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In the future, electronics-related gear including advanced driver-assistance systems (ADAS) will account for a whopping 50 percent of automotive costs. More importantly, with more control of vehicles shifting to automation, the margin of error in component performance and reliability will become vanishingly small as zero defects become the new safety standard.SEMI spoke with Antoine Amade, Senior Regional Director EMEA, Entegris about zero defects as a new collaborative approach necessary to shape the car of the future and the automotive industry.SEMI: The next generation of automobiles will be more electric, autonomous and connected. What is the most pressing next step for automotive players to pursue this goal? Amade: The automotive ecosystem faces many challenges. For example, when cars become autonomous, their interaction with the cloud and the massive amount of data computed simultaneously could be vulnerable to cyberattacks capable of seizing control of the vehicle.Another example is the use of artificial intelligence (AI) as there is a big opportunity to explore and define the right architecture while also meeting automotive quality requirements. The quality challenge will be amplified by advanced nodes. Reliability is also critical since 90 percent of device failures are extrinsic, or unrelated to device design. Today, the top priority should be to eliminate latent defects, those that remain undetected until the product is in use. These latent defects may appear at some future point in the life of vehicle – 1 month, 1 year, 10 years, etc. This is the vital focus of the carmaker and the supply chain.SEMI: With in-line metrology tools reaching their detection limits, how will the industry reduce latent defects? Amade: Minimizing latent defects is now a top priority in semiconductor fabs. However, there is a gap between visible and non-visible defects. Although fabs can detect small defects, human intervention is still needed to manage them. We are witnessing a fundamental shift in the contamination control strategy in auto chip production, from contamination control for yield to contamination control for reliability. The shift is born of the recognition that all particles, regardless of size, and parts per trillion (ppt) concentration levels of contaminants matter, impact both defectivity and reliability. Contamination management will play a key role in enabling the industry to reach parts per billion (ppb) failure rates at the component level. SEMI: How will the industry reach the goal of zero defects? Amade: A sound contamination management strategy that follows three main axes of actions will be one key to reaching zero defects: the ambient air in the fab, the wafer’s environment over its lifetime, and the integrity of the materials in the clean chemical delivery pathway.Contamination management in each of these three areas presents opportunities to limit process variability. The first step in limiting variation is detecting it, which can be difficult when the contaminants causing the variation are hard to identify or caused by an unexpected event. When a contaminant signature can be detected, it leaves clues to its root cause. Careful scrutiny of these signatures can inform a contamination control strategy to eliminate the root cause and reduce overall defectivity.SEMI: What collaborative engagement model do you see as the best for reaching zero defects? Amade: Entegris sees the SEMI Global Advisory Automotive Council (GAAC) as the perfect collaboration platform for the entire automotive semiconductor ecosystem, from car manufacturers to material suppliers. Entegris is also a member of the Platform for Automotive Semiconductor Requirement Across the Supply Chain (PASRASC). Both forums help raise the visibility of key challenges and potential solutions.Collaboration starts with agreement on a definition of automotive based on existing standards and guidelines that must be communicated across the value chain. Another important element for collaboration is standardizing on how new materials such as SiC Semiconductors (silicon carbide) should be used. Entegris plays a leading role in contamination management for defectivity reduction through its New Collaborative Approach (NCA) platform, which brings a new level of knowledge sharing to all those involved in detecting and improving defectivity.SEMI: Can you explain the New Collaborative Approach in more detail?Amade: During the SEMI Smart Transportation Forum at SEMICON Europa, we presented the process and tools we have been developing in collaboration with car makers and are implementing with chipmakers as part of our New Collaborative Approach. Our data-driven tools compare current contamination solutions practices and identify optimization opportunities. A good indicator of the maturity of the ecosystem, the tools allow chipmakers to compare the contamination mitigation practices of peers with their own and identify hot topics for advancing contamination management strategies. Every year, during Entegris Technology Days, we share best known methods, case studies, and review fab processes in order to propose customized solutions. It is all about improving defectivity.Mr. Amade joined Entegris in 1995 as an Application Engineer in its semiconductor business. In his current role as EMEA/NA Sr. Director, Mr. Amade is focused primary on growing the semiconductor business in Europe and Middle East through market strategies, and the management of sales, customer service, and marketing teams. Mr. Amade held leadership positions at Entegris in functions including gas microcontamination market management, strategic account management, and regional sales management. Mr. Amade has a degree in Chemical Engineering from ENS Chimie Lille and is a member of the SEMI Electronic Materials Group and the Global Automotive Advisory Council for Europe (GAAC).Serena Brischetto is a marketing and communications manager at SEMI Europe.
