SOPOT, Poland — February 17, 2025 — The SEMI Industry Strategy Symposium Europe (ISS Europe) 2025, March 12-14 in Sopot, Poland, is themed AI: Catalyst to Propel Europe’s Competitiveness. The event will explore how AI is reshaping economic, technological, and market dynamics within the semiconductor industry. Experts will examine AI-driven innovation, efficiency improvements, and the balance between collaboration and competition (co-opetition) in fostering Europe’s leadership in the global semiconductor market. Registration is open.

ISS Europe 2025 will feature featured speakers addressing key unprecedented challenges and opportunities in the semiconductor industry. Topics will focus on the role of artificial intelligence (AI) in shaping the industry, strategies to strengthen Europe’s semiconductor supply chain resilience, sustainability, and innovative approaches to workforce development. Industry executives, market analysts, economists, and policymakers will convene to discuss the latest industry trends and advancements. 

“As AI, automation, and sustainability reshape our industry, it is crucial that we foster collaboration and innovation to secure Europe’s competitive edge,” said Laith Altimime, President of SEMI Europe. “At ISS Europe 2025, industry leaders will share their strategies for supply chain resilience, workforce development, and the transition from systems on chips to systems of chips. By working together, we can drive technological advancement and build a more sustainable and robust semiconductor ecosystem for the future.”

ISS Europe 2025 Featured Speakers  

• Andreas Schleicher, Director for Education and Skills, Organisation for Economic Co-operation and Development (OECD)
• Benedikt Ernst, SVP, Head of Strategy & Transformation, Electronics, Merck KGaA, Darmstadt, Germany
• Bill Lussier, Managing Director, Tokyo Electron Europe Ltd (TEL)
• Charles Vaillant, Chief Technology Officer and Chief Digital Officer, MANN+HUMMEL
• Christophe Frey, VP of EU Engagements and General Manager, Arm France
• Dariusz Standerski, Secretary of State, Ministry of Digital Affairs, Poland
• George Dritsantos, VP of Secure Power Central and Eastern Europe, Schneider Electric
• Hendrik Bourgeois, VP, European Government Affairs, Intel
• Jean-Christophe Eloy, CEO, Yole Group
• John Behnke, General Manager FPS Product Line, INFICON
• Meike Boekelmann, Chief Human Resources Officer, Comet Group
• Rainer Kiefer, EVP Global Head of Sales, Schenker AG
• Thomas Kralinski, State Secretary, Saxon State Secretary of Economic Affairs, Labour, Energy and Climate
• Volker Herbig, VP, BU MEMS, X-FAB

 ISS Europe 2025 Highlights

Session 1: Europe’s Strategy in a Shifting Geopolitical Landscape
Industry leaders will analyze how Europe is addressing global market trends and navigating geopolitical challenges to maintain a leadership position and drive innovation.

Session 2: Technology Roadmap to Net Zero: Breakthroughs and Energy Strategies
Experts will discuss breakthrough technologies, energy strategies, and AI-driven innovations shaping the semiconductor industry’s journey toward Net Zero goals.

Session 3: Shaping Europe’s Future Workforce: Strategies for Growth
Thought leaders will share actionable strategies to cultivate the workforce of tomorrow, emphasizing collaboration between industries, academia, and governments to drive innovation and sustainable growth.

Session 4: AI for Smarter Sustainable Manufacturing
Speakers will explore how AI can transform semiconductor manufacturing with smarter, sustainable processes while addressing workforce readiness and revitalizing European manufacturing capabilities.

Session 5: Driving Innovation to the Next Generation from Materials to System Level
Experts will highlight next-generation advancements in materials, design, and AI that are driving semiconductor innovation and enabling future technological breakthroughs.

