SEMI has long promoted the industry collaboration that has contributed to the rise of the smart digital world we live in today. A world where data is being generated continuously by systems, gadgets, and sensors around us – often referred to as the Internet of Things (IoT). In our personal lives, most of us have smartphones, smart watches, smart TVs and smart cars, and we live in smart homes and smart cities generating huge amounts of data.In the work world, data and analytics are now influencing almost every industry including healthcare, government, financial services, construction and transportation. This data has the potential to transform our lives and make our world even smarter – if we can communicate and process this data, and use it to come up with actionable recommendations or actions. Artificial Intelligence (AI) and Machine Learning (ML) techniques have generated much excitement precisely because they offer us ways to realize the full value of data by harnessing it and transforming it into active intelligence.Data-intensive technologies are required to store, communicate and analyze data. And it all starts with innovation in microelectronics chips and systems spanning processors, memory, sensors, radios and other devices, presenting a huge opportunity to producers of these technologies. However, with Moore's Law beginning to slow, technology paths and innovation options are diverging. Companies must swiftly assess these options in order to develop competitive offerings. But the technological complexity and divergence makes it increasingly expensive or even unaffordable for many companies to track and pursue these options.The good news is that cost-effective early assessment is possible through pre-competitive collaboration that can produce new and often unexpected cross-disciplinary insights by overcoming traditional silos in industry and academia. Unfortunately, important collaborative industry platforms, such as the International Technology Roadmap for Semiconductors (ITRS), have folded, opening a collaboration gap in the global microelectronics ecosystem.As part of its mission to help companies connect, collaborate, and innovate, SEMI has built a collaborative, cross-supply-chain platform – the Strategic Innovation Platform (SIP). The goal is to provide early and comprehensive assessment of future technologies that are five to eight years away from commercialization. The assessment identifies not just technical barriers but also manufacturing and supply-chain constraints to implementing new technologies. SIP brings together the entire microelectronics ecosystem including strategic technology thought leaders, subject matter experts, technology and application developers, academia, researchers, start-ups and government. With more than 2,100-member companies spread across the global electronics manufacturing supply chain, SEMI is uniquely positioned to enable this critical collaboration. Award-Winning First ProjectThe inaugural SIP project assessed key drivers of future technologies. A key finding was that fast, efficient interconnects between devices and components are critical to the system performance important to customers and users, implying that system-level optimization is required. For data-intensive applications, interconnects have emerged as a key bottleneck for both performance and power in various circuits and systems in part because the slowing of Moore’s Law has decelerated advances in individual device performance, and in part because systems are becoming more complex, requiring heterogeneous integration.To address this challenge, SIP brought together industry experts from ASE Inc., Dow Chemical, Lam Research, Qualcomm and Xilinx to assess the future impact of interconnects for data-intensive applications. SEMI also involved Stanford University professors to collaborate on modeling and simulation. Through this unique cross-disciplinary collaboration, SIP developed a realistic model to evaluate the system-level performance of single-chip systems, as well as multi-chip systems – including traditional 2D packages, high-performance 2.5D systems that use interposers, and futuristic 3D systems. SIP also explored supply chain challenges in business continuity, manufacturability, Environment, Health and Safety (EHS) and the regulatory environment. SEMI worked with a broad range of industry partners to ensure that the model parameters accurately reflected realities on the design and factory floors to ensure usable results. Experimentation has become ever more expensive, with one industry player reporting that “it costs us $100 million to do a good experimental evaluation.” Accurate models can go a long way toward reducing the cost of technology assessment. The SIP collaboration produced key quantifiable insights including comparisons that highlight the benefits and limitations of various materials being explored for future interconnects, and of architectures under consideration for future data-intensive applications. For example, the current workhorse for artificial intelligence (AI) platforms – 2.5D technology – delivers a 4X improvement over 2D packaging but falls short of providing the orders-of-magnitude improvement that future AI/ML applications may require. These findings enable the industry to begin to identify ways to optimize 2.5D architectures, transition to 3D heterogeneous integration for performance-critical applications in the medium term, and to eventually evaluate new paradigms such as neuromorphic and quantum. The project findings were presented late last year in the form of two research papers at Electronics System-Integration Technology Conferences (ESTC) and International Microelectronics Assembly and Packaging Society (IMAPS) recently. One received the “Best Paper of the Session” award at IMAPS – a recognition that affirms the power of a collaborative platform such as SIP to produce valuable insights to address the growing technology complexity within the microelectronics industry. The microelectronics industry is on the cusp of a historic inflection point, where it could fuel the rise of emerging applications in AI/ML and IoT, and can grow into a trillion dollar industry over the next several years. More importantly, the industry is poised to help solve some of society’s most complex problems in areas including healthy living, climate change and transportation. No company can do this alone, and pre-competitive platforms such as SIP are key both to accelerating innovation through cross-disciplinary collaboration, and to reducing costs for individual companies. Please contact Tom Salmon at [email protected] or Pushkar Apte at [email protected] for more details and to get involved in future projects.Tom Salmon is vice president of Collaborative Technology Platforms. Pushkar Apte is a strategic technology advisor at SEMI.

