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Dr. Sreeni Rao has been in the MEMS sensing and semiconductor sector for the last 25 years, and has previously held technical and business leadership positions at Texas Instruments, IBM, Analog Devices, Qualtre, Inc., TDK and currently is GM, Gas and Environmental Sensing at Interlink Electronics. He has a PhD in ECE from University of California, Irvine and an MBA from Northeastern University. 

Radislav Potyrailo is a Principal Scientist at GE Research and the Chair of the Device Working Group of the MEMS and Sensors Industry Group. Radislav has been leading multiple programs for gas, chemical, and biological detection on inventing new sensing systems and bringing them from lab feasibility studies, to field validation, and to commercialization.  He has MS degree in Optoelectronics from Kyiv Polytechnic Institute and PhD in Analytical Chemistry from Indiana University. 

Ryotaro Sakauchi is a Senior Manager at Robert Bosch LLC and is responsible for Business Development of Bosch Sensortec’s MEMS sensors for the consumer market. He has been in the MEMS sensor sector for the last 13 years and has previously held technical and business positions at Bosch’s USA and Japan locations. He has a Bachelor’s degree of Liberal Arts from International Christian University in Japan.

Virtual, Online
United States

Paul Carey
Paul Carey
Sr. Director
SEMI MSIG
Sreeni Rao
Dr. Sreeni Rao
GM of Gas & Environmental Sensing
Interlink Electronics
Radislav Potyrailo
Radislav Potyrailo
Principle Scientist
GE Research
Ryotaro Sakauchi Bosch Sensortec
Ryotaro Sakauchi
Senior Manager Business Development
Bosch Sensortec
MSIG Standards

As miniature gas sensors become increasingly popular, especially for emerging applications, it is important for the gas sensor device community to adhere to standard ways of describing them. We propose that the first step in doing so is to standardize the set of functional parameters thatform the core of a gas sensor specification.

This presentation dives into the basic list of parameters, their definitions and measurement units, and where applicable, testing procedures, that we recommend be part of a standard gas sensor datasheet.

12:00 am - 12:00 am Off Add to Calendar Disabled America/Los_Angeles

Heidelberg, Germany – Heidelberg Instruments, a global player in direct write technology and solution provider for the advanced packaging market, is transforming the semiconductor industry with its maskless laser lithography system, the MLA 300. Continuous and repeat orders of MLA 300 systems confirm Heidelberg Instruments' capabilities and customer satisfaction.

MLA 300 is increasing production capacity for wafer-level packaging providers.

Flexible designs, high throughput, uniformity, and yield are the basic requirements in the semiconductor industry. The MLA 300 Maskless Aligner meets all of these requirements and more, with its capability to expose a tailor-made design on each substrate to match the actual die locations. Unlike a fixed mask, the design data can be tailored and augmented before exposure, enabling yield improvements by compensating for line width bias due to processing or loading re-mapped designs that include die shift. In addition, serial number labeling and other dynamically generated, unique patterns can be added to each exposure.

The MLA 300 is optimized for industrial volume production and features distinct benefits such as full automation. The flexibility of maskless lithography allows rapid design customizations, even unique designs on each substrate, which can be updated automatically. This is particularly useful for chip packaging where mounted die shift due to the curing of a reconstituted wafer or panel. The MLA 300 system seamlessly integrates into wafer-level packaging production lines, fully automating production with a resolution down to 2 µm lines and spaces. Customers benefit from reduced production costs and efforts by eliminating mask procurement, verification, and management requirements. Operating costs are reduced by utilizing a long-lifetime exposure laser and fewer consumables. The modularity enables fast maintenance, replacement, or repair. Real-time autofocus compensates substrate warp or corrugations for flawless patterning.

“We are thrilled to witness this cutting-edge technology’s impact on the industry, and we’re excited that many important companies and groups are taking this journey with us. The MLA 300 is a game-changer in maskless lithography,” states Alexander Forozan, Head of Global Sales and Marketing at Heidelberg Instruments Group. “Its revolutionary features transform the production process, delivering unmatched precision and high throughput. So, whether you want to enhance productivity or streamline your operations, the MLA 300 is designed to exceed your expectations.”

Introduced into the market at the end of 2019, the MLA 300 Maskless Aligner is the first direct exposure system specially designed for industrial applications in advanced packaging, wafer-level packaging, electronics components, sensors, MEMS, and many more.