Sponsors

• Headline:
  Invest in Pomerania
• Platinum: 
  Comet, Edwards, INFICON, MANN+HUMMEL, Polish Investment & Trade Agency, Schneider Electric, Synopsys and Tokyo Electron Limited (TEL)
• Gold:
  EBARA and Merck KGaA, Darmstadt, Germany
• Event: 
  DB Schenker, EV Group (EVG), HCLTech, imec, JSR Micro, Ovivo and VAT

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2025 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#ISSEurope).

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.  

Contact Information:

Maria Daniela Perez / SEMI Europe 
Phone: +49 160 2562977 
Email: [email protected]  

Sherrie Gutierrez / SEMI Corporate
Phone: +1 831 889 3800 
Email: [email protected]

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Press Release: Kurt J. Lesker Company Announces Groundbreaking Report in an ALD first!

Jefferson Hills, PA – January 8th, 2024 – Kurt J. Lesker Company is proud to announce the successful publication of our latest Atomic Layer Deposition (ALD) technology in JVSTA. This groundbreaking innovation, featuring our patented Precursor Focusing Technique (PFT) and Ultra-High Purity (UHP) process capability, marks a significant milestone in our commitment to advancing next-generation applications.

The new ALD research and development (R&D) represents the first successful demonstration of scandium nitride (ScN) deposition using plasma-enhanced atomic layer deposition (PEALD) on silicon, sapphire, and magnesium oxide substrates under UHP conditions. This innovative process utilizes a new scandium precursor, bis(ethylcyclopentadienyl)scandium-chloride [ClSc(EtCp)2], combined with N2-H2 plasma species, allowing for the deposition of conformal, high-quality ScN films at relatively low temperatures (200−300°C).

"We are thrilled by the prospects of this breakthrough, which underscores our dedication to innovation and excellence in the field of ALD," said Kurt Lesker IV. "This achievement is a testament to the hard work and expertise of our team, and we look forward to leveraging this technology to drive sustainable business growth."

The ScN films produced by this process exhibit high crystalline quality and excellent electrical properties, with high mobility and low resistivity. This makes them suitable for advanced electronic applications, including thermoelectric applications and as an interlayer for epitaxial gallium nitride (GaN) growth. The ability to conformally coat high aspect ratio (HAR) structures is particularly valuable for applications in 3D embedded memory and piezoelectric microelectromechanical systems (piezoMEMS).

The new ALD breakthrough positions Kurt J. Lesker Company as a leader in the ALD market, providing a significant competitive edge. KJLC’s unique UHP technology equips researchers to meet the challenges of next generation 3D nanotechnology. 

The new ALD publication, in JVSTA, will be featured on www.lesker.com and stay tuned for more updates as we continue to push the boundaries of ALD technology.

For more information, please visit our website or contact our marketing team.

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Pioneering Digital Manufacturing Technology Will Revolutionize Semiconductor Packaging, Display Manufacturing, and Consumer Electronics

Las Vegas, US, January 8, 2025 – SCRONA AG, a leader in microfabrication technologies and the proud holder of a World Record for the smallest printed color picture, has unveiled its revolutionary 128-nozzle electrohydrodynamic (EHD) printhead at CES 2025. This groundbreaking innovation achieves a three-digit nozzle count in digital EHD technology for the first time, marking a major milestone that transforms EHD printing into a mass-production-ready solution.

Launching with a newly developed print engine for seamless integration into production tools by the end of Q1 2025, the 128-nozzle printhead is poised to revolutionize high-precision manufacturing across industries. "The rapid development from 8 to 48 and now to 128 nozzles in such a short time is a testament to the scalability of our MEMS-based EHD Gen-3 platform and execution of our team," said Dr. Patrick Galliker, CTO and Co-Founder of SCRONA.

A Leap in Digital Manufacturing for Key Industries

The SCRONA 128-nozzle printhead brings unprecedented precision, material flexibility, and scalability to industries such as semiconductor advanced packaging, display manufacturing, and consumer electronics. Key benefits and applications include:

1. Semiconductor Manufacturing:
- Revolutionary die-attach applications, dispensing ultra-small adhesive volumes with unparalleled accuracy.
- High-resolution printing of conductive interconnects, vital for advanced AI chiplets and chip manufacturing innovations.