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As technology companies worldwide struggle to narrow the yawning gender parity gap, organizations in other industries ranging from insurance and food services to banking have emerged as guiding lights for how to boost the number of women in the workplace. MetLife, the 48,000-employee insurance giant, is among the standouts. In 2015, the New York-based company launched Developing Women’s Career Experience, a 14-month program designed to hone the business and strategic acumen of high-potential female workers. The goal was to increase the sense of urgency to promote women. The program bore fruit, expanding the representation of female managers and entry-level workers to 50 percent. Over the past five years, Sodexo, the French food services and facilities management company headquartered in Paris, has also upped female representation on its list of corporate priorities, expanding the ranks of women in entry and manager roles by 10 percent on average. More impressively, the number of women senior vice presidents has grown 20 percent and those in the C-suite have doubled.Sodexo drove the increases by developing a scorecard to hold managers accountable for diversity and inclusion and tying their performance to total compensation. Fully 10 percent of their bonuses were linked to strides in diversity and inclusion. Leaders at the 470,000-employee company scored points for hiring, promoting and retaining more women and underrepresented groups and could hike the total by taking other steps to improve the work culture by demonstrating inclusive leadership.“We do see companies taking bold actions and are seeing tremendous results,” said Audrey Bernardo, a partner at consultancy McKinsey Company, as she presented the case studies at Diversity – Women in Tech to kick off FLEX|MEMS Sensors Technical Congress (MSTC) 2020 last week in San Jose.And it turns out the payoffs matter not only for the bottom line but also a company’s ability to attract and retain the best talent. Citing research from the McKinsey Company and Lean In 2019 report Women in the Workplace as well as McKinsey’s 2018 Delivering through Diversity, Bernardo noted that gender-diverse companies are 24 percent more likely to financially outperform their less inclusive counterparts, while organizations with higher ethnic diversity are 33 percent more likely to outshine less diverse companies.Younger workers are particularly sensitive to diversity biases. The survey of more 250,000 employees at 600 companies found that employees under the age of 30 are almost two times more likely than older workers to raise the need for diversity and more likely to see bias in the workplace.“Diversity and inclusion has become a business imperative,” Bernardo said. Yet despite the urgency, gains among tech companies in cultivating a diverse workforce have been hard-won in part because of the challenge to better balance the proportions of male and female workers. And the headwinds start to gather when females are young. According to the report, 15-year-old females are vastly outnumbered by boys in their appetite to work in tech fields, with girls 65 percent to 84 percent less interested in pursuing tech careers than boys the same age.That dynamic extends to females in their college years. Despite earning more degrees than men overall, women account for the minority of tech degrees – ranging from as low as 13 percent representation in Chile and 15 percent in Brazil to as high as 45 percent and 36 percent, respectively, in India and Mexico. In the U.S., women account for just 23 percent of undergraduate degrees in tech.Bernardo praised the growing number of companies that are “reaching further down the age pipeline” to inspire young students to pursue STEM educations and careers in tech and cited the work of the SEMI Foundation – through High Tech U and other programs geared toward young students – to inspire the next generation of industry workers.The picture brightens once women have entered careers at technology hardware companies – they are promoted at only a slightly lower rate than men. Yet when it comes to outside hires, women are brought on board at a much lower rate than men. For example, women account for just 22 percent of the senior vice presidents hired at hardware companies, 17 percent of vice presidents, 22 percent of senior managers and directors, and 25 percent of managers.Part of the challenge for women in senior leadership positions is balancing careers with their home lives since they are two times more likely to be in dual-career households than their male counterparts.“We will never solve the women-in the-workplace problem until we solve the women-in-the-home problem,” Bernardo said.Indeed, giving women the leeway to work from home and take time off for family or personal reasons ranked among the power practices the study found most correlated to diversity and inclusion progress. Others include C-level executive participation in shaping a diversity and inclusion strategy, establishing numeric targets for tracking gender representation across the workforce as Sodexo has done, and unconscious bias training. “D I needs to be visible from the top,” Bernardo said.A shining example of executive support for diversity and inclusion initiatives is the work by Atlanta-based SunTrust Bank to encourage workers to embrace differences in people and build awareness of unconscious bias. In 2018, the 23,000-employee company held a daylong event that included workshops focused on candid conversations about gender, race, disability, LGPTQ identity, religion and military service.The Day of Understanding was sponsored by the SunTrust CEO. Within three years, the proportion of employees viewing the SunTrust workplace as inclusive grew to 80 percent, an 11 percent jump.Michael Hall is a marketing communications manager at SEMI.
