Clark Tseng SEMI Market Intelligence Senior Director
「AI Demand Meets Semiconductor Reality Global Market Growth, Fab Investment, and Capacity in the Next Industry Cycle」
Artificial intelligence is accelerating semiconductor demand and driving a new cycle of investment in leading-edge logic, advanced memory, packaging, and manufacturing infrastructure. At the same time, market growth remains uneven, with AI-related technologies expanding rapidly while many consumer and traditional end markets recover more gradually. Using SEMI’s latest semiconductor market, fab investment, equipment, and capacity forecasts, this presentation will examine how AI demand is translating into manufacturing investment across key device segments and regions. It will highlight changes in the global capacity mix, the concentration of spending in advanced logic and memory, and the increasing importance of packaging, test, and supply-chain execution. The discussion will also consider implications for the global equipment and materials ecosystem, including Japan’s important role in manufacturing technology, specialty devices, equipment, materials, and supply-chain support.
「Technology Roadmaps in the Semiconductor and Material Trend」
The presentation outlines semiconductor technology roadmaps, focusing on logic, NAND, and DRAM advancements. It highlights the shift from FinFET to GAA and CFET architectures, enabling better performance and power efficiency. New materials like molybdenum, ruthenium, and HZO, along with processes such as ALE, ALD, and cryo etch, are driving innovation. 3D scaling and backside power delivery are key trends. ESG concerns and geopolitical risks impact material supply chains. Scenario planning and survey data assess future challenges. The conclusion emphasizes the importance of material innovation and risk management for high-volume manufacturing and sustainable growth.