With continuous order intakes from leading wafer-level packaging providers in Asia, the Heidelberg Instruments MLA 300 Maskless Aligner has proven capabilities and customer satisfaction, making the company poised for growth in the demanding and fast-growing high-technology market.

Contact:
Sonja Pfeuffer
Head of Global Marketing
[email protected]

Further information:
https://heidelberg-instruments.com/

About Heidelberg Instruments Mikrotechnik GmbH
With over 35 years of experience and over 1,300 systems installed worldwide, Heidelberg Instruments is a world leader in designing, developing, and manufacturing high-precision laser lithography systems, maskless aligners, and nanofabrication tools. Industry stakeholders and working groups of renowned universities and research institutes worldwide use Heidelberg Instruments systems for advanced micro- and nanofabrication. Fields of applications include micro-optics and microsystems technology, photonics, electronics, semiconductors/ advanced packaging, quantum computing, MEMS/NEMS, micro-mechanics, biomedical engineering, 2D materials, IoT, and many more. Heidelberg Instruments provides lithography solutions tailored to meet our global customers' micro- and nanofabrication requirements – no matter how challenging.

RoodMicrotec shows strong financial performance for the year 2022.
• Total income of EUR 16.5 million with an EBITDA of EUR 3.9 million
• Net profit of EUR 2.4 million
• Cash flow from operating activities of EUR 3.6 million

Deventer, April 20, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the Company’s Annual Report for the financial year 2022 including the audited consolidated and company financial statements. The 2022 Annual Report is available for download on the corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.

The total income for 2022 amounted to EUR 16.5 million, which is 14% higher than in 2021 (EUR 14.5 million) resulting in a second consecutive year with double-digit growth. Notably, this is the highest total income since 2000, and it shows that RoodMicrotec is focusing on the right fast-growing future-oriented markets.

“Once again, we managed to exceed the outlook and deliver a higher total income as well as a higher profit. In the first and second quarter of 2022, we generated a total income that was similar to the fourth quarter of 2021, which was a very good start of the year,” says Martin Sallenhag, CEO of RoodMicrotec. “In the third and fourth quarter of 2022, we saw a steady increase in total income making the full year the best in over 20 years. The profit before tax for the year as well as the overall liquidity put us in a good position for future investments in machinery and services. This allows us to focus on growing the business with new customer engagements.”

Throughout the year, the Test Operations department continued to deliver outstanding results. The total income increased from EUR 7.9 million in 2021 to EUR 10.0 million in 2022, which is a growth of 26%. Our long term customers are increasing their demand and we are able to support them with additional capacity. In 2022, we have added both manpower and new machines to support the expanding business.

The Supply Chain Management unit is growing thanks to long-term projects. The total income increased from EUR 3.4 million in 2021 to EUR 3.5 million in 2022, a growth of 5% year-over-year. This is also driving turnover in the other units, especially in the Test Operations department.

In the Qualification & Failure Analysis department we have seen a big increase in request for counterfeit analysis. Due to the shortage of components, it is becoming more important to analyze the used components before going into mass production. RoodMicrotec is the first and only company in Germany to offer the counterfeit electronic parts standard SAE AS6081 as an accredited method according to DIN EN ISO/IEC 17025:2018.

2022 HIGHLIGHTS / MAIN DEVELOPMENTS

Financials
• Total income: EUR 16.5 million (2021: EUR 14.5 million).
• EBITDA: EUR 3.9 million (2021: EUR 2.8 million).
• Balance sheet total: EUR 17.2 million (2021: EUR 15.0 million).
• Net result: EUR 2.4 million profit (2021: EUR 1.4 million profit).
• Net cash flow from operating activities: EUR 3.6 million (2021: EUR 2.0 million).

