innovation opportunities. Reason 5: Learn from disaster and recovery experiencesJapan has taken important disaster recovery lessons from devastating earthquakes over the past three decades, most notably the Kumamoto quake in 2016, the Tohoku temblor in 2011 and the Kobe rattler in 1995. So has the Japan electronics supply chain, including SEMI members. In the Business Continuity Plan (BCP) area at SEMICON Japan 2019, exhibitors including DISCO, Murata Machinery and THK will highlight technologies that can strengthen your preparedness for a disaster and aid in the recovery.On December 12 at the BCP seminar at Japan 2019, Sony Semiconductor Manufacturing, DISCO and Team Engineering Consulting will share their experiences and expertise in mitigating the disaster impacts. (Sony and Disco will present in Japanese.)To get the feel for the magnitude of a major earthquake and how seismic isolation protects against structural damage, be sure to take advantage of THK’s earthquake experience car. Seismic isolation installs isolators – rubber bearings, friction bearings, ball bearings, spring systems or other devices – beneath a building to buffer earthquake vibrations transmitted to structures.More reasons to attend SEMICON JapanAnd of course your visit to Tokyo for SEMICON Japan 2019 wouldn’t be complete without exploring Tokyo and other regions to experience Japan’s exotic culture, cityscapes and cuisine! Here are some resources to give you even more reasons to book a flight to Tokyo: Japan National Tourism Organization Go Tokyo Kyoto Tourism I look forward to seeing you at SEMICON Japan in December!Jim Hamajima is president of SEMI Japan.

Technology advancements seem to be coming at us fast and furiously. Every time you turn around, another company is introducing a breakthrough product with claims of far-reaching implications on how we live and work. But how often do consumers really experience disruptive innovation, like the kind that smartphones and cloud computing have had on our lives? Instead of astounding people, many new products that hit the market today are merely upgraded versions of their predecessor – perhaps offering smaller footprints with faster processors, more attractive packaging, or add-on features. These upgrades tend to underwhelm customers, offering no compelling reason to justify their accompanying price hikes.What consumers want is disruptive technology that truly enhances their lives, whether at work, at home or at play. And that’s exactly what product manufacturers want to deliver. So what’s holding them back?The Limits of Traditional BatteriesThe challenge doesn’t lie in envisioning exciting new offerings. Vendors are great at that. Rather, when it comes to consumer-focused, electronics-based products, the culprit is often conventional, rigid and thick batteries that limit what can be designed around them.But it doesn’t have to be this way.Advances in flexible and thin batteries can spark a whole new level of product differentiation. Even though such batteries have been available now for a few years, they are still a foreign concept to many product designers accustomed to conventional off-the-shelf energy storage that is fixed in rigidity and shape. It’s hard for some people to believe that batteries can fold and flex while maintaining their performance and safety. As a result, they design products around rigid battery parameters. The Promise of FlexibilityFortunately, flexible battery technology is available today, even for high-volume production.While the allure of flexible battery technology is strong, we find ourselves having to reassure manufacturers that flexible batteries are every bit as dependable as their rigid progenitors. Our testing shows that performance-integrity in flexible batteries is strong. They can be flexed, bent and even rolled in any direction without deteriorating performance. For instance, we tested a flexible battery by bending it 10,000 times to prove that it has essentially the same capacity as a non-bent battery. This flexibility gives designers and engineers a new level of freedom in hardware design: Manufacturers can now place batteries in spaces not possible or practical before. Take smartwatches, for instance. Instead of locating batteries in only the head case, engineers can embed a flexible, thin battery in the strap band to increase accessible energy or lengthen battery life. As market demand grows for wearables and hearables, smart apparel and other personal battery-powered products, consumers want more natural-feeling experiences. Unlike fixed off-the-shelf energy solutions offered in a limited range of form factors and capacities, flexible batteries can support customization by size, thickness and capacity, enabling development of products that are smaller, lighter and more comfortable.Rigid batteries are problematic on a whole other level, and that’s safety. Electrolyte advancements ensure flexible batteries are safer. The latest gel-polymer electrolyte is safer than liquid electrolyte because it does not contain liquid that would leak if the battery is pierced or penetrated – yet it still delivers the same high level of ionic conductivity. This is a great advantage for manufacturers of wearables in medical devices, sports equipment and fabrics, industrial applications, and consumer electronics. Knowing that their devices contain safer components not only brings peace of mind to manufacturers and consumers but also increases both adoption and usage rates. Staying competitive in any technology-driven market requires a steady stream of innovation. To rise above the pack, companies must fearlessly embrace advancements that will differentiate them in the marketplace. Your choice of battery is critical to your hardware design – especially if consumers will be in direct contact with the battery. The performance and enhanced safety inherent in next-generation flexible batteries can free you to create disruptive products that deliver a compelling user experience. To learn more about flexible batteries, visit Jenax.EJ Shin delivered an engaging presentation at 2019FLEX Japan (May 22-23, 2019, in Shinagawa, Tokyo), where she discussed Jenax’s flexible and customizable rechargeable battery, a technology that allows batteries to integrate seamlessly into a new generation of medical devices.FLEX Japan is a hosted by FlexTech and MEMS Sensors Industry Group, SEMI technology communities.EJ Shin is Global Director at Jenax Inc., a company that pioneered the next-generation flexible, thin battery that can be bent and rolled in any direction. She has been with Jenax since the company initiated its battery development. EJ helps device and wearable companies leverage Jenax’s customized battery solution for their innovative products. Earlier, she held communications consulting positions at Fleishman Hillard and G20 Summit in Korea. EJ holds an MBA from Yonsei University, South Korea, and a B.A. in International Relations from Tufts University, U.S.