The more than 53,000 people who flocked to SEMICON Korea last month were treated to a motherlode of insight into the future of the semiconductor industry as 470 companies exhibited innovative technologies in more than 2,000 booths. But the annual event’s most arresting numbers came in keynotes and other presentations pointing to the extraordinary industry growth that lies ahead.“It is no exaggeration to say that 90 percent of the world’s data has been generated in the last few years,” said Jim Feldhan, president of Semico Research. “This explosive growth of data is expected to continue. That's why server shipments will grow by 20.3 percent, or 30 million units, this year alone.”Feldhan said that the Internet of Things (IoT) will be a chief driver of semiconductor industry growth, with IoT expected to be applied in areas as varied as automotive, smart cities, edge computers, finance, architecture, agriculture and healthcare. For its part, artificial intelligence (AI) will start to exercise human-like judgment. Feldhan noted that in many instances in these fields, “it is more accurate to apply AI and vision systems than to rely on traditional decision-making.”Yoon Jong Lee, senior vice president of DB HiTek, predicted that the Internet, AI and 5G will drive market growth. “Looking back over the past 30 years, semiconductor market growth was powered by PCs, the Internet and cell phones, yet last year memory accounted for 35 percent of total semiconductor sales, more than double the figure in 2016,” he said. He predicted that, in 2019, the foundry sector will outstrip the semiconductor market in growth, noting that the average growth rate of the semiconductor industry is expected to be 4.1 percent, compared to 7.1 percent for the foundry market. Clark Tseng, director of SEMI, reported that the strong semiconductor growth in 2018 is unlikely to continue in 2019 due to the decline in memory pricing, as well as mobile and PC demand. “Demand for semiconductors is likely to decline in the first half as the industry is still digesting inventory and rebound in the second,” Tseng said. Semiconductor industry growth headwinds include decreases in high-end smartphone purchases, PC demand and demand for DRAMs for servers in data centers, Tseng said. Declines in economic growth and consumption in China and the U.S.-China trade war will also contribute to a slowdown. However, Tseng noted that, over the long term, technology innovation will continue and that the semiconductor industry’s prospects remain bright.One key innovation will be the elimination of AI’s reliance on Internet connections in the future. In his opening day keynote, Eunsoo Shim, senior vice president at Samsung Electronics, emphasized that AI technology that operates without the Internet in the future is essential. “We are developing 'on-device AI' technology that incorporates AI algorithms in products such as smartphones and autonomous vehicles,” he said. "When on-device AI technology is implemented, it reduces reliance on the Internet, battery consumption, and data latency.” Reducing latency will significantly improve device response time.Walden C. Rhines, CEO Emeritus of Mentor, a Siemens business, predicted that AI will fuel rapid memory growth. The memory semiconductor (DRAM, NAND flash) market is expected to see a temporary slowdown this year, with the market expected to rebound in 2020. Rhines said that memory could be seen as an early market with rapid future growth, citing memory market super-booms in 1995 and 2000.“Memory production has not decreased since 1995 or 2000,” he said. “Although memory prices will temporarily fall this year after significant market growth in 2017 to 2018, the market will continue to grow as memory production increases,” he said. Rhines added that “although memory prices will drop by about 10 percent this year, he believes prices will increase 6 percent next year.” He also predicted the steady growth of the non-memory semiconductor market as AI technology matures and China’s investment in fabless companies continues.Indeed, SEMICON Korea speakers made it clear that concerns about the growth of the semiconductor industry are expected to be short-lived. While overall growth is likely to slow in 2019, the industry is expected to rebound steadily – powered by the semiconductor industry paradigm shift led by AI, IOT, and autonomous driving – and reach a new high of nearly $541 billion in 2020.Jaegwan Shim is a marketing specialist at SEMI Korea.

As group vice president of the Analog MEMS Group and general manager of the MEMS Sensor division at STMicroelectronics, Andrea Onetti brings nearly three decades of experience in MEMS, sensors and audio systems to his leadership role at one of the world’s most successful electronics and semiconductor manufacturers. During his keynote at FLEX and MEMS Sensors Technical Congress 2019, February 18-21 in Monterey, Calif., Onetti will address the criticality of sensor accuracy in advancing automotive, industrial and consumer applications. SEMI’s Maria Vetrano spoke with Onetti recently to give FLEX/MSTC attendees a preview of his presentation. SEMI: What are some promising advancements in sensors for autonomous cars? Onetti: The avionics industry is already successfully applying sensors for autonomous operationl. Inertial navigation systems (INS) support the operation of planes during flight, both after takeoff and before landing. Unfortunately, the technology in these navigation systems is expensive and not scalable, and they are hampered by reliability limitations in an automotive environment.Following the steady progress that we have made with MEMS inertial sensors in consumer applications, we are on the cusp of realizing greater accuracy in temperature and time – finally delivering the performance required for autonomous driving. Because we can scale in production – we’re now manufacturing more than a billion units a year – we can select the cream of this production crop for adoption in cars. Consequently, we should see Level 3 and Level 4 autonomous driving for consumers very soon.SEMI: How are companies using sensors to monitor and track their assets in industrial applications? Onetti: Predictive maintenance and asset tracking are the two main verticals in Smart Industry. The adoption of multiple sensors for condition monitoring is helping to detect the faulty operation of equipment and to detect early signs of issues that are otherwise difficult to capture. Ultrasonic microphones can detect leaks in a pipe at an early stage, accelerometers with high bandwidth can act as micrometers, and accurate temperature sensors can catch overheating. Similarly, in asset tracking, we use temperature monitoring in combination with inertial sensors to detect