Commercial/operational
• RoodMicrotec has continued to expand its services in the areas defined in the Company’s technology roadmap. High frequency test solutions are being developed for our demanding customers based on this new technology and their demand for production test.
• The first projects to qualify high power electronics according AQG 324 have been started in the Qualification & Failure Analysis department. These new services have been added to handle high power devices aimed for battery management and control.
• RoodMicrotec and Rohde & Schwarz have been working together for over 10 years and in this period RoodMicrotec has carried out the test development for various high frequency ASICs used by Rohde & Schwarz in their products. RoodMicrotec performs wafer and component level tests as well as qualifications prior to product launch. For the coming years, further projects of this kind are already scheduled.
• The world leader in UWB (Ultra-Wideband) sensing solutions, Novelda, and RoodMicrotec have reached an agreement on qualification, test, and supply of a new generation of UWB devices. The Ultra-Wideband Sensor can detect the tiniest movements, even breathing and heartbeat. The cooperation with RoodMicrotec as European partner enables Novelda to manage faster qualification and industrialization of new products. Effective collaboration, both on engineering and management level, and combining each partner’s expertise is allowing ‘first time right’ development of test solutions, qualification processes, and the rapid launch of production testing and supply.
• The order book is at a higher level than in the beginning of the year, even though the total income was higher than budgeted. This means that the book-to-bill ratio was above 1 for the year.
• During 2022, we have continued to progress the booked SCM projects towards production through test program development as well as qualification work. Some projects have been released for production and we start to see the first volumes for these customers. The turn-key project for a Swiss customer, which includes the design of an ASIC by a design house partner, packaging of the device in Asia, qualification, and in-house test development, is progressing well. The volume production for this device will be launched early in 2023 in the RoodMicrotec facility in Nördlingen.
• The nationally and internationally funded APPLAUSE project “Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe,” fosters the European semiconductor value chain by building new tools, methods and processes for high volume manufacturing. RoodMicrotec has taken over the leadership of the work package “testing, reliability, failure analysis and metrology”. The project has delivered exceptional results with significant immediate or potential impact. The progress over the last period was convincing.
• As a full and final settlement of the 2012 perpetual bond, RoodMicrotec GmbH has paid Robus a total settlement amount of EUR 400k nominal, i.e. without any interest, in two equal nominal installments of EUR 200k on February 28, 2022 and June 30, 2022. This final settlement has been reached before and confirmed by the Regional Court of Hamburg in February 2022.

Events after balance sheet date
• RoodMicrotec GmbH has entered into an agreement for a full and final settlement with Prime Capital Debt SCS, SICAV-FIS – Robus Recovery Sub-Fund (“Robus”) regarding the perpetual bond that RoodMicrotec GmbH issued in 2010 and which is held by Robus.

Following an oral hearing held on March 7, 2023, both parties have reached agreement on a full and final settlement that was reached before and confirmed by the Regional Court of Frankfurt am Main. Pursuant to the settlement, RoodMicrotec GmbH shall pay a total amount of EUR 2,194k (110% of the nominal value of the perpetual bond issued in 2010), in four equal installments of EUR 548k, by March 31, June 30, September 30, and December 31, 2023.

Key figures
(x EUR 1,000 unless stated otherwise) 2022 2021

Results & Cash
Total income 16,548 14,532
EBITDA 3,898 2,786
EBITDA as % of total income 23.6% 19.2%
EBIT (operating result) 2,451 1,227
EBIT as % of total income 14.8% 8.4%
Profit (loss) before tax 2,271 1,038
PBT as % of total income 13.7% 7.1%
Net result 2,380 1,435
Net cash position (year-end) 3,682 2,558
Net cash flow from operating activities 3,553 2,049

Capital, Debt & Liquidity Ratios (at year-end)
Total assets 17,197 15,014
Equity 7,850 5,583
Net debt -805 374
Invested capital (net debt + equity) 7,045 5,957
Gearing ratio (net debt / invested capital) -11% 6%
Solvency (equity / total assets) 46% 37%
Debt ratio (net debt / EBITDA) -0.2 0.1
Net working capital (working capital - net cash position) 211 317
Net working capital ratio (net working capital / total income) 1.3% 2.2%
ROCE (EBIT / average invested capital) 37.7% 21.0%

Assets (at year-end)
Tangible and intangible fixed assets 8,765 8,295
Investments in (in)tangible fixed assets 1,743 681
Depreciation of (in)tangible fixed assets 1,447 1,559

Data per share (x EUR 1)
Equity 0.105 0.074
Operating result 0.033 0.016
Net cash flow from operating activities 0.047 0.027
Net result 0.032 0.019
Share price: year end 0.205 0.201
Share price: highest in the year 0.215 0.267
Share price: lowest in the year 0.171 0.176