Global and regional forces shaping the $2 trillion electronics industry have intensified more in the past few years than at any other time I can recall. The uncertainty bred by trade wars, corporate tax changes, new environmental regulations, immigration issues and STEM talent shortages is vexing the global microelectronics supply chain as companies shift investments and operational strategies to adjust to the unrelenting change and new realities with heightened urgency.In our industry, an increasingly dynamic world requires a more determined and strategic approach to advocacy. To meet the industry’s rapidly evolving needs, SEMI is transforming its global advocacy initiatives and programs. In the past 18 months, we have honed the focus of SEMI Global Advocacy to better serve member interests and needs, respond more quickly to fast-moving geopolitical developments, and deliver more value to help spur growth across the end-to-end electronics supply chain.Most importantly, SEMI Global Advocacy is now much more forward-looking and proactive. We have expanded our focus from primarily U.S. and independent regional issues to global affairs, allowing us to better leverage the power of our worldwide platforms. Organizationally, SEMI continues to add specialized staff advocates and calibrate its operational and member-driven engagement models to increase their involvement. There will be more to come, and with your continued support, we’ll be in a stronger position to meet your needs. Thank you!Strengthening the industry’s voiceThe rapid shift to a more proactive advocacy approach across all our initiatives was triggered by one disruptive action a little more than a year ago – the buildup and onset of the trade war between the United States and China. From the outset, SEMI formed strong member coalitions to intensify our lobbying efforts, met frequently with policymakers, submitted written comments to government panels, and issued public communications, all aimed at amplifying our collective voice. SEMI has taken a principled approach to advocacy, publicly stating its positions based on its trade pillars of free and fair trade/open markets, supply chain growth, respect for IP and national security.That approach was on full display as Japan tightened controls on exports to the Republic of Korea, sending shockwaves through the microelectronics industry. To minimize the industry impact, we leveraged our global reach and the counsel of our International Board of Directors to engage with both governments early on and ensure that Japan took into account our members’ interests in developing and implementing the new rules. In general, SEMI opposes the use of tariffs and limiting market access as levers to correct trade imbalances and other structural issues. Instead, we support dialogue and negotiations that lead to multilateral agreements aligned with our members’ interests and global trade principles.This year in the U.S. alone, SEMI advocates have met with more than 70 policymakers in Washington, D.C., including members of Congress and representatives from the White House, federal agencies and the Trade Representative’s office. We have also spoken with representatives from European and Asian government delegations. Since the trade war erupted, we have met with more than 220 policymakers worldwide, giving SEMI a seat at the table – a louder voice for our members – as we are increasingly seen as the voice of the end-to-end electronics manufacturing and design supply chain. SEMI Global Advocacy has also broadened its focus beyond public policy to address other areas of strategic importance to the industry such as the talent shortage.Expanding Advocacy’s global influenceSEMI’s public policy efforts now reach well beyond Washington, D.C. to all seven major manufacturing centers worldwide where we have regional offices, with SEMI advocacy staff in every location. This has created a network multiplier effect that allows us to rally our collective strength around common member interests. It’s no coincidence that our member-driven advocacy initiatives and programs have improved in parallel with expanded global participation by our member companies on our various policy and advocacy committees.Our Trade Advisory Committee, for example, has grown from 16 to 60 active members in the past year alone. This year, we have also formed working groups with SEMI members around the world to address talent pipeline challenges. The upshot is that we are now much more focused in attacking regional issues. Thank you once again.Despite changes in the strategic approach of SEMI Global Advocacy, we remain squarely focused