2. Display Technology:
- Unmatched precision in applying quantum dots and color filters for next-generation micro-LED and OLED displays, enabling vibrant, energy-efficient screens.
- High-accuracy printing of adhesives and sealants for display packaging, facilitating thinner and flexible substrates.

3. Versatility Across Sectors:
- Enhanced printing capabilities for consumer electronics, defense, and life sciences, with the ability to print on curved or challenging substrates.
- A versatile solution surpassing the limitations of traditional inkjet and screen printing technologies.

Accelerating Mass Production Ready for EHD Technology

The introduction of the 128-nozzle printhead represents a paradigm shift in production technology, setting a new benchmark for accuracy, speed, and material flexibility. This innovation addresses the long-standing challenges of scaling EHD technology to meet the rigorous demands of high-volume manufacturing. "We are thrilled to unveil our 128-nozzle EHD printhead at CES 2025," said Dr. Patrick Heissler, CEO, SCRONA AG. "This breakthrough paves the way for manufacturers to achieve greater performance, miniaturization, and efficiency in production processes while unlocking new opportunities for innovation in advanced technologies."

About Scrona AG
Scrona is a spin-off from ETH Zurich, one of the top 10 global research universities. Scrona has developed the industry's first multi-nozzle printing platform that can digitally print with sub-micron precision, on any material and at scale. Its patented electrostatic printing technology is transforming manufacturing processes in the field of semiconductors, displays and many other products. It is enabling new designs not feasible for implementation with today’s processes while significantly reducing material, energy and water consumption.
Learn more at www.Scrona.com

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From January 1, 2025 Heraeus is combining the high-performance materials expertise of Heraeus Conamic and Heraeus Comvance into a new operating company: Heraeus Covantics. The merged business will be led by a new management team. The legal entities will remain the same.

With the new operating company, Heraeus is further expanding its technology leadership in the manufacturing and processing of high-purity quartz, fused silica, and other high-end materials such as ceramics and innovative composites.

“We are creating a global powerhouse in which we drive innovation and exploit technological synergies,” explain Christoph Fark, Michael Werth and Nikolas Pojezny, Managing Directors of Heraeus Covantics. ”The new structure more closely aligns our combined capabilities and competencies with market requirements and customer needs. This enables our customers to strengthen their competitive advantage.”

Heraeus Covantics manufactures semi-finished products, complex system components and custom-tailored solutions made of quartz glass, fused silica and ceramic materials. They are used in the data transmission and telecommunication industry, the production of specialty optical fibers for industrial and medical applications, semiconductor manufacturing and optical applications among others.

About Heraeus
Heraeus is a family-owned global technology group headquartered in Hanau, Germany. The company’s roots go back to a family pharmacy started in 1660. With its expertise and resources, Heraeus has been making meaningful contributions over generations and is committed to do so in the future. Today, the group bundles diverse activities in four Business Platforms: Metals and Recycling, Healthcare, Semiconductor and Electronics, as well as Industrials. Customers benefit from innovative technologies and solutions based on broad materials knowledge and technological leadership. In the 2023 financial year, the group generated revenues of €25.6 billion (US$27.7 billion*) with approximately 16,400 employees in 40 countries. Heraeus is one of the top 10 family-owned companies in Germany.

About Heraeus Covantics
Heraeus Covantics is a technology leader specializing in the manufacturing and processing of the industry’s highest purity quartz, fused silica and other high-end materials such as ceramics and composites. With locations in Europe, USA and Asia, Heraeus Covantics manufactures semi-finished products, complex system components and custom-tailored solutions made of quartz glass, fused silica and ceramic materials. They are used in the data transmission and telecommunication industry, the production of specialty optical fibers for industrial and medical applications, semiconductor manufacturing and optical applications among others.

• Read more about Heraeus Covantics: Materials specialist further expands its technology leadership