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For the past several months, U.S. Department of Commerce officials have been developing proposals to amend the foreign direct product rule to require a license for the use of U.S.-origin semiconductor manufacturing equipment or technology in producing semiconductor devices for Huawei and its affiliates. Commerce has also advanced proposals to amend the de minimis rule to expand license requirements for shipments to Huawei and its affiliates of semiconductors produced outside the U.S. and incorporating minimal amounts of non-sensitive U.S. content.The expansion of both rules is among the many Huawei-related actions the administration is pursuing that include a government procurement ban, replacing Huawei equipment in rural U.S. networks, and prohibiting imports of technology and services from unspecified foreign adversary nations. The de minimis proposal was under final interagency review, and the direct product rule next in line for further action, when on February 18 President Trump issued a tweet saying that “The United States cannot, will not, become such a difficult place to deal with in terms of foreign countries buying our product, including for the always used National Security excuse, that our companies will be forced to leave in order to remain competitive.”Speaking to reporters later that day, the president, referring to chipmakers and Huawei, said “I think people were getting carried away with it… Things are put on my desk that have nothing to do with national security.”This week, SEMI President and CEO Ajit Manocha sent President Trump a thank-you letter for his comments and warned that the proposals could severely impact the U.S. and global semiconductor and electronics industries, create confusion and uncertainty in manufacturing supply chains, reduce investment in new capacity, and lead to the design-out of U.S. technology and U.S. components. SEMI also stressed that unilateral controls on U.S.-origin semiconductor devices, equipment, materials and technology could significantly and disproportionately harm U.S. companies, serve as a disincentive for further investments and innovation in the U.S., and impact non-U.S. companies as well. SEMI continues to work with policymakers to build awareness of the damaging and far-reaching effects of these proposals. The 2020 sales forecast for the global semiconductor manufacturing equipment market, excluding the U.S. (since the proposals only directly affect non-U.S. fabs), is approximately $53 billion. With U.S. producers accounting for roughly 40 percent market share, over $21 billion in U.S. equipment sales to non-U.S. fabs could be affected. Non-U.S. companies whose equipment incorporates U.S.-origin components and technology could also be impacted, and every fab worldwide using U.S.-origin manufacturing equipment or technology to produce items destined for Huawei would need to stop their use immediately and file for a license and/or remove U.S.-origin equipment and technology from production lines used for Huawei and its affiliates. The president’s remarks, along with the resignation of two key officials supporting the proposals, have created uncertainty around the next steps. SEMI is holding regular conference calls to keep members up to date and developing strong messages for members to use in their communications with government officials. SEMI Advocacy in Washington remains actively engaged with executive and congressional officials to ensure that U.S. export controls are narrowly tailored to specific national security concerns and applied at the multilateral level with major trading partners.Joe Pasetti is Vice President of Global Public Policy and Advocacy at SEMI.