on critical issues affecting industry growth and our members’ interests. In a nutshell, we call these the four T's: Tax – We strive to encourage rates that are fair to all companies, leveling the playing field globally Technology – We seek government investment in technology and innovation (R D) Trade – We advocate for open markets, free and fair trade as we promote our 10 Principles for the Global Semiconductor Supply Chain in Modern Trade Agreements worldwide Talent – We support education investments and immigration policies that provide opportunities and build the talent pipeline In addition, SEMI has long been a leading voice in promoting Environment, Health and Safety regulations that enable industry growth and demonstrate environmental stewardship – and we continue to make investments at this critical juncture as new technologies are driving changes in the regulatory landscape.Maintaining laser focus on member priorities amid shifting geopoliticsThe only way for SEMI Global Advocacy to navigate the cauldron of geopolitical disruption is to remain laser-focused on our members’ top priorities including trade, tax, technology and talent. And we will stick to what SEMI has done best for almost 50 years – facilitate public-private collaborations and more investment on behalf of our members.In workforce development, SEMI is taking bold steps to develop a robust talent pipeline, as much a growth and innovation driver for SEMI members and the industry as any technology. Announced earlier this year, SEMI Works™, our landmark talent development initiative, is already gaining steam with U.S. government investment and our rapid progress in laying its foundation with a database of standardized competencies for technical jobs as well as a certification and credentialing process for curriculum, education and training programs.The future for SEMI members and the industry is brimming with possibility. The strides SEMI Global Advocacy has made over the past year have only been possible through your support and involvement. As we broaden our scope beyond policy, we recognize that more progress needs to be made. We look forward to your continued participation as, together, we help our industry fulfill its great potential.Mike Russo is Vice President of Global Industry Advocacy at SEMI.

The first day of the SOI Consortium’s recent China event – the 7th Shanghai FD-SOI Forum – was full to bursting in every way: the room, the networking, the level of expertise, the in-depth presentations and the overall energy. We covered the Samsung and GlobalFoundry keynotes in our previous post (if you missed it, read it here).This post will recap the rest of the presentations given during the day. (If your company or institution is a member of the SOI Consortium, you’ll be able to access the full presentations online.)International Business Strategies (IBS) – Impact of AI on Automotive and IoT, and Opportunities in China (Handel Jones, CEO) When it comes to deep insights on China + tech + analytics, and especially with a thorough understanding of FD-SOI markets, Handel Jones is arguably the world’s leading expert. Here are some of the observations he shared. Though the chip industry will see declines across the board in 2019 (he sees 13.5%), he sees a return to growth in 2020. By 2030, he sees it as a trillion dollar market, of which China will have half. AI is a key driver – and will become more prevalent at the edge. Major drivers will include preventative medicine, gaming, NB-IoT and 5G. At the chip level, FD-SOI has a lower cost/chip compared to bulk – you’ve got small chips and high yields. Sensors – especially image sensors – are a key area, and this is another place where FD-SOI is better than bulk. He sees chip shortages in the 2022-24 time frame (as opposed to the current oversupply), so now is the time that China should be establishing large FD-SOI capacity.NXP – Automotive, Industrial and IoT Solutions Leveraging FD-SOI (Ron Martino, VP GM) In terms of power consumption, computing is easy but data transmission is hard, Ron Martino reminded the audience at the onset. That’s why you need the edge. This is where FD-SOI comes in, and if you want to have leadership, you should be leveraging body biasing, he said. In terms of machine learning, a lot can happen at the edge on the smallest devices. NXP is now shipping a very wide range of products based on FD-SOI, including the i.Mx7 and 8 families and the new RT crossovers. The latest announcement is the i.Mx RT 1100 MCUs, a very low-cost processor solution for high volumes. The i.MX7 ULP is in mass production for wearables, with record low leakage and