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HENKEL presents Innovative Semiconductor and Sensor Assembly Solutions via package level EMI shielding solutions, advanced semiconductor packaging materials, high conductivity semi sintering die attach adhesive, ultra-low and stable modulus materials for MEMS sensors, low outgassing and low temperature cure materials for CMOS image and biometric sensor packaging. These product technologies can be applied to wirebound semiconductors, sensors & modules (SiP), and advanced semiconductors. From SEMICON Europa, November 2017 in Munich, Germany.

 

Keywords: Copper, Copper Pillar, SiP, MEMS, Packaging, Materials, Sensors, Die Attach, CMOS