Samco, a leading manufacturer of etching, deposition and surface treatment processing equipment for the semiconductor and related industries and academic facilities, launches the new Plasma Enhanced Atomic Layer Deposition (PEALD) system, "AD-800LP". The main target of the system is gate oxide film deposition for next-generation power devices of silicon carbide (SiC) and gallium nitride (GaN) materials, which will play important role toward carbon neutral.

The plasma enhanced ALD system "AD-800LP" is a multi-purpose R&D system equipped with a unique ICP plasma source called "Tornado ICP", in addition to the conventional thermal ALD capability. AD-800LP enables various film deposition such as oxide or nitride films by Tornado ICP, which is Samco's proprietary plasma technology and is different from remote plasma. Tornado ICP enables stable plasma discharge even in the high-pressure range during ALD deposition.

“We are also considering a cluster ALD system that can connect multiple reaction chambers for production” says Tsukasa Kawabe, President and COO of Samco. “The launch of the AD-800LP will greatly enhance our presence in the world ALD equipment market.” Tsukasa adds.

As a global mid-sized company, Samco has successfully delivered numerous dry etch systems and plasma enhanced CVD systems for the electronic device field, mainly for compound semiconductors such as SiC, GaN, and GaAs, not only in Japan but also in the United States, Europe, Taiwan, Korea, China, Southeast Asia, India, and other countries.

The new Research Center for Nano Thin Films & Materials, which opened in February 2022, conducts research and development of unique thin film deposition, including ALD system. Samco will continue to utilize our "thin-film technology" to develop unique products and expand sales globally.

AD-800LP system photo

About Samco Inc.
Samco Inc. (TSE: 6387) stands for Semiconductor And Materials Company, and is a leading manufacturer of processing equipment for the semiconductor and related industries founded by Mr. Osamu Tsuji in Kyoto, Japan in 1979. Over the past forty-three years, more than 4,300 Samco systems have been installed and used in 35 different countries. Its equipment and thin film technology are widely adopted in the fabrication of semiconductor devices, including BAW filters, SiC power devices, GaN RF devices, GaAs VCSELs, InP lasers, microLEDs, MEMS, TSVs, advanced packaging, and so on. Learn more at https://www.samcointl.com/.

Company Contacts:
TSUCHIHASHI, Atsushi
Public Relations
Phone: 81-75-621-7841
E-mail: [email protected]

• Read more about Samco Unveils Plasma Enhanced ALD System for SiC and GaN Power Devices

Illinois Institute of Technology (Illinois Tech) alumnus Rick Carlson (MATH ’70), vice president of sales for Verific Design Automation, a leading provider of SystemVerilog, Verilog, VHDL, and UPF Parser Platforms, has been elected to the College of Computing Board of Advisors.

Carlson graduated from Chicago’s comprehensive tech-focused university with a Bachelor of Science in Mathematics and was also a member of the Illinois Tech men’s basketball team. “I’m exceptionally proud to join the College of Computing’s Board of Advisors,” he says. “Illinois Tech and the College of Computing provide students of all backgrounds with the best-in-class computational and data science platform to excel in their respective fields.”

With more than 40 years of experience in the electronic design automation (EDA) industry, Carlson will help the College of Computing promote its collective power of difference to advance technology and progress for all. He will serve as an advocate to reinforce the college’s position as the leading creator of computational talent, knowledge and innovation for Chicago and beyond.

Carlson is a Lanza techVentures Investment Partner and an adviser to many EDA startups in his role as vice president of sales for Verific. He was one of the co-founders of the ESD Alliance (formerly the EDA Consortium), an industry trade association that is a SEMI Technology Community. While at Highland Software (now Flexera Software), Carlson helped launch FLEXlm, a software license manager intended for corporate environments to provide floating licenses to multiple computer software end users.

