SEMICON Europa 2018: Power Semiconductor Wafer Thinning Process Control for Automotive Application

Yann Guillou, Global Marketing Manager of UnitySC, discusses power semiconductor ICs and their reliability. Power semi wafer backside processing and inspection techniques are discussed, as well as deflector modules and the deflector principle, thereby creating full wafer characterization to identify defects. This includes wafer edge inspection. Reliability is key in power semiconductors for automotive applications. Numerous pictures and graphs are shown. From SEMICON Europa in November 2018 in Munich, Germany.

Keywords: Automotive, Transportation, Defects, Reliability, Power, Characterization