Coronavirus

As part of bi-weekly meetings of the SEMI Environment, Health, Safety and Sustainability (EHSS) community to share information on the impacts of the pandemic, the EHSS COVID-19 Working Group recently revealed that companies are offering PTO to employees to get vaccinated.

Considering the history of computing and the low expectations for women that were once widespread in academia and the workplace, little wonder that women continue to face significant hurdles in the microelectronics industry. Today, women make up less than 25% of the computing workforce.

As monolithic scaling slows down, the semiconductor industry is increasingly relying on advanced packaging technologies to extend Moore’s law through heterogeneous integration. Higher on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries are driving demand for advanced packaging technologies that address these issues but introduce challenges of their own such as efficient power delivery to all the different domains in a heterogeneous system. SEMI spoke with Kaladhar Radhakrishnan, Intel Fellow at Intel, about heterogeneous system integration trends and new developments in the semiconductor industry. Radhakrishnan shared his views ahead of his keynote at the SEMI Connecting Heterogeneous Systems Summit, 1-3 September 2021, an online event. Join the summit to meet experts from Intel and other key industry influencers. Registration is open. SEMI: What is driving the adoption of electronics and semiconductor devices nowadays and why is the development of new and innovative technologies important? Radhakrishnan: We are living in an increasingly data-driven world where devices have become an integral part of our lives. A recent study estimated that in the United States alone, 13.6 connected devices per capita consume an average of 300 gigabytes worth of data every month. In the workplace, COVID-19 has driven fundamental business changes that has sped up the adoption of digital technologies such as virtual conferencing, remote work, and e-commerce. Organizations are realizing that a high-quality video conference can be an adequate substitute for many in-person meetings. As a result, businesses are accelerating the digital transformation in order to adapt and thrive in this new environment. Five decades of sustained exponential growth in semiconductor performance has conditioned the average digital consumer to expect more from their devices. However, there are some headwinds ahead as traditional scaling slows down and power density rises. Because consumers and businesses are now generating data at a faster rate than they can consume it, technologists need to scale compute, storage, and bandwidth even faster to keep pace. Without investments in research and development of new and innovative technologies to address these challenges, the full potential of this data will go unrealized. SEMI: What forces are heightening the importance of heterogeneous system integration? What are the implications for increased on-package bandwidth, improved yield resiliency and the need to integrate diverse IP from multiple foundries? Radhakrishnan: The semiconductor industry increased transistor density and scaled performance through classical Dennard scaling until the turn of the century. By then, the gate oxide thickness had scaled down to atomic dimensions and the exponential increase in sub-threshold leakage signaled the end of scaling through traditional methods. Since that time, the chip industry has been relying on innovations in transistor materials and structures such as high-k metal gate, strained silicon, and FinFETs to keep pace with Moore’s law. However, this alone will not be sufficient to continue scaling and the industry needs to explore other vectors to augment improvements in transistor technology. Heterogeneous integration through advanced packaging is one key technology that can help drive these gains. Technologies like Foveros can enable device density scaling by creating a 3D stack of multiple die using high-density interconnects. Heterogeneous integration enables chipmakers to move from a monolithic system designed on a single large chip to a heterogeneous system comprised of a number of smaller chiplets. The main benefit of using smaller chiplets is that they improve yield and enable application based customization of the foundry processes. However, if the disaggregation to smaller chiplets is not accompanied by an increase in on-package bandwidth, the power and performance penalties associated with chiplet-to-chiplet communication will hobble system performance. This is why advanced packaging technologies that improve die-to-die communication are key enablers for heterogeneous integration. SEMI: What are some of the key technology challenges in developing heterogeneous systems? Radhakrishnan: The obvious challenge that most people focus on is the need for improved on-package bandwidth. However, as we rely on 3D stacking to continue device scaling at the package level, it is important to comprehend power delivery and thermal challenges as well. Power to the top die has to be delivered through TSVs on the bottom die, which not only adds resistance but also reduces the useful area available on the bottom die. This problem is further exacerbated when we stack more than two die. Excessive noise on the power delivery network can cause timing issues that limit the maximum operating frequency of the transistor. Similarly, when we stack multiple die, we must take into account associated thermal challenges. For example, each interface of the multi-die stack adds thermal resistance, which makes it harder to cool the chips at the bottom. SEMI: What are some of the key global market trends that driving demand for heterogeneous and system-level integration? Radhakrishnan: The number of artificial intelligence (AI) and machine learning applications have grown dramatically due to their ability to solve highly complex problems across a wide range of segments. AI and machine learning models require more memory bandwidth and compute capabilities that are difficult to achieve without some form of heterogeneous integration. Another market trend driving demand for heterogeneous integration is the increasing reliance on custom hardware accelerators. To combat the slowdown in frequency scaling and single-core performance, we have moved to multi-core architectures by tackling the inherent parallelism in our workloads. However, Amdahl’s law tells us that such an approach will hit a bottleneck when we reach the limits of the serial portion of the workload. As these constraints slow the performance of general-purpose processors, the reliance on custom hardware accelerators to boost performance for specific workloads is growing. Heterogeneous integration at the system level with a combination of CPUs, GPUs, FPGAs and other accelerators can optimize system power and performance. SEMI: What solutions is Intel developing to address these market needs? Radhakrishnan: Intel is actively involved in the development of the industry ecosystem for heterogeneous integration. We have developed a number of innovative advanced packaging solutions such as the EMIB and Foveros that are used in products today. Intel is also developing the next generation of advanced packaging technologies, Foveros Omni and Foveros Direct, which will dramatically scale the IO density by using direct Cu-Cu bonding technology. Foveros Omni is a crucial building block technology to enable high-voltage power conversion on the package for efficient power delivery. Intel is uniquely positioned to predict the design needs for future systems and deploy its resources to develop the technology building blocks needed to continue performance scaling. Our IDM 2.0 strategy enables us to leverage our leadership in packaging technologies to design the best products and use the best IP to deliver leading products across a broad range of categories. SEMI: What do you expect from your participation at SEMI Connecting Heterogeneous Systems Summit? Radhakrishnan: I’m hoping to shed some light on some of the new technologies we have been developing at Intel to enable heterogeneous system integration. I also want to bring awareness to the power-related challenges we are facing with heterogeneous systems. I also look forward to listening to what other industry leaders have to say on the topic. Kaladhar Radhakrishnan is an Intel Fellow and a Power Delivery Architect with the Technology Development group at Intel. He plays a significant role in shaping and driving power delivery technologies for Intel microprocessors. His areas of expertise include integrated voltage regulators, advanced packaging and passives technologies. Kaladhar is a two-time recipient of the Intel Achievement Award, the highest Intel honor an individual or small team can receive. He has authored four book chapters, over 40 technical papers in peer-reviewed journals, and has been awarded 35 U.S. patents. He has also served as an adjunct professor at Arizona State University. Kaladhar joined Intel in 2000 soon after receiving his Ph.D. in Electrical Engineering from the University of Illinois at Urbana-Champaign. Serena Brischetto is senior manager of marketing and communications at SEMI Europe.

COVID-19 has likely had a greater impact on healthcare than on any other industry sector, said Glenn Snyder, Principal and Lead Analyst for MedTech at Deloitte, and a featured speaker at a recent SEMI webinar that offered a glimpse into the Future of MedTech in the run-up up to the SEMI Global Smart MedTech Symposium, kicking off tomorrow and running through August 5th. Snyder said medtech growth may appear muted in its early years but is poised to begin a steep climb as innovation continues, harkening back to the super-charged growth of circuitry on a wafer (aka Moore’s Law), which also saw a seemingly slow, flat start. Medtech enjoy its own exponential growth powered by 5G implementations, consumer demand, and the development of a robust ecosystem of bio-sensors, data standards, and regulatory improvements. Consumer-Driven Future and COVID-19 Impact Snyder noted that the future of medtech will be consumer-driven – enabled by open, highly interoperable data and secure platforms geared toward end users. A case in point: Detecting disease early through sensor systems will rely on not only on-body and environmental sensors, marking a fundamental shift from the today’s today’s hospital-centric system to improve health outcomes. Telemedicine growth during the pandemic is a notable example. In one case study of a health system, Snyder noted that telehealth usage skyrocketed from 1% to 60% of all patient visits over the early months of the pandemic but has since dropped to 10% due to the lack of charting, billing and other support systems needed to sustain the high rate of telehealth visits. Even so, hospitals expect to see a steady rise in consumers’ use of telehealth in the coming years. One driver are pilot programs for healthcare-at-home services for post-surgical patients. The programs have delivered better health outcomes and are more personalized and family-friendly than medical clinic or hospital visits. They also cost less. Digital monitoring using remote biometrics sensors are one key to driving the long-term success of these programs. Health Systems Changing Their Business Model In the medtech sector, changes in health system business models lag consumer adoption. What’s more, policy changes aren’t keeping pace with new models for medtech products. For medtech products to thrive, a solid foundation of data gathering, transmission and management capabilities that tie into traditional healthcare systems must be formed. Companies considering a vertically integrated approach to the medtech market can steer clear of healthcare providers – but only at the risk of having less access to patients and their historical healthcare data. Snyder said companies that control vertically integrated healthcare products and patient data can make support systems more efficient and robust but may struggle to deepen their market penetration. Companies such as Intuitive Surgical have found success with this model by offering highly differentiated products. Supply Chain Alarmingly Thin for Medtech Devices In a recent Deloitte survey of medtech companies, 60% reported that at least half of their products are powered by semiconductors, yet 70% noted pointed to high supply chain risks with most of their products because they have only a single source. Risk management and creating a resilient supply chain will remain key for medtech providers to adapt on a global scale. Partnerships and Collaborations During the event roundtable, Snyder mentioned that bio and pharma companies have partnered successfully to grow their businesses. Doug Kiehl of Eli Lilly, the moderator of the discussion, added that traditional healthcare providers should look outside of their usual business circles for medtech innovation. COVID-19 highlighted how new multi-disciplinary healthcare partnerships risk assessment processes have opened several paths to innovation previously unexplored. Both Snyder and Kiehl expect to see more collaboration between health systems and medtech innovators as they uncover synergistic business models. SEMI Global Smart MedTech Symposium Kicks Off Today Explore the gaps in the supply chain at the Global Smart MedTech Symposium and join the conversation with medtech device companies and health systems providers. Sessions include: Realtime Continuous Diagnostics and Monitoring Decentralized DNA Sequencing and Molecular Diagnostics Data Science and Infrastructure – AI/Data Fusion Applications in Rural and Decentralized Healthcare in the Digital Age The four-day symposium features three sessions at different times each day to cater to participants in Taiwan/Asia, Europe and North America. Register today! Heidi Hoffman is senior director of Technology Communities marketing at SEMI.