About Illinois Institute of Technology’s College of Computing
Illinois Tech created the College of Computing in 2020 as part of an effort to drive Chicago’s thriving tech ecosystem by educating a future diverse workforce that is rigorously trained in data and computation. Illinois Tech is home to the Midwest’s only Bachelor of Science in Artificial Intelligence degree, and the numerous cybersecurity and intelligence pathways at Illinois Tech explore not only the deep foundations of fast-growing fields of computer science, but also emphasize societal ethics in developing this technology. The United States Department of Homeland Security and the National Security Agency have designated Illinois Institute of Technology (Illinois Tech) as a National Center of Academic Excellence in Cyber Defense Education. The university’s Center for Cyber Security and Forensics Education (C2SAFE) is at the core of Illinois Tech’s designation. Additionally, the center is a member of the United States Strategic Command (USSTRATCOM) Academic Alliance and North American Defense and Security Academic Alliance (NADSAA).

About Verific Design Automation
Verific Design Automation is the leading provider of SystemVerilog, Verilog, VHDL and UPF Parser Platforms that enable project groups to develop advanced electronic design automation (EDA) products quickly and cost effective worldwide. With offices in Alameda, Calif., and Kolkata, India, Verific has shipped more than 60,000 copies of its software used worldwide by the EDA and semiconductor industry since it was founded in 1999.

Engage with Verific at:
Email: [email protected]
Website: www.verific.com
LinkedIn: https://www.linkedin.com/company/verific-design-automation-inc/
Facebook: https://www.facebook.com/Verific-Design-Automation-100448363329771/

• Read more about Verific’s Rick Carlson Appointed Advisory Board Member for the College of Computing at Illinois Institute of Technology

In the two-day event, leading manufacturing partners will show how application visions in manufacturing are implemented through concrete software solutions and considerations. You will experience first-hand the presentation of application case details from various industrial manufacturers and their ongoing collaboration with partner camLine.

In association with Elisa IndustrIQ, you will get first insights into camLine’s AI-driven manufacturing strategy. Development highlights of camLine’s sophisticated LineWorks Suite, InFrame Synapse, XperiDesk, and Cornerstone software products will also be presented for discussion. Several solution demo stations will be available in the foyer.

In the User Group Meetings, participants are given the opportunity to vote on the priorities of future product
developments.

Register now: https://www.camline.com/forum-registration/

• Read more about camLine forum 2022

Kitchener, Ontario, July 27, 2022 – PEER Group®, the largest supplier of innovative factory automation software for the semiconductor industry, is inviting software developers to register for a virtual hiring event happening on August 16, 2022, beginning at 4:00 p.m. ET.

The hiring event is part of the Kitchener-based software company’s planned growth strategy to add talented resources across all engineering departments to meet the demand for its software products and solutions. The openings are located at the company’s Toronto and Kitchener offices.

The two-hour drop-in event will provide attendees the opportunity to learn about the current openings and speak with PEER Group representatives, including members of the software development management team, several software developers, and the talent acquisition team.

“This is a great time to start a career in the semiconductor industry,” shares Mike Pryzmant, PEER Group’s Director of Engineering Services. “Our software teams do amazing work making sure the world’s largest semiconductor factories and tools are operating at their best. The challenges we face are complex, exciting, and always interesting.”

Scott McKee, PEER Group’s Talent Manager, along with members of his team, will be present to share details about working at PEER Group, including the hybrid work model, flex hours, comprehensive benefits plan, expert mentorship, personal development and career opportunities, profit sharing, and more.

“The way we designed this hiring event is to give jobseekers a forum to learn about anything they want to know about our culture, industry, or development projects,” says McKee. “We’ll have several team members, both technical and from the HR side, who will be able to provide in-depth answers to any questions prospective candidates may have.”

PEER Group has been having a banner year in 2022, which marks the company’s 30th year in business. In March, PEER Group was named a 2022 Intel EPIC Outstanding Supplier – one of only six companies out of more than 9,000 Intel suppliers to receive the recognition. Great Place to Work Canada named PEER Group one of Canada’s Best Workplaces for the 11th time. The company also opened a new 4,000 sq. ft. office in the heart of downtown Toronto.