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The U.S. Toxic Substances Control Act (TSCA) requires the Environmental Protection Agency (EPA) to cost-share risk assessment fees for 20 chemicals designated as high priority across all U.S. manufacturers (including importers) that produce or import at least one of the chemicals including Formaldehyde, Di-ethylhexyl phthalate (DEHP) and Dibutyl phthalate (DBP). Providers of the substances must self-declare as manufacturers or importers under a 5-year look-back requirement.The SEMI EPA TSCA working group formed to assess the potential impact of the self-declaration requirement has uncovered two points of primary concern: 1. Of the 20 substances, about 10 are commonly found in electro-technical components such as capacitors, resistors, transformers and power supplies.2. Companies that import articles (e.g., components and parts) containing any level of these substances, even unintended residue from a production process upstream in their supply chain of imported articles, must self-identify. Manufacturers and importers that self-identify will be required to share the $1.4 million risk-assessment cost per substance. Small business concerns qualify for an 80 percent discount, with larger businesses covering the balance.The EPA has identified a preliminary list of companies that provide each chemical. The number of companies on the lists ranges from two to 525.On January 27, 2020, the EPA opened a 60-day period for organizations to submit comments to the EPA and self-identify as a manufacturer (or importer). SEMI plans to submit comments prior to the March 27 deadline, in part to request an extension.More information is available by visiting the Federal Register or contacting Olivier Corvez. This EPA webpage contains a February webinar transcript that is also a helpful resource.Olivier Corvez is senior manager of Environment, Health, Safety and Sustainability at SEMI.
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As the body’s largest organ, skin is responsible for the transduction of a vast amount of information. This conformable, stretchable, self-healable and biodegradable material simultaneously collects signals from external stimuli, which translates into information such as pressure, pain and temperature. The development of electronic materials, inspired by the complexity of this organ, offers a tremendous unrealized materials’ challenge. Fortunately, the advent of organic-based electronic materials may offer a solution to this longstanding problem.Zhenan Bao, K.K. Lee Professor of Chemical Engineering, Stanford University, is one of the world’s leading researchers working on the design of organic electronic materials that mimic skin functions. SEMI’s Maria Vetrano interviewed professor Bao to preview her February 25 keynote, Skin-Inspired Electronics, at FLEX|MEMS Sensors Technical Congress (MSTC) 2020, February 24-27, 2020, at the DoubleTree by Hilton in San Jose, California.Join us at FLEX|MSTC to meet Professor Bao and other industry influencers furthering innovation in flexible hybrid electronics (FHE) and MEMS sensors. Register now to connect with her at FLEX|MSTC or visit her on LinkedIn.SEMI: Your pioneering work on the use of electronic materials to construct second skin is a major step forward in human-machine interfaces. Could you please describe second skin?Bao: Second skin is a new electronic-device platform encompassing electronic devices that have skin-like properties such as stretchability, self‐healing ability, biocompatibility and biodegradability. In essence, the second skin is an electronic system of fully integrated multifunctional components operating on the surface of or inside the body to enable smart healthcare for disease prevention and treatment and to enhance the functional capabilities of natural skin. The second skin could also serve as a module to connect our human body to the Internet, thereby allowing human integration with the Internet of Things (IoT) for next‐generation wireless communications. In this way, we can view the second skin as an artificial body part that can be used to improve our everyday lives.SEMI: How might second skin operate in the human body?Bao: It has many potential uses. It could be a prosthesis for people who have lost their sense of touch. It could be used to repair damaged skin as well as to provide enhanced functionality that’s not possible with biological human skin. It could, for example, connect us with our external environment, with other people, even with our cars.I can also envision second skin as an implantable device for both neurostimulation and for early detection of disease. Schematic illustration of structure of second skin composed of