U.S. consumers are flush with cash, the American economy is hurtling back from the depths of the COVID-19 pandemic, and the semiconductor industry is flying high on skyrocketing chip demand, with chip equities soaring since the initial outbreak in early 2020 as virus outbreaks worldwide supercharged demand for the digitization of everything from factories to home offices. “Wow, what a difference a year makes,” said Jennie Raubacher, Global Head of Semiconductor Electronics Investment Banking at Wells Fargo, speaking at a recent SEMI webinar. The two rounds of government stimulus payments in 2020 and 2021 gave many U.S. households the safety net to withstand the heaviest blows dealt by the COVID-19 pandemic and stoked consumer spending that has helped lift a hobbled economy. Durable goods spending in the U.S. has also seen a sharp rebound, surging more than 60% from its April 2020 trough, Raubacher said. The twin forces have driven a blistering U.S. economic recovery after GDP shrunk about 10% by the second quarter of 2020 only to bounce back in the first quarter of this year to roughly $19 trillion, regaining the lost ground to match the GDP charted at the end of 2019. With the U.S. economy continuing to gain steam, inflation has, as expected, edged higher, with price increases particularly acute in used vehicle and lumber markets. Despite surging prices, Wells Fargo sees inflation moderating as durable goods demand slows, easing pressure on interest rates, Raubacher said. Equity Valuations at Record Highs Heady semiconductor stock prices are not new. Over the past 15 years, equity prices of chip companies in the S P 500 have grown more than 460%, outpacing the 230% jump in value of the S P 500 index overall, Raubacher said. And chip stocks continue to shine. Since early 2020, when the spread of COVID-19 hit its rapid clip, the recognition of the growing importance of chips to economies around the world has exploded. That dynamic joined secular technology trends including autonomous driving development, industrial and factory automation, 5G infrastructure buildouts, data center expansions, and smart city and smart home innovation fueled by the Internet of Things (IoT) as key drivers of semiconductor stock valuations. With its price/earnings (PE) ratio now at more than 21x, the S P 500 is well above its historical average of 15x PE. “The S P 500 valuation is at record high any way you look at it, and valuation multiples across the board, currently at 3x Next Twelve Months revenue, have increased dramatically from historical averages,” Raubacher said. Semiconductor stock valuations are on similar trajectory, with the SOXX index now at 15x Next Twelve Months EBITDA (earnings before interest, taxes, depreciation and amortization). “While semiconductor stocks may seem highly valued compared to historical levels, the chip industry has grown faster and expanded profitability by a wider margin than S P 500 companies,” Raubacher said. With that differential, “semiconductor equities are not as expensive as they may seem at first glance.” Earnings expansion and valuation multiple increases for the chip industry over the past 15 years have translated into a more than 500% jump in market capitalization, compared to a 300% increase for the S P 500 excluding chip companies, she said. Chip company revenue growth in the first quarter of 2021 was predictably low due to seasonality, dipping 2.4%, though dropped less than the historical average, Raubacher said. Second-quarter revenue growth for the industry is expected to hew to the historical average of 6%. Semiconductor growth forecasts by market analysts for 2021 range widely from 6% to 17% year-over-year, she added. Chip Companies Raise Capital at Record Pace In 2020 and 2021, semiconductor companies have raised an unprecedented $82 billion in capital to finance maturing debt and acquisitions, a wave that will “likely catalyze further consolidation in the sector,” Raubacher said. None of the financing has stemmed from liquidity crunches. Since Raubacher joined Wells Fargo 10 years ago to lead its semiconductor practice, the group has executed more than 175 transactions including $40 billion in mergers and acquisitions and $360 billion of financing for its semiconductor industry clients. “With a strong macroeconomic backdrop and demand environment, relatively low interest rates, semiconductor companies showing strong business fundamentals and robust valuations, we expect a pickup in M A activity,” she said. Growth Forecast Across Most Semiconductor Applications The next four years will see the chip industry grow across most applications including wireless communications, consumer electronics, transportation and medical. Automotive and industrial/aerospace will lead the way, expanding at an expected compounded annual growth rate of 14% and 10%, respectively, from 2020 to 2025 to “drive a significant portion of the TAM expansion during that period,” Raubacher said. Across all applications, the semiconductor industry is expected to grow at a 6.8% CAGR from 2020 through 2025, adding $183 billion in revenue by the end of the forecast period, she said. ESG Rises in Importance For their part, investors now focus on more than pure business performance when valuing individual companies. The ability of businesses to reduce their carbon footprint, promote workplace diversity and take other steps to serve the greater good as part of Environmental, Social and Governance (ESG) programs are carrying more weight in valuation models. “Investors are paying more and more attention to ESG initiatives and targets,” Raubacher said. “On the debt side, we’re seeing things like green bonds and interest rate reductions tied to ESG targets. Only a few semiconductor companies have incorporated ESG measures into their financing, so it’s still early days. It really comes down to the metrics you can track in your companies and the goals and targets you can commit to. It will be a very company-specific approach rather than an industry standard.” In the chip industry, Raubacher noted that ESG targets are geared not only to manufacturing equipment and processes in fabs and other semiconductor facilities throughout the supply chain, but increasingly also to chips themselves. As technology innovation continues to spur the development of chips to power more electronics for consumers and businesses, their proliferation comes at a cost: greater energy consumption. The upshot is that semiconductor makers are becoming more focused than ever on power-efficient designs to bolster their ESG initiatives, Raubacher said. Many semiconductor players across the supply chain are reducing their carbon footprint by switching