high performance. The i.Mx8 and 8x are going into a broad range of applications – from retail solutions for automated checkout to pasta makers, and automotive applications for full cockpits with vision detection, as well as things like parking, V2X and in-vehicle monitoring.Sony Semi – Low Power IoT Products with FD-SOI eMRAM Technology (Kenichi Nakano, GM) Chips built on FD-SOI with eMRAM are in production, said Kenichi Nakano. In GNSS/GPS, Sony is the #1 in lowest power consumption worldwide, thanks to FD-SOI, he continued. They’ve had 70 remarkable design wins, giving them over 50% market share in the sports and health watch markets, he said with a tip of the hat to the FD-SOI ecosystem and SOI Consortium. In GNSS, performance is very important – and now they can do it in water, which is huge. Development cycles are shorter than ever – for the latest chip it started in February 2018 and was in production by the spring of 2019, achieving decreases of 20% in power, 30% in area and 10% in cost. Integrating eMRAM was easy in terms of the design flow and manufacturing, with production yield of 97-100%. So with the GXD5605GF they’ve got the first GNSS chip with FD-SOI/eMRAM/RF in the world and it’s on 28FDS/eMRAM technology. It’s very reliable and very good, he concluded.Rockchip – Challenges of AIoT Chip (Feng Chen, SVP) At the beginning of this year Rockchip announced the launch of their RK1808, a low-power AIoT solution with built-in high performance (3TOPS) NPU fabbed in GlobalFoundries 22FDX, said Feng Chen. Their clients were very happy that Rockchip delivered the real power and performance numbers they’d promised. Because of the power/performance it delivers, FD-SOI (both 22 and 28nm) is very well suited for AIoT chips, he said. It’s very cost-effective in terms of NRE and die, and there’s room for further savings. While the ecosystem needs a unified push, FD-SOI is good for the market in China, and China has the volumes FD-SOI needs. Rockchip sees particular potential in retail and smartphones.Panel – Verticals Driving FD-SOI VeriSilicon CEO Wayne Dai moderated the first panel, asking first why China should adopt FD-SOI. Soitec CEO Paul Boudre said because it is a big, dynamic market (noting that Sony’s first FD-SOI GPS win was in China). Handel Jones said that at the wafer level, there was cost parity, but with FD-SOI chips are smaller and higher yield. The main reason it’s taken so long to get going was IP, but that’s changing now, he added. Dai’s next question was about the top application fields the panelists predicted for 2020. Sony’s Kenichi Nakano said wearables with connectivity, low power consumption, small size and high levels of integration; Rockchip’s Feng Chen agreed. NXP’s Ron Martino said FD-SOI for automotive, machine learning and edge computing was shipping now, with wearables ramping.VeriSilicon – Low Power IoT Connectivity IP Design Based on FD-SOI (Yi Zeng, Director, IoT Connectivity Platform) The “value” of IoT data is not yet being generated, noted Yi Zeng but AI can help here. The IoT industry needs innovation for both chips and networking. SiPaaS – which stands for Silicon Platform as a Service – as offered by VeriSilicon can help lower the barrier to entry. [In the SiPaaS model, VeriSilicon has its own IP-based core. Based on the company's advanced chip design capabilities and mass production service experience, it has created a variety of silicon-proven chip design platforms that can significantly reduce the customer's chip design cycle.] They have FD-SOI IP for NB-IoT, BLE, GNSS and sub-1 GHz. The BLE (Bluetooth) RF IP is a complete offering optimized for low power on GlobalFoundry’s 22FDX. The NB-IoT IP is also optimized on their 22FDX ZSPNano, an energy efficient general purpose MCU+DSP core on 22FDX. And they’ll have results of test chips for GNSS RF IP on 22FDX by the end of this year.Secure-IC – AIoT Embedded Security Using FD-SOI (Hassan Triqui, CEO) While AI enables products and services, it’s important to plan for security early in the design cycle, said Hassan Triqui. Software is not enough to protect edge-to-cloud. Secure-IC’s hardware security module, Securyzr, is an IP block that can be embedded into every device to answer security functionalities such as root-of-trust and key management. In sleep-mode/tunable cryptography, FD-SOI allows the creation of physically secure systems. (Note that designers are leveraging FD-SOI’s unique body biasing for ultra-low-power deep-sleep modes.) Because safety and privacy require a combined solution, Securyzer is particularly well-suited to IoT chips built on FD-SOI, he concluded, so that IoT adds value to AI, and not just the other way around.Soitec: FD-SOI – The 5th Gear for mm-Wave Radio (Michael Reiha, GM FD-SOI Business Unit) There are four key areas to 5G, explained Michael Reiha: coverage, number of antennas, frequency and traffic density. 