functional devices: sensor, integrated circuit, display and power supply. Source: Stanford University SEMI: How did you get started in this research? Bao: Sixteen years ago when I started at Stanford, I learned of a colleague in mechanical engineering who was working on robotic cockroaches. That’s when I understood the need for sensor functions in robotics.I considered the large number of people with prosthetics who do not have a sense of touch. With this audience in mind, I started by designing a simple flexible electronic device that could take the shape of skin, even conforming to a robot hand, thereby approximating the natural sense of human touch.Once we developed the first sensor, and realized that its touch sensitivity could eclipse that of human touch, I asked myself: what can we learn from second skin – in addition to its sensing functionality?Skin is not just flexible; it is biodegradable and stretchable. So we started to dream. We began by developing electronic materials, either conductors or semiconductors. We added new functionality, such as self-healing properties, biodegradability and stretchability. That opened the way to new materials’ development.SEMI: What discoveries have you made in new materials?Bao: Over the past decade, we’ve developed skin-like materials with electronic properties that are on par with the best conducting and semiconducting polymers. Some of our skin-like semiconducting polymers can perform even better than amorphous silicon. That means with suitable processing methods, we can make stretchable ICs, initially with tens of transistors that can perform analog or digital functions, and in a later stage, stretchable displays driven by active matrix arrays.SEMI: What would it take to put these materials into production?Bao: We need to develop methods to pattern the skin-like electronic materials into fine features. We have been leveraging similar processes used for flexible circuit boards. Some research groups are developing roll-to-roll fabrication and printing methods.SEMI: Which technologies/applications are you commercializing?Bao: C3Nano is a Bao Research Group spin-off startup that is commercializing nanomaterials that are promising for bendable and foldable electronics.Another spin-off that is licensing our technology, PyrAmes, is developing a continuously non-invasive blood-pressure monitor. It’s not a cuff so the patient doesn’t have to remember to put it on.In the shorter term, we’re looking at putting artificial skin on prosthetic limbs and robotic hands. Further down the road, we could put skin on wounded regions of the body, forging connections to nerves that would support realistic sensation.To realize these applications, we’ll need to conduct further R D on materials and applications. The manufacturing of these devices still needs much more development.Fortunately, we’re part of a fertile development ecosystem at Stanford. I started the Stanford Wearable Electronics Initiative (eWEAR) to forge collaborations across Stanford campus as well as with industry.SEMI: What would you like FLEX|MSTC attendees to take away from your presentation?Bao: I’d like them to realize that the future of electronics is changing. I imagine a future in which the functions of a smartphone will disappear into what we wear, what we attach to our skin and what we implant inside our body. I believe that skin-like electronics will help to facilitate this future, allowing us to connect with each other and our surroundings in ways that feel natural, yet that also enhance our quality of life. Zhenan Bao is K.K. Lee Professor of Chemical Engineering with courtesy appointments in Chemistry and Material Science and Engineering at Stanford University. She founded the Stanford Wearable Electronics Initiate (eWEAR) and serves as the faculty director. Prior to joining Stanford in 2004, she was a Distinguished Member of Technical Staff at Bell Labs, Lucent Technologies from 1995 to 2004.Bao has over 500 refereed publications and over 65 U.S. patents with a Google Scholar H-Index 155. In her recent work, she has developed skin-inspired organic electronic materials, which have resulted in unprecedented performance or functions in medical devices, energy storage and environmental applications. She has pioneered several important design concepts for organic electronic materials. Her work has enabled flexible electronic circuits and displays.For more information on professor Bao’s research, visit Bao Research Group. FLEX|MSTC is organized MEMS Sensors Industry Group (MSIG) and FlexTech, SEMI technology communities focused on the growth of MEMS sensors and the flexible electronics supply chain, respectively. Maria Vetrano is a public relations consultant at SEMI.
