European 3D Summit 2018: 3D SoCEnablement Through Hybrid Wafer Bonding – A Foundry Perspective

Luke England, 3D Package Development Manager and Tanya Atanasova, Technology Development Engineer at GlobalFoundries discuss 3D Wafer Bonding Applications, Hybrid Bond Process Flow Scenarios, and Supply Chain considerations. From European 3D Summit, January 2018 in Dresden, Germany.

Keywords: SoC, 3DSoC, Wafer Bonding, Bonding, Supply Chain