5G mmW access architectures are currently inefficient in terms of power and performance, but FD-SOI is ready for 5G access as both an analog and hybrid beamformer. For MU-mMIMO (massive MIMO), the RF front-end modules (FEMs) and transceiver will fully exploit FD-SOI. Sensing, calibration and control enabling hybrid beamforming and multiple users is easy in FD-SOI. The adaptive body biasing on the horizon will reduce power of FEM mixed-signal circuitry, and be a disruptive technology.STMicroelectronics – Automotive MCUs in 28nm FD-SOI for ePCM NVM (Shan-Lin Liu, Automotive Marketing Manager) As a leader in the automotive market, ST has seen that increased data flows in automotive are driving demand for higher performance and bigger memory in automotive MCUs, said Shan-Lin Liu. ST has taken a unique approach to NVM with embedded PCM (phase change memory) on 28nm FD-SOI. This gives them energy-efficient, high-performance cores with larger NVM memories, and it’s already qualified up to auto grade-0. PCM (vs MRAM) is BEOL. It uses two cells, so it’s more reliable and is good at high temperatures, he said. With FD-SOI, they can go up to 165o, and it’s soldering compliant. The preliminary results of the first MCU chip are excellent. It’s now running in a car, replacing the previous generation 40nm eFlash product.Leti – Advanced FD-SOI for Edge AI (Emmanuel Sabonnadiere, CEO) To fully run artificial intelligence on the edge, research powerhouse Leti is working on an unsupervised learning neural network using advanced FD-SOI and a mix of other technologies. These include embedded non-volatile memory (NVM), 3D integration, and new design tools. Sabonnadière said this new approach is expected to exceed the performance levels of current digital deep learning with neural networks that are capable of handling time-domain signals, sound and speech—and may produce a first "killer app" for advanced SOI. AI will require compact and power-efficient circuits for the inference phase, when neural networks infer things based on new data they receive, close to the end user. The combination of FD-SOI, 3D integration, and NVM opens a path towards dedicated circuits with major performance improvement within the limited power budgets of distributed electronics. In Europe, he noted, privacy concerns are driving the move from the cloud to the edge. On the Leti roadmap, they’ve broken through the 10nm limit for FD-SOI, using strain and body biasing to compensate for transistor mismatch. Also of note: since 2016 Leti has had an ongoing collaboration with SITRI, the Shanghai Industrial μTechnology Research Institute, an international innovation center focused on globally accelerating the innovation and commercialization of More than Moore technologies to power IoT.GlobalFoundries – GF Fab 1 Dresden: Delivering Differentiation with FDX for the Future of Automotive (Thomas Morgenstern, SVP GM Fab 1) Dresden Fab 1, Thomas Morgenstern reminded the audience, is the biggest in Europe, where it is part of the Saxony ecosystem. GF is moving advanced mask-making to Dresden, which is the lead site and Center of Competence for FD-SOI. With the “pivot”, GF is providing platforms. Fab 1 is automotive certified for 22FDX (GF’s 22nm FD-SOI technology), with automotive tapeouts in 2019. “Automotive is a journey,” he said, of continuous improvement, and a mindset: it’s a zero defects culture. The ramp to volume production is well underway, with 26 tapeouts of 22FDX products this year – almost double that of last year. He showed high yield data of about a dozen products, adding that since the beginning of the year every tapeout was first-time right with decreased cycle time. The key specifications for 22FDX with eMRAM for Auto Grade-1 have all been demonstrated, and customer feedback has been excellent.Next: Shanghai International RF-SOI Workshop recap As you can see, it was a packed day for the FD-SOI part of the SOI Consortium’s Shanghai event. In fact the room was still packed at the very end of the day. Several hundred VIPs then headed out for the ever-popular and festive evening riverboat dinner cruise, where the non-stop networking continued.A big shout-out to our sponsors and supporters: VeriSilicon, Simgui, SIMIT, Soitec, Samsung, IBS Ion Implant, ShinEtsu, GlobalFoundries and NXP.The next day of the event was devoted to RF-SOI. That will be the subject of our next post.