problems during the transport of goods. Shock sensors with extremely high full scale (up to 8000g) can tell whether a lightweight envelop has been dropped. Pressure sensors can switch off a radio system when a cargo plane takes off and can mute smart trackers in compliance with flight regulations. We really can do almost anything! A full slate of ST sensors and microcontroller units (MCUs) enable WEG’s small but powerful motor sensor, which listens to a motor, feels its pain, and shares that information with engineers, operators and others to diagnose problems before they happen. Image courtesy of STMicroelectronics. High-accuracy motion, environmental and proximity sensors are crucial to VR/AR. Image courtesy of STMicroelectronics. SEMI: How will sensors advance user experiences in consumer electronics, such as VR/AR systems?Onetti: Virtual reality (VR) and augmented reality (AR) are great examples of promising consumer technologies that will become pervasive as performance of inertial sensors improves. First, we need super accuracy in time and temperature to provide the right experience to users. To achieve this level of accuracy, we need a major step forward in performance, and that includes power consumption and miniaturization. Fortunately, we are constantly making progress in the high-accuracy motion, environmental and proximity sensors that are critical to these systems. While the scale is vastly different between VR/AR and automotive, the requirements for AR/VR systems are pretty similar to those that will enable autonomous cars. A growing variety of sensors (environmental, microphone, proximity, motion) – combined with a sensor hub in an MCU – are central to VR controllers (above) and VR head mounted displays (below). Images courtesy of STMicroelectronics. SEMI: We don’t hear much about the criticality of higher accuracy in sensors. Why is improving accuracy in sensors especially important – and what role do calibration routines play in achieving higher accuracy?Onetti: A sensor is more than just the performance of the relevant function. It is also the intrinsic accuracy that it brings. This accuracy is tuned by calibration, which is typically an expensive process done at the end of product manufacturing or – better still – during earlier stages of manufacturing.Today more applications require sensors with higher accuracy, which necessitates investing more time in calibration, leading to higher cost.MEMS technology can help by offering solutions with intrinsic higher accuracy, which reduces the cost of calibration for product manufacturers. This naturally delivers major benefits to OEMs and, ultimately, their customers.SEMI: What would you like FLEX and MSTC attendees to take away from your presentation?Onetti: As attendees explore the wide variety of available sensor solutions for their end products, I would ask them to prioritize the role of accuracy in sensor selection – because improved accuracy means higher quality data, and higher quality data means better decisions with reduced need for data processing.While designers understand the role of calibration routines in qualifying individual components for specific applications, it is the continuous evolution of MEMS technology that offers the best possibility of breakthrough reductions in time and cost of these calibration routines. This makes MEMS sensors more attractive and affordable than similar sensor components based on different technologies. Andrea Onetti will present Accuracy Enables MEMS Sensor Pervasion at FLEX/MSTC on Tuesday, February 19 at 11:00 am.Register today to connect with him at the event. To learn more about STMicroelectronics, click here. Maria Vetrano is a public relations consultant at SEMI.MSTC FLEX 2019 is organized by MEMS Sensors Industry Group (MSIG) and FlexTech.Maria Vetrano is a public relations consultant at SEMI.

SEMI’s annual FLEX Conference Exhibition returns to Monterey, California, February 18-21, 2019, bringing together nearly 100 speakers on the major developments at the leading edge of printed/flexible/hybrid sensors and electronics technology.The maturing technology for smarter sensors, in a wider range of flexible formats, is enabling new opportunities across a wide range of applications, from healthcare to agriculture. And that means sensor suppliers need to connect with a broader range of users to build the next generation of innovative outside-the-box solutions. SEMI gathers the flexible/hybrid integration supply chain, leading researchers and potential customers at this annual event to help advance the sector.Collaborative efforts for sensors emerging markets: global health, faster crop development, military monitoringThere’s huge potential for smarter, more accessible sensor systems to detect infectious diseases and aid decision-making for community health workers around the globe, but new technologies and manufacturing methods alone will not be enough to meet the needs of these resource-constrained environments, argues Arunan Skandarajah, program officer at the Bill and Melinda Gates Foundation. He’ll introduce the foundation’s funding and partnering priorities for sensing and imaging for diagnostics and decision support and discuss potential paths forward for development.Recent advances in plant genomics and high-throughput phenotyping have big potential to enable faster development of crop varieties that better withstand adverse conditions – but that will depend on getting fast feedback from sensor data from the field. There’s immediate need for robust, high-efficiency, low-cost sensor technologies to collect on-the-ground microclimate and resource-use data from tractor-based sensors to field scanners, says Nadia Shakoor, Danforth Plant Science Center. She’ll discuss the sensors researchers need to develop high-yielding, energy- efficient crops that are resilient to variable climates.Military interest in biosensor patches to monitor human physiology and performance, and other sensor solutions for flexible imaging and point-of-care diagnostics, are also drivers of collaborative research between industry and universities. The Nano-Bio Materials Consortium (NBMC), a SEMI strategic association partnership with the Air Force Research Lab, will offer a workshop to discuss its potential needs, and how to get involved in its development program to create an integrated suite of nano-bio materials and production technology. Progress in scaling printed/hybrid flexible electronics manufacturing technologyThe maturing manufacturing supply chain continues to make progress towards scaling volume manufacturing of higher performance products, with recent innovations in materials and assembly technologies.Cal Poly researchers will report results from the recent FlexTech