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SEMI U

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United States Belgium France Germany Ireland Italy Training

Course Description

Elastomer seals are critical components in semiconductor manufacturing equipment, where they are routinely exposed to demanding conditions including aggressive process chemistries, plasma environments, vacuum, elevated temperatures, and repeated mechanical cycling. Understanding how elastomer properties, seal design, application conditions, and installation practices interact is essential for achieving reliable sealing performance. 

This webinar will explore common seal failure modes and the mechanisms that can contribute to premature failure, including chemical and plasma degradation, compression set, thermal effects, mechanical damage, and installation-related issues. Examples will be used to demonstrate how visual observations, application information, and engineering analysis can help identify potential root causes and guide corrective actions. 

The course concludes by presenting information on current or emerging technologies and the attendant challenges, that include hybrid bonding, co-packaged optics, and advanced substrate materials. The course also touches upon challenges with thermal dissipation for high-power AI products, and the bottlenecks now shaping next-generation semiconductor package roadmaps. 

Learning Objectives

  • An understanding of the fundamental properties of elastomers and how those properties influence seal performance. 

  • Types of elastomers used in semiconductor manufacturing and factors that affect the material selection process.

  • How operating conditions such as temperature, plasma, process chemistry, vacuum, and mechanical loading can affect seal life. 

  • Common seal failure modes and how to identify them. 

  • The importance of proper seal design, gland design, and installation practices. 

  • Understand how failure analysis can be used to troubleshoot sealing problems and identify opportunities for improvement. 

  • How ASNA can support customers through application evaluation, material and design recommendation, failure analysis, customer engineering, and on-site installation support. 

     

     

Who Should Attend

This course is ideal for engineers and technical professionals, including equipment, process, mechanical, applications, reliability, maintenance, and field service engineers. 

 

Instructors

 

 

 

ANSA


Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U

This two-hour webinar provides a practical introduction to elastomer sealing technology, beginning with the fundamentals of seal elastomers and the properties that influence their performance. 

Pricing
  • Members: Free
  • Non-Members: Free

 

8:00 am - 10:00 pm Off Add to Calendar 2027-03-01 08:00:00 2027-03-01 22:00:00 Why Elastomer Seals Fail in Semiconductor Equipment (America/EU) 3/1/27 This two-hour webinar provides a practical introduction to elastomer sealing technology, beginning with the fundamentals of seal elastomers and the properties that influence their performance. PricingMembers: FreeNon-Members: Free  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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United States Belgium France Germany Ireland Italy Packaging Quality and Reliability 3/11 Training

Course Description

Given the immense cost of AI products & platforms, an important and differentiating factor for a successful packaging technology supplier is offering stellar quality and reliability to preserve the value of the expensive silicon chiplets. This course introduces various aspects of demonstrating Quality and Reliability in semiconductor packaging. One way to guarantee stellar quality and reliability of products with new technologies is to overdesign them, but that can be very expensive. Alternatively, under-designing packages from a reliability perspective may be cheaper; however, it will likely trigger premature failures in the field, leading to higher ownership costs and frustration for customers. Optimizing this balance to deliver new technology and meet customer expectations requires drawing from experience (history), judicious use of simulations, augmenting with empirical data and, more importantly, engineering rigor to make the right technology decisions. 

This course will prepare the audience to tackle technical problems (related to failure mechanisms and product qualification) by providing a blueprint that aids in proving that the technology capabilities can meet the market demands. The participants will experience the concepts through hands-on exercises throughout the course. 

Learning Objectives

  • A brief overview of semiconductor packaging. 

  • Understand the fundamentals of quality and reliability principles. 

  • Understand the concept of the bathtub curve and its use for Q&R optimization. 

  • Introduce the philosophy, and practical elements, of product qualification. 

  • Understand use conditions based on different markets like Automotive, Data Centers, Mobile, Space, etc.

  • Understand different quality tests and reliability stress tests done for product qualification. 

  • Get insight into typical failure mechanisms and failure analysis techniques. 

  • Demonstrate how to perform life distribution analysis to characterize statistical behavior of failures.

  • Introduction to acceleration models for predicting useful life of the package. 

  • Hands-on exercises

     

Who Should Attend

This course is ideal for anyone seeking a better understanding of how quality and reliability evaluation s performed for semiconductor packaging. 