GlobalFoundries Has Quietly Become A Player In Silicon Photonics Manufacturing - 31 March 2020 by Patrick Moorhead, Forbes. Blog: Body Bias Gets Its Own Book - 13 February 2020, Junko Yoshida, EETimes Asia. The authors of The Fourth Terminal: Benefits of Body Biasing Techniques for FD-SOI Circuits and Systems make the case for body biasing, describing it as “a new and efficient tuning knob.” Three design experts at STMicroelectronics, including Fellow Andreia Cathelin, have co-edited and written chapters for The Fourth Terminal. NXP's i.MX RT1170 Crossover MCUs (on Samsung's 28nm FD-SOI) - the industry's first GHz MCU - wins Best In Show Arm - TechCon2019 in the Microprocessors, Microcontrollers and IP category! (Embedded Computing Design, 9 Oct. '19)

Artificial intelligence and machine learning are reshaping electronic system design as consumer-facing companies like Facebook and Google design their own hardware. Electronic system design is enabling rapid changes and new innovation in automotive. Designing microchips for the commercialization of outer space faces stiff challenges.These are just a few topics that companies driving technology innovation in electronic system design will discuss at SEMICON Europa, 12-15 November 2019 in Munich, Germany. In the run-up to the event, SEMI spoke with Bob Smith, executive director of the Electronic System Design (ESD) Alliance, a SEMI Strategic Association Partner, about how the integration of the ESD Alliance with SEMI’s global platforms is extending design expertise in the worldwide electronics industry. Smith shared his views ahead of the SMART Design Forum, 14 November 2019, 14:30 to 17:00, at SEMICON Europa. Registration is open. Join the forum to meet experts from ESD Alliance and other key industry influencers. Attendance is free of charge for all SEMICON Europa visitors (Hall B1, TechARENA 1).SEMI: In August of last year, SEMI announced the ESD (Electronic System Design) Alliance joined SEMI as a Strategic Association Partner. How does this partnership benefit the design and semiconductor industries?Smith: As indicated back then by Ajit Manocha, president and CEO of SEMI, “Design is the very foundation of semiconductor innovation and manufacturing.” The integration of the ESD Alliance with SEMI’s event and global platforms enables the design community to expand its expertise to the worldwide electronics industry. The integration helps streamline collaboration and connection of SEMI members with the electronic system design, IP and fabless communities.ESD Alliance members are now able to more efficiently engage with the electronics manufacturing supply chain on technical and business issues and gain access to comprehensive global resources and platforms. Those resources include SEMI’s technology communities and activities in areas such as advocacy, international standards and environment, health and safety (EH S), industry statistics, trade and regulatory initiatives.SEMI: And what were the main opportunities for the ESD Alliance to present the scope of the brand-new collaboration? How did the ESD Alliance enlarge the scope of the semiconductor and design industries?Smith: Although the ESD Alliance has international member companies, the reach and focus of our activities was limited to North America. SEMI’s global platform allows us to spread our design initiatives worldwide. In 2019 we introduced design at SEMICON events in China, Taiwan, the U.S. and now Europe with our participation in SEMICON Europa’s SMART Design Forum. By introducing design into these global events, we are advancing SEMI’s expanded mission to represent the entire global electronic design and manufacturing chain and tighten the connection between the semiconductor and design industries.Industrywide events like SEMICON Europa and its SMART Design Forum bring the entire electronic product supply chain closer together by focusing on commercial achievements in design and presenting forward-looking, system-centric views. The Smart Design Forum is a great opportunity for attendees to deepen their understanding of the links across design and manufacturing and throughout the supply chain during sessions and informal discussions at networking and social events. These exchanges help foster the collaborations essential to addressing technical challenges and ushering exciting new electronic products from concept to consumer.SEMI: How is the semiconductor design ecosystem evolving? What disciplines are becoming integrated with those that have historically governed the scene? Can you tell us more about the concept of system-centric view?Smith: In the early days of electronic design automation (EDA), design was largely separated from manufacturing. On the design side, the goal was to design and tape-out chips. After tape-out, the chip was handed off to the manufacturing group and the design team went on to a new project. We refer to this era as chip-centric.Now, given the complexity of both chips and electronic systems, design and manufacturing can no longer be separated. Instead, they must collaborate from the beginning of a project on all aspects of system design. This system-centric view enables the delivery of smarter, faster, more powerful, and more affordable electronic products. This is a big responsibility and meeting it demands tight cooperation and collaboration across multiple disciplines including semiconductor design, packaging, software development, materials and manufacturing, system integration and testing.SEMI: What’s one of your