benchmark study of the flexible hybrid electronic industry. The study looks at the current state of maturity of the technology, its manufacturing processes, and its main applications while projecting the roadmap for future development. The study covers passives, sensors, batteries, antennas, speakers, PV and energy harvesting, and flexible hybrid integration.Catch up on new process development capabilities and recent work at the NextFlex Flexible Hybrid Electronics Manufacturing Institute’s San Jose Technology Hub for prototyping and pilot manufacturing. The institute has been adding engineers and projects as it looks towards the next generation of technology for sector growth. Innovations in scalable assembly of thin die on flexible substratesSeveral companies will update on recent progress developing solutions for the industrial-scale, high-yield assembly of fragile thinned die on to flexing substrates. American Semiconductor reports new automated assembly capacity for flip chip die attach and interconnect for devices with up to 100 I/Os and 100um pitch pads. The company also notes that it now has flexible Bluetooth ICs from two major suppliers available in semiconductor-on-polymer chip-scale packages, finally enabling improved wireless capacity for flexible hybrid systems.CEA-Leti will present its latest developments in flip chip bonding of thin bare die on flex. It uses gold stud bumps on the die, with 150°C thermocompression bonding to PEN Film. The researchers have also developed a wafer-level die process that thins and encapsulates die before removing them from the carrier wafer. systeMECH will also present its results for direct die placement of 300nm die on flexible polyester. Innovations in materials for easier processing, higher performanceDevelopments in substrates and processing may now enable use of photonics for laser patterning and flash curing on flexible substrates. Brewer Science will report developments on new polymers that can be quickly and cleanly etched with the mid-UV wavelengths commonly used for laser drilling and etching on printed circuit boards, bringing this improved performance to printed electronics as well. The polymers can be processed at less than 200°C with desirable qualities for substrates, adhesives, protective layers and the like for many electronics applications.Novacentrix will update on improvements in photonic curing equipment for fast heating to enable the use of high-temperature solders without damaging low-temperature substrates. Atotech will report results from its multiyear initiative to develop lower temperature solder pastes for better performance than SAC-based materials on a variety of substrates. Printed graphene and carbon nanotubes find applications in sensors and RF devicesBonbouton will introduce its commercial smart insole using a printed graphene sensor to monitor skin temperature to detect early signs of foot ulcers in diabetic patients. The company inkjet-prints graphene oxide followed by thermal reduction to fabricate graphene supercapacitor electrodes for temperature and pressure sensing.C2Sense will update on its development of carbon nanotube gas sensors to monitor food condition to prevent waste. The sensitized carbon nanotubes selectively detect ethylene from fruit or ammonia from chicken to accurately track the condition of the foods as they pass through the supply chain. Georgia Tech will report results of printing not only sensors from carbon nanotube ink but even RF and mm-wave diodes and transistors for high-frequency, long-range, low-cost RFIDs. Innovations in display materialsMaterials for flexible displays continue to see innovations – from solutions for foldable displays to plenty of new options for improved transparent conductive films and force-sensitive films. Solotech will introduce a cross-inked polymer that it says offers both high hardness and excellent foldability as a reliable covering for foldable/bendable displays. Atotech will describe its development of selective electroless copper deposition for metal mesh and TFT electrode patterns for touch screens to eliminate the need for costly mask and etching steps after deposition. Chasm Advanced Materials suggests hybrids of the conductive metals and carbon nanotubes offer a promising alternative for flexible transparent conductive films.C3Nano reports on nanowire ink, fused after printing, for flexible transparent conductors. Peratech will report on its printable pressure touch technology that it describes as high-resolution and low-cost for better localized, force-sensitive touch. Jabil will share the results of its evaluations of five of the available printed force-sensitive sensors. E Ink will introduce new capabilities for its electrophoretic display technology – it’s now possible to write on it with a magnetic stylus, and there’s a variable transmission version for electronic windows. Next generation technologies from universities and startupsResearchers from major research institutions and startups will talk about developments in flexible/printed/hybrid electronics including innovations in biological/electronics interfaces, via skin or neurons, and demonstrations of piezoelectric and better stretchable circuits. Emerging technologies for biosensors and human/machine skin interfaces Georgia Tech researchers will detail their electrical interface with human skin for wireless control of a remote-control car and a wheelchair by electrical signals from the body. They’ve developed a flexible elastomer skin patch patterned with thin film metal/polymer nanostructures made by CMOS processes, and metal pads compatible with conventional reflow soldering. Other Georgia Tech researchers will report their work on better cochlear implants made of encapsulated polymer printed with conductive microcoils for pulsed micro-magnetic stimulation that can focus more tightly on specific areas of auditory neurons. Seoul National University will introduce its flexible organic artificial nerves that can activate an insect’s leg muscle. Researchers there have devised a pressure sensor connected to a ring oscillator that converts the pressure signal into voltage pulses, which are then integrated by a transistor into a signal that replicates a post-synaptic current to communicate with the biological nerves.Epicore Biosystems will report on its advances in manufacturing and packaging technology that enable its skin-interface electronics and microfluidics systems in thin stretchable format to continuously monitor electrical, acoustic and biochemical signals. The technology is now entering commercial development with industrial partners. GE Global Research will update on its field testing of sweat-sensing devices to monitor hydration. Emerging technologies for piezoelectric actuators and improved stretchable sensors and circuits PARC will report on audio speakers made of PVD piezoelectric film on polyimide with inkjet-printed flexible hybrid operating circuits, and Novasentis will talk about its piezoelectric electroactive polymer for different kinds of vibrations for wristband notifications. UTC will share its learnings from deploying large numbers of stretchable flexible hybrid sensors conformably over large areas on aerospace and infrastructure assets to sense temperature, vibration, strain and damage for critical safety.The Air Force Research Lab reports promising results for stretchable circuits made with liquid metals, which maintain their high conductivity even when stretched. Silent Sensors will discuss its printed flexible manufacturing technology for low-cost, stretchable energy storage and piezoelectric energy harvesting for monitoring the condition of automobile tires.By Heidi Hoffman, senior director of technology community marketing, SEMI