Those interested in attending the hiring event can register by completing the form and uploading a resume using the link below. All attendees will be entered into a draw for a chance to win an Apple iPad.

PEER Group Hiring Event registration page: https://bit.ly/3zpZpiV .

About PEER Group
PEER Group® is a leading supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..

• Read more about PEER Group inviting software developers to attend virtual hiring event

Deventer, July 27, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and Rohde & Schwarz GmbH & Co. KG, a market leader in the fields of measurement technology and communications, today announce the continuation of their longstanding partnership through several new projects in ASIC development.

The two companies have been working together for over 10 years and in this period RoodMicrotec has carried out the test development for various high frequency ASICs used by Rohde & Schwarz in their products. RoodMicrotec performs wafer and component level tests as well as qualifications prior to product launch. For the coming years, further projects of this kind are already scheduled.

"At Rohde & Schwarz, we rely on our own in-house expertise to develop our high-performance ASICs and therefore count on partners who share our high standards. We appreciate the quality RoodMicrotec offers - from quotation to test development, qualification and volume testing," says Bastian Nagel, Senior Director Mixed Signal ASIC Development at Rohde & Schwarz.

RoodMicrotec also appreciates the collaboration with Rohde & Schwarz, especially the respectful interaction and the high level of professional expertise.

Jan de Koning Gans, Managing Director of RoodMicrotec GmbH says: "Our projects with Rohde & Schwarz constantly pose new technical challenges, thus allowing us to broaden our know-how and the quality of our work from project to project."

About Rohde & Schwarz
The Rohde & Schwarz technology group develops, produces and sells a wide range of electronic capital goods. The company’s entire product portfolio represents a valuable contribution to a secure and networked world. In the markets of test & measurement, secure communications, networks & cybersecurity, as well as broadcast & media, customers around the world rely on Rohde & Schwarz and its technologically leading solutions. In addition to its well-established business areas, the Group invests in future technologies such as artificial intelligence, Industrial Internet of Things (IIoT), 6G, cloud, and quantum technology.

Further Information
Email: [email protected], Web: www.rohde-schwarz.com
 
About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany
For more information visit https://www.roodmicrotec.com

Further information
Martin Sallenhag - CEO, Arvid Ladega – CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail.

• Read more about RoodMicrotec and Rohde & Schwarz extend longstanding partnership in ASIC development

RoodMicrotec N.V. publishes the unaudited Interim Report for 2022

• Total income EUR 7.3 million (HY1 2021: EUR 7.3 million)
• EBITDA EUR 1.4 million (HY1 2021: EUR 1.3 million)
• Net profit EUR 0.6 million (HY1 2021: EUR 0.4 million)

Deventer, July 21, 2022 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today publishes the unaudited Interim Report and the half-year results for the period ended on June 30, 2022.

The total income in the first half-year of 2022 is EUR 7.3 million, which is equal to the total income reported for the first half-year of 2021 and for the second half of 2021. The stable total income is driven by a continued strong delivery level, especially in the test operations unit. In the first half of 2021 we ordered and received wafers for one of our SCM customers to manage the supply chain during a planned change of an assembly house. About EUR 0.4 million was realized for these wafers as total income and approximately the same amount was accounted for in the cost for raw materials and consumables. This resulted in a higher total income and a higher cost of materials in the first half of 2021 without an impact on the net profit. These parts will be delivered during the second half of 2022 where only part of the selling price will be recognized in the total income. The profit will therefore be positive.

EBITDA increased from EUR 1.3 million for the first half of 2021 to EUR 1.4 million for the first half of 2022. The lower cost of raw materials together with a good cost control have continued to reduce the overall costs in the first half-year of 2022.

Compared to the first half of 2021, the depreciation was lower in the first half of 2022 due to lower investments during 2021. The financing costs remained unchanged.

The net profit for the first half-year of 2022 increased by 47% to EUR 0.6 million compared to the first half-year of 2021.