strategic objectives for 2020? Smith: In 2020 we plan to launch our Connecting the Divide initiative to bring the design and manufacturing communities closer together to help both better understand the role of the other, the value each provides and the unique challenges each community faces. The goal is to increase the rate of collaboration between design and manufacturing in answering both industries’ need for a system-centric approach to new electronic product/system design.SEMI: Do we have good reason to be optimistic about opportunities on the horizon? What’s one prediction for the future of semiconductor design solutions you’d like to share?Smith: We seem to be surrounded by almost limitless opportunities. In terms of design, my prediction is that we will see higher levels of system design abstraction that will allow systems to be rapidly configured and verified in a way that we cannot do today. In essence, we will be able to build virtual systems rapidly to reduce the risk and cost of developing new electronic products.SEMI: What are your expectations regarding the SMART Design Forum at SEMICON Europa 2019 in Munich? Smith: We are excited to be bringing the design conversation into SEMICON Europa at the SMART Design Forum. Europe has been recognized as a leading region in embracing and driving system design. Our objective is to move deeper into system-centric design through the exchange of information and ideas at the SMART Design Forum.Robert (Bob) Smith is Executive Director of the Electronic System Design (ESD) Alliance, a SEMI Strategic Association Partner. The ESD Alliance is an international trade association of companies providing goods and services throughout the semiconductor design ecosystem. Bob began his career as an analog design engineer at Hewlett-Packard working on disk drive technology. Since then, he has spent more than 30 years in various roles in executive management, marketing, and business development primarily working with startup and other early stage companies in Electronic Design Automation (EDA) and semiconductor IP. These companies include IKOS Systems, Synopsys, LogicVision, Magma Design Automation and Uniquify. He was a member of the IPO teams that took Synopsys public in 1992 and Magma public in 2001. Bob received his BSEE from U.C. Davis and his MSEE from Stanford University. Serena Brischetto is a marketing and communications manager at SEMI Europe.

Most of today’s blockbuster MEMS products – from pressure sensors and resonators to accelerometers and microphones – originated from academic research, a trend that Alissa M. Fitzgerald, Founder Managing Member, A.M. Fitzgerald Associates, expects to continue. While many of these potentially game-changing new technologies will require many more years of intensive development and up to $100 million in investment to reach full commercialization, Fitzgerald sees their potential for generating new waves of activity and opportunity in the MEMS and sensors industry.SEMI’s Maria Vetrano caught up with Fitzgerald to preview her October 23 presentation, Emerging MEMS Sensors Technologies to Watch as We Enter a New Decade, at MEMS Sensors Executive Congress, October 22-24, 2019, at the Coronado Island Marriott Resort Spa in Coronado, California.Join us at MEMS Sensors Executive Congress (MSEC) to meet Alissa Fitzgerald and other industry influencers driving innovation in the MEMS and sensors industry. Register now to connect with her at MSEC or visit her on LinkedIn.SEMI: What are your top three emerging MEMS and sensors technologies with the greatest promise?Fitzgerald: Let’s start by defining emerging. In researching this topic for MSEC, I reviewed a year’s worth of academic papers to search for compelling technologies that will emerge five to 10 years from now. While these applications are not yet commercially ready, they bear a distinct presence in academic literature, and some have even reached the proof-of-concept phase. They all have the potential to advance user functionality derived from MEMS and sensors in very meaningful ways.Next-Generation MicromirrorsI’ve noticed renewed interest in micromirrors, driven by interest in LiDAR for autonomous vehicles, in fiberoptic networking, and in VR/AR glasses and headsets as well.Newer generations of micromirrors will use piezoelectric films to enhance optical performance. Piezoelectric actuation can pivot the mirror to a much larger angle than older-generation electrostatically actuated micromirrors. This is important for wider-angle scanning for LiDAR – as well as for other applications – as it enables the creation of a larger picture image.Piezoelectric films can also be used to change the shape of the mirror surface to enable a variable-focus mirror. This is useful on two fronts: It supports depth-of-field adjustments and it alleviates the need for extreme precision in packaging of optical devices, improving both cost and yield.Event-driven sensors/zero-power/ultra-low power sensorsSensors that draw no power, or that draw just small amounts, by activating only upon a triggering stimulus, are enormously exciting. Their extremely low power consumption addresses one of the most significant obstacles to creating large-area sensor networks: the problem of too-frequent battery changes.In addition, while most sensor nodes today broadcast a large stream of data back to the mother ship by radio, these event-driven or zero-power sensors consume only a small amount of power because they activate the radio only to transmit essential data.Resolving