For public policy lovers, civic-minded, engaged U.S. citizens, and people around the world interested in the U.S. President’s positions and priorities, the annual State of the Union address (SOTU) is “must-see TV.” This year, the anticipation and expectations were different than with past presidents. President Trump is the first U.S. president who has used social media to the extreme that he has. President Trump’s prolific Twitter feed has had an interesting impact on the SOTU. U.S. citizens and people from around the world already know President Trump’s positions on issues, his policy priorities and what gets him excited. There is an ongoing, direct line to the President’s thoughts throughout each and every day. In the past we looked to the SOTU for insights into what the sitting president is really thinking and his future policy priorities. Now, there isn’t much we don’t already know.One looming question this year was whether President Trump would reach out in a conciliatory manner to help bridge the political divide and lay the groundwork to enable some public policy wins and avoid another government shutdown. While there were moments of conciliation, the President made it clear he would not move on areas that are most contentious with the other side of the aisle. For example, the President unequivocally reiterated his intent to build the wall. While the message plays well to his base, it is, in effect, a frontal assault and challenge to Democrats. It’s hard to image that his staunch stance will help move the two parties to work together on substantive policy issues. It may also mean that the wall issue will occupy lawmakers time for the foreseeable future, sidelining debate on other important issues.The best hope is that a bipartisan bill finds its way to the President’s desk that he can sign and use to “declare victory.” However, many political observers believe the likelihood of the President declaring a national security emergency is rising as a maneuver to ensure funding for the wall and avoid a shutdown. While such a declaration would most likely face a court challenge, the President could claim that his decision was a move of last resort and leverage the moment to position Democrats as obstructionists to his base. The scenario does not bode well for the bipartisan support necessary to address other issues.What does this mean for our industry? Were there any points raised in the SOTU that would signal a change in what we are facing regarding trade, tariffs, export controls and immigration? Were any new issues or ideas raised that could help lift the global economy? In short, no. On one hand, the President cited his good relationship with the president of China, but on the other doubled down on his attacks on China, seeming to stand firm to bolster his position at the table as the U.S. and China trade talks continue.What do these dynamics mean for SEMI Global Advocacy? In 2018 we were heavily engaged in efforts to prevent regulations that would inhibit our members' ability to develop and deploy technologies and maintain global market access. We advanced our global advocacy model, leveraging our regional presence around the world. Many of the potential issues we faced emanated from the U.S., including those focused on controlling technology development, limiting trade and enhancing export controls. We also intensified our efforts to address industry talent pipeline issues.In 2019, our public policy focus will be to continue to push back on tariffs, engage members to inform the rule-making process for export controls and to attempt to influence the immigration debate as it pertains to access to talent. In addition, while the U.S. R D tax credit was made permanent through the tax cut in 2017, some of the provisions may have unintended consequences and will need to be modified. How the law is enacted will affect how businesses can deduct qualified research and development and other expenses from their taxable income, so we anticipate activity on the tax front as well.It will also be a big year for SEMI on the workforce development front. SEMI will continue to grow its existing High Tech U (HTU), university and mentor programs. In addition, SEMI will be positioning itself as the global leader in addressing issues related to the talent pipeline by approaching the problem with a full-spectrum, holistic approach that is intended to better address more immediate needs in attracting, training and retaining qualified talent. We’ll also focus on improving the industry image and exciting students at a younger age by providing experiential learning activities throughout a defined educational pathway. Stay tuned on this front as the full program unfolds.In general, we will continue to build our relationships and stature as a leading voice for our members and the end-to-end semiconductor supply chain in the areas of talent, trade, tax and technology (SEMI’s “4 Ts”) and to ensure free and fair trade, access to markets, supply chain growth, IP protections and enhanced efforts to improve cybersecurity. Mike Russo is VP of Global Industry Advocacy at SEMI.