Other information
Number of issued shares at year end (in millions of shares) 75.1 75.1
Average number of employees (FTE) 94 89
Total income / average FTE 176 163
Market capitalization (in EUR millions) 15.4 15.1


Total income and result
In 2022, RoodMicrotec’s total income of EUR 16.5 million was 14% higher than in 2021 (2021: EUR 14.5 million), with 92% of its total sales effected in the European countries.
Total income from the Automotive sector increased by 18% to EUR 8.1 million in 2022 (2021: EUR 6.9 million) and represents 49% of the total income. Total income in the Industrial / Medical sector increased by 7% to EUR 6.7 million in 2022 (2021: EUR 6.3 million) and represents 40% of the total income. The HiRel / Aerospace segment declined by 8% to EUR 0.8 million (2021: EUR 0.9 million) and with 5% only represents a small percentage of the total income. The income in this sector mainly consists of failure analysis and qualification work and this is very much depending on our customers’ design cycles. Total income in other sectors increased by 105% to EUR 0.9 million (2021: EUR 0.5 million).
Total income by market sector:
(x EUR 1,000) 2022 2021 change

Automotive 8,094 6,886 17.5%
Industrial / Medical 6,683 6,270 6.6%
HiRel / Aerospace 849 926 -8.3%
Others 922 450 104.9%

Total 16,548 14,532 13.9%

Throughout 2022, the Test Operations unit showed a strong increase, which was related to the superior services and the excellent position RoodMicrotec has with its existing and new customers. The Supply Chain Management unit showed a limited increase compared to last year. The sharp increase in the second half of 2022 compared to the first half of 2022 was due to a higher demand for existing products as well as the production ramp-up in the context of new long-term contracts. In 2022, the Qualification & Failure Analysis unit saw a decrease compared to 2021. However, the total income for the second half of 2022 was 9% higher than for the first half of 2022, which shows that new customer projects are now starting.
Total income results per operational unit:
(x EUR 1,000) 2022 2021 change

Supply Chain Management 3,533 3,364 5.0%
Test Operations 10,035 7,938 26.4%
Qualification & Failure Analysis 2,980 3,230 -7.7%

Total 16,548 14,532 13.9%

Operating result
The Company recorded an operating result for 2022 of EUR 2.5 million compared to EUR 1.2 million in 2021, and thus an increase of 99.8%. The increase in total income only led to a modest rise of expenses for raw materials and consumables (in 2021, expenditures for raw materials and consumables were exceptionally high due to a high level of wafer deliveries). Combined with a lower increase in operating expenses than in total income, this led to an increase in the operating margin from 8.4% in 2021 to 14.8% in 2022.

Net result
The Company recorded a net result of EUR 2.4 million profit for 2022, which is an increase of 65.9% compared to 2021. 

Personnel and organization
During 2022, RoodMicrotec continued to optimize the organization to keep track with the changing demands from customers and markets. Furthermore, highly experienced personnel has been recruited for support of the Company’s future plans. The average number of full time employees (FTE) in 2022 was 94. Total income per average full-time employee increased to EUR 176,000 from EUR 163,000 in 2021. RoodMicrotec’s policy is to strive for growth of sales per FTE.
Looking back, RoodMicrotec got through the COVID-19 period very well and without any material impact on staffing levels. The measures taken with facial masks, distance between the working places, home offices, and general care, offered a safe environment for all employees.

Outlook
RoodMicrotec expects the total income for 2023 to be in the range of EUR 17.0 million to EUR 17.5 million, with a profit before tax of 5-10% and thus in line with the financial targets. The geopolitical situation in the world and the current energy crisis throughout Europe could have an impact on the Company’s business. The Management is keeping a close eye on the situation and is doing everything possible to mitigate any potentially negative impact.