 

Instructors

Shalabh Tandon
Qurius LLC
Instructor Bio

 

Shubhada Sahasrabudhe
Qurius LLC
Instructor Bio


Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U

This four-hour course presents a methodology to deliver an optimum approach, and quantify, figures of merit that define quality and reliability for complex, heterogeneous integrated products. 

Pricing
  • Members: $149
  • Non-Members: $199

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar 2027-03-11 08:00:00 2027-03-11 12:00:00 Packaging Quality and Reliability in the Era of Chiplets 3/9/27(Americas/EU) This four-hour course presents a methodology to deliver an optimum approach, and quantify, figures of merit that define quality and reliability for complex, heterogeneous integrated products. PricingMembers: $149Non-Members: $199* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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United States Belgium France Germany Ireland Italy Training

Course Description 

This three-day virtual workshop (4 hours a day) provides a complete overview of the semiconductor manufacturing process. The class focuses on key process steps needed to form a functioning device. Some important science and engineering ideas needed to understand device manufacturing will be discussed. The workshop is designed for non-technical personnel needing an understanding of the fab process steps.  Some technical background from attendees will improve the workshop learning. 

The first day will overview the fab process steps with a brief summary of how a transistor functions. We will discuss how multiple transistors are connected to form a logic or memory device. We will also cover how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors. 

The second day will cover key fab process steps. Ion implantation, photolithography including DUV and EUV processes, plasma processes including deposition and etch, rapid thermal processing, and wet etch processing. Specific emphasis will be given to the different wet etch processes. 

The third day of the workshop will focus on the new transistor designs, including FinFET and CFET designs. We will also cover reasons for changing the transistor design and newer materials, including tantalum, hafnium, silicon germanium, and low-k dielectrics.  We will also review roadmaps of leading companies, including TSMC, Intel, and Samsung. 

After completing the workshop, the student will be able to describe all the fabrication and assembly process steps and have an understanding of how the process steps work together to form the completed integrated circuit, in addition to an understanding of future structures.

 

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Process Technicians
  • Material Engineers
  • Process Engineers
  • Equipment Manufactures
  • Technical Marketing Engineers

Topics Included

  • Silicon wafer manufacturing
  • Basic operating principles of transistors and semiconductor devices
  • Planar, FinFET, and GAA transistor formation and design differences
  • Fab processes needed to form a semiconductor, including the following:
    • Lithography, with a focus on DUV and EUV methods
    • Etching, including wet and plasma processes
    • Deposition, thermal, plasma, electroplating deposition
    • CMP and modern CMP processes
       

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Dr. Tom Dory
ITM Consulting, Inc
Instructor Bio

United States

- SEMI U

Unlock the essentials of the semiconductor manufacturing process.  We will cover science and engineering concepts needed to understand device manufacturing. 

Pricing         
  • Members:  $549
  • Non-Members:   $599

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].

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United States Belgium France Germany Ireland Italy SubFAB 101 3/17 Training

Course Description

By the end of this course, participants will understand the scope of SubFAB and its critical role within the semiconductor manufacturing ecosystem, tracing its evolution and recognizing new trends. They will be able to identify and describe the core SubFAB systems and interpret typical facility layouts and equipment installation specifics. Learners will assess the environmental, and sustainability impacts of modern SubFABs. They will map a standard SubFAB organizational chart, typical roles, and responsibilities, and simulate incident-response workflows to reinforce operational readiness. Participants will be exposed to preventive maintenance and safety best practices to ensure reliability and compliance with regulations.

Who Should Attend

This course is designed for engineers and technicians in semiconductor manufacturing, equipment suppliers/OEM on-site service personnel, IE and MEP designers. 