With over 25 years of experience in the technology industry, Sri Peruvemba, CMO of CLEARink Displays, is a longtime advocate of electronic display technology. During his presentation at FLEX and MEMS Sensors Technical Congress 2019, February 18-21 in Monterey, Calif., Peruvemba will explain recent innovations in electronic paper (ePaper) that will open new applications to reflective displays for the first time. SEMI: ePaper has been around for more than a decade. How has it evolved for wearables and mobile devices?Peruvemba: ePaper in its current form provides a reflective display that is low power and sunlight-readable to applications such as eReaders and electronic shelf labels (ESLs), both of which are in mass production. There is a much larger opportunity, however, for reflective displays that offer color and video atop the traditional benefits of ePaper. Now possible through electrophoretic total internal reflection (eTIR) – which we have termed ePaper 2.0 – is a low-power technology that allows devices to work for days instead of hours. eTIR offers sunlight readability as well as full color and video-level switching speeds, which satisfies the diverse requirements of wearables and mobile devices.New electrophoretic total internal reflection (eTIR) display technology uses the charged particles in a fluid to modulate the total internal reflected light from the optical structures incorporated into its novel reflector film. Image courtesy of CLEARink Displays. SEMI: How do you define a “reflective display?”Peruvemba: A display that reflects external light to its advantage is a reflective display. This includes the display that uses ambient light rather than a backlight and one that uses the sun rather than fights it.SEMI: Where is there a larger opportunity for reflective displays that offer color and video over the traditional benefits of ePaper?Peruvemba: While most of us are familiar with ePaper in applications such as eReaders and wearables that need sunlight readability, there is an untapped market in the wearables space for applications that require internet browsing and color, even video, displays. ESLs are a good example. Retailers are no longer content to show prices. They also want to show specials, display color ads, and run video and animation to enhance product differentiation. Displays in tablets, digital signage and automotive are additional targets.SEMI: How large is the opportunity?Peruvemba: The electronic display industry has been trying to build reflective displays that are low-power color and video for many years but without success. Hence, the opportunity is in the tens of billions of U.S. dollars in outdoor signs, automotive displays, tablets, wearables, shelf labels and dozens of others products.SEMI: What will it take for manufacturers to migrate from LCD or OLED to eTIR?Peruvemba: The good news is that implementation is pretty much the same as with the LCD or OLED displays currently in use. The interfaces, connections and form factors remain form-, fit-, function-compatible. Only the software/waveforms and drive voltages will change/reduce. This allows the manufacture of our tech., ePaper 2.0, on the old LCD lines that are already in use. You can literally go back and forth between ePaper 2.0 and LCD on a day-to-day basis. This differs from other eTIR implementations, which require new dedicated manufacturing lines that cost tens to hundreds of millions of dollars.SEMI: Are there other emerging markets that are particularly well-matched to eTIR?Peruvemba: Tablet devices designed for long use on a single charge, mobile devices including wearables for outdoor applications, Internet of Things (IoT) devices that need high ambient readability, and very low-power and unobtrusive displays in home or office settings represent other emerging markets.SEMI: What technical obstacles have hindered ePaper in certain markets – and how do you overcome those obstacles?Peruvemba: Bringing a display technology to market is not only about solving technical and process hurdles. It is also about finding the right one percent of the applications that your technology can uniquely address. Success requires developing the ecosystem of subcomponent suppliers and peripheral technology providers (like touch and front lights). Partnering with the display fabs that can mass-produce your technology is another important step.With most emerging technologies, the pursuit of the right customer is the bigger challenge, but for us it has been getting the product into production. Fortunately, we already have customers that have invested in the company and have committed to product volume, so they get early access to our technology.SEMI: What would you like FLEX and MSTC attendees to take away from your presentation?Peruvemba: Now just months away from deploying our eTIR technology as ePaper 2.0, we welcome partnership inquiries as we seek to implement eTIR across a range of previously unserved and underserved display markets.Sri Peruvemba will present ePaper 2.0 — Creating New Markets at FLEX/MSTC on Tuesday, February 19 at 2:45 pmRegister today to connect with him at the event. To learn more about CLEARink Displays, click here. MSTC FLEX 2019 is organized by MEMS Sensors Industry Group (MSIG) and FlexTech. Maria Vetrano is a public relations consultant at SEMI.

Critical subsystems for the IC equipment market continued to grow to a new record of $11 billion in 2018. While 2019 is expected to be a downturn year, the long-term outlook remains unchanged with an average growth rate of 3 percent. Last year may have been a new high for revenues, but it will be remembered as a year of two parts: record quarterly revenues in Q1, followed by rapidly falling orders in Q3 and Q4. Normally, this would not be a problem as suppliers are used to managing volatility in their businesses. However, encouraged by solid end market drivers and optimistic customers, the timing of this downturn was particularly bad as it coincided with the addition of significant new manufacturing capacity for critical subsystems that will be needed to supply the industry into the next decade. The resulting step change in costs against the backdrop of falling revenues has put strain on the financials of these suppliers. Although current visibility is poor, the order decline appears to be stabilising and the worst is nearly over. Revenues are expected to recover in the second half of 2019 followed by a promising outlook for the following three years. Critical Subsystems for IC equipment history and forecast to 2022. After a pause in 2019, the trend is expected to continue to reach new industry records. Suppliers of subsystems used in vacuum process tools, such as deposition and etch, have benefited the most from critical subsystems growth since 2012. Vacuum intensity of semiconductor processing continues to grow and in 2018 the value of vacuum process tools exceeded the value of non-vacuum process tools for the first time. This trend is expected to continue with vacuum based semiconductor process equipment accounting for over 60 percent of wafer fab equipment revenues by 2023. In summary, 2019 is expected to be down 10 percent to 20 percent as the industry digests the recent large additions to semiconductor manufacturing capacity, followed by a new cycle starting in 2020.Julian West is a technical and marketing analyst at VLSI Research Europe.