Conference call
You are invited to take part in RoodMicrotec’s conference call for shareholders, financial press, and analysts via Microsoft TEAMS on
Thursday, April 20, 2023 at 9:30 CEST.
The Board of Management, Martin Sallenhag and Arvid Ladega, will comment on the Annual Report 2022 in detail and will answer your questions.
To join the event please follow these login instructions:
Join with your computer or mobile app Click here to join the meeting
Or call in (audio only)
+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich

Find a local number – in case you are in another country
Phone Conference ID: 124 673 558#
Annual General Meeting of Shareholders
The Annual General Meeting of Shareholders of the Company will be held on Tuesday, June 6, 2023 at 15:00 CEST at the Amsterdam Stock Exchange (EURONEXT), Beursplein 5, 1012 JW Amsterdam, the Netherlands.
The convening notice (including registration and voting instructions) and the agenda with explanatory notes, as well as all other meeting documents for the AGM, including the 2022 Annual Report and the 2023 Remuneration Policy are available for download on our corporate website:
www.roodmicrotec.com/en/investor-relations-en/annual-general-meeting.

Financial calendar
June 6, 2023 Annual general meeting of shareholders
July 20, 2023 Publication interim report 2023
July 20, 2023 Conference call for media, analysts and shareholders
October 19, 2023 Trading update quarter 3-2023

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses of the Board of Management, and on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates, and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare, and industrial sectors. RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

• Total income for the first quarter of 2023 was EUR 4.6 million (first quarter 2022: EUR 3.6 million)
• Order book value increased by 12% compared to March 31, 2022
• Invitation to the presentation of the 2022 Annual Report on April 20, 2023 at 9.30 CEST

Deventer, April 13, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the first quarter of 2023. The total income for the quarter was EUR 4.6 million, which is 28% higher than the total income in the first quarter of 2022. Having in mind the forecasted increase of the total income in 2023 over last year, it is encouraging to see the growth in total income in the first quarter and that the order book continues to rise. The order book contains orders for both long term contracts and engagements as well as short-term orders. The long term contracts and engagements are mainly in the SCM and Test Operations units and the short-term orders in the Failure Analysis & Qualification unit.

“I’m very proud to be able to report another increase in total income for the first quarter of 2023. We are working very hard to support our customers in their demanding test and qualification tasks and the continuous high level of total income shows that we are doing a good job”, says Martin Sallenhag, CEO of RoodMicrotec. “The steady increase in the order book is a good indicator for the rest of the year and makes us confident for the future.”

RoodMicrotec will publish the 2022 Annual Report before the opening of the Euronext Amsterdam stock exchange on Thursday, April 20, 2023. The Company’s Board of Management, Martin Sallenhag and Arvid Ladega, will comment on the report and answer questions during the conference call for media, analysts and shareholders to be held on Thursday, April 20, 2023 at 9:30 CEST.

You are invited to join the Microsoft TEAMS event using the following login instructions:
Join with your computer or mobile app Click here to join the meeting
Or call in (audio only)
+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich
Find a local number – in case you are in another country
Phone Conference ID: 124 673 558#

Outlook
RoodMicrotec expects the total income for 2023 to be in the range of EUR 17.0 million to EUR 17.5 million, with a profit before tax of 5-10% and thus in line with the financial targets. The geopolitical situation in the world and the current energy crisis throughout Europe could have an impact on the Company’s business. The Management is keeping a close eye on the situation and is doing everything possible to mitigate any potentially negative impact.

Audit
The financial data in this press release have not been audited.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany
For more information visit https://www.roodmicrotec.com

[April 10, 2023 – Taipei, Taiwan] Test Research, Inc. (TRI) has unveiled its latest innovation in Conformal Coating Inspection, the TR7700 SIII Ultra CI. Equipped with advanced optical design, specialized multi-phase lighting, and intelligent inspection algorithms, this cutting-edge AOI can detect coating issues with unprecedented accuracy, measure coating thickness, and inspect dispensed flux and glue.

The TR7700 SIII Ultra CI AOI can precisely measure coating thickness from critical areas on the PCB, detecting unwanted coating spills near PCB connectors, sensitive components, and designated mounting holes. The CI software can identify common coating issues, including cracks, bubbles/voids, insufficient/excess coating, and loss of adhesion, with innovative algorithms calculating the maximum/minimum coating coverage length and measuring coating length, splash, or insufficient coating. The coating thickness measurement range is from 35 μm to 750 μm.

The Smart CI AOI allows for the creation of coating maps from CAD data for rapid deployment. The smart programming also extends to learning and tuning the coating programming for an accurate inspection.

Upgrade your conformal coating inspection with TRI's latest technology. For more information about the TR7700 SIII Ultra CI, please visit the link below, https://www.tri.com.tw/en/product/product_detail-60-2-1689-1.html.