to energy-saving equipment and reducing water waste, Raubacher said. At the same time, more semiconductor executives are recognizing the rising importance of highlighting corporate achievements across all aspects of ESG. More Governments See Vital Importance of Semiconductors As shelter-in-place orders took hold in countries worldwide after the initial COVID-19 outbreak, work-from-home offices, online shopping, virtual classes and remote doctor’s visits became the norm. The electronics at the heart of this connectivity – born of both necessity and convenience – and the chips that power them took on outsized importance around the world. Geopolitical skirmishes intensified and supply chains across the semiconductor industry were reimagined and redrawn. Governments jockeyed for advantage in the race to build new semiconductor manufacturing facilities and upped their chip investments. An acute chip shortage that started in the automotive industry and quickly spread to other sectors magnified just how pervasive and vital semiconductors had become in making the world go round. “There’s no question that the semiconductor industry is vitally important to global and national economies as governments around the world now recognize its strategic importance,” Raubacher said. That puts the industry in an even stronger position to help lay the regulatory groundwork for its own future. “There’s a unique opportunity for semiconductor industry executives to shape the public policies that could impact the direction of the industry for the next 30 years,” she said. More than 750 people attended the June 2nd webinar, Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next?, sponsored by SEMI members Brooks Automation, Hitachi, JECT, KLA and TEL. Sven Smit of McKinsey Company also delivered his talk Leading in COVID-19 Exit at the event.

When COVID-19 hit the semiconductor industry, SEMI members were confronted with new hurdles to keeping their employees safe and their operations running uninterrupted. We quickly assisted our global membership around the globe by providing a forum for collecting member insights on best practices for operating and safety procedures, supply chain issues and sentiments on business impact and recovery. That forum took the form of surveys we launched in March 2020. We shared the results with the larger SEMI member community to help them cope with the evolving impacts of the pandemic on their businesses. Following is a summary of our 4th survey, issued last month. Regional and Sector Representation Nearly 40% of our respondents represented companies headquartered in North America. Of the respondents, 10% each were from companies headquartered in Taiwan and China; 5% from Korea, 13% from Japan and 20% from European and Middle Eastern members. The largest share of respondents – 40% – develop equipment for semiconductor fabrication, assembly, and test; 21% supply materials to the microelectronics industry; 14% are device makers; 6% supply software and design services; and 3% are OSATs, EMS suppliers or ODMs. Measures Member Are Taking to Continue Operations The May survey found that almost no companies ceased production for any significant length of time. In order to continue operations, companies instituted social distancing and masking requirements, temperature checks, schedule changes, and some contact tracing, all to varying degrees, as shown in Figure 1. In addition, several companies implemented some combination of mandatory testing, bump sensors, air purification and site capacity limits and sequestered foreign workers in separate housing for required quarantines after travelling. Figure 1 All of these measures are routinely discussed during the regular SEMI EHSS COVID-19 Working Group calls. That group consists of facilities, HR managers and others tasked with ensuring safety monitoring and compliance at member companies. Company Vaccination Policies With the pace of vaccine rollouts varying widely around the world, only 5% of respondents are requiring all workers to be vaccinated before returning to the office, and 12% have not yet considered a vaccine policy. The majority of companies are encouraging but not requiring employee vaccinations, and 26% leave the decision to the individual employees. Figure 2 North American companies constituted the majority of the required and encouraged vaccination categories. In Europe, companies fall into the employee decision or encouraged categories but none require vaccinations. Japanese companies primarily leave the vaccination decision to employees, while Chinese companies are split among the required, encouraged and employee decision categories. Clearly, these guidelines are not required by law in each region, but instead fall to employers and local policymakers. Member Readiness for Digital Transformation A solid majority of members reported they have invested in the adoption of digital transformation technologies and practices, though only about 14% expect to continue their digital investments in the coming year. Many respondents have deployed virtual meeting software and have implemented or plan to put in place virtual reality tools for remote diagnostics and predictive modeling for semiconductor manufacturing. Figure 3 Location by Functional Group in Returning Employees to Sites Not surprisingly, manufacturing and distribution staff that could work from home during the pandemic are back on site, and respondents signaled that R D and engineering groups will soon end their remote work, following by finance and procurement. Sales and marketing show the highest percentage of staff working remotely, with sales having the highest number remaining remote for some time to come. Figure 4 Resilience to Further Economic Uncertainty Of the 274 companies responding, 229, or 84%, feel more resilient in the face of further economic uncertainty after their response to COVID-19, though continuing supply chain issues and raw materials shortages ranked among their top concerns, as did rising customer demands, their ability to increase capacity utilization rates, and the increasing demands on employees and facilities overall. Figure 5 Many thanks to all survey respondents over the past year! We’ll keep you up to date on results of future surveys. For more details on the SEMI EHSS COVID-19 Working Group calls, visit the SEMI COVID Response Site. To watch the recording of our most recent CEO Webinar – Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next? – click here. More than 750 people attended the June 2nd webinar sponsored by SEMI members Brooks Automation, Hitachi, JCET, KLA and TEL. Heidi Hoffman is senior director of Technology Communities marketing at SEMI.

