European 3D Summit 2018: Photonic Interconnects for High-Performance Computing and Data Center Applications

Ashkan Seyedi, Photonics Research Scientist at Hewlett Packard Labs, discusses memory-driven compute architecture, network topology, VCSEL photonics, silicon photonics interconnects, LSIP technical advanced development, and thermal management. Many graphs and charts are included. From the European 3D Summit in January 2018 in Grenoble, France.

Keywords: Photonics, CMOS, VLSI, 3D Packaging, Packaging, Interconnects, Memory, Thermal Management