TRI's PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0, can help manufacturers realize their production line's full potential. These systems are designed to interoperate with other manufacturing equipment, minimize downtime, optimize production quality, and reduce operator workload.

About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. From Optical Inspection to Board Testing, TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] call +886-2-2832 8918.

SLiM 100 delivers real-time detection and quantification of VOCs to the 1 ppb level

Santa Clara, CA — March 14, 2023 — Picarro Inc., a leading provider of chemical metrology systems for advanced semiconductor fabs, today announced the SLiM 100 Lithography Process Tool Monitoring System. The new 1-ppb class chemical metrology solution detects volatile organic compounds (VOCs) in the lithography process in real time, enabling semiconductor manufacturers to quickly take steps to prevent excursions and detect non-visual defects, thereby improving yield.

As design features shrink, small amounts of airborne molecular contamination (AMC) from VOCs are resulting in significant increases in non-visual defects on reticles and wafers. Crystal growth defects on reticles, hazing of scanner optics, and t-topping of photoresists are some of the serious problems that are caused by the presence of undesired VOCs. Ultimately, these contaminants not only damage expensive lithography tools; they result in yield loss on the wafer.

To mitigate the negative effects of VOCs in the lithography process, fab operators need real-time measurements of VOCs at very low concentration levels. This is very difficult to do in the fab environment with traditional technologies because they are slow and difficult to use.

The SLiM 100 system is a real-time measurement system that is designed to run 24/7 in the fab environment. It is a fully integrated chemical metrology system that is robust, easy to operate, and is ideal for use as a high-volume process monitoring and control system. It measures and monitors 10 organic compounds that negatively affect the lithography process with concentration sensitivity down to 1 part per billion. The system can also accommodate analyzers that measure inorganic molecules at parts-per-trillion concentration levels.

“The Picarro SLiM 100 enables fab operators to detect and resolve semiconductor manufacturing issues much faster than other solutions,” said Dr. Sanjay Yedur, Director of Product Management at Picarro. “This robust system will allow them to reduce costs by halting production of defective wafers sooner and minimize downtime of lithography tools for maintenance and repair."

About Picarro Semiconductor Solutions
Picarro’s Semiconductor business offers industry leading solutions for airborne molecular contamination (AMC) and chemical contaminant monitoring within fabs and process tools. Picarro’s Semiconductor solutions respond to contaminants in seconds, not hours, enabling semiconductor manufacturers to quickly mitigate contamination events in cleanrooms, FOUP, and lithography process equipment – improving production yield. For more information, visit semi.picarro.com.

Applied Nanolayers BV (ANL) and SoundCell BV (a spin-off from Technische Universiteit Delft TUD), today announced they have received 275,000 EUR R&D funding from Provincie Zuid-Holland to develop a prototype for SoundCell’s high throughput single-cell graphene antibiotic sensitivity test.

The announcement follows research undertaken at TU Delft and published in Nature Nanotechnology last year where ultrathin bilayer graphene was used to detect nanoscale forces – at least 1000 times smaller than a mosquito bite – generated by single bacteria.

By tracking the changes in the bacteria’s nanomotion when different types of antibiotics are administered, the team were able to demonstrate that graphene drums can effectively perform antibiotic susceptibility testing with single-cell sensitivity.

This breakthrough in measuring antibiotic efficacy has major implications for public health worldwide. The technology has the potential to enable very fast antibiotic testing in healthcare settings, giving physicians a much more effective diagnostic toolkit for fast detection of antibiotic resistance in clinical practice, leading to more effective treatment, and acting as an invaluable tool in the fight against antibiotic resistance.

The 18-month project will optimise the antibiotic sensitivity platform, bringing it closer to market. Enhancing the throughput of the platform, developing faster read-out schemes, and validating it against a variety of pathogenic samples, the funding will accelerate development of a clinical-grade graphene-based antibiotic screening device that is manufacturable in high volumes.

Paul Hedges, CEO of Applied Nanolayers, said, “The team at SoundCell has made a phenomenal scientific breakthrough, and ANL will provide the quality and volumes of graphene needed to deliver on that vast potential. Our work over the next few months will therefore focus on delivering suitably sensitive chips with arrays of graphene membranes that can be reliably manufactured in the high volumes that will be required by healthcare providers.”