As we move through Q2 of 2021, it seems that the world is finally approaching normalcy. But I don’t believe our lives and businesses will ever be the same. Travel is unlikely to return to the same level as pre-COVID-19 for many years. I’m sure many companies will establish tighter travel policies and budgets as virtual conferencing has proven to be beneficial and cost-effective. Patients and doctors who were skeptical of telemedicine are embracing it, and although it’s not perfect, it has filled a needed gap. Online learning essentially happened over a weekend and will now be part of many curriculums and programs. All of these elements have spurred our semiconductor industry into a super cycle. Demand for chips is leading to an increased demand for semiconductor equipment. Semiconductor capital equipment expenditures in 2020 surpassed $63 billion and are forecast to top $70 billion in 2021. The secondary equipment market typically makes up about 5% to 10% of that. Our inquiries have definitely increased this year. With this in mind, I’d like to share some thoughts for the remainder of the year. Storage of Chipmaking Equipment Not New The semiconductor industry has been experiencing an equipment shortage for some time. It is difficult for original equipment manufacturers (OEMs) to support such a large variety of products and technologies. Some companies use equipment for manufacturing 150mm, 200mm and 300mm wafers. Fabs still run 30-year-old technology on 150mm wafers while the latest technology is manufactured on 300mm wafers. We’ve also seen new technologies like silicon carbide (SiC) being developed on these smaller wafer sizes. Unfortunately, some OEMs stopped making 150mm and 200mm some time ago and have only recently jumped back into the market. These OEMs have had to balance technological advances, pricing, and manufacturing capacity to meet this demand since their primary focus is on 300mm equipment. Third-party refurbished equipment suppliers have also experienced an increase in demand over the last several years. We see it increasing at all technology levels over the next three to five years. This translates to increased equipment pricing for both new and used equipment, as well as increased lead times. Growing Demand for Legacy Tools Many electronic products we use and are familiar with don't require state-of-the-art technology. For instance, cellphones, electric vehicles, wearables, monitors and industrial products still contain many chips manufactured on 200mm wafers using 200mm equipment. There are still approximately 200 200mm fabs worldwide and this makes up about 25% of all wafer capacity regardless of wafer size. These fabs manufacture analog devices, MEMS products, power management ICs, RF devices, discrete devices and sensors. We have also seen an increase in lead times for 200mm equipment. Typical lead times of three to six months have increased in some cases to one year or more. This situation has created a dramatic increase in chip making equipment prices and we do not expect much relief there. Many OEMs transitioned to 300mm equipment prior to 2010. Revenue and profit margins are much higher for them on 300mm equipment. 200mm manufacturing was supported by many third parties for a while. However, in 2016 we saw a resurgence in 200mm equipment, and at that time many OEMs began jump-starting their supply chains. It took some time for them to develop new supply chains, upgrade technology and in some cases hire newly trained engineers to support these new tool sets. All this costs money, which is why we will continue to see an increase in new legacy equipment pricing. Because manufacturers and products may not be able to support these prices, we expect the robust third-party ecosystem to continue. SurplusGLOBAL's Response to this Demand One of the advantages we bring to the secondary equipment market is our ability to recycle technology. We continuously search for opportunities to purchase large packages of tools from companies that are transitioning technology nodes, moving from 200mm to 300mm wafer size or changing product lines. We spend approximately $65 million to $100 million each year on purchasing equipment and in some cases storing it for the right customer. For instance, a memory company may be changing technology nodes and no longer needs its equipment. This use to happen on a predictable schedule. Instead of scrapping that equipment, SurplusGLOBAL purchases and stores it. Sometimes we only need to store it for one month before relocating it. However, in many cases, we store it for one year or more. We may power it on at a later date if it is in good condition. In some cases, we work with an OEM or third party to have it refurbished and ready for a new customer. In response to the need for more secondary market equipment, we have opened up additional offices in Japan and Singapore to stay close to and better support our customers in those regions. Finally, our biggest and most recent endeavor is building our Semiconductor Equipment Cluster, which opens in July 2021. Learn more about the SurplusGLOBAL Semiconductor Equipment Cluster. Emerald Greig is executive vice president Americas at SurplusGLOBAL.

