Showing 2593-2598 of 2598
Blog
12nm FD-SOI on the Roadmap for H1/2019 Customer Tape-out! Says GloFo (While Giving 22FDX Ecosys a Great Boost)
12nm FD-SOI has now officially joined the GlobalFoundries’ roadmap, targeting intelligent, connected systems and beating 14/16nm FinFET on performance, power consumption (by 50%!) and cost (see press...
Blog
GlobalFoundries and Synopsys Streamline the Move to 22nm FD-SOI
By: Tamer Ragheb,Digital Design Methodology Technical Manager at GlobalFoundries and Josefina Hobbs, Senior Manager of Strategic Alliances, Synopsys
It’s clear that getting an optimal balance of...
SEMI Press Release
SEMI Reports 2010 Global Semiconductor Equipment Sales of $39.5 Billion
SAN JOSE, Calif. — March 8, 2011 — SEMI, the global industry association for companies that supply manufacturing technology and materials to the world’s chip makers, today reported that worldwide...
Infographic
SEMI Equipment Brief: Organic Substrates
In the past decade, high volume IC packaging has shifted from the era of ceramic packages to organic substrate-based packages, especially the plastic ball grid array (PBGA). The shift from ceramic to...
Infographic
SEMI Equipment Brief: Semiconductor Photoresists
Improvements in semiconductor performance continue to be made, largely driven by advances in optical lithography equipment, photomask, and photoresist (resist) materials. In particular, the design...
Infographic
SEMI Equipment Brief: Epitaxial or Epi Silicon Wafers
There are two types of epitaxial or epi silicon wafers used in the semiconductor industry: discrete and MOS. MOS epi wafers offer the advantage of obtaining a lightly doped material on top of a...