Course Outline

  • Introduction & Course Logistics
    • Welcome, introductions, and platform quick start
    • Learning objectives and course flow
  • Module 1: SubFAB Fundamentals
    • Definition & scope of SubFAB
    • Historical evolution (from early fabs to today)
    • Core equipment & support systems overview
    • Typical facility layouts and installation configurations
  • Module 2: Environmental & Sustainability Considerations
    • Key environmental impacts (emissions, water/chemical use)
    • Gas abatement and PFAS management fundamentals
    • Metrics & case studies in sustainable SubFAB operation
  • Module 3: Organizational & Operational Structures
    • SubFAB org charts and stakeholder roles
    • Operational workflows (from tool install to maintenance)
    • Incident-response and escalation paths (role-play)
  • Module 4: Safety, Maintenance, & Reliability
    • Preventine- maintenance best practices
    • Safety protocols and hazard identification
    • Reliability metrics and continuous improvement loops
  • Module 5: Emerging Trends & Innovations
    • Automation, digital twins, and Industry 4.0 in SubFAB
    • Advanced materials handling and process integration
    • Open discussion: Where SubFAB will go next
  • Wrap-Up & Next Steps
    • Final Q&A and feedback collection
    • Certification requirements and further resources
    • Suggested post-course readings and SEMI standard references 

 

Instructor

Ilya Zabelinksy

Instructor Bio

 

 

 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U Standards

SubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends. 

  • San Francisco: 8:00 AM - 12:00 PM
  • Jerusalem:       6:00 PM - 10:00 PM 
  • England:          4:00 PM - 8:00 PM 
  • Munich:            5:00 PM - 9:00 PM
Pricing
  • Members: $349
  • Non-Members: $399

* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected]. 

8:00 am - 12:00 pm Off Add to Calendar 2027-03-17 08:00:00 2027-03-17 12:00:00 SubFAB 101: Foundations of Semiconductor Support Facilities (Americas/EU) 3/17 SubFAB 101: Foundations of Semiconductor Support Facilities is a 4-hour course that covers SubFAB basics and its critical role within the semiconductor manufacturing ecosystem, including its evolution and new trends. San Francisco: 8:00 AM - 12:00 PMJerusalem:       6:00 PM - 10:00 PM England:          4:00 PM - 8:00 PM Munich:            5:00 PM - 9:00 PMPricingMembers: $349Non-Members: $399* For group orders with 10+ attendees, and for Students/Veterans, discounted pricing, please contact [email protected].  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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United States Belgium France Germany Ireland Italy Semiconductor Packaging Fundamentals 3/9/27 Training

Course Description

In this course, we dive into the fundamental roles of packaging in enabling a complex product; namely, signal distribution, power delivery, thermal management, mechanical protection of the fragile silicon die(s), and the risks associated with the manufacturing flow. We trace the evolution of packaging technology from wire-bonded leadframe packages through flip-chip and ball grid arrays to today's advanced heterogeneous integration platforms, including 2.5D interposers, 3D die stacking, fan-out wafer level packaging, and chiplet-based architectures. 

Given the complicated, and expensive, nature of these semiconductor packages, quality and reliability are a central theme for such complex products. We will discuss quality metrology used to maintain outgoing product quality and accelerated testing methods used to predict field performance using physics of failure methodology. 

The course concludes by presenting information on current or emerging technologies and the attendant challenges, that include hybrid bonding, co-packaged optics, and advanced substrate materials. The course also touches upon challenges with thermal dissipation for high-power AI products, and the bottlenecks now shaping next-generation semiconductor package roadmaps. 

Learning Objectives

  • Define core packaging functions (signal, power, thermal, and mechanical).

  • Trace the evolution from leadframes to 2.5D/3D and chiplet architectures.

  • Explain the "More than Moore" shift from transistor to package innovation.

  • Identify key failure mechanisms like electromigration and thermal fatigue.

  • Apply quality metrology and screening methods to ensure outgoing product standards.

  • Use accelerated testing and physics-of-failure models to predict long-term package reliability. 

  • Evaluate emerging trends in hybrid bonding and co-package optics. 

  • Hands-on exercises

     

Who Should Attend

This course is ideal for anyone seeking a better understanding of semiconductor packaging fundamentals, challenges, and latest technologies. 

 

Instructors

Shalabh Tandon
Qurius LLC
Instructor Bio

 

Shubhada Sahasrabudhe
Qurius LLC
Instructor Bio


Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U

This four-hour workshop provides a comprehensive technical foundation in semiconductor packaging, bridging the gaps between front-end wafer fabrication and final system integration. 

Pricing
  • Members: $149
  • Non-Members: $199

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar 2027-03-09 08:00:00 2027-03-09 12:00:00 Semiconductor Packaging Fundamentals and Advances (Americas/EU) 3/9 This four-hour workshop provides a comprehensive technical foundation in semiconductor packaging, bridging the gaps between front-end wafer fabrication and final system integration. PricingMembers: $149Non-Members: $199* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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China Japan Taiwan South Korea India Malaysia Singapore Vietnam From Wafer to Chip 3/5 Asia Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices. 

