Showing 9757 - 9768 of 11343
Event Presentation
European 3D Summit 2018: Photonic Interconnects for High-Performance Computing and Data Center Applications
Ashkan Seyedi, Photonics Research Scientist at Hewlett Packard Labs, discusses memory-driven compute architecture, network topology, VCSEL photonics, silicon photonics interconnects, LSIP technical...
Event Presentation
European 3D Summit 2018: 3D SoCEnablement Through Hybrid Wafer Bonding – A Foundry Perspective
Luke England, 3D Package Development Manager and Tanya Atanasova, Technology Development Engineer at GlobalFoundries discuss 3D Wafer Bonding Applications, Hybrid Bond Process Flow Scenarios, and...
Event Presentation
SEMICON Korea 2017: The Future of Mobility
Klaus Meder, President of Bosch Corporation Japan, share sales figures from 2016 within mobility, industrial tech, energy/building tech, and consumer goods. Specifically a breakdown of total...
Event Presentation
European 3D Summit 2018: Fan Out Transformation from WLCSP to 3D
John Hunt, Senior Director of Engineering and Technical Promotion at ASE Inc. discusses WLP evolution, fan out variations (chip first vs. chip last; low density vs. high density), fan out...
Event Presentation
SEMI Oregon Breakfast Forum: China's Impact on the Semiconductor Industry – 2017 Update
Ed Pausa, Director of the Technology Center at PricewaterhouseCoopers discusses current findings on China’s impact on the Semiconductor Industry, including IC and O-S-D market/revenue growth and fab...
Event Presentation
SEMI Oregon Breakfast Forum 2017: How do I Protect Design and Value in the Global IC Manufacturing World?
Michael Chen, Director at Mentor Graphics, Siemens, suggests that only by continuing to innovate at the cutting edge will the United States be able to mitigate the threat posed by Chinese industrial...
Event Presentation
SEMICON Korea 2018: Shaping the Electronic Mobility Experience
Berthold Hellenthal, Manager of Development Electronics at AUDI AG, discusses Audi’s comprehensive semiconductor strategy, or Audi Progressive SemiConductor Program (PSCP), which features three...
Event Presentation
SEMICON Korea 2017: The Next Memory Cycle – When, Why, and How it Will Happen
Jim Handy, General Director at Objective Analysis, begins by showing a chart on semiconductor forecast accuracy, and digs into the memory cycle, what drives commodity cycles, what will drive today’s...
Member Press Release
APC|M 2018: Brooks Instrument Technology Expert to Speak About New Mass Flow Controller With Self-Diagnostics
HATFIELD, Pa. (April 9, 2018) – Mohamed Saleem, Chief Technology Officer at Brooks Instrument, will deliver a technical presentation titled “Advanced Mass Flow Controllers With EtherCAT®...
SEMI Press Release
SEMI Reports Record Semiconductor Photomask Sales of $3.7 Billion
MILPITAS, Calif. — April 9, 2018 — SEMI, the global industry association representing the electronics manufacturing supply chain, today announced that after several years of incremental increases the...
Blog
Fluid Management Subsystems Sales Top $1 Billion for First Time
Sales revenues for fluid management subsystems grew 28 percent in 2017 to $1.28 billion, breaking the $1 billion mark for the first time. Fluid management subsystems have now seen five years of...
Blog
U.S. Federal Government Finalizes R&D Spending for 2018
Although many months past due, Congress on March 23 finalized the federal spending for the remainder of fiscal year (FY) 2018, only hours before a what would have been the third government shutdown...