３D-ICやチップレットが注目を浴びる中で、半導体前工程・後工程の設計領域において新たな技術革新や設計環境が求められています。ADISでは、半導体前工程、後工程の設計・検証・解析ツールを提供するEDAベンダーと、ユーザを代表する団体・企業が参加し、新たな時代に相応しい設計環境について交流や情報交換を進めていますSEMICON Japan 2024に向けてADISによる展示や講演、パネルディスカッションなどを予定していますので、その概要を紹介します。
14:20 ｜ SEMI Market Outlook - Semiconductor Equipment Forecasts, Fab Investment, and Material Market Outlook
Clark Tseng SEMI Market Intelligence Team Senior Director
The 2024 semiconductor industry is poised for a robust recovery as inventory levels normalize and key end markets rebound. Strong demands for AI and memory chips will drive growth momentum into 2025. SEMI remains optimistic about the medium to long-term growth prospects for semiconductor revenue to reach $1 trillion in the early 2030s.
Beyond 2024, the semiconductor industry will continue to evolve with new technologies such as new transistor architecture and advanced packaging solutions. These innovations will drive further investment in semiconductor equipment and materials, ensuring sustained growth. The global diversification of semiconductor manufacturing will also play a crucial role in stabilizing supply chains and meeting the growing demand.
In this presentation, we will discuss the latest capital equipment forecasts by region and key segments. We will also explore the fab investment outlook by region and capacity growth projections through 2027. Furthermore, we will examine the global diversification of semiconductor manufacturing and its impact on supply chain dynamics. Finally, we will share SEMI’s latest forecasts on wafer fab materials.
Yole Intelligence
SEMICONDUCTOR, MEMORY AND COMPUTING DIVISION
Technology and Market Analyst
Technology and Market Trends of High-End Performance Packaging as the Fastest Growing Advanced Packaging Platform
Advanced Packaging has become extremely important when it comes to follow the More than Moore trend ensuring high performance integration and functionality to continuously growing in complexity dies resulting in device performance and bandwidth increase. It allows also to compensate the rising costs associated to front-end manufacturing by making possible chiplet and heterogeneous integration. High-End Packaging with 2.5D & 3D integration is expected to be the fastest growing platform reaching $16B by 2028. Foundries and IDMs are leaders for 2.5D & 3D packaging solutions but OSATs are following this trend as well. Hybrid bonding with wafer to wafer, die to wafer approach is the hot topic technology breakthrough as it allows to achieve 10μm fine pitch and less. This enables denser 3D IC stacking of logic or memory dies, the interconnection of partitioned SoC dies and heterogeneously integrated packages. What is Yole’s definition for advanced packaging and for high-end performance packaging? From technology to market, an overview of innovations, applications, players & markets will be shared and debated to shed light on these questions and on 2.5D and 3D packaging impact on industry.