(x EUR 1,000) Unaudited
HY1 2022 Unaudited
HY1 2021
Total Income 7,317 7,282
EBITDA 1,440 1,317
Net profit 644 437

 
Net cash flow from operating activities was positive with EUR 0.3 million (2021: positive with EUR 0.9 million). The change is the result of an increase in working capital during the first half of 2022. Net cash flow was negative with EUR 0.6 million (2021: positive with EUR 0.6 million). This was mainly due to the lower net cash from operating activities as well as investments and redemption of the 2012 perpetual bond during the first half of 2022.

The order book increased considerably compared to December 31, 2021, which is encouraging and indicates that a big part of the forecasted increase in total income for 2022 over last year is now covered with orders.

“Despite the general supply chain situation in the world, we have been able to continue our test operations at a high utilization level. This shows that we have logistics under control and are well prepared for the future increase in demand”, says Martin Sallenhag, CEO of RoodMicrotec. “The global shortage of semiconductor supplies as well as logistic challenges may still impact our ability to meet our plan for the full-year 2022, but we are closely monitoring the situation to be able to act if necessary.”

Unaudited Interim Report 2022
You will find the complete unaudited Interim Report 2022, which is available only in English and as an electronic version, on our corporate website: www.roodmicrotec.com/en/investor-relations-en/financial-publications.

Conference call
CEO Martin Sallenhag and CFO Arvid Ladega will present the unaudited Interim Report 2022 and respond to questions. You are invited to join RoodMicrotec’s conference call for media, analysts and shareholders (a Microsoft TEAMS event) on Thursday, July 21, 2022 at 9:30 CEST

Login-information:
Join with your computer or mobile app Click here to join the meeting
Or call in (audio only)
+49 69 509544247 Germany, Frankfurt am Main
+31 20 399 9804 The Netherlands, Amsterdam
+32 2 895 09 68 Belgium, Bruxelles
+41 43 217 23 02 Switzerland, Zurich

Find a local number – in case you are in another country
Phone Conference ID: 760 330 187#

Financial calendar
July 21, 2022 Conference call for media, analysts and shareholders
October 13, 2022 Trading update quarter 3-2022
January 26, 2023 Publication (preliminary) annual total income 2022

Forward-looking statements
This press release contains a number of forward-looking statements. These statements are based on current expectations, estimates and prognoses by the Board of Management as well as on the information currently available to the Company. The statements are subject to certain risks and uncertainties which are hard to evaluate, such as the general economic conditions, interest rates, exchange rates and amendments to statutory laws and regulations. The Board of Management of RoodMicrotec cannot guarantee that its expectations will materialize. Furthermore, RoodMicrotec does not accept any obligation to update the statements made in this press release.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.

For more information visit https://www.roodmicrotec.com
Further information
Martin Sallenhag - CEO, Arvid Ladega - CFO
Telephone: +31 570 745623 Email: [email protected] Web: www.roodmicrotec.com

This press release is only published in English. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.

• Read more about RoodMicrotec N.V. publishes the unaudited Interim Report for 2022

Established in July of 1982 by Sig, Kail, and Mariellen Wathne (hence the name, “SiKaMa”), Sikama was founded to design, develop, and manufacture high quality reflow soldering and curing systems utilizing a first of its kind high efficiency conductive heating technology to support the demands of the electronics industry.

After nearly 40 successful years, Sikama was purchased by Herb Weigel. Keeping with the mission originated by the founders, Herb’s goal is to elevate Sikama’s products to keep pace with the demands of the industry and exceed customer expectations. With an enhanced product roadmap and a growing number of services to support customers, Sikama is positioned better than ever to meet the increasing demands of its customers.

Sikama continues to grow its production space and team to meet the increasing demand for small footprint, high efficiency, and long-lasting products. In addition, with the launch of the fluxless EA UP1200, the company is positioned better than ever to meet the needs of the most demanding applications.

Here’s what was happening in 1982 when Sikama was founded:

• Time Magazine’s Machine of the Year was The Computer
• Biggest Blockbuster of 1982 was E.T.: The Extra-Terrestrial
• Superbowl XVI Champions were the San Francisco 49ers
• Billboard’s #1 Song was Physical by Olivia Newton-John
• Adobe was founded in California by Chuck Geschke and John Warnock

• Read more about Sikama International Celebrates 40th Anniversary

Chip Integration Technology Center (CITC) and Henkel announced today that the organizations have formalized an agreement to collaborate on the development of high-thermal die attach solutions for RF and power electronics. Under the terms of the partnership, Henkel will supply commercialized and developmental pressureless sintering die attach formulations and CITC will provide testing and analysis of the materials within next-generation package designs.

CITC’s Thermal High-Performance Packaging program focuses on thermo-mechanical design strategies and device packaging platforms that integrate low-stress, high-reliability rugged interconnect solutions. As die attach and molding materials are often limiting factors for the optimal operation of RF and power packages, Henkel is the ideal partner or innovation in this application area.

In addition to ongoing work in its state-of-the-art R&D centers, Henkel wants to accelerate time-to-market for its semiconductor packaging materials through strategic relationships across industry, government, and academia. CITC, which collaborates with leading power and RF device packaging companies, provides a unique opportunity to characterize and analyze Henkel’s high-thermal die attach formulations as an enabler for leading-edge device designs.

“Henkel’s pressureless sintering die attach materials are already proven in certain mobile applications,” explained Ramachandran “Ram” Trichur, the company’s Global Market Segment Head, Semiconductor Packaging Materials. “We want to extend that success to other sectors such as automotive, where large, high-power chips are the norm. Our pressureless sintering solutions are unique because they deliver the simple, low-stress processability of conventional die attach adhesives and very high thermal conductivity capabilities. The work at CITC will augment our in-house projects, allowing additional performance and reliability validation.”

The new die attach technology has the potential to enable the replacement of lead (Pb) within RF and power semiconductor devices that incorporate larger die on copper leadframes, allowing the introduction of high operating temperature gallium nitride (GaN) and silicon carbide (SiC) power die technologies. Many of CITC’s partners are actively integrating these new chip structures, making the cooperative project an excellent proving ground for Henkel’s pressureless sintering platform.

“In Henkel, we have found a material innovator that will enable the development of power and RF devices with a holistic approach that leverages the latest in die attach technology,” concluded CITC General Manager, Jeroen van den Brand. “With many major power device manufacturers based in Europe, and in Nijmegen in particular, we view this partnership as vital to satisfying the current and future demands within these important market sectors.”

About CITC
Chip Integration Technology Center (CITC) is a non-profit joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. CITC has created an effective ecosystem in which companies, research and educational institutes work on bridging the gap between academics and industry. CITC’s contribution to the ecosystem is to provide access to innovation, infrastructure and education.
www.citc.org

About Henkel
Henkel operates globally with a well-balanced and diversified portfolio. The company holds leading positions with its three business units in both industrial and consumer businesses thanks to strong brands, innovations and technologies. Henkel Adhesive Technologies is the global leader in the adhesives market – across all industry segments worldwide. In its Laundry & Home Care and Beauty Care businesses, Henkel holds leading positions in many markets and categories around the world. Founded in 1876, Henkel looks back on more than 140 years of success. In 2021, Henkel reported sales of more than 20 billion euros and adjusted operating profit of about 2.7 billion euros. Henkel employs about 53,000 people globally – a passionate and highly diverse team, united by a strong company culture, a common purpose to create sustainable value, and shared values. As a recognized leader in sustainability, Henkel holds top positions in many international indices and rankings. Henkel’s preferred shares are listed in the German stock index DAX.
www.henkel-adhesives.com/electronics

Contact
CITC: Marco Koelink | M +31 6 15 15 66 41 | E [email protected]
Henkel: Ruud de Wit | M +31 6 43 37 21 08 | E [email protected]

• Read more about CITC and Henkel forge partnership to accelerate high-thermal die attach solutions