Aleksandre Japaridze, CEO of SoundCell, added: “Proving the commercial viability of this test over the next 18 months represents the cutting edge of the fight against antibiotic resistance, an ever-increasing threat to human health. It is an issue that demands innovative and-out-of-the box solutions and using graphene to detect nanoscale vibrations offers a unique method for monitoring the efficacy of antibiotics.

By developing a much faster and more sensitive method for diagnosing bacterial resistance – that can be used by doctors worldwide – our work with ANL is a critical effort in the fight against a threat that endangers millions of lives worldwide.”

About Applied Nanolayers BV
Applied Nanolayers (ANL) is based in the city of Delft in the Netherlands. We are a high volume 2D material foundry and producer of monolayer graphene and other high performance 2DM wafers to 200mm (8”) diameter.

Deventer, March 8, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today announces that its wholly owned subsidiary RoodMicrotec GmbH has entered into an agreement for a full and final settlement with Prime Capital Debt SCS, SICAV-FIS – Robus Recovery Sub-Fund ("Robus") regarding the perpetual bond that RoodMicrotec GmbH issued in 2010 and which is held by Robus.

As announced on 21 February 2022, Robus had initiated legal proceedings against RoodMicrotec GmbH before the Regional Court of Frankfurt am Main. Robus claimed being entitled to an 11.7% compensation payment in relation to 2017, 2018 and H1-2021. In addition, alleging non-compliance by RoodMicrotec GmbH of the terms and conditions of the 2010 perpetual bond, Robus claimed the immediate and full repayment of the nominal amount of the perpetual bond asserting grounds for the extraordinary termination of the perpetual bond. The total amount claimed by Robus in the proceedings amounted to EUR 2,568k to be increased with 11.7% interest for the applicable period.

Following an oral hearing held on 7 March 2023, the parties have reached agreement on a full and final settlement that was reached before and confirmed by the Regional Court of Frankfurt am Main. Pursuant to the settlement, RoodMicrotec GmbH shall pay a total amount of EUR 2,194k, in four equal instalments of EUR 548k each, by 31 March, 30 June, 30 September and 31 December 2023. RoodMicrotec will be able to pay the installments from free available cash.

RoodMicrotec is pleased that the ongoing litigation procedure is now settled and the dispute is closed.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors.
RoodMicrotec’s headquarter is located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information visit https://www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

Rochester, N.Y. – Linton Crystal Technologies (LCT), headquartered in Rochester, New York, announced today it will produce semiconductor and solar manufacturing equipment in the United States. This is the first Inflation Reduction Act related announcement for producing solar machine tools in the United States. LCT plans to break ground in Q2 2023.

“We’ve been working on this plan for a while now and are looking forward to reshoring manufacturing to the United States,” said Todd Barnum, president and CEO of Linton Crystal Technologies. “As a U.S. company with Chinese ownership, Linton Technologies Group, the geopolitical issues have been difficult to navigate. Our company used to manufacture in Rochester and we’re eager to get back to the United States.”

Efforts are underway to secure a site as soon as possible, with future plans for expansion to accommodate international orders as necessary. Linton is also developing an international service team to support customers worldwide as the industry looks to grow and improve processes and efficiency.

The company will establish a manufacturing center to build and demonstrate the full line of equipment represented by Linton Technologies Group. This includes Czochralski (CZ) furnaces for monocrystalline silicon ingots, both semiconductor and solar grade, and the machines for producing solar ingots and wafers, including wire saws and polishing equipment. Linton will be the first company to return this technology to the United States.

Linton’s initial investment of $10M will be used to add a new facility, establish a demonstration line, and build 1-2 gigawatts of production capacity, all by the end of year one. This will grow the company’s workforce to more than 75 employees. Linton’s goal is to exceed 2008 employment numbers, when the company had nearly 200 employees, at its New York factory by the end of year two.

“I’m excited to break ground. This creates more opportunities for our employees, new employees and their families,” Barnum said. “The IRA and CHIPS Act have created the pathway for manufacturing investment to fulfill the need for U.S.-made products. We’re going to meet that demand and we have the expertise to scale rapidly.”

