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Event Presentation
SEMICON Europa 2017: Transparent and Flexible Moisture Barriers
Luca Gautero, Senior Process Development Engineer at Meyer Burger discusses moisture barrier applications/challenges, stacked encapsultation layers with PECVD and inkjet printing, and barrier foil...
Event Presentation
SEMICON Europa 2017: Henkel – Enabling Materials for Semiconductor and Sensor Assembly
HENKEL presents Innovative Semiconductor and Sensor Assembly Solutions via package level EMI shielding solutions, advanced semiconductor packaging materials, high conductivity semi sintering die...
Event Presentation
SEMICON Europa 2017: How Sensor Frameworks Enable Efficient Development
Shubhadip Paul, Software Engineer at NXP Semiconductors, discusses remote sensors in an IoT ecosystem, from smart sensor nodes to sensor frameworks. Two demonstrations of NXP’s technology are...
Event Presentation
SEMICON Europa 2017: Measurement of Airborne Nanoscale Particles Using Condensation Particle Counters
Richard Remiarz, Business Director of Controlled Environments at TSI Incorporated, discusses market needs, limits in light-scattering instruments, CPC technology and its history, water-based CPCs,...
Event Presentation
SEMICON Europa 2018: Power Semiconductor Wafer Thinning Process Control for Automotive Application
Yann Guillou, Global Marketing Manager of UnitySC, discusses power semiconductor ICs and their reliability. Power semi wafer backside processing and inspection techniques are discussed, as well as...
Event Presentation
SEMICON Europa 2017: The Digital Twin in the Cloud – Smart Equipment Life Cycle Managemetn by OEMs
Frank Geissler, Sales Director at AIS Automation Software Systems, defines “digital twin” as a dynamic digital representation of an industrial asset, that enables companies to better understand and...
Event Presentation
SEMICON Europa 2017: farao Company Pitch
This presentation, given by staff at farao, discusses the mobility/transportation market, acknowledging that private/commercial ownership dominates the total miles driven today, despite other...
Event Presentation
Chemical & Gas Manufacturers Group Webinar 2017: Advanced Patterning Challenges at 5nm
Darron Jurajda, Business Unit Leader at Brewer Science leads a presentation featuring three key speakers, including Greg MacIntyre, Advanced Patterning Department at IMEC, with “EUV Patterning...
Blog
More than EDA - Cadence Talks About Designing With FD-SOI
EDA companies Cadence, Synopsys and Silvaco all gave excellent presentations at the SOI Consortium forums in Nanjing and Shanghai.Here's a recap of what the Cadence folks said. (I'll cover the...
Blog
Securing Talent to Connect, Collaborate and Innovate
In my first six months at SEMI, I’ve visited with many member companies and industry leaders. One theme I hear repeatedly is a concern about our most fundamental source of innovation and productivity...
Blog
China's Semiconductor Industry and Win-Win Growth
As China embarks on the Made in China 2025 plan with electronics and semiconductor technology as one of the Top 10 focus areas, China's semiconductor industry has an unprecedented growth opportunity....
Member Press Release
MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing
North Billerica, MA, USA, August 14, 2017 — MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High...