European 3D Summit 2018: Fan Out Transformation from WLCSP to 3D

John Hunt, Senior Director of Engineering and Technical Promotion at ASE Inc. discusses WLP evolution, fan out variations (chip first vs. chip last; low density vs. high density), fan out innovations, and drivers for fan out. From European 3D Summit in January 2018.

Keywords: WLP, FO-WLP, OSAT, Supply Chain, SiP