Photo on left: My Skin Track pH by L'Oréal Group’s La Roche-Posay – the first wearable sensor and companion app to easily measure personal skin pH levels – leverages two decades of microfluidic and soft materials research in Professor John Rogers’ laboratory at the Center for Bio-Integrated Electronics and the Simpson Querrey Institute. As director of the Center for Bio-Integrated Electronics at Northwestern University, Professor John A. Rogers explores soft materials for conformal electronics, nanophotonic structures, microfluidic devices and MEMS, all with an emphasis on bio-inspired and bio-integrated technologies. During his keynote at FLEX and MEMS Sensors Technical Congress 2019, February 18-21 in Monterey, Calif., Rogers will present examples of the diverse, novel classes of biocompatible electronic and microfluidic systems with skin-like physical properties that stem from his work in materials science, mechanical engineering, electrical engineering and advanced manufacturing. SEMI’s Maria Vetrano caught up with Rogers to discuss his research, which has already been commercialized by companies such as L'Oréal Group.SEMI: What is the concept behind skin-interfaced electronic and microfluidic devices?ROGERS: Biological systems are mechanically soft, with complex, time-dependent 3D curvilinear shapes. Modern electronic and microfluidic technologies are rigid, with simple, static 2D layouts. We believe that eliminating this profound mismatch in physical properties will create vast opportunities in microsystems technologies (electronics, optoelectronics, microfluidics and microelectromechanical devices) that can intimately integrate with the human body for diagnostic, therapeutic or surgical functions. Skin-like devices that assess blood-glucose levels in real-time or continuously monitor the vital signs of infants in neonatal intensive care are just two examples of non-invasive, wirelessly connected biocompatible devices with the potential to dramatically improve quality of life.SEMI: What are some examples of commercially available biocompatible/microfluidic wearables that have leveraged your research?ROGERS: We’ve been fortunate in that we have been able to translate some of our ideas into commercial products for broad deployment in both life-enhancing and potentially life-saving applications. In sports and fitness, our skin-interfaced microfluidic systems form the basis of soft devices that capture, store and perform in-situ chemical analysis of sweat. These devices have been launched as products in two different categories – cosmetics and athletics – with two global brands. As an example of the former, L’Oréal Group just unveiled at CES 2019 My Skin Track pH, a thin, flexible version of this technology, designed to determine skin pH from measurement of sweat pH. Once armed with this information, L’Oréal customers can choose skincare products matched to their personal body chemistry. See the video on this device. Notably, a globally recognized consumer brand will reveal a product for athletics around the time of the 2019 Super Bowl on Sunday, February 3. A look inside My Skin Track pH, which uses Rogers Research Group technology from the Center for Bio-Integrated Electronics at Northwestern University Our technologies also have applications in clinical medicine and rehabilitation, including soft, skin-interfaced wireless sensors used to assess patient progress in stroke rehabilitation. In contrast with conventional, wired sensors that tether the patient to external boxes of electronics (a design that makes such devices impractical for in-home use), or conventional wearables that are confined to the wrist, our systems apply to the skin like a BAND-AID, and are described as “imperceptible” by stroke patients who are using them during rehab. These platforms measure speech, swallowing capability, movement of limbs, sleep quality, walking and balancing. Healthcare professionals can use the information collected to continue to monitor patients when they leave medical facilities, to understand how patients function in the real world. See video.SEMI: What work are you doing beyond flexible devices?ROGERS: We are pursuing devices that are unique not due to their soft mechanics, but due to their extremely small sizes. A good example is My Skin Track UV, which we recently commercialized with L’Oréal’s La Roche-Posay. This millimeter-scale, wireless, battery-free platform for digital UV dosimetry measures UV exposure dose continuously in real time and provides user access to this information via a smartphone app. My Skin Track UV is now available at all Apple stores across the U.S. and through the Apple website. See video. L’Oréal’s La Roche-Posay My Skin Track UVOther biocompatible/microfluidic devices based on our technology provide functionality that can save lives. Hydrocephalus patients suffer from a condition that, if unchecked, leads to excessive buildup of fluid in the brain. If left untreated, the resulting pressures can prove fatal.Hydrocephalus is treated with shunts, which drain accumulated fluid away from the intracranial space to a distal part of the body, often the abdomen. Unfortunately, however, shunts have a nearly 100 percent fail rate over a 10-year period, and testing them typically requires an MRI, CT scan or even surgery. Our technology serves as the basis of a bandage-sized, skin-like sensor that applies to the surface of the skin on the neck. Within five minutes of placement on the skin, the sensor can test non-invasively to determine if fluid is flowing through the shunt. The net result uniquely supports the rapid evaluation of shunts from home or other non-medical settings. The devices free patients from the constraints of hospitals, giving them a greater sense of security and independence. See video. SEMI: What would you like FLEX and MSTC attendees to take away from your presentation?ROGERS: I would like attendees to know that biocompatible microfluidic and electronic wearables that are flexible and conformal to the human body are no longer risky futuristic technologies that exist only in academic labs: They are emerging right now as key products in commercial markets for flexible hybrid electronics (FHE) and MEMS/sensors. Our group alone is anticipating deployment at the scale of tens to hundreds of millions of units in the markets in which we are seeing traction over the next five years. We believe that the broader area will become a multi-billion-dollar market opportunity in five to 10 years.John Rogers, Ph.D. will present Soft Electronic and Microfluidic Systems for the Skin at FLEX/MSTC on Tuesday, February 19 at 10:30 am.Register today to connect with him at the event. To learn more about Rogers Research Group, click here.MSTC Flex 2019 is organized by the MEMS Sensors Industry Group (MSIG) and FlexTech.Maria Vetrano is a public relations consultant at SEMI.

STMicroelectronics is now sampling 28nm FD-SOI microcontrollers (MCUs) with embedded non-volatile memory (eNVM) based on ePCM to alpha customers. Field trials meeting the requirements of automotive applications and full technology qualification are expected in 2020. These MCUs—the world’s first to use ePCM, which stands for embedded Phase-Change Memory—will target powertrain systems, advanced and secure gateways, safety/ADAS applications, and Vehicle Electrification. (Read the full press release here.) [caption id="attachment_14593" align="alignright" width="300"] A cross section of the embedded-PCM bitcell integrated in the 28nm FD-SOI technology shows the heater that quickly flips storage cells between crystalline and amorphous states. (Courtesy: STMicroelectronics)[/caption] “Having applied ST’s process, design, technology, and application expertise to ePCM, we’ve developed an innovative recipe that makes ST the very first to combine this non-volatile memory with 28nm FD-SOI for high-performance, low-power automotive microcontrollers,” said Marco Monti, President Automotive and Discrete Group, STMicroelectronics. “With samples already in some lead-customers’ hands, we’re confirming the outstanding temperature performance of ePCM and its ability to meet all automotive standards, further assuring our confidence in its market adoption and success.” ePCM presents a solution to chip- and system-level challenges, meeting automotive MCU requirements for AEC-Q100 Grade 0, operating at temperature up to +165°C. In addition, ST says its technology assures firmware/data retention through high-temperature soldering reflow processes and immunity to radiation, for additional data safety. Architecture and performance benchmark updates were presented the most recent IEDM (December 2018 in San Francisco) in a paper entitled Truly Innovative 28nm FDSOI Technology for Automotive Micro-Controller Applications embedding 16MB Phase Change Memory (F. Arnaud et al). As of this writing, the IEDM 2018 papers are not yet posted on the IEEE Xplore Digital Library site. However, the ppt that ST presented at the conference is available here. For more in-depth information on ePCM, see the ST PCM page. To learn more about how it compares with competing technologies such as eMRAM, read Embedded Phase-Change Memory Emerges by Mark Lapedus of SemiEngineering. Papers describing other eNVM solutions on FD-SOI were also presented at IEDM 2018. Samsung's is entitled Demonstration of Highly Manufacturable STT-MRAM Embedded in 28nm Logic (Y. J. Song et al). GlobalFoundries' is entitled 22-nm FD-SOI Embedded MRAM Technology for Low-Power Automotive-Grade-1 MCU Applications (K. Lee et al).