Now, more than ever, semiconductor companies are relying on their human resources departments to ensure employee safety, support facility access and hygiene measures, cope with staffing demands and incorporate the rapidly evolving guidelines from Centers for Disease Control and Prevention (CDC) and the local state and city mandates. SEMI spoke with Crystal Reich, HR manager at X-FAB Texas, about her participation in the Fab Owners Alliance (FOA) human resources group and the value of collaborating with industry peers on a broad spectrum of topics: from focusing on specific areas such as ensuring employee safety and managing the workforce during a pandemic, to addressing broader organizational challenges such as benchmarking activities and identifying compensation and staffing best practices. SEMI: How did you learn about the FOA human resources group? Reich: I have been part of the FOA HR group since its inception in 2012. Lloyd Whetzel, the CEO at X-FAB Texas, has been very involved with the FOA for several years. When this group was being formed, he let me know about it. I came to the first meeting and have been a part of it ever since. SEMI: What does your participation in the FOA human resources group allow you and your company to do differently? Reich: I am also involved with the Society for Human Resource Management (SHRM), but the FOA HR group provides an excellent opportunity for semiconductor industry HR professionals to collaborate. The group not only covers topics that are specific to the semiconductor industry but also discusses broader topics related to preserving employee well-being during unprecedented challenging times, managing negative emotions, establishing appropriate political expression policies, and creating safe spaces for dialogue. Also, the benchmarking has been fantastic, especially from a compensation and staffing standpoint. It allows us to identify best-in-class recruitment strategies, determine any shortfalls and use this information to improve employee onboarding and development. In addition to discussing these types of issues and trends, we compare and benchmark other HR issues such as policy deployment and legislative trends with colleagues in the industry. SEMI: What are some of the key topics and activities that the FOA HR group has helped you focus on? Reich: X-FAB has been involved in a variety of activities at SEMI. Through the SEMI High Tech U program, we have been able to help college-bound high school students in our community access STEM curriculum and explore careers in technology. We have devised more robust military outreach strategies with the help of the Veterans Program at SEMI, allowing us to recruit and retain excellent technicians from the military. Additionally, benchmarking activities within the FOA HR group have helped us improve our talent acquisition process - especially for positions which are challenging to fill. SEMI: The pandemic brought many significant and unprecedented challenges that affected business continuity. How did your company's participation in the FOA help you navigate these changes? Reich: The FOA has been a great help in addressing the challenges of the global pandemic across several operational collaborative teams. In the early days of the pandemic, as employees moved to remote work, FOA organized a forum that allowed members to share how they dealt with this transition. Constantly changing guidelines and protocols meant that FOA members leaned on each other more than ever to share best practices and lessons from new safety process implementations. FOA offered survey and area-specific team activities, cross-functional operational sessions, and round table discussions at its 2020 Q4 meeting, where members exchanged ideas on how business processes changed during this period and shared what they were doing to ensure business continuity. This provided another excellent opportunity for FOA members to benchmark best practices within the semiconductor industry. SEMI: Would you recommend your peers to join the FOA HR group? Reich: I would highly recommend HR colleagues in the semiconductor industry join this collaborative group. It is a great platform to share ideas, learn from each other, and benchmark with other colleagues in the same industry. The FOA HR Metrics survey is a comprehensive survey covering several different areas within the HR discipline such as compensation, learning and development, tool training, corporate social responsibility, and many others. True to the nature of the FOA, the survey is a result of the collaboration between several HR professionals from Device Maker member companies. Please contact Shilpa Talwalkar at [email protected] if you would like to participate. X-FAB is a member of the SEMI Fab Owners Alliance, an international group of semiconductor and MEMS fab managers and industry suppliers that meet regularly to solve common non-competitive manufacturing issues and improve their business results. Nishita Rao is senior product marketing manager at SEMI.

The pandemic unleashed by the coronavirus SARS-CoV-2 (which causes the disease COVID-19) has infected over 100 million and resulted in over 2.6 million deaths worldwide as of March 2021. It is well-established that this virus primarily spreads from person-to-person via respiratory droplets produced when an infected person coughs, sneezes or even breathes (see Ref. 1-3). Subsequently, the droplets meet the eyes, or enter nose or mouth of a nearby person, or transmit when a person touches an infected surface, then contacts their eyes, nose, or mouth. Since the virus is small, 0.06–0.14 microns in diameter, many copies can be contained in or attached to emitted respiratory droplets. Droplets as small as one micron can carry enough viral load to cause an infection. A particular concern is the interaction of droplets with ventilation systems, which potentially could enhance the propagation of pathogens. This has implications on situation-specific safe distancing and the design of building filtration systems, air distribution, heating, air-conditioning and decontamination systems. A particular instance of this is the semiconductor manufacturing cleanroom, where systems and protocols are specifically designed to minimize contamination. The $440 billion global semiconductor industry depends on these cleanrooms for integrated circuits (chips), and in turn, these chips form the lifeblood of the multi-trillion-dollar global electronic systems industry. Electronic systems are now critical for just about every aspect of human life, including health, work, finances, entertainment, transportation, power grids and many others. Thus, it is critical to understand how cleanrooms can operate more safely to ensure the health of workers while maintaining productivity levels to meet increasing global demand for semiconductors. In the work described here, we analyzed particle and droplet transport via modeling, simulation [Refs 1-3], and experimentation [Ref. 4] to help