About Linton
Linton Crystal Technologies has a long history of manufacturing innovation. The company originated in Rochester in 1952 as a wire saw manufacturer, Hamco, and through a series of purchases became Kayex, a manufacturer of CZ crystal pullers. Linton has been the exclusive owner of Kayex technology since 2013 (the IP resides with LCT in the United States). The company also continues to advance the design of the machines. It holds several patents, with others under application.
For more information, visit www.lintoncrystal.com.

PENANG, MALAYSIA - FEBRUARY 2023 Wafer inspection is always a critical stage for quality assurance for wafer foundry, integrated device manufacturing (IDM), fabless, and outsourced semiconductor assembly & test (OSAT). Since semiconductor devices are continuously getting smaller and more complex, the requirement for wafer inspection has become more stringent to accommodate these changes. However, defects on the wafer may be overlooked and may pass through the final stages of fabrication and assembly if they are not eliminated or filtered out, which could be a costly mistake for the manufacturers. Consequently, this will lead to increasing demand for quality wafer production.

At ViTrox, we aim to be the World’s Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions. Therefore, we would like to introduce our all-new Wi8i G2 PRO Wafer Vision Inspection Handler, which is designed to offer high flexibility in wafer handling, cover different semiconductor processes and high-accuracy inspection results to the users of the semiconductor market, and is also an expansion to the inspection capabilities of our existing Wafer Vision Inspection Hander - Wi8i G2.

One Solution For Two Semiconductor Processes
The all-new Wi8i G2 PRO solution is enhanced with hardware and programming features to accommodate both bare wafers (pre-dicing process) and mounted wafers (post-dicing process) inspection requirements. This innovative configuration eliminates the need for hardware conversion on the wafer robot arm when inspecting these two wafer types of the same size, which is suitable for production involving both pre-and-post-dicing processes and/or having a high-mix-low-volume of bare and mounted wafers. Hence, our Wi8i G2 PRO is the ideal solution to deliver high overall equipment effectiveness (OEE) which guarantees excellent wafer quality without any machine stop time.

Ability To Handle Up To 12” Wafers & FOUP
Based on the current market trend, there is a demand for wafer inspection equipment to cater to larger wafers due to the increasing number of chip-related productions. To address this, our Wi8i G2 PRO offers a significant enhancement in catering to a new type of wafer carrier box, Front Opening Unified Pod (FOUP) which is particularly important to users with such production practice to accommodate 12 inches of bare wafer transferring. Nowadays, FOUPs are the preferred carrier boxes to handle raw water because FOUPs offer a sealed wafer environment that provides static protection, white-light shielding, and control of moisture and oxygen. Today’s FOUPs not only address particles, but also minimize and control volatile organic compounds (VOCs), oxygen, and relative humidity. Any of these potential contamination sources can negatively impact device yield. Alternatively, should the user need to handle framed wafers, they can opt for a metal cassette instead.

Users are also able to configure their load ports based on their production needs, which can be either:
FOUP + Metal cassette
FOUP + FOUP
Metal cassette + Metal cassette

This load port design accommodates both 8 inches and 12 inches of metal cassettes on the load ports, which translates to cost-effectiveness on different-sized wafer inspections!

Robust Wafer Inspection With Our Advanced Vision Optics
Wi8i G2 PRO is not only equipped with robust vision optics that provides high-quality image under different magnification lenses but also integrates an advanced deep-learning algorithm in defect detection and determining the defect types. When a user’s wafer has a complex circuit design and/or is required to inspect different defect types at different regions, this algorithm is the perfect solution for enhancing the accuracy of defect detection.

With the combination of cutting-edge wafer handling mechanisms and robust wafer vision inspection, our latest Wafer Inspection Solution is guaranteed to solve your production pain points! Additionally, we also seek to better understand our customers’ needs in their production line and boost their production yield and also significantly reduce their long-term costs.

Interested to know more about our Wi8i G2 PRO? Do get in touch with our Sales Expert Ms Kong Poh Mei ([email protected]). To top it off, we also invite you to visit us here at ViTrox Campus 2.0 in Penang, Malaysia for a demonstration of the solution. We look forward to serving you!

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company to provide the most innovative, advanced, and cost-effective machine vision solutions of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Electronics Communication Systems, and Industry 4.0 Manufacturing Intelligence Solutions. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States, as well as sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.