the power-consumption problem with sensors will allow deployment of large-area sensor networks in remote or inaccessible locations, highly useful for applications such as monitoring infrastructure.Bacterial sensorsSensors that can detect the presence of bacteria, as well as the type, have widespread applicability beyond medical uses. They would be particularly useful in food-safety applications as they can identify particular strains of bacteria, such as E. coli, before the beef leaves the processing plant or the spinach ships from the warehouse. This could offer dramatic improvements in food safety over the Centers for Disease Control (CDC) and U.S. Food and Drug Administration’s (FDA’s) food safety program, which only flags foodborne illness when a cluster of people are seriously ill.Researchers are also designing bacterial sensors for rapid point-of-care (POC) diagnostics to detect, for example, sepsis early, potentially saving lives.SEMI: You’ve said that some future MEMS and sensors will use alternatives to silicon. When might we see MEMS and sensors printed on paper or other flexible materials – and for which applications are they suited?Fitzgerald: We’re seeing an enormous amount of development of sensors made on paper, plastics and even textiles, materials that are readily available, inexpensive and flexible.What’s gating our progress right now is manufacturing infrastructure. At present, researchers are using inkjet printers, 3D printers, etc. to manufacture prototype sensors, but in most cases, they would need to move to roll-to-roll printing to scale up. I think that we’re looking at a decade before we see these sensor technologies reach the mass market.When they do arrive, we’ll see sensors that we can easily affix to any kind of carton, wrapper or packaging used with food or other disposable items. Traceability and status of perishable items in particular will allow consumers to track food from the farm or factory to the warehouse, store and, finally, to the home.Implementing these kinds of sensors would also help the environment. According to the Natural Resources Defense Council, in the United States alone up to 40 percent of our food is wasted annually, in part because we fear it’s gone bad. If consumers feel assured that their food is safe, they will waste less. And wasting less means that we can grow less food to feed the same number of people. We’ll also reduce the volume of food waste that goes to landfills.SEMI: What can the MEMS industry do to promote the use of more environmentally friendly materials in its products?Fitzgerald: Some of this is already underway. More companies in our industry are adopting Restriction of Hazardous Substances (RoHS) standards to get rid of heavy metals, such as lead, cadmium or other hazardous materials, in their electronics.We could also produce disposable sensors on paper or on biodegradable plastics, which would decompose within a few months, and we could use safer metals, such as gold, magnesium or zinc, to reduce hazardous metals’ contamination in landfills. While it’s not feasible to make all sensors biodegradable, the market for such sensors could be massive.As companies (and individuals), we should also work hard to design electronics that consume less power, because this ultimately translates to fewer disposable batteries in landfills.SEMI: What would you like MSEC attendees to take away from your presentation?Fitzgerald: I’d like to make two main points. First, the trend to use other non-silicon materials to make MEMS and sensors is real and inevitable. It’s a matter of when. Anyone building a gas or chemical sensor on silicon should look at how to do it on paper or plastic because there are great future applications incorporating flexible, disposable sensors in packaging of all types. That’s the low-hanging fruit.Second, to support this technology development trend, we must look seriously at manufacturing infrastructure because we will need completely different sets of equipment, environments and consumable materials to manufacture MEMS and sensors on paper or plastic. Sensor manufacturers could prepare for this future expansion by beginning to collaborate today with companies that already produce paper and plastic goods. Alissa Fitzgerald, Ph.D., founded A.M. Fitzgerald Associates, LLC (AMFitzgerald), a MEMS and sensors solutions company, in 2003. She has over 20 years of engineering experience in MEMS design, fabrication and product development.Prior to founding AMFitzgerald, Fitzgerald worked at the Jet Propulsion Laboratory, Orbital Sciences Corporation, Sigpro, and Sensant Corporation, now part of Siemens. She received her bachelor’s and master’s degrees from MIT and her doctorate from Stanford University, in Aeronautics and Astronautics. Fitzgerald has numerous journal publications and holds eight patents. She served on the Governing Council of MEMS Industry Group from 2008-2014 and was inducted into the MIG Hall of Fame in 2013. Fitzgerald serves on the Board of Directors of both Rigetti Computing and the Transducer Research Foundation.For more information, please visit AMFitzgerald.MEMS Sensors Industry Group (MSIG), the industry association representing the global MEMS and sensors supply chain, hosts the annual MEMS Sensors Executive Congress. To learn how MSIG enables professionals in the MEMS and sensors industry to innovate, address common challenges and accelerate business results, visit us today.Maria Vetrano is a PR consultant for MSIG, a SEMI Strategic Association Partner.