guide the industry. Modeling and Simulation In this part of the work, mathematical models were developed to simulate the progressive time-evolution of the distribution of locations of particles produced by a cough. Analytical and numerical studies were undertaken. The models ascertain the range, distribution and settling time of the particles under the influence of gravity and drag from the surrounding air. Beyond qualitative trends that illustrate that large particles travel far and settle quickly – versus small particles that do not travel far and settle slowly (yet can be carried far by ambient flow) – the models provide quantitative results for distances travelled and settling times, which are needed for constructing social distancing policies and workplace protocols. Figure 1 shows examples of the results of the modeling and simulation work. Figure 1: Model of particle spreading from a person coughing, with and without a mask. (Ref. 1) Following are key insights from the modeling and simulation work (Ref. 1): Large particles travel far (launched “ballistically”) and settle quickly, while small particles do not travel far and settle slowly (when there are no ambient externally-driven flow fields). Small particles do not settle even by the end of the simulation time (4 seconds in Ref. 1). Accordingly, the simulations were also run for extremely long periods to ascertain that the “mist” of small particles remained airborne for several minutes (as predicted by the theory). For strong opposing headwind, small particles move backwards, yet still remain airborne for extended periods of time. This is by far the most dangerous case since this will encounter other persons at the torso level. Ratio of the general drag to gravity indicates that at high velocities, the dynamics are dominated by drag. For general cough conditions, there can be cases where the change in the surrounding fluid’s behavior, due to the motion of the particles and cough, may be important. One major implication of this work is that the challenge of infection must be addressed both spatially and temporally. In other words, it is necessary to maintain social distancing based on how far the virus travels, but it is also important to account for how long the virus stays at the location because of specific air patterns. On the positive side, understanding these spatio-temporal patterns accurately will enable companies to design (or re-design) ventilation and decontamination systems precisely to improve worker safety. Other aspects of this analysis entail contact tracing (Ref. 2) and decontamination (Ref. 3). Further details, including simulations, are available at https://msol.berkeley.edu/publications/. Experimentation The major vector of coronavirus spread is through respiratory droplets expelled when coughing, speaking, and breathing; and the efficacy of any safety measures depends on accurate characterization of the dispersal of these droplets. The term particle describes objects that begin their journey as a solid. The term droplet is reserved specifically for objects that are initially liquid, albeit it is important to note that droplets can evaporate and effectively transform into solid particles composed of non-evaporative material. A purpose-built room, the Cal Covid Cube, C3, was set up and utilized for this research [Thatcher et al. 4]. The C3 is a parallelepiped room that is 232 centimeters tall, 376 centimeters long and 284 centimeters wide on the inside. For experimental results to be meaningful and repeatable for scientific and practical purposes, it is essential that the experimental setup be carefully controlled and calibrated. The following precautions were taken to ensure this: Charge-free: When solid particles are released, it is critical to eliminate (or thoroughly know) static charge effects for obtaining accurate deposition patterns. Static charge effects can manifest through particle-particle interactions (affecting particle motion in flight) or particle-surface interaction (affecting deposition pattern). Two methods for the elimination of charge effects on the deposition surface were found to be effective: (1) ionized non-conductive adhesive sampling strips, and (2) grounded aluminum backed carbon sampling strips. Isothermal: The room is a converted walk-in freezer with 10.5-13 centimeter thermal insulation and located in the middle of a building, at least 5 meters away from all building walls. Temperature uniformity was checked and the C3 room temperatures were found to be isothermal within uncertainty of measurements. Quiescent: It was ensured that the room did not create uncontrolled thermal convection due to isothermal nature. Quiescence was verified with both hot-wire measurements and with free-falling particle drift observations. Isopotential: The outer and inner surfaces, including the door of the C3 were conductive aluminum and stainless steel, and copper tape were used to ensure reliable electrical connection of door, interior and exterior panels. Electric fields were surveyed and found to be negligible within precision of instruments. Other design elements: All interior surfaces were coated with black matte paint to reduce scattered light and provide uniform background for imaging measurements. The facility was located on ground floor to limit vibrations. Repeatable Launch: To emulate the release from a true cough or sneeze, and to better understand droplet motion in a canonical turbulent jet versus a cough type release, we studied different layers of complexity for the release geometry: (i) Straight round pipe (ii) Smooth 90-degree curved pipe, with a changing radius along the length of the pipe (iii) Intubation trainer doll, with realistic airways and mouth/tongue structure Figure 2 shows the experimental setup with the intubation doll in C3, with the particle/droplet release being measured after deposition on the sampling strips that appear green. Figure 2: Experimental Setup in C3 with both charge neutralized (white appearing green) and conductive (black) sampling strips placed on a conductive and grounded alignment grid [Ref. 4] We utilized both liquid droplets and solid particles. For droplets, we explored and found promise in a method of deposition analysis based on fluorescence. For particles, we explored many ways in which the smallest of thermal gradients or electrostatic charge issues can affect the data and developed practical methods to address these issues. For accurate measurement free of static charge effects even in environments where high ambient flow velocities may cause a nonconductive surface to rapidly acquire charge (e.g., clean room environment), we developed carbon-tape-based sampling strips that are cleanroom-compatible, conductive, and grounded. For analysis, we developed a cost-effective method utilizing a commercial photo negative scanner followed by image enhancement by blind deconvolution. Figure 3 shows sample results for particle deposition location along our centerline for