RITdb is a semiconductor manufacturing database project organized as a Working Group under SEMI’s CAST (Collaborative Alliance for Semiconductor Test) Technology Community. Originally, RITdb was the “Rich Interactive Test Database” and the original goal was to create a shared architecture that supports smart adaptive testing for semiconductor makers by providing ready access to integrated, consistent, easy-to-use data across the entire manufacturing and test process. Figure 1 illustrates this process for making integrated circuits and how RITdb will collect data from the entire manufacturing flow. Figure 1: Manufacturing Flow for Making Integrated Circuits RITdb’s end goal is to enable access to any sort of manufacturing data across the life of a product from inside or outside of the factory that made the product.Adaptive test has two scopes: The Historical Scope: Make disparate data obtained from many different sources available on demand while dealing with issues of sharing, trust, and data security amongst all database users. The Immediate Scope (Now): Enable real-time decision making about processes and parts moving through the manufacturing process based on process history, results, and feedback. Figure 2 illustrates a manufacturing flow that takes advantage of the RITdb database to make real-time decisions based on test results for devices as they move onward from the immediately preceding process step and from rules that have been developed over multiple manufacturing runs using previous test data in the historical manufacturing record. Figure 2: Real-Time Manufacturing Flow that Makes Decisions based on RITdb data. Image Source: IEEE Electronics Packaging Society HIR (Heterogeneous Integration Roadmap) One of the development issues that the CAST RITdb Working Group has wrestled with is how to make data as easy to extract from the database as it is to put into the database. Many previous manufacturing database development efforts have stumbled over this goal, yet it’s imperative that data be easily accessible if it’s to be used for real-time decision making.The end goal is for RITdb to become an “interplanetary” file system, which means that the database should be distributed over both time and distance. It should be available everywhere it’s needed. In addition, the data in the database has attached metadata to permit content-aware access. The metadata allows a data-consuming application to extract just the data it needs from the database, which reduces the amount of traffic over the manufacturing networking system and speeds database transactions.Further, the database must maintain data integrity, which means that it uses hash-based naming and immutable files to make the data easy to find, so that the data-consuming application knows that the data it obtains from the database is correct, and to prevent data deletion. The database must also be secure, with access controls and encryption to protect data. Finally, the RITdb database employs versioning so that any changes made to the database can be easily tracked and traced over time.RITdb GoalsThe RITdb project has been driven by several goals: Enable plug-and-play database access so that many types of testing tools can feed data into the database in support of diverse test and manufacturing applications. Support generation of and access to real-time streaming data as well as to data previously stored in the database. Allow data from different producer tools to be merged, synchronized, and then delivered to data-consuming applications. Permit new data types to be easily added to the database without adversely affecting the existing database model. This goal allows new data types to be added to the database even before there’s an idea of how to use this new data. Integrate cleanly with the Adaptive Test Model. The Data in the LakeTo meet all of these objectives, RITdb employs a “data lake” instead of a “data-warehouse” model. The data-warehouse model is a more traditional “big data” approach to databases where data is cleaned and normalized when it’s imported into the one, large database. A database using the data-lake model stores a pool of disparate but related data, which is cleaned and normalized at the point of creation. This approach better serves the goals of the RITdb database project by allowing real-time decision making based on prepared, good data with provenance.Data provenance encompasses many data characteristics that require answers to many questions regarding: Identity: What is this data? Integrity: Who created this data, where was this data created, and is this truly the data that was created? Security: Who can access this data? Locality: Is this data grouped with other data based on some characteristic? Lineage: Where did this data come from? In addition, RITdb incorporates other features to satisfy the “Now” scope. It supports a streaming data-flow model using RITdb packets and events. It uses a real-time messaging infrastructure based on IOT bidirectional, machine-to-machine communications and the MQTT (Message Queuing Telemetry Transport) protocol, an ISO standard (ISO/IEC PRF 20922) for publish-and-subscribe messaging, and the CBOR (Concise Binary Object Representation, a serialized, binary data format loosely based on JSON) format for payload data within the messages. Finally, the RITdb streaming protocol permits real-time rules checking so that an application program can look at data streaming in from a test cell and make real-time decisions based on that data.Currently, planned submission for RITdb specification to SEMI for balloting is scheduled for 1Q19. To learn more about the SEMI CAST Technology Community, its RITdb activity, and/or to engage in this effort, please contact Paul Trio, senior manager of Strategic Initiatives) at SEMI, at [email protected] Ajouri is a systems integration engineer at Texas Instruments.