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The chip design ecosystem finally has the book it’s been clamoring for: The Fourth Terminal - Benefits of Body-Biasing Techniques for FDSOI Circuits and Systems. [bctt tweet="The FD-SOI Chip Design Book: Yes, It’s Finally Here!" username="@soiconsortium"] The editors (who have also contributed chapters) are Andreia Cathelin, Sylvain Clerc and Thierry DiGilio, all world experts from STMicroelectronics. As Cathelin and Clerc note in the introduction: “The aim of this book is to introduce to the design community the straightforward design solutions in any modern FD-SOI planar CMOS technologies, by taking full advantage of body biasing techniques to efficiently modulate on the fly SoC solutions from high performance operation to energy efficiency mode. All design techniques are based on the classical pillar of regular planar CMOS devices. As the first fully industrial solution has been the 28nm FD-SOI CMOS technology from STMicroelectronics, all the design examples in this book have been demonstrated within this process integration frame.” [bctt tweet="The Fourth Terminal...taking full advantage of (FDSOI) body biasing techniques to efficiently modulate on the fly SoC solutions from high performance operation to energy efficiency mode" username="@soiconsortium"] The folks at ST were really the first to get into FD-SOI in a big way – in fact they’ve been at it for over two decades (!) so you’d be hard pressed to find experts at a company with deeper expertise. [caption id="attachment_29610" align="alignnone" width="535"] The Fourth Terminal team friends sporting Tour de Fourth Terminal t-shirts at ISSCC 2020. From left to right: MIT Prof. (and Series Editor for Springer's Integrated Circuits and Systems) Anantha Chandrakasan; Charles Glaser, Springer Editorial Director; Laurent Le Pailleur, ST; Andreia Cathelin, ST Fellow; Sylvain Clerc, ST; Stanford Prof. Boris Murmann (Photo courtesy Springer STMicroelectronics)[/caption] The Fourth Terminal is structured to cover three major areas: a technology overview (including body biasing for digital, analog and SRAM); a selection of circuits that illustrate body biasing in various fields; body bias deployment in mixed-signal and digital SoCs. The initial response has been tremendous. Editor Andreia Cathelin reports that posts she's made about it on LinkedIn were quickly viewed 10k times and more. Then came the book review by the eminent Stanford Professor Boris Murmann, who heralded its tour de force status in a clever turn of phrase: “With the help of a renowned international team of experts from industry and academia, the editors have distilled everything you need to know about FD-SOI circuit design into a 16-chapter "tour de fourth terminal". (Read his complete review here).[bctt tweet="Stanford Professor Boris Murmann calls this book a #Tour_de_Fourth_Terminal. #FDSOI #lowpower #chipdesign" username="@soiconsortium"] EETimes journalist Junko Yoshida blogged about it as Body Bias Gets Its Own Book (read that here), which generated lively discussions on LinkedIn (and underscored just how necessary this book is!). The Fourth Terminal - Benefits of Body-Biasing Techniques for FDSOI Circuits and Systems is part of the Springer Integrated Circuits Systems Series -- considered by many to be the most prestigious in the industry. Weighing in at 431 pages, The Fourth Terminal is available in both e-book and hardcover versions. See the Springer website to order this must-have addition to your library.
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The recent World Economic Forum event in Davos ranked the unfolding climate crisis among the top three risks companies and governments must address in order to prevent irreversible environmental damage. With the stakes that high, it is becoming critical for organizations of all sizes to take into account climate change risks and opportunities as they develop their strategic and business continuity plans.Two fundamentally different schools of thought have emerged on how to address climate change. On one side, NGOs and climate activists such as Greta Thunberg are pressuring governments to abruptly divert away from fossil fuels, a shift that experts say would exact a deep economic impact. On the other side is the camp that believes capitalism will run its course and ultimately guide public and private entities to find climate change solutions.For their part, organizations are responding to rising pressure from shareholders and stakeholders to disclose their emissions mitigation strategies. The accuracy and completeness of environmental disclosures ranges widely. Some businesses adopt a conservative approach and limit the volume of information made public, while others announce aggressive targets for reducing emissions from their operations and supply chains.Formed 18 years ago, the Carbon Disclosure Project (CDP) has motivated companies (and now cities) to disclose their greenhouse gas (GHG) emissions. In 2019, more than 525 institutional investors representing $96 trillion in assets backed the CDP, whose annual CDP questionnaire is often recognized as the most “comprehensive collection of self-reported environmental data in the world.”As the list of signatory investors supporting the CDP has grown over the years, so has the number of companies responding to the annual CDP questionnaire – from 228 companies in 2003 to over 8,400 in 2019. Company scores are based on 14 disclosure areas such as C-suite level sign-off on the questionnaire content, producing GHG emission data verified by a third party, or publicizing their completed questionnaire on the CDP website. Among all respondents, 179 companies (2%) scored the highest in leadership by demonstrating the strongest commitments to reducing greenhouse gases emissions from their operations and supply chain.Among these 179 companies – referred to as the A-list companies – 10 are SEMI members headquartered in Japan, Taiwan, Korea and France. SEMI applauds these members for ranking among the most progressive companies in disclosing greenhouse gas emissions, an achievement that requires considerable work but puts them in a position of strength in conveying to customers, investors and other stakeholders their commitment to climate resiliency.Olivier Corvez is senior manager of Environment, Health, Safety and Sustainability at SEMI.
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