particles in the ballistic, intermediate and aerosol regime. Figure 3: Experimental Results [Thatcher et al. 4] Following are key insights from experimental work: Significance of both static charge effects and thermal gradients in rooms for validation tests are more than usually appreciated. For modelling, accounting for the non-uniform initial particle velocity matters for the ballistic particles. For all sizes of particles, simulating the transient versus steady state significantly impacts predicted particle spread. Thermal plumes alone from humans along particle flight path can transport 50 micron particles across the room. In some situations, this was observed up to ~6 meters. There is a significant effect of Relative Humidity (RH) and temperature on droplet evaporation. The practical consequence is that, in low RH, particles spread further, with all other things being equal. (The reason is that particles shrunk more and entered the aerosol regime.) In summary, a systematic analysis of particle and droplet transport was conducted by simulation, modeling, and experimentation. We were able to develop robust, rigorous, and repeatable methodologies and draw meaningful insights that will support safer operation and productivity of semiconductor cleanrooms globally. Further, these studies will help with the design (or re-design) of ventilation and de-contamination systems that help protect both the health of humans and the economy from current and future pandemics. This article provides a high-level overview of the work, and further details will be available through a series of scientific papers that are in various phases of publication. We gratefully acknowledge the following support: Gift of the Lam Research Corporation Gifts coordinated through SEMI and provided by Advanced Energy Industries, Applied Materials, ASM, Entegris, JSR, KLA, TEL, and Wonik The 2020 Seed Fund Award from the Center for Information Technology Research in the Interest of Society (CITRIS) and the Banatao Institute at the University of California Vision Research for providing a v2640 camera to help quantify the particle velocities Graduate students Eric Thacher and Tvetene Carlson who conducted the experiments in C3 Valuable discussions with Brett Singer, Thomas Kirchstetter, Michael Sohn, Chelsea Preble of Lawrence Berkeley National Laboratory regarding droplet transport and COVID, and Keith Hansen on particle sampling and charge neutralization DOE Office of Science through the National Virtual Biotechnology Laboratory, a consortium of DOE national laboratories focused on response to COVID-19, with funding provided by the Coronavirus CARES Act Steven Ruzin and the Biological Imaging Facility for their assistance in obtaining the high-quality fluorescence microscopy scans to validate the particle counting methodology. References Zohdi, T.I. (2020) Modeling and simulation of the infection zone from a cough, Computational Mechanics. https://doi.org/10.1007/s00466-020-01875-5 Zohdi, T.I. (2020). An agent-based computational framework for simulation of global pandemic and social response on planet X, Computational Mechanics. https://doi.org/10.1007/s00466-020-01886-2 Zohdi, T.I. (2020) Rapid simulation of viral decontamination efficacy with UV irradiation. Computer Methods Appl. Mech. Eng. https://doi.org/10.1016/j.cma.2020.113216 Thatcher, E., Carlson, J., Castellini, J., Sohn, M.D., Variano, E. and Makiharju S.A. (2021) Droplet and Particle Methods to Investigate Turbulent Particle Laden Jets (in preparation) Authors Evan A. Variano, Professor, Environmental Engineering, UC Berkeley Simo Mäkiharju, Assistant Professor of Mechanical Engineering, UC Berkeley Tarek I. Zohdi, Will C. Hall Endowed Chair of the UCB Computational Data Science Engineering Program, Professor of Mechanical Engineering, UC Berkeley Pushkar P. Apte, Director of Strategic Initiatives, Center for Information Technology Research in the Interest of Society (CITRIS) and the Banatao Institute, UC Berkeley; and Strategic Technology Advisor, SEMI

The work of the SEMI Environment, Health and Safety (EHS) COVID-19 working group to address industry EHS issues and share best practices has morphed as rapidly as COVID-19 itself as the vaccine rollout continues, inspiring new hope for a return to normal. The group has evolved from mounting crisis responses to urgent issues such as the shortage of masks and sanitization wipes and sprays to helping companies prepare for their employees’ return to the workplace and developing on-site health-screening procedures for employees and visitors to help ensure their safety. Hot SEMI EHS COVID-19 working group topics have included the following as the team continues to meet every other week to stay abreast of COVID-19 developments and their industry impacts. Vaccinations SEMI members have been monitoring the progress of U.S. states and counties in delivering vaccines. So far, no essential workers in the electronics industry have been eligible to be vaccinated. To help gauge the availability of vaccines to essential industry workers, some companies have hired external consultants to monitor the phase-in. The SEMI EHS COVID-19 working group will collect and centralize the information to help members plan for their employees’ return to the workplace. Policy Enforcement At manufacturing sites, some employees reportedly are becoming complacent in following masking and distancing policies, prompting reminder communications from top management for workers to comply until the pandemic is brought to heel. The higher-ups are also encouraging staff to get vaccinated once they are eligible, with some member companies offering workers time off or other incentives for their employees and families to get vaccinated. Contact Tracing Despite the intense focus on contact tracing since the initial COVID-19 outbreak last year and early efforts to track people movement using smartphone applications or wearables, no tracking technology has emerged as the standard for helping to curb the virus’s spread. SEMI members have been testing various technologies ranging from Bluetooth to wearables with wide-band radio waves to track employees while on site. Tracing by wearables has proven inaccurate. Left with no better alternative, the vast majority of SEMI members are performing time-consuming manual contact tracing. OSHA Compliance While OSHA has picked up the pace in issuing new regulations related COVID-19, pandemic-related site inspections have lagged, some SEMI working group members report. In California, CAL/OSHA recently passed a COVID-19 Preparedness Plan that defines the responsibility of employers in preventing workplace outbreaks, offering PPE to workers and conducting frequent testing. The California plan mirrors the CDC recommendations implemented at the onset of the pandemic. To join the SEMI EHS COVID-19 working group, contact our EHS team at [email protected]. Olivier Corvez is senior manager of Environment, Health, Safety and Sustainability at SEMI.