Who Should Attend

This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.   

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Module 1: Semiconductor Fundamentals

    Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.

  • Module 2: Semiconductor Terminologies and Manufacturing Context

    Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.

  • Module 3: Front-end and Back-end Semiconductor Manufacturing

    Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.

  • Module 4: Transistors and Their Operation

    Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits. 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Mayura Padmanabhan
Program Manager
SEMI
Instructor Bio

 

Singapore

SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

  • Singapore: 8:00 am - 12:00 pm 
  • San Francisco: 5:00 pm - 9:00 pm
Pricing                     
  • Members:  $199
  • Non-Members:  $249


Any questions, please contact [email protected]

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United States Belgium France Germany Ireland Italy From Wafer to chip 3/2/27 Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices. 

Who Should Attend

This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.   

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Module 1: Semiconductor Fundamentals

    Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.

  • Module 2: Semiconductor Terminologies and Manufacturing Context

    Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.

  • Module 3: Front-end and Back-end Semiconductor Manufacturing

    Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.

  • Module 4: Transistors and Their Operation

    Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits. 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Mayura Padmanabhan
Technical Project Manager
SEMI
Instructor Bio

 

United States

SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

  • London: 4:00 pm - 8:00 pm 
  • Munich: 5:00 pm - 9:00 pm 

Pricing:                     

  • Members:  $199
  • Non-Members:  $249


Any questions, please contact [email protected]

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Belgium France Germany Ireland Italy Overview of Semiconductor Mfg 2/23 Training

Course Description

This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.

Learning Objectives

  • Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
  • Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
  • Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals

Course Topics

  • Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
  • Process Nodes: Process nodes and their impact on device performance and cost
  • Device Physics and Transistor Operation: Principles of device operation and transistor functionality
  • Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
  • Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
  • Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
  • Wafer Processing: Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
  • Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
  • Etching and Cleaning Processes: Plasma and wet etching processes
  • Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
  • Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
  • Electroplating and Sputtering: Metal deposition techniques used in manufacturing
  • Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
  • Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
  • Semiconductor Industry Ecosystem: The major players in the industry 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Testimonials 

See what course participants had to say about this course!

  • "The expansive width of coverage with sufficient depth; well curated, relevant information with live references, and the open style of delivery which made the course more of a sharing than a lecture, was enjoyable."
  • "Denny's knowledge and ability to explain things in simplified ways was awesome!"
  • "I really enjoyed going over the topics and watching the in-depth videos. I also liked how we received the slide information prior to the class."
  • "The range of topics was perfect for an intro course."
  • "Denny did a great job explaining complex topics. The opportunity to ask questions directly was beneficial for the entire class. If a question couldn't be answered immediately, it was addressed by the next break at the latest."
  • "Thank you very much for the informative course. I appreciate the in-depth and in-detail insight in all aspects of Semiconductor Manufacturing!"

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

Germany

- SEMI U

Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.

Day 1 8:00 - 5:00 GMT +8

Day 2 8:00 - 1:00 GMT +8

Pricing

Early Bird Special - $100 off  

  • Members: $995 $895
  • Non-Members: $1095 $995

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

8:00 am - 5:00 pm Off Add to Calendar 2027-02-23 08:00:00 2027-02-24 17:00:00 Overview of Semiconductor Manufacturing (Europe) - 2/23 Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.Day 1 8:00 - 5:00 GMT +8Day 2 8:00 - 1:00 GMT +8PricingEarly Bird Special - $100 off  Members: $995 $895Non-Members: $1095 $995* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Germany SEMI.org [email protected] Europe/Brussels public Europe/Brussels
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Belgium France Germany Ireland Italy Understanding EU 2/27 Training

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Testimonials 

See what course participants had to say about this course!

  • "Denny Frye knows so much about the history of the semiconductor industry that he was able to tie together many different industries and technologies that I have heard about but never knew how they were connected."
  • "Great overview of the semiconductor industry & market."
  • "This was a very detailed course on many facets of the industry, would recommend!"
  • "It was a great mix of technical and overview of the key players in the market!"
  • "Good blend on technical and commercial topics."
  • "Excellent introduction to the semiconductor world."
  • "Great session on the understanding of the semiconductor industry in a nutshell."

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

Germany

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing

Early Bird Special - $100 off 

  • Members: $845 $745
  • Non-Members: $945 $845

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

8:00 am - 5:00 pm Off Add to Calendar 2027-02-22 08:00:00 2027-02-22 17:00:00 Understanding Semiconductor Technology and Business (Europe) 2/22 Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingEarly Bird Special - $100 off Members: $845 $745Non-Members: $945 $845* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] Germany SEMI.org [email protected] Europe/Brussels public Europe/Brussels
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United States Belgium France Germany Ireland Italy Semiconductor Ecosystem 2/17/27 Training

Course Description

This interactive course provides a practical, comprehensive overview of the semiconductor industry, with an emphasis on real-world applications, production processes, and the critical roles within semiconductor manufacturing. Attendees will gain insights into the global semiconductor value chain, from initial design and development to final product shipment, and explore how semiconductors power essential technologies in automotive, AI, and healthcare. The course covers emerging trends such as sustainable manufacturing, data-driven operations, and advanced node technology. Participants will also delve into key performance indicators (KPIs) for fab operations, R&D, and product development, and discover career paths and skill requirements within this dynamic industry.

Through engaging discussions, case studies, and hands-on exercises, participants will gain knowledge that can be immediately applied to their roles, empowering them to better understand semiconductor manufacturing’s impact and contribute to their organization’s success.

Learning Objectives

  • Identify key applications of semiconductors across industries

  • Map the semiconductor value chain from design to shipment

  • Gain understanding of smart manufacturing and resource-efficient production

  • Interpret KPIs for fab operations, product development, and R&D

  • Understand key roles and skills within the semiconductor industry

Who Should Attend

This course is ideal for industry newcomers, career changers, recent graduates, technical professionals from related fields, business leaders, and educators seeking a practical, comprehensive understanding of semiconductor applications, processes, roles, and industry dynamics.

  • Industry Newcomers: Individuals new to the semiconductor field who need a comprehensive overview of applications, production processes, and key roles.
  • Early- and Mid-Career Semiconductor Employees: Current employees seeking to deepen their understanding of the semiconductor value chain, industry challenges, and emerging trends.
  • Career Changers and Recent Graduates: Those entering the semiconductor industry or recent graduates looking for insights into industry roles and required skills.
  • Professionals from Related Fields: Technical professionals in areas like automotive, medical devices, consumer electronics, or engineering who want to understand semiconductor applications and manufacturing.
  • Managers and Business Leaders: Leaders in strategy, business development, or operations who need to understand semiconductor production dynamics, KPIs, and sustainability to enhance profitability and competition.
  • Educators and Trainers: Instructors teaching semiconductor technology who want a practical, industry-focused course structure. 

Course Topics

  • Introduction to Semiconductor Applications and Market Impact
  • Semiconductor Value Chain: From Design to Shipment
  • Smart Manufacturing and Technology Evolution
  • Fab Operations and Facility Layout
  • Key Performance Indicators for Semiconductor Functions
  • Quality Assurance and Continuous Improvement
  • Workforce Roles and Skills in Semiconductor Manufacturing
  • Emerging Trends and Future Opportunities
  • Closing and Immediate Application Planning

Instructor

Dr. Sirisha Kuchimanchi 

Sahita Technologies

Instructor Bio

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U

Interested in learning about the semiconductor ecosystem as a whole? This course introduces you to the basics of semiconductors, applications of semiconductors, front-end and back-end processing, fabrication facilities, process control and yield management, jobs and roles within the semiconductor industry, and what life is like working in a fab. Great for anyone seeking an understanding of an overview of the industry.  

Pricing
  • Members: $249
  • Non-Members: $299

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar 2027-02-17 08:00:00 2027-02-17 12:00:00 Semiconductor Ecosystem Overview (Americas & EU) 2/17 Interested in learning about the semiconductor ecosystem as a whole? This course introduces you to the basics of semiconductors, applications of semiconductors, front-end and back-end processing, fabrication facilities, process control and yield management, jobs and roles within the semiconductor industry, and what life is like working in a fab. Great for anyone seeking an understanding of an overview of the industry.  